MY196754A - Heater chip unit - Google Patents

Heater chip unit

Info

Publication number
MY196754A
MY196754A MYPI2022004863A MYPI2022004863A MY196754A MY 196754 A MY196754 A MY 196754A MY PI2022004863 A MYPI2022004863 A MY PI2022004863A MY PI2022004863 A MYPI2022004863 A MY PI2022004863A MY 196754 A MY196754 A MY 196754A
Authority
MY
Malaysia
Prior art keywords
lead wire
trowel
heater chip
main body
chip unit
Prior art date
Application number
MYPI2022004863A
Inventor
Shinichiro Suga
Original Assignee
Apollo Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Giken Co Ltd filed Critical Apollo Giken Co Ltd
Publication of MY196754A publication Critical patent/MY196754A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Resistance Heating (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

A heater chip unit (1) in which inconvenience of carelessly hooking a lead wire (3b) of a temperature sensor is not prone to occur is provided. Specifically, in a heater chip unit (1) in which a thermocouple (3) is attached to a plate-shaped heater chip (2) for thermally press-fitting a terminal lead wire to a terminal member, the heater chip (2) includes a trowel portion (6) having a trowel tip portion (13) to be in contact with the terminal lead wire in a trowel main body (11), and a pair of connecting arm portions (7) that are extended upward from left and right end portions of the trowel main body (11) while spaced from each other, and causes current from a power supply to flow into the trowel main body (11) to increase a temperature of the trowel portion (6), and a gap between the connecting arm portions (7) is set as a lead wire accommodating hollow portion (30) having an opened upper end portion, and a lead wire (3b) of the thermocouple (3) is accommodated in the lead wire accommodating hollow portion (30).
MYPI2022004863A 2020-09-09 2021-07-20 Heater chip unit MY196754A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151044A JP7137236B2 (en) 2020-09-09 2020-09-09 heater chip unit
PCT/JP2021/027195 WO2022054420A1 (en) 2020-09-09 2021-07-20 Heater chip unit

Publications (1)

Publication Number Publication Date
MY196754A true MY196754A (en) 2023-05-03

Family

ID=80632530

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022004863A MY196754A (en) 2020-09-09 2021-07-20 Heater chip unit

Country Status (6)

Country Link
JP (1) JP7137236B2 (en)
KR (1) KR20220126796A (en)
CN (1) CN115379917B (en)
MY (1) MY196754A (en)
TW (1) TW202224820A (en)
WO (1) WO2022054420A1 (en)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0661639A (en) * 1992-08-04 1994-03-04 Fujitsu Ltd Wire bonding chip structure
US5864118A (en) * 1997-04-30 1999-01-26 Seagate Technology, Inc. Soldering instrument with heated tip and protective heat shield associated therewith
JP2005319468A (en) * 2002-05-15 2005-11-17 Kobo Pda Co Ltd Heater chip for thermocompession bonding
JP4081396B2 (en) * 2003-03-27 2008-04-23 京セラ株式会社 Thermocouple mounting structure of ceramic heater
JP3917964B2 (en) * 2003-08-22 2007-05-23 株式会社 工房Ｐｄａ Heater chip for thermocompression bonding
US8274011B2 (en) * 2009-01-24 2012-09-25 Hakko Corporation Soldering device and method of making same
JP2010253503A (en) * 2009-04-23 2010-11-11 Miyachi Technos Corp Heater chip and joining apparatus
JP5457107B2 (en) 2009-05-19 2014-04-02 ミヤチテクノス株式会社 Heater chip and joining device
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method
JP5794577B2 (en) * 2011-10-21 2015-10-14 株式会社アマダミヤチ Heater chip, joining device, joining method, and conductor thin wire and terminal connection structure
WO2017038282A1 (en) * 2015-08-28 2017-03-09 株式会社工房Pda Heater chip, bonding device, and bonding method
JP6677406B2 (en) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ Heater chip, joining device and joining method
JP6851610B2 (en) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ Heater tip and joining device and joining method
US20190299311A1 (en) * 2018-03-28 2019-10-03 Hakko Corporation High Power Dual Sensor Cartridge

Also Published As

Publication number Publication date
JP2022045443A (en) 2022-03-22
WO2022054420A1 (en) 2022-03-17
CN115379917B (en) 2023-09-01
TW202224820A (en) 2022-07-01
KR20220126796A (en) 2022-09-16
CN115379917A (en) 2022-11-22
JP7137236B2 (en) 2022-09-14

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