CN115379917B - Heating nozzle unit - Google Patents
Heating nozzle unit Download PDFInfo
- Publication number
- CN115379917B CN115379917B CN202180027326.1A CN202180027326A CN115379917B CN 115379917 B CN115379917 B CN 115379917B CN 202180027326 A CN202180027326 A CN 202180027326A CN 115379917 B CN115379917 B CN 115379917B
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- Prior art keywords
- wire
- soldering iron
- heating tip
- heating
- tip unit
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Resistance Heating (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention provides a heating nozzle unit which is not easy to cause the defect of carelessly clamping a wire of a temperature sensor. Specifically, the heating tip unit (1) is formed by attaching a thermocouple (3) to a plate-shaped heating tip (2) for thermocompression bonding a terminal wire to a terminal member, and the heating tip (2) is provided with: a soldering iron part (6) which is provided with a soldering iron front end part (13) which is abutted against the lead wire for the terminal on the soldering iron body (11); and a pair of connection arm sections (7) which extend upward from the left and right end sections of the soldering iron body (11) in a state of being separated from each other, and which heat the soldering iron section (6) by passing a current from a power source through the soldering iron body (11), wherein the connection arm sections (7) are provided with a gap between them as a wire housing space section (30) with an upper end section open, and wherein the wire (3 b) of the thermocouple (3) is housed in the wire housing space section (30).
Description
Technical Field
The present invention relates to a heating tip unit for thermocompression bonding a terminal wire to a terminal member.
Background
In a process of thermocompression bonding a terminal wire to a terminal member, for example, in a process of thermocompression bonding a wire to a terminal portion of a core in manufacturing an electronic component such as a chip inductor (chip inductor), a heating tip unit for thermocompression bonding is used. Specifically, a thermocouple is attached as a temperature sensor to a heating tip that heats up in a soldering iron part to form a heating tip unit, and the heating tip unit is attached to a tool holder (tool holder) of a thermocompression bonding device. Then, the thermal compression bonding apparatus is operated, and the terminal wire mounted on the terminal member is rapidly heated while being pressurized by the soldering iron portion of the heating tip, so that the terminal wire is thermally compressed to the terminal member (for example, refer to patent document 1).
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5457107
Disclosure of Invention
Problems to be solved by the invention
However, in the heating tip (heating tip unit) described in the above patent document, the core wire of the thermocouple (the wire of the temperature sensor) is inserted into the protection tube to be protected, and further, a holder hole formed in the heating tip is inserted into the protection tube together with the protection tube to be held. However, since the core wire and the protection tube of the thermocouple are led out from the surface of the heating tip, there is a possibility that the core wire may be blocked or carelessly caught and the thermocouple may be detached from the heating tip when the heating tip unit is mounted to the thermo-compression device or the like.
Further, in the case of operating the thermo-compression bonding apparatus to bring the heating tip unit into the working area or to perform the thermo-compression bonding operation, there is also a possibility that the thermocouple may be separated from the heating tip by carelessly catching the core wire with another tool (an auxiliary tool for clamping a workpiece or the like). Therefore, there is a possibility that the operation of the heating nozzle unit into a narrow work area is hindered.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a heating tip unit in which a defect that a wire of a temperature sensor is not likely to be inadvertently stuck is less likely to occur.
Means for solving the problems
The present invention has been made to achieve the above object, and a first aspect of the present invention provides a heater nozzle unit in which a temperature sensor is attached to a plate-shaped heater nozzle for thermocompression bonding a terminal wire to a terminal member, wherein,
the heating nozzle is provided with:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm parts extending upward from left and right end parts of the soldering iron body in a state of being separated from each other, and allowing a current from a power supply to flow through the soldering iron body to heat the soldering iron part,
the gap between the connection arm portions is provided as a wire receiving space with an open upper end portion, and the wire of the temperature sensor is received in the wire receiving space.
The heating tip unit of the second aspect is the heating tip unit according to the first aspect, characterized in that a wire stopper portion that stops the housed wire is provided in the wire housing space portion.
The heating tip unit according to the third aspect is the heating tip unit according to the second aspect, wherein the wire stopper is a resin that is injected into the wire receiving space and is hardened.
A heating tip unit according to a fourth aspect is the heating tip unit according to the third aspect, wherein the heating tip unit includes a stopper recess communicating with the wire receiving space, and resin serving as a wire stopper is injected into the wire receiving space and the stopper recess to harden the resin.
A fifth aspect of the heating tip unit according to the second aspect is the heating tip unit of the second aspect, wherein the wire stopper portion is a protrusion integrally formed with the connection arm portion and protruding toward the wire receiving space portion side.
A heating tip unit according to a sixth aspect is the heating tip unit according to any one of the first to fifth aspects, wherein a temperature measurement fixing portion to which a temperature measurement portion of the temperature sensor is fixed is provided at a position facing a lower end portion of the wire receiving space portion in the soldering iron portion.
A seventh aspect of the heating tip unit according to the sixth aspect is characterized in that the heating tip is formed with an oxidation-resistant coating layer on at least the surfaces of the soldering iron portion and the temperature measurement fixing portion.
A heating tip unit according to an eighth aspect is the heating tip unit according to the seventh aspect, wherein an oxidation-resistant coating layer is formed on a surface of the temperature measuring part fixed to the temperature measuring fixing part.
The heating tip unit of the ninth aspect is the heating tip unit according to the seventh or eighth aspect, characterized in that the oxidation-resistant coating layer is a nickel coating.
A heating tip unit according to a tenth aspect of the present invention is the heating tip unit according to any one of the sixth to ninth aspects, wherein the temperature measurement fixing portion includes a pair of fixing contact surfaces with which the temperature measurement portion is in contact, and the fixing contact surfaces are set in a state in which a distance between the fixing contact surfaces gradually spreads from the soldering iron portion side toward the upper side.
A heating tip unit according to an eleventh aspect is the heating tip unit according to any one of the first to tenth aspects, characterized in that the temperature sensor is a thermocouple, and the wire of the temperature sensor is constituted by including a core wire of the thermocouple.
Effects of the invention
The present invention has the following excellent effects.
According to the first aspect of the invention, the gap between the connection arm portions is provided as the wire receiving space with the upper end portion open, and the wire of the temperature sensor is received in the wire receiving space, so that the wire of the temperature sensor can be prevented from exceeding the range of the plate thickness of the heating tip. Thus, when the process such as the mounting operation of the heating tip unit to the thermocompression bonding device is performed or when the heating tip unit enters the work area, a defect in which the wire is inadvertently stuck or even a defect in which the temperature sensor is detached from the heating tip is not likely to occur.
According to the second aspect of the invention, since the wire stopper portion for stopping the housed wire is provided in the wire housing space portion, the housed wire can be prevented from coming off from the wire housing space portion.
According to the third aspect of the invention, since the wire stopper is a resin that is cured by being injected into the wire receiving space, the resin is easily put into the gap between the connection arm and the wire as the wire stopper, and the wire can be sufficiently stopped.
According to the fourth aspect of the invention, since the heating tip unit includes the stopper recess communicating with the wire receiving space, and the resin serving as the wire stopper is injected into the wire receiving space and the stopper recess to be hardened, the wire stopper is less likely to fall out of the wire receiving space, and the wire along with the wire stopper can be prevented from falling out of the wire receiving space.
According to the fifth aspect of the invention, since the wire stopper is a protrusion integrally formed on the connection arm portion and protruding toward the wire receiving space, the function of preventing the wire from coming off can be achieved by a simple structure.
According to the sixth aspect of the invention, since the temperature measuring fixing portion to which the temperature measuring portion of the temperature sensor is fixed is provided at the position facing the lower end portion of the wire receiving space portion in the soldering iron portion, the temperature measuring portion can be simply brought into contact with the temperature measuring fixing portion by inserting the temperature sensor into the wire receiving space portion from the open upper end with the temperature measuring portion as the front. Thus, the temperature measuring portion of the temperature sensor can be smoothly fixed to the temperature measuring fixing portion.
According to the seventh to ninth aspects of the invention, oxidation of the surface of the heating tip can be suppressed and durability can be improved even if temperature increase and cooling are repeated.
According to the tenth aspect of the invention, since the temperature measuring fixing portion is set in such a state that the distance between the fixing contact surfaces gradually spreads from the soldering iron portion side to the upper side, the temperature measuring portion of the temperature sensor can be brought into sufficient contact with the temperature measuring fixing portion, and the good fixing of the temperature measuring portion to the heating tip can be performed, and the heating tip unit capable of performing good temperature measurement can be further configured.
According to the eleventh aspect of the invention, since the temperature sensor is a thermocouple and the wire of the temperature sensor includes the core wire of the thermocouple, the temperature sensor of the heating tip unit can be realized by a simple structure.
Drawings
Fig. 1 is a perspective view of a heating tip unit.
Fig. 2 is an explanatory view of the heating tip, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
Fig. 3 is an explanatory view of a temperature measurement fixing portion of the heating tip, (a) is a front view, and (b) is a cross-sectional view.
Fig. 4 is an explanatory diagram of a procedure of installing the thermocouple in the heating tip, (a) is a state before the thermocouple is inserted into the heating tip, (b) is a state after the thermocouple is inserted into the heating tip, and (c) is a state after the resin is injected into the wire receiving space and the stopper recess as the wire stopper.
Fig. 4-1 is an explanatory view of a heating tip including a protrusion integrally formed with a connection arm portion as a wire stopper, (a) is a perspective view, (b) is a plan view, (c) is a front view, and (d) is a side view in which the wire stopper is drawn in a broken line.
Fig. 5 is a perspective view of a heating tip provided with two soldering iron portions.
Fig. 6 is an explanatory view of a heating tip provided with two soldering iron portions, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
Detailed Description
The manner in which the present invention can be practiced is described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, the heating tip unit 1 includes: a plate-shaped heating tip 2 for thermocompression bonding the terminal wire a to the terminal member B (see fig. 2 (d)); and a thermocouple 3 mounted as a temperature sensor to the heating tip 2. The heater nozzle 2 is a nozzle formed by processing a plate material of a conductive material (tungsten, molybdenum, super hard material, or the like) by wire electric discharge machining, and as shown in fig. 2, the heater nozzle 2 is configured to include: a soldering iron portion 6 which is a lower portion (a front end portion located on the side of the workpiece (terminal lead a or terminal member B)) of the heating tip 2; and a pair of left and right connection arm portions 7 which become upper portions (base portions). When the electric current is supplied to the soldering iron portion 6 via the connection arm portion 7, the soldering iron portion 6 can be heated by the electric resistor, and the temperature of the soldering iron portion 6 can be measured by the thermocouple 3.
The soldering iron portion 6 includes a laterally long soldering iron body 11 connecting lower portions of the connection arm portions 7 to each other, and a lateral width (a lateral dimension along which the pair of connection arm portions 7 are arranged) of the soldering iron body 11 is set to be gradually narrowed toward a lower portion of the heating tip 2. A box-shaped soldering iron tip portion 13 is provided to protrude downward at the bottom of the soldering iron body 11 protruding slightly downward, and a bottom surface (tip end surface) of the soldering iron tip portion 13 is made to be a soldering iron tip end surface 13a so as to be capable of being brought into contact with the terminal lead a. A substantially rectangular solder concave portion 15 is formed in an upper portion (a connection arm portion 7 side) located on the opposite side of the solder tip portion 13 of the solder body 11, and a temperature measurement contact (temperature measurement portion) 3a of the thermocouple 3 is fixed in the solder concave portion 15. The structure to which the temperature measuring contact 3a is fixed will be described in detail later.
The connection arm portions 7 are elongated constituent portions extending upward from the left and right end portions of the soldering iron body 11, and are provided in a state in which the connection arm portions 7 are separated from each other. Further, a mounting hole 17 for mounting to a nozzle holder (not shown) of the thermocompression bonding device is formed in an upper portion (extending end portion) of the connection arm portion 7 so as to penetrate in a plate thickness direction of the heating tip 2, and a mounting bolt (not shown) passing through the mounting hole 17 is screwed to the nozzle holder, whereby the heating tip unit 1 is mounted to the nozzle holder in a posture in which the soldering iron tip portion 13 is directed downward.
In the heating tip unit 1 attached to the tip holder, one of the connection arm portions 7 is electrically connected to one end of a heater power supply (not shown) of the thermal compression bonding apparatus, and the other connection arm portion 7 is electrically connected to the other end of the heater power supply. When a current is supplied from a power source (heater power source) to the heater nozzle 2, the current flows through the connection arm portion 7 into the soldering iron body 11, the soldering iron body 11 generates heat due to the resistance in the soldering iron body 11, and the soldering iron tip portion 13 is heated by the heat. Further, although the current in the soldering iron body 11 flows from one of the connection arm portions 7 side toward the other connection arm portion 7 side, in the path of the current flow, the cross-sectional area of the reduced diameter portion located at the corner portion of the soldering iron concave portion 15 is narrower than the cross-sectional area of other portions, and therefore the current density becomes highest at the reduced diameter portion, and joule heat due to resistance is liable to occur around the portion.
As shown in fig. 1 and 2 (d), the heater tip 2 is configured such that the grooves 20 extend in the left-right direction (the direction from one of the connection arm portions 7 toward the other connection arm portion 7) as the gouging portions of the present invention, and the thin portions 21 are formed by the extension of the grooves 20 on both front and back surfaces of the heater tip 2, and the soldering iron tip end portions 13 are provided so as to protrude below the thin portions 21, in a range from the lower portions of the connection arm portions 7 to the soldering iron body 11. In other words, the thin portion 21 is formed at a position offset from the soldering iron tip portion 13 (more specifically, at the connection arm portion 7 side of the soldering iron tip portion 13).
As shown in fig. 2 d, the depth dimension (dimension in the plate thickness direction of the heating tip 2) of the groove 20 formed on the front and back sides is set to be the same, the centers in the thickness direction of the connection arm portion 7, the soldering iron body 11 (thin wall portion 21), and the soldering iron tip portion 13 are on the same plane, and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connection arm portion 7. The surface of the thin portion 21, which is the bottom of the groove 20, is set to be the side surface (front and rear surface) of the soldering iron body 11, the plate thickness of the soldering iron body 11 (the plate thickness of the thin portion 21) is set to be thinner than the plate thickness of the connection arm portion 7, and the cross-sectional area of the soldering iron body 11 (in other words, the cross-sectional area of the flow path through which the current flows) is set to be smaller than the cross-sectional area of the connection arm portion 7. The thickness t1 of the side surface of the soldering iron body 11 is formed to be smaller than the thickness t2 of the connection arm portion 7 (specifically, the thickness of the connection arm portion 7 from which the thin portion 21 is removed (the thickness of a portion of the connection arm portion 7 that is offset from the thin portion 21)), see fig. 1 and 2 (d)).
Next, the thermocouple 3 attached to the heating tip 2 and the structure of the heating tip 2 to which the thermocouple 3 is attached will be described.
As shown in fig. 1 and 3, the thermocouple 3 is configured such that the distal ends of the two kinds of core wires 25 are welded to each other to form a spherical temperature measurement contact (temperature measurement portion) 3a, each core wire 25 is covered with a core wire coating 26 having electrical insulation, and the core wires are bundled into one piece by the covering of an outer coating 27 to form a lead wire 3b. In other words, the wire 3b is constituted so as to include the core wire 25. The diameter of the temperature measuring contact 3a and the wire diameter of the wire 3b are set to be smaller than the plate thickness of the heating tip 2.
In the heating tip 2, a receiving portion for the lead wire 3b is provided in a gap between the connection arm portions 7, and a fixing portion for the temperature measurement contact 3a is provided in the soldering iron portion 6. Specifically, as shown in fig. 1 and fig. 2 (a) and (b), the gap between the connection arm portions 7 extending in the longitudinal direction of the connection arm portions 7 is set to be one turn larger than the wire diameter of the wire 3b (thickness and width), and the wire 3b (more specifically, the portion of the wire 3b located near the temperature measurement contact 3 a) is housed in the wire housing space 30 in a state where the wire 3b does not protrude outward from the front and rear surfaces of the heating tip 2, as the wire housing space 30 is opened at the upper end portion. The lead 3b is extended from the opening 30a at the upper end of the lead receiving space 30, and the lower end of the lead receiving space 30 is opened to communicate with the soldering iron recess 15 (see fig. 1).
Further, in each connection arm portion 7, a notch is formed in a part of a side surface facing the wire receiving space portion 30 and stopper concave portions 31 are formed so as to communicate with the wire receiving space portion 30, and a wire stopper portion 32 is provided in each stopper concave portion 31 and a part of the wire receiving space portion 30 (a portion located between the stopper concave portions 31) by hardening after injection of a resin such as an ultraviolet curing resin or a thermosetting resin, and a wire 3b is prevented from being deviated from the wire receiving space portion 30 by the wire stopper portion 32 so as to protrude from the heating tip 2.
Further, a temperature measurement fixing portion 35 to which the temperature measurement contact 3a of the thermocouple 3 is fixed is provided in a protruding state toward the upper connection arm portion 7 at a portion facing the end (lower end) of the wire housing space portion 30 in the soldering iron recess portion 15 formed in the soldering iron portion 6. As shown in fig. 3, the temperature measurement fixing portion 35 is a protruding portion provided so as to protrude to the opposite side of the soldering iron tip portion 13 through the soldering iron body 11, and is formed to be smaller than the soldering iron tip portion 13 by one turn. Further, in a portion facing the wire accommodating space 30 side (an upper portion of the temperature measuring fixing portion 35), a pair of fixing contact surfaces 35a for the temperature measuring contact 3a to contact are provided so as to be opposed to the end portions of the wire accommodating space 30, and the distance between the fixing contact surfaces 35a is set to be gradually increased as going from the soldering iron portion 6 side to the upper wire accommodating space 30 side. Further, each of the fixing contact surfaces 35a is formed in a flat surface, so that a V-shaped groove 36 is formed in an upper portion of the temperature measurement fixing portion 35 (an upper portion on the side of the wire accommodating space portion 30), and the temperature measurement contact 3a is received in the groove 36 so as to be in contact with the fixing contact surface 35a, and the temperature measurement contact 3a is fixed to the soldering iron portion 6 (the temperature measurement fixing portion 35) by soldering or the like in this state.
Next, a manufacturing sequence of the heating tip unit 1, particularly, a mounting sequence of the thermocouple 3 to the heating tip 2 will be described.
First, as shown in fig. 4 (a), the heating tip 2 and the thermocouple 3, which are individually manufactured in advance, are arranged in a state in which the opening 30a of the wire housing space 30 faces the temperature measurement junction 3a, and the posture of the heating tip 2 and the thermocouple 3 is set so that the temperature measurement fixing portion 35, the wire housing space 30, the temperature measurement junction 3a, and the wire 3b are aligned in this order. When the postures of the heating tip 2 and the thermocouple 3 are set, the thermocouple 3 is inserted into the opening 30a of the wire accommodating space 30 of the heating tip 2 with the temperature measurement junction 3a as the front. Then, the side surface of the connection arm portion 7 serves as a guide (guide) to guide the thermocouple 3 to the soldering iron portion 6 side.
When the thermocouple 3 is inserted deeply, the temperature measurement junction 3a passes through the wire receiving space 30 and then enters the soldering iron recess 15, as shown in fig. 4 (b). Here, as shown in fig. 3a, in the soldering iron portion 6, since the temperature measurement fixing portion 35 is provided at a portion facing the lower end portion (the open end portion on the soldering iron portion 6 side) of the wire housing space portion 30, and the V-shaped fixing contact surface 35a is made to face the end portion of the wire housing space portion 30, the temperature measurement contact 3a entering the soldering iron concave portion 15 reaches the temperature measurement fixing portion 35 and contacts (abuts) the fixing contact surface 35a. In this way, the temperature measurement contact 3a can be simply and reliably brought into contact with the fixing contact surface 35a (temperature measurement fixing portion 35). Thus, the temperature measurement contact 3a can be smoothly fixed to the temperature measurement fixing portion 35.
The wire 3b is pressed toward the temperature measurement fixing portion 35 to maintain contact between the temperature measurement contact 3a and the fixing contact surface 35a, and the temperature measurement contact 3a and the fixing contact surface 35a are fixed (welded) by laser welding in this state. Specifically, laser light is irradiated to the fixing contact surface 35a to heat the same, and the temperature measurement contact 3a is melted by the heat to fix (weld) the same. At this time, as shown in fig. 3 (a), the temperature measurement fixing portion 35 is set in such a state that the distance between the fixing contact surfaces 35a gradually spreads upward from the soldering iron portion 6 side, so that the temperature measurement contact 3a can be brought into sufficient contact with the temperature measurement fixing portion 35. Thus, the heater nozzle unit 1 capable of performing good fixation of the temperature measurement contact 3a to the heater nozzle 2 and further capable of performing good temperature measurement can be constructed. Further, since the fixing contact surface 35a is formed in a flat surface and the temperature measurement contact 3a is formed in a spherical body, the temperature measurement contact 3a is easily in point contact with the fixing contact surface 35a. Further, by pressing the temperature measurement contact 3a against the anchor contact surface 35a, stress is easily concentrated, and the temperature measurement contact 3a is less likely to float from the anchor contact surface 35a. This makes it possible to fix the temperature measuring contact 3a to the heater tip 2 more favorably and to measure the temperature of the heater tip 2 more favorably.
When the temperature measurement contact 3a is fixed to the temperature measurement fixing portion 35, as shown in fig. 4 c, a part of the wire housing space 30 (a portion located between the stopper recesses 31) and the stopper recesses 31 are injected with a resin such as an ultraviolet curing resin or a thermosetting resin in a state before curing (a flowing state), and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin, thereby forming the wire stopper 32.
In the heating tip unit 1 configured by attaching the thermocouple 3 to the heating tip 2 in this manner, the lead wire 3b of the thermocouple 3 is accommodated in the lead wire accommodating hollow portion 30, and therefore, the lead wire 3b of the thermocouple 3 can be prevented from exceeding the range of the plate thickness of the heating tip 2. Thus, when the process such as the mounting work of the heating tip unit 1 to the thermocompression bonding device is performed, or when the heating tip unit 1 enters the work area, a defect in which the wire 3b is carelessly caught or even a defect in which the thermocouple 3 is detached from the heating tip is not likely to occur. In addition, when the plurality of heating tip units 1 are to be sorted during transportation (shipment) or storage, the heating tip units 1 can be stably overlapped without any trouble, and the transportation operation or storage operation can be smoothly performed.
Further, since the wire stopper 32 is provided in the wire housing space 30, the housed wire 3b can be prevented from coming off from the wire housing space 30. Further, since the resin injected into the wire housing space 30 and hardened is used as the wire stopper 32, the resin is easily put into the gap between the connection arm 7 and the wire 3b as the wire stopper 32, and the wire 3b can be sufficiently stopped. Further, since the stopper concave portion 31 communicating with the wire receiving space portion 30 is provided, and the resin as the wire stopper portion 32 is injected into the wire receiving space portion 30 and the stopper concave portion 31 to be hardened, the wire stopper portion 32 is not easily detached from the wire receiving space portion 30, and the defect that the wire 3b is detached from the wire receiving space portion 30 together with the wire stopper portion 32 can be suppressed.
As a work of thermocompression bonding the terminal wire a to the terminal member B using the heating tip unit 1, first, the heating tip unit 1 is mounted to a tip holder of the thermocompression bonding device in a state that the soldering iron tip portion 13 is on the lower side, and the wire 3B of the thermocouple 3 is connected to a thermocouple connection terminal (not shown) of the thermocompression bonding device. Thereafter, the terminal member B and the terminal wire a are placed in a working area (both not shown) provided below the mouth holder, and the terminal wire a is overlapped on the upper surface of the terminal member B. When the terminal member B and the terminal wire a are set, the heating tip unit 1 is lowered together with the tip holder to press the soldering iron tip end portion 13 against the terminal wire a, and the heating tip 2 is energized to heat the soldering iron body 11, so that the terminal wire a is thermally pressed against the terminal member B. The temperature of the soldering iron portion 6 is measured by the thermocouple 3, and a control unit (not shown) of the thermocompression bonding device performs energization control of the heating tip 2 based on the measured value, and further performs temperature control of the soldering iron tip portion 13.
Here, in the heating tip 2 for generating heat, since the plate thickness of the soldering iron body 11 is set to be smaller than the plate thickness of the connection arm portion 7 and the cross-sectional area of the soldering iron body 11 is set to be smaller than the cross-sectional area of the connection arm portion 7, even if the plate thickness of the heating tip 2 is set to be thicker, it is possible to suppress a defect that the current density in the soldering iron body 11 is reduced and heat generation becomes insufficient. Thus, good heat generation efficiency is easily achieved regardless of the increase or decrease in the plate thickness of the heating tip 2. Further, the volume of the iron body 11 can be prevented from increasing, and further, the heat capacity can be prevented from increasing, and the iron body 11 or the iron tip 13 can be easily and rapidly cooled. Further, since the groove 20 is extended from the lower portion of the connection arm portion 7 to the soldering iron body 11 to form the thin portion 21, and the surface of the thin portion 21 which is the bottom portion of the groove 20 is set as the side surface of the soldering iron body 11, the structure of the heating tip 2 in which the plate thickness of the soldering iron body 11 is thinner than the plate thickness of the connection arm portion 7 can be simply realized.
Further, since the soldering iron tip portion 13 is provided to protrude below the thin portion 21, when foreign matter (an insulating film of the terminal wire a or the like) adheres to the soldering iron tip portion 13 due to the thermo-compression bonding operation, the foreign matter is easily removed by grinding the tip end of the soldering iron tip portion 13 or the like. Further, the polishing margin of the tip end of the soldering iron tip portion 13 can be sufficiently ensured, and the replacement cycle (service life) of the heating tip unit can be prolonged. Further, since the thin portion 21 is formed closer to the connection arm portion 7 than the soldering iron tip portion 13 and the thickness of the side surface of the soldering iron body 11 is formed thinner than the thickness of the connection arm portion 7 after the thin portion 21 is removed, it is possible to suppress a decrease in current density in the soldering iron body 11 and to sufficiently secure the dimension in the plate thickness direction in the tip end surface of the soldering iron tip portion 13. This can expand the allowable range of the size of the workpiece (thermocompression bonding target) that can be thermocompression bonded by the heating tip 2. Further, since the thin portion 21 is formed at a position offset from the soldering iron tip portion 13 and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connection arm portion 7, it is not necessary to increase or decrease the plate thickness of the soldering iron tip portion 13 with respect to the plate thickness of the connection arm portion 7, and the heating tip 2 can be easily manufactured.
Further, since the centers in the thickness direction of the connection arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 are on the same plane, bending moment is less likely to occur in the heating tip 2 during the thermocompression bonding operation, and therefore, a defect in which an excessive load is applied to the heating tip 2 can be suppressed, and further, a defect in which the heating tip 2 is likely to be damaged can be suppressed. Further, since the thermocouple 3 is mounted as a temperature sensor to the soldering iron portion 6 of the heating tip 2, information on the temperature of the soldering iron portion 6 can be obtained and used for controlling the heat generation of the heating tip 2. Further, the temperature sensor can be realized by a simple structure.
However, in the above embodiment, the soldering iron body 11 is configured by forming the thin portions 21 by extending the grooves 20 on both front and back surfaces of the heating tip 2, but the present invention is not limited thereto. In short, any type of soldering iron body 11 may be provided to the heating tip 2 as long as the plate thickness of the soldering iron body 11 is set to be thinner than the plate thickness of the connection arm portion 7 and the cross-sectional area of the soldering iron body 11 is set to be smaller than the cross-sectional area of the connection arm portion 7. For example, the soldering iron body 11 may be formed by extending grooves in either the front or rear surface of the heating tip 2 to form the thin portion 21. However, since the soldering iron body 11 is biased to be located on either surface of the front and back of the heating tip 2, bending moment is generated in the heating tip 2 during the thermocompression bonding operation, it is preferable to adopt a structure in which the centers in the thickness direction of the connection arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 are located on the same plane, that is, the structure of the above embodiment. The soldering iron body 11 may be configured to include a portion having the highest resistance value (a portion to be a heat generating portion). Therefore, the region to be thinned by the groove or the like may be formed in the connection arm portion 7 or may be formed not entirely in the soldering iron body 11.
The plate thickness of the soldering iron tip portion 13 and the plate thickness of the connection arm portion 7 are set to the same dimensions, but the present invention is not limited thereto. For example, if the plate thickness of the soldering iron tip portion 13 is reduced to be thinner than the plate thickness of the connection arm portion 7, the degree of freedom in the plate thickness dimension of the soldering iron tip portion 13 can be increased, and it is easy to design the heating tip 2 corresponding to the size of the work (the terminal member B, the terminal wire a) to which the thermocompression bonding process is applied. As shown in fig. 3, the temperature measurement fixing portion 35 is formed to be smaller than the soldering iron tip portion 13 by one turn, but the present invention is not limited to this. For example, if the volume of the soldering iron tip portion 13 is set to be identical to the volume of the temperature measurement fixing portion 35 so as to avoid an extreme difference between the heat capacity of the soldering iron tip portion 13 and the heat capacity of the temperature measurement fixing portion 35, the temperature change at the temperature measurement fixing portion 35 can be synchronized with the temperature change at the soldering iron tip portion 13, and the temperature management of the soldering iron tip portion 13 can be easily performed based on the temperature measurement of the temperature measurement fixing portion 35.
The fixing contact surface 35a of the temperature measurement fixing portion 35 is formed in a flat surface, but the present invention is not limited to this. In short, the fixing contact surface 35a may be formed in a curved surface as long as the distance between the fixing contact surfaces 35a gradually spreads upward from the soldering iron portion 6 side. The temperature measuring contact (temperature measuring portion) 3a is not limited to a spherical shape, and may be formed in any shape, as long as the temperature measuring contact (temperature measuring portion) 3a can be sufficiently brought into contact with the fixing contact surface 35a. The temperature measurement junction 3a of the thermocouple 3 is welded and fixed to the temperature measurement fixing portion 35, but the present invention is not limited to this. In short, the fixing state of the temperature measuring contact 3a and the temperature measuring fixing portion 35 is not limited as long as the temperature of the soldering iron portion 6 can be measured. For example, the temperature measurement contact 3a and the temperature measurement fixing portion 35 may be fixed using a fixing agent (adhesive) having good heat conduction.
In the heating tip 2 of the above embodiment, the wire receiving space 30 is formed to extend linearly along the longitudinal direction of the connection arm 7, but the present invention is not limited thereto. In short, any configuration of the wire receiving hollow portion 30 may be applied as long as the wire 3b of the thermocouple 3 can be received. For example, the wire receiving space 30 extending in a bent line or a curved line can be applied. Further, although a resin such as an ultraviolet ray hardening resin or a thermosetting resin is exemplified as the wire stopper 32 in the present invention, the present invention is not limited thereto. In short, the form of the wire stopper 32 is not limited as long as the wire 3b accommodated in the wire accommodating space 30 can be stopped and prevented from falling out of the wire accommodating space 30. For example, a cap (cap) that can be fitted into the wire accommodating space 30 may be used as the wire stopper, or a protrusion that is integrally formed with the connection arm 7 and protrudes toward the wire accommodating space 30 may be used as the wire stopper.
An example of the wire stopper portion constituted by the protrusion is described, and the heating tip 2″ of the modification shown in fig. 4-1 is basically the same as the above-described embodiment (first embodiment), except that the stopper recess portion 31 for filling with resin is not formed, and instead, the rectangular protrusion-shaped wire stopper portion 37 is provided. Specifically, a plurality of (two in this modification) wire stoppers 37 are provided to protrude from the side surface of one of the connection arm portions 7 facing the wire receiving space 30 toward the other connection arm portion 7 in a state of being separated from each other in the longitudinal direction of the wire receiving space 30. Further, a plurality of (two in this modification) wire stoppers 37 are provided so as to protrude toward one of the connection arm portions 7 from the side surface of the other connection arm portion 7 facing the wire receiving space portion 30 in a state of being separated from each other in the longitudinal direction of the wire receiving space portion 30 and in a state of being prevented from being opposed to the wire stopper 37 on the one connection arm portion 7 via the wire receiving space portion 30. As shown in fig. 4-1 (d), the wire stoppers 37 on one of the connection arm portions 7 are arranged at positions close to the surface of the heater nozzle 2", and the wire stoppers 37 on the other connection arm portion 7 are arranged at positions close to the rear surface of the heater nozzle 2", so that the wire stoppers 37 are positioned at positions offset from each other along the longitudinal direction of the wire housing space 30.
As shown in fig. 4-1 (b), the wire engaging portions 37a of the wire stoppers 37, which are capable of engaging with the outer peripheral surfaces of the wires 3b, are curved, so that the wires 3b and the wire stoppers 37 are easily brought into surface contact. In addition, when wire cutting (wire electric discharge machining) of a plate material serving as a material of the heating tip 2″ is performed, the wire stopper 37 is formed by forming a rectangular protrusion in the wire accommodating space 30, and then, an electrode for electric discharge machining (die-cut electric discharge machining) is formed by approaching the protrusion from the outside of the wire accommodating space 30 to form a wire clamping portion 37a and is provided in the heating tip 2″. The method of forming the wire engaging portion 37a is not limited to electric discharge machining, and may be, for example, laser machining.
As described above, by adopting the wire stopper 37 integrally formed with the connection arm 7, the function of preventing the wire 3b from coming off can be achieved with a simple configuration. In addition, the filling work of the resin or the waiting time until the resin is hardened is not required, so that the efficiency of the manufacturing work of the heating nozzle unit can be improved.
The stopper recess 31 communicating with the wire receiving space 30 is formed by a shallow notch in the side surface of the wire receiving space 30, but the present invention is not limited thereto. In short, as long as the resin as the wire stopper 32 is injected from the wire receiving space 30 to the stopper recess 31 and is curable, the constitution of the stopper recess 31 may take any form. For example, a groove-shaped stopper recess may be formed on each of the front and back surfaces of the connection arm portion 7, and the end of the stopper recess may be connected to the wire receiving space portion 30 to allow the resin (wire stopper portion 32) to be injected from the wire receiving space portion 30 to the stopper recess.
In the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measurement junction 3a of the thermocouple 3 is exemplified as the temperature measurement portion of the present invention, but the present invention is not limited thereto. In short, any type of temperature sensor may be used as long as it is a temperature sensor configured to be able to measure the temperature of the soldering iron portion 6 and to provide a temperature measuring portion at the end of the lead wire 3b, and it is possible to mount the temperature sensor to the heating tip 2.
However, in the above embodiment, the groove 20 is exemplified as the gouging portion of the present invention, but the present invention is not limited thereto. In other words, the gouging portion may be set to any configuration as long as the thin portion is formed in the heating tip by extending the gouging portion in a direction from one of the connection arm portions toward the other connection arm portion. For example, the heating tip 2' of the second embodiment shown in fig. 5 and 6 is basically the same as the above-described embodiment (first embodiment), except that: the soldering iron body having two legs is formed by forming a gouged part not only on the front and back surfaces of the heating tip 2' but also in the middle part of the heating tip 2' in the plate thickness direction so that the lower half part of the heating tip 2' is branched into two.
Specifically, in the heating tip 2', a solder iron space portion 40 extending in the left-right direction (the direction from one connecting arm portion 7 toward the other connecting arm portion 7) is formed as a gouged portion in the middle portion in the plate thickness direction of the solder iron portion 6' located at the lower portion of the heating tip 2', and the solder iron space portion 40 is opened downward. Further, a soldering iron body 11 and a soldering iron tip 13 are provided on both front and back sides of the heating tip 2' via a soldering iron space 40. In other words, in the soldering iron portion 6 'of the heating tip 2', two soldering iron bodies 11 apart from each other and two soldering iron tip portions 13 apart from each other are provided. Further, in each of the iron bodies 11, a groove 20 is formed on the outer surface and a groove 20' is also formed on the inner surface, and each of the iron bodies includes an iron concave portion 15 in which a temperature measurement fixing portion 35 is projected, and a temperature measurement contact (temperature measurement portion) 3a of the thermocouple 3 can be fixed to each of the temperature measurement fixing portions 35, and the plate thickness of each of the iron tip portions 13 is set to be smaller than the plate thickness of the connection arm portion 7 at each of the iron tip portions 13.
By configuring the heating tip 2 'having the soldering iron portion 6', the two soldering iron tip portions 13 can simultaneously perform the thermocompression bonding processing of the two portions, and the efficiency of the thermocompression bonding operation can be improved. Further, by setting the dimension of the soldering iron space portion 40 in the plate thickness direction, the distance (pitch) between the two soldering iron tip portions 13 or the size of the soldering iron tip surface 13a of each soldering iron tip portion 13 can be adjusted according to the work.
In the above embodiment, an oxidation-resistant coating layer may be formed on the surface of the heating tip to improve oxidation resistance.
The oxidation-resistant coating layer will be described below.
In the heating tip, the temperature is repeatedly raised and cooled every time the hot press bonding is performed, and therefore the surface is liable to oxidize, and particularly, oxidation is remarkable in the vicinity of the soldering iron portion 6 (heat generating portion) and the portion where the thermocouple 3 is soldered. Accordingly, the oxidized portion in the vicinity of the heat generating portion is peeled off to lower the strength, and the thermocouple is broken when pressurized, and the welded portion of the thermocouple is corroded to lower the strength, resulting in defects such as detachment of the thermocouple and failure in use.
Therefore, in the present embodiment, the oxidation resistance is improved by forming the oxidation resistance coating layer on the surface of the heating tip. Hereinafter, a specific description will be given including the manufacturing process.
First, as for the metal plate to be a material (base material), specifically, it is preferable to use a so-called super hard material (hardness HV900 to 2400) (formal name: super hard alloy, an alloy obtained by sintering a powder of a hard metal carbide) which has been generally used in the past, such as tungsten (hardness HV430 or the like), and which has more excellent abrasion resistance than tungsten alloy (hardness HV200 to 400 or the like), and cut a plate of the super hard material into a predetermined shape by wire cutting. Then, the cut piece was subjected to a pretreatment for plating, then immersed in a dissolution tank, and energized, whereby an oxidation-resistant coating layer formed of nickel was formed on the surface of the cut piece, that is, nickel plating was performed. Then, the solution is pulled up from the dissolution tank to perform post-treatment such as washing.
Further, as in the above-described embodiment, the temperature measurement junction 3a of the thermocouple 3 is laser welded to the temperature measurement fixing portion 35. In this welding, since a coating film of a nickel layer is formed on the surface (the fixing contact surface 35 a) of the temperature measurement fixing portion 35, wettability is improved, and thereby welding reliability and welding strength are improved. In addition, if wettability at the time of welding is improved, it is possible to suppress laser output more than before, suppress damage to the base material, and achieve improvement in quality and saving in energy consumption.
When the welding of the thermocouple 3 is completed, a further pre-plating treatment is performed, the heating tip unit 1 provided with the thermocouple 3 is immersed in an electrolyte, and nickel plating is performed on the entire surface including the temperature measurement junction 3a of the thermocouple 3.
When the heating tip unit 1 manufactured in this manner is used, the oxidation resistance is improved, and therefore peeling or strength decrease due to oxidation of the soldering iron portion 6 and the attachment portion of the thermocouple 3 can be suppressed, and durability can be improved. In particular, when the base material is made of a superhard material and nickel plating is performed, wettability and weldability can be improved, and durability can be reliably improved. Further, since the main component of the thermocouple is nickel, the affinity of nickel plating is good. The oxidation-resistant coating is not limited to nickel plating, and may be gold plating, for example.
Moreover, the embodiments described are illustrative in all aspects and should not be construed as limiting the invention. The present invention is not limited to the above description, and is intended to be illustrative of the present invention and includes all modifications within the meaning and scope equivalent to the present invention.
Description of the reference numerals
1. Heating nozzle unit
2. 2', 2' heating nozzle
3. Thermocouple
3a temperature measuring contact
3b wire
6. 6' soldering iron part
7. Connection arm
11. Soldering iron body
13. Front end of soldering iron
13a front end face of soldering iron
15. Soldering iron concave part
17. Mounting hole
20. 20' ditch
21. Thin wall part
25. Core wire
26. Core wire coating material
27. Outer coating material
30. Wire accommodating hollow part
30a opening mouth
31. Stop recess
32. Wire stop
35. Temperature measurement fixing part
35a fixation contact surface
36. Groove
37. Wire stop
37a wire clamping part
40. Soldering iron space part.
Claims (11)
1. A heating nozzle unit formed by mounting a temperature sensor on a plate-shaped heating nozzle for thermocompression bonding a terminal wire to a terminal member, the heating nozzle unit characterized in that,
the heating nozzle is provided with:
a soldering iron part which is provided with a soldering iron front end part abutting against the terminal lead wire on the soldering iron body; and
a pair of connection arm parts extending upward from left and right end parts of the soldering iron body in a state of being separated from each other, and allowing a current from a power supply to flow through the soldering iron body to heat the soldering iron part,
the gap between the connecting arm parts is set as a wire receiving hollow part with an open upper end part, the wire receiving hollow part accommodates the wire of the temperature sensor,
a thin portion is formed in a range from a lower portion of the connection arm portion to the soldering iron body, a dimension of the thin portion in a direction along which the pair of connection arm portions are arranged is set to be gradually narrowed toward a lower portion, and the soldering iron tip portion is provided to protrude below the thin portion.
2. The heating tip unit of claim 1, wherein the heating tip unit comprises a heater,
the wire receiving space is provided with a wire stopper for stopping the received wire.
3. The heating tip unit of claim 2, wherein,
the wire stopper is a resin injected into the wire receiving space and hardened.
4. A heating tip unit according to claim 3, wherein,
the heating nozzle unit includes a stopper recess communicating with the wire receiving space, and resin serving as a wire stopper is injected into the wire receiving space and the stopper recess to be hardened.
5. The heating tip unit of claim 2, wherein,
the wire stopper is a protrusion integrally formed with the connection arm and protruding toward the wire receiving space.
6. The heating tip unit according to any one of claims 1 to 5, wherein,
a temperature measuring fixing part for fixing a temperature measuring part of the temperature sensor is arranged at a position facing the lower end part of the lead accommodating empty part in the soldering iron part.
7. The heating tip unit of claim 6, wherein the heating tip unit comprises a heater,
and the heating nozzle is provided with an oxidation-resistant coating layer at least on the surfaces of the soldering iron part and the temperature measurement fixing part.
8. The heating tip unit of claim 7, wherein the heating tip unit comprises a heater,
an oxidation-resistant coating layer is formed on the surface of the temperature measuring part fixed on the temperature measuring fixing part.
9. The heating tip unit of claim 7, wherein the heating tip unit comprises a heater,
the oxidation-resistant coating layer is a nickel coating.
10. The heating tip unit of claim 6, wherein the heating tip unit comprises a heater,
the temperature measuring fixing part is provided with a pair of fixing contact surfaces for the temperature measuring part to contact, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
11. The heating tip unit according to any one of claims 1 to 5, wherein,
the temperature sensor is a thermocouple, and the lead wire of the temperature sensor comprises a core wire of the thermocouple.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-151044 | 2020-09-09 | ||
| JP2020151044A JP7137236B2 (en) | 2020-09-09 | 2020-09-09 | heater chip unit |
| PCT/JP2021/027195 WO2022054420A1 (en) | 2020-09-09 | 2021-07-20 | Heater chip unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115379917A CN115379917A (en) | 2022-11-22 |
| CN115379917B true CN115379917B (en) | 2023-09-01 |
Family
ID=80632530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180027326.1A Active CN115379917B (en) | 2020-09-09 | 2021-07-20 | Heating nozzle unit |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7137236B2 (en) |
| KR (1) | KR20220126796A (en) |
| CN (1) | CN115379917B (en) |
| MY (1) | MY196754A (en) |
| TW (1) | TW202224820A (en) |
| WO (1) | WO2022054420A1 (en) |
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| JP2018012200A (en) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Ｐｄａ | Heater chip, joint device and joint method |
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-
2020
- 2020-09-09 JP JP2020151044A patent/JP7137236B2/en active Active
-
2021
- 2021-07-20 MY MYPI2022004863A patent/MY196754A/en unknown
- 2021-07-20 KR KR1020227030265A patent/KR20220126796A/en not_active Application Discontinuation
- 2021-07-20 WO PCT/JP2021/027195 patent/WO2022054420A1/en active Application Filing
- 2021-07-20 CN CN202180027326.1A patent/CN115379917B/en active Active
- 2021-09-06 TW TW110133048A patent/TW202224820A/en unknown
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| JPH0661639A (en) * | 1992-08-04 | 1994-03-04 | Fujitsu Ltd | Wire bonding chip structure |
| US5864118A (en) * | 1997-04-30 | 1999-01-26 | Seagate Technology, Inc. | Soldering instrument with heated tip and protective heat shield associated therewith |
| JP2005319468A (en) * | 2002-05-15 | 2005-11-17 | Kobo Pda Co Ltd | Heater chip for thermocompession bonding |
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Also Published As
| Publication number | Publication date |
|---|---|
| MY196754A (en) | 2023-05-03 |
| CN115379917A (en) | 2022-11-22 |
| WO2022054420A1 (en) | 2022-03-17 |
| KR20220126796A (en) | 2022-09-16 |
| TW202224820A (en) | 2022-07-01 |
| JP7137236B2 (en) | 2022-09-14 |
| JP2022045443A (en) | 2022-03-22 |
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