CN115379917A

CN115379917A - Heating nozzle unit

Info

Publication number: CN115379917A
Application number: CN202180027326.1A
Authority: CN
Inventors: 须贺伸一郎
Original assignee: Apolo Technology Research Co ltd
Current assignee: Apolo Technology Research Co ltd
Priority date: 2020-09-09
Filing date: 2021-07-20
Publication date: 2022-11-22
Anticipated expiration: 2041-07-20
Also published as: WO2022054420A1; CN115379917B; JP7137236B2; KR20220126796A; MY196754A; JP2022045443A; TW202224820A

Abstract

The invention provides a heating nozzle unit which is not easy to generate the defect of carelessly clamping a lead of a temperature sensor. Specifically, the heating nozzle unit (1) is formed by mounting a thermocouple (3) on a plate-shaped heating nozzle (2) for thermocompression bonding a terminal lead wire to a terminal member, and the heating nozzle (2) is provided with: a soldering iron part (6) provided with a soldering iron tip (13) that abuts against a terminal lead on a soldering iron body (11); and a pair of connecting arm sections (7) which extend upward from the left and right end sections of the soldering iron body (11) in a spaced-apart state and which allow current from a power supply to flow through the soldering iron body (11) to heat the soldering iron section (6), wherein a gap between the connecting arm sections (7) is provided as a lead wire receiving space (30) having an open upper end portion, and a lead wire (3 b) of the thermocouple (3) is received in the lead wire receiving space (30).

Description

Heating nozzle unit

Technical Field

The present invention relates to a heating nozzle unit for thermocompression bonding a terminal lead to a terminal member.

Background

In the work of thermocompression bonding a lead wire for a terminal to a terminal member, for example, in the work of thermocompression bonding a lead wire to a terminal portion of an iron core in manufacturing an electronic component such as a chip inductor (chip inductor), a heating nozzle unit for thermocompression bonding is used. Specifically, a thermocouple is attached as a temperature sensor to a heating nozzle whose temperature is increased in a soldering iron portion to constitute a heating nozzle unit, and the heating nozzle unit is attached to a tool holder (tool holder) of a thermocompression bonding apparatus. Then, the thermocompression bonding apparatus is operated to rapidly heat the terminal lead wire placed on the terminal member while pressing the terminal lead wire with the soldering iron portion of the heating tip, thereby thermocompressively bonding the terminal lead wire to the terminal member (see, for example, patent document 1).

Documents of the prior art

Patent document

Patent document 1: japanese patent No. 5457107

Disclosure of Invention

Problems to be solved by the invention

However, in the heating nozzle (heating nozzle unit) described in the above patent document, the core wire (lead wire of the temperature sensor) of the thermocouple is passed through the protection tube to be protected, and further, passed through the holder hole provided in the heating nozzle together with the protection tube to be held. However, since the core wire of the thermocouple and the protection tube are drawn out from the surface of the heating nozzle, when the heating nozzle unit is attached to the thermocompression bonding apparatus, there is a possibility that the core wire may be a hindrance or the core wire may be inadvertently caught and the thermocouple may be detached from the heating nozzle.

In addition, when the thermal compression bonding apparatus is operated to cause the heating nozzle unit to enter the working area or perform the thermal compression bonding work, the core wire may be inadvertently caught by another tool (an auxiliary tool for clamping the workpiece or the like) and the thermocouple may be detached from the heating nozzle. Therefore, there is a possibility that the movement of the heating nozzle unit into a narrow working area is hindered.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a heating nozzle unit in which a defect that a lead wire of a temperature sensor is inadvertently caught is unlikely to occur.

Means for solving the problems

The present invention has been made to achieve the above object, and a first aspect of the present invention provides a heating nozzle unit in which a temperature sensor is attached to a plate-shaped heating nozzle for thermocompression bonding a terminal lead to a terminal member,

the heating nozzle is provided with:

a soldering iron part, wherein a soldering iron front end part abutting against the terminal lead is arranged on the soldering iron body; and

a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a spaced-apart state and heating the soldering iron portion by passing a current from a power source through the soldering iron body,

the gap between the connection arm portions is provided as a lead wire housing space having an open upper end portion, and a lead wire of the temperature sensor is housed in the lead wire housing space.

A heating nozzle unit of a second aspect is the heating nozzle unit of the first aspect, characterized in that a wire stopper portion that stops the received wire is provided in the wire receiving empty portion.

A heating nozzle unit according to a third aspect is the heating nozzle unit according to the second aspect, wherein the wire stopper portion is a resin that is injected into the wire housing hollow portion and is cured.

A heating nozzle unit according to a fourth aspect is the heating nozzle unit according to the third aspect, wherein the heating nozzle unit includes a stopper recess communicating with the lead wire accommodating space, and resin serving as the lead wire stopper is injected into the lead wire accommodating space and the stopper recess and cured.

A heating nozzle unit according to a fifth aspect is the heating nozzle unit according to the second aspect, wherein the wire stopper portion is a protrusion integrally formed on the connecting arm portion and protruding toward the wire receiving space portion.

A heating nozzle unit according to a sixth aspect is the heating nozzle unit according to any one of the first to fifth aspects, wherein a temperature measurement fixing portion to which the temperature measurement portion of the temperature sensor is fixed is provided at a position facing a lower end portion of the wire receiving hollow portion in the soldering iron portion.

A heating nozzle unit according to a seventh aspect is the heating nozzle unit according to the sixth aspect, wherein the heating nozzle has an oxidation-resistant coating layer formed on at least surfaces of the soldering iron portion and the temperature measurement fixing portion.

A heating nozzle unit according to an eighth aspect is the heating nozzle unit according to the seventh aspect, wherein an oxidation-resistant coating layer is formed on a surface of the temperature measuring part fixed to the temperature measuring fixing part.

A heating nozzle unit according to a ninth aspect is the heating nozzle unit according to the seventh or eighth aspect, wherein the oxidation-resistant coating layer is a nickel coating.

A heating tip unit according to a tenth aspect is the heating tip unit according to any one of the sixth to ninth aspects, wherein the temperature measurement fixing section includes a pair of fixing contact surfaces with which the temperature measurement section contacts, and the fixing contact surfaces are set in a state in which a distance between the fixing contact surfaces gradually increases as going upward from the soldering iron portion side.

The heating nozzle unit according to an eleventh aspect is the heating nozzle unit according to any one of the first to tenth aspects, characterized in that the temperature sensor is a thermocouple, and a lead wire of the temperature sensor is constituted including a core wire of the thermocouple.

Effects of the invention

The present invention has the following excellent effects.

According to the invention of the first aspect, since the gap between the connecting arm portions is provided as the lead wire accommodating hollow portion whose upper end portion is open, and the lead wire of the temperature sensor is accommodated in the lead wire accommodating hollow portion, it is possible to avoid the lead wire of the temperature sensor from exceeding the range of the plate thickness of the heating nozzle. Therefore, when the heating nozzle unit is mounted on the thermal compression bonding device or enters the working area, the defect of carelessly clamping the lead wire or the defect of falling off of the temperature sensor from the heating nozzle are not easy to occur.

According to the second aspect of the invention, since the wire receiving space is provided with the wire stopper portion for stopping the received wire, it is possible to prevent a defect that the received wire falls off from the wire receiving space.

According to the third aspect of the present invention, since the lead stopper portion is made of the resin which is injected into the lead housing hollow portion and cured, the resin can be easily put into the gap between the connecting arm portion and the lead as the lead stopper portion, and the lead can be sufficiently stopped.

According to the fourth aspect of the invention, since the heating nozzle unit includes the stopper recess portion communicating with the lead wire accommodating space portion, and the resin serving as the lead wire stopper portion is injected into the lead wire accommodating space portion and the stopper recess portion and hardened, the lead wire stopper portion is less likely to fall off from the lead wire accommodating space portion, and a defect that the lead wire falls off from the lead wire accommodating space portion along with the lead wire stopper portion can be suppressed.

According to the fifth aspect of the invention, since the lead stopper portion is a protrusion integrally formed on the connecting arm portion and protruding toward the lead housing hollow portion, the function of preventing the lead from coming off can be realized with a simple configuration.

According to the sixth aspect of the invention, since the temperature measurement fixing portion to which the temperature measurement portion of the temperature sensor is fixed is provided at the position of the soldering iron portion facing the lower end portion of the wire housing hollow portion, the temperature measurement portion can be simply brought into contact with the temperature measurement fixing portion by inserting the temperature sensor into the wire housing hollow portion from the open upper end with the temperature measurement portion as the tip. Thus, the temperature measuring part of the temperature sensor can be smoothly fixed to the temperature measuring fixing part.

According to the seventh to ninth aspects of the invention, oxidation of the surface of the heating nozzle can be suppressed and durability can be improved even if temperature rise and cooling are repeated.

According to the tenth aspect of the invention, since the temperature measurement fixing unit is set in a state in which the distance between the fixing contact surfaces gradually increases from the soldering iron portion side toward the upper side, the temperature measurement unit of the temperature sensor can be brought into sufficient contact with the temperature measurement fixing unit, the temperature measurement unit can be favorably fixed to the heating tip, and the heating tip unit can perform favorable temperature measurement.

According to the invention of the eleventh aspect, since the temperature sensor is a thermocouple and the wire of the temperature sensor is configured to include the core wire of the thermocouple, the temperature sensor of the heating nozzle unit can be realized with a simple structure.

Drawings

Fig. 1 is a perspective view of a heating nozzle unit.

Fig. 2 is an explanatory view of the heating nozzle, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.

FIG. 3 is an explanatory view of a temperature measuring fixing part of a heating nozzle, wherein (a) is a front view and (b) is a sectional view.

Fig. 4 is an explanatory view of a procedure of mounting the thermocouple to the heating nozzle, (a) is a state before inserting the thermocouple into the heating nozzle, (b) is a state after inserting the thermocouple into the heating nozzle, and (c) is a state after injecting resin as a lead stopper portion into the lead housing space and the stopper recess.

Fig. 4-1 is an explanatory view of a heating nozzle including a protrusion integrally formed on a connecting arm portion as a wire stopper, (a) is a perspective view, (b) is a plan view, (c) is a front view, and (d) is a side view in which the wire stopper is drawn by a broken line.

Fig. 5 is a perspective view of a heating tip provided with two iron portions.

Fig. 6 is an explanatory view of a heating tip provided with two iron portions, wherein (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a side view.

Detailed Description

The mode for carrying out the invention is explained below with reference to the drawings.

As shown in fig. 1 and 2, the heating nozzle unit 1 includes: a plate-shaped heating nozzle 2 for thermocompression bonding the terminal lead a to the terminal member B (see fig. 2 (d)); and a thermocouple 3 attached to the heating nozzle 2 as a temperature sensor. The heating nozzle 2 is a nozzle formed by machining a plate material of a conductive material (tungsten, molybdenum, an ultra-hard material, or the like) by wire electric discharge machining, and as shown in fig. 2, the heating nozzle 2 includes: a soldering iron portion 6 serving as a lower portion (a distal end portion on the side of the workpiece (the terminal wire a or the terminal member B)) of the heating tip 2; and a pair of right and left connecting arm portions 7 serving as upper portions (base portions). When current is supplied to the soldering iron portion 6 through the connecting arm portion 7, the resistance causes the soldering iron portion 6 to generate heat, and the thermocouple 3 can measure the temperature of the soldering iron portion 6.

The soldering iron portion 6 includes a horizontally long soldering iron body 11 in which the lower portions of the connecting arm portions 7 are connected to each other, and the horizontal width of the soldering iron body 11 (the dimension along the horizontal direction in which the pair of connecting arm portions 7 are arranged) is set to be gradually narrower toward the lower portion of the heating tip 2. A box-shaped soldering iron tip portion 13 is provided to protrude downward from the bottom of the soldering iron body 11 that protrudes slightly downward, and the bottom surface (tip surface) of the soldering iron tip portion 13 can be brought into contact with the terminal lead a as a soldering iron tip surface 13 a. A generally rectangular soldering iron recess 15 is formed in an upper portion (on the side of the connecting arm portion 7) of the soldering iron body 11 on the side opposite to the soldering iron tip portion 13, and a temperature measuring contact (temperature measuring portion) 3a of the thermocouple 3 is fixed in the soldering iron recess 15. The structure to which the temperature measuring contact 3a is fixed will be described in detail later.

The connecting arm portions 7 are vertically long components extending upward from the left and right ends of the soldering iron body 11, and are provided in a state where the connecting arm portions 7 are spaced apart from each other. Further, in the upper portion (extending end portion) of the connecting arm portion 7, a mounting hole 17 for mounting to a tip holder (not shown) of the thermocompression bonding apparatus is formed to penetrate in the plate thickness direction of the heating tip 2, and a mounting bolt (not shown) inserted through the mounting hole 17 is screwed to the tip holder, whereby the heating tip unit 1 is mounted to the tip holder with the soldering iron tip portion 13 facing downward.

In the heating nozzle unit 1 attached to the nozzle holder, one connecting arm portion 7 is electrically connected to one end of a power supply for a heater (not shown) of the thermocompression bonding apparatus, and the other connecting arm portion 7 is electrically connected to the other end of the power supply for the heater. When an electric current is supplied from a power source (heater power source) to the heating tip 2, the electric current flows through the connection arm 7 into the soldering iron body 11, the soldering iron body 11 generates heat by a resistance in the soldering iron body 11, and the temperature of the soldering iron tip portion 13 is raised by the heat. Further, although the current in the soldering iron body 11 flows from one connecting arm portion 7 side toward the other connecting arm portion 7 side, the cross-sectional area of the reduced diameter portion located at the corner portion of the soldering iron recess 15 in the path through which the current flows is narrower than the cross-sectional area of the other portion, so that the current density becomes highest at the reduced diameter portion, and joule heat due to electric resistance tends to occur around this portion.

As shown in fig. 1 and 2 (d), the heating tip 2 is configured such that grooves 20 as the grooves of the present invention extend in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) in the range from the lower portion of the connecting arm portion 7 to the soldering iron body 11 on both front and back surfaces of the heating tip 2, and a thin portion 21 is formed by the extension of the grooves 20 on the front and back surfaces, and the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21. In other words, the thin portion 21 is formed at a position shifted from the soldering iron tip portion 13 (more specifically, closer to the connection arm portion 7 side than the soldering iron tip portion 13).

As shown in fig. 2 d, the depth dimension (the dimension in the thickness direction of the heating tip 2) of the front and back grooves 20 is set to be the same, the centers of the connecting arm portion 7, the soldering iron body 11 (the thin portion 21), and the soldering iron tip portion 13 in the thickness directions are located on the same plane, and the thickness of the soldering iron tip portion 13 is set to be the same as the thickness of the connecting arm portion 7. The surface of the thin portion 21 that forms the bottom of the groove 20 is a side surface (front and back surfaces) of the soldering iron body 11, the plate thickness of the soldering iron body 11 (the plate thickness of the thin portion 21) is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the soldering iron body 11 (in other words, the cross-sectional area of a flow path through which current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7. The thickness t1 of the side surface of the soldering iron body 11 is formed to be thinner than the thickness t2 of the connecting arm portion 7 (more specifically, the thickness of the connecting arm portion 7 after the thin portion 21 is removed (the thickness of a portion of the connecting arm portion 7 which is shifted from the thin portion 21)) t2 (see fig. 1 and fig. 2 (d)).

Next, the structure of the thermocouple 3 attached to the heating nozzle 2 and the heating nozzle 2 to which the thermocouple 3 is attached will be described.

As shown in fig. 1 and 3, the thermocouple 3 is configured such that the tips of two types of core wires 25 are welded to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a, the core wires 25 are covered with an electrically insulating core wire covering material 26, and the core wires are bundled into a single wire by being covered with an outer covering material 27 to form a lead wire 3b. In other words, the wire 3b is constituted so as to include the core wire 25. The diameter of the temperature measuring contact 3a and the wire diameter of the lead wire 3b are set to be smaller than the thickness of the heating nozzle 2.

In the heating tip 2, a receiving portion for the lead wire 3b is provided in a gap between the connecting arm portions 7, and a fixing portion for the temperature measuring contact 3a is provided in the soldering iron portion 6. Specifically, as shown in fig. 1 and 2 (a) and (b), the gap between the connection arm portions 7 extending in the longitudinal direction of the connection arm portions 7 is set to a width (thickness, width) one turn larger than the wire diameter of the lead wire 3b, and the lead wire 3b is housed in the lead wire housing hollow portion 30 with the upper end portion thereof open, in a state in which the lead wire 3b does not protrude outward from each of the front and back surfaces of the heating nozzle 2 (more specifically, a portion of the lead wire 3b located close to the temperature measuring contact 3 a). The lead wire 3b is extended from the opening 30a at the upper end of the lead wire receiving hollow portion 30, and the lower end of the lead wire receiving hollow portion 30 is expanded to communicate with the soldering iron recess 15 (see fig. 1).

In each of the arm portions 7, a notch is formed in a part of a side surface facing the wire housing hollow portion 30, stopper concave portions 31 are formed in a state of communicating with the wire housing hollow portion 30, and a wire stopper portion 32 is provided in each of the stopper concave portions 31 and a part of the wire housing hollow portion 30 (a portion located between the stopper concave portions 31) by being cured after injecting a resin such as an ultraviolet curing resin or a thermosetting resin, and the wire stopper portion 32 prevents the wire 3b from being displaced from the wire housing hollow portion 30 and protruding from the heating tip 2.

A temperature measurement fixing portion 35 to which the temperature measurement contact 3a of the thermocouple 3 is fixed is provided in a portion facing an end portion (lower end portion) of the lead wire accommodating hollow portion 30 in the soldering iron recess 15 formed in the soldering iron portion 6 so as to protrude toward the upper connecting arm portion 7 side. As shown in fig. 3, the temperature measurement fixing part 35 is a protrusion protruding from the soldering iron tip 13 through the soldering iron body 11, and is formed to be smaller than the soldering iron tip 13 by one turn. In addition, a pair of fixing contact surfaces 35a, which the temperature measuring contact 3a contacts, are provided at a portion facing the wire housing recess 30 (an upper portion of the temperature measuring fixing portion 35) so as to face an end portion of the wire housing recess 30, and a distance between the fixing contact surfaces 35a is set in a state in which the distance gradually increases from the soldering iron portion 6 side toward the wire housing recess 30 side upward. Further, the fixing contact surfaces 35a are formed in a flat surface, so that a V-shaped recess 36 is formed in the upper portion of the temperature measuring fixing portion 35 (the upper portion on the side of the lead accommodating space portion 30), and the temperature measuring contact 3a is received in the recess 36 to be in contact with the fixing contact surfaces 35a, and the temperature measuring contact 3a is fixed to the soldering iron portion 6 (the temperature measuring fixing portion 35) by soldering or the like in this state.

Next, a manufacturing procedure of the heating nozzle unit 1, particularly, an attaching procedure of the thermocouple 3 to the heating nozzle 2 will be described.

First, as shown in fig. 4 (a), the heating tip 2 and the thermocouple 3, which are individually manufactured in advance, are arranged in a state where the open port 30a of the lead wire accommodating hollow portion 30 faces the temperature measuring contact 3a, and the postures of the heating tip 2 and the thermocouple 3 are set so that the temperature measuring fixing portion 35, the lead wire accommodating hollow portion 30, the temperature measuring contact 3a, and the lead wire 3b are sequentially arranged on the same straight line. When the postures of the heating nozzle 2 and the thermocouple 3 are set, the thermocouple 3 is inserted into the opening 30a of the lead wire accommodating space 30 of the heating nozzle 2 with the temperature measuring contact point 3a as the front end. Then, the side surface of the connecting arm portion 7 serves as a guide (guide) to guide the thermocouple 3 to the soldering iron portion 6 side.

When the thermocouple 3 is inserted deeply, the temperature measuring contact 3a passes through the lead wire accommodating space 30 and then enters the soldering iron recess 15, as shown in fig. 4 (b). Here, as shown in fig. 3 (a), in the soldering iron part 6, since the temperature measurement fixing part 35 is provided at a portion facing the lower end portion (the open end portion on the soldering iron part 6 side) of the lead wire accommodating space 30 and the V-shaped fixing contact surface 35a is opposed to the end portion of the lead wire accommodating space 30, the temperature measurement contact 3a having entered the soldering iron recess 15 reaches the temperature measurement fixing part 35 and contacts (abuts) the fixing contact surface 35a. In this way, the temperature measuring contact 3a can be simply and reliably brought into contact with the fixing contact surface 35a (temperature measuring fixing portion 35). Thus, the preparation for fixing the temperature measurement contact 3a to the temperature measurement fixing portion 35 can be smoothly performed.

Further, the temperature measuring contact 3a is kept in contact with the fixing contact surface 35a by pressing the lead wire 3b toward the temperature measuring fixing part 35, and the temperature measuring contact 3a and the fixing contact surface 35a are fixed (welded) by laser welding in this state. Specifically, the fixing contact surface 35a is irradiated with laser light and heated, and the temperature measuring contact 3a is melted by the heat and fixed (welded). At this time, as shown in fig. 3 (a), the temperature measurement fixing portion 35 is set in a state in which the distance between the fixing contact surfaces 35a gradually increases from the soldering iron portion 6 side toward the upper side, so that the temperature measurement contact 3a can be brought into sufficient contact with the temperature measurement fixing portion 35. Thus, the heating nozzle unit 1 can be configured to be capable of fixing the temperature measurement contact 3a to the heating nozzle 2 well and measuring the temperature well. Further, since the fixed contact surface 35a is formed as a flat surface and the temperature measuring contact 3a is formed as a spherical body, the temperature measuring contact 3a is likely to be in point contact with the fixed contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fixed contact surface 35a, stress is easily concentrated, and the temperature measuring contact 3a is less likely to float from the fixed contact surface 35a. This enables the temperature measuring contact 3a to be more favorably fixed to the heating nozzle 2, and the temperature of the heating nozzle 2 to be more favorably measured.

When the temperature measuring contact 3a is fixed to the temperature measuring fixing portion 35, as shown in fig. 4 (c), a resin such as an ultraviolet curing resin or a thermosetting resin is injected and filled into a part of the lead housing hollow portion 30 (a portion located between the stopper recesses 31) and the stopper recesses 31 in a state before curing (a flowing state), and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin, thereby forming the lead stopper portions 32.

In the heating nozzle unit 1 configured by attaching the thermocouple 3 to the heating nozzle 2 in this manner, the lead wire 3b of the thermocouple 3 is accommodated in the lead wire accommodating hollow portion 30, so that the lead wire 3b of the thermocouple 3 can be prevented from exceeding the range of the plate thickness of the heating nozzle 2. Therefore, when a process such as an attaching operation of attaching the heating nozzle unit 1 to a thermocompression bonding apparatus is performed, or when the heating nozzle unit 1 enters a working area, a defect that the lead 3b is inadvertently caught, or a defect that the thermocouple 3 falls off from the heating nozzle, is unlikely to occur. In addition, when the plurality of heating nozzle units 1 are to be arranged in order during transportation (shipment) or storage, the heating nozzle units 1 can be stacked stably without any trouble, and the transportation operation or the storage operation can be performed smoothly.

Further, since the lead wire receiving space 30 is provided with the lead wire stopper portion 32, it is possible to prevent the defect that the received lead wire 3b is detached from the lead wire receiving space 30. Further, since the resin injected into the lead wire accommodating space 30 and cured is used as the lead wire stopper portion 32, the resin can be easily put into the gap between the connecting arm portion 7 and the lead wire 3b as the lead wire stopper portion 32, and the lead wire 3b can be sufficiently stopped. Further, since the stopper recess 31 communicating with the wire housing space 30 is provided and the resin serving as the wire stopper portion 32 is injected into the wire housing space 30 and the stopper recess 31 and cured, the wire stopper portion 32 is less likely to come off from the wire housing space 30, and the defect that the wire 3b comes off from the wire housing space 30 together with the wire stopper portion 32 can be suppressed.

As a work for thermocompression bonding the terminal lead a to the terminal member B using the heating tip unit 1, first, the heating tip unit 1 is attached to the tip holder of the thermocompression bonding apparatus in a posture in which the soldering iron tip portion 13 is positioned on the lower side, and the lead 3B of the thermocouple 3 is connected to a thermocouple connection terminal (not shown) of the thermocompression bonding apparatus. Thereafter, the terminal member B and the terminal wire a are placed in an operation area (both not shown) provided below the nozzle holder, and the terminal wire a is overlapped on the upper surface of the terminal member B. When the terminal member B and the terminal lead a are mounted, the heating tip unit 1 is lowered together with the tip holder to press the soldering iron tip 13 against the terminal lead a, and the heating tip 2 is energized to heat the soldering iron body 11, thereby thermocompressively bonding the terminal lead a to the terminal member B. The temperature of the soldering iron portion 6 is measured by the thermocouple 3, and a control unit (not shown) of the thermocompression bonding apparatus controls the current supply to the heating tip 2 and further controls the temperature of the soldering iron tip portion 13 based on the measured value.

Here, in the heating tip 2 that generates heat, since the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, even if the plate thickness of the heating tip 2 is set to be thick, it is possible to suppress a defect that the current density in the iron body 11 decreases and the heat generation becomes insufficient. Accordingly, it is easy to realize a good heat generation efficiency regardless of increase or decrease in the plate thickness of the heating nozzle 2. Further, the soldering iron body 11 or the soldering iron tip portion 13 can be cooled easily and quickly while avoiding an increase in the volume of the soldering iron body 11 and an increase in the heat capacity. Further, since the groove 20 is extended from the lower portion of the arm portion 7 to the soldering iron body 11 to form the thin portion 21, and the surface of the thin portion 21 which becomes the bottom portion of the groove 20 is set as the side surface of the soldering iron body 11, the structure of the heating tip 2 in which the plate thickness of the soldering iron body 11 is thinner than the plate thickness of the arm portion 7 can be easily realized.

Further, since the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21, when foreign matter (e.g., an insulating coating of the terminal lead a) adheres to the soldering iron tip portion 13 by the thermocompression bonding operation, the foreign matter can be easily removed by grinding the tip of the soldering iron tip portion 13 or the like. Further, the polishing margin of the tip end of the soldering iron tip portion 13 can be sufficiently secured, and the replacement cycle (service life) of the heating tip unit can be extended. Further, since the thin portion 21 is formed on the connecting arm portion 7 side with respect to the soldering iron tip portion 13 and the thickness of the side surface of the soldering iron body 11 is formed to be thinner than the thickness of the connecting arm portion 7 after the thin portion 21 is removed, it is possible to sufficiently secure the dimension in the thickness direction of the tip surface of the soldering iron tip portion 13 while suppressing a decrease in the current density in the soldering iron body 11. This can expand the allowable range of the size of the workpiece (the object to be thermocompression bonded) to which the heating tip 2 can be thermocompression bonded. Further, since the thin portion 21 is formed at a position shifted from the soldering iron tip portion 13 and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, it is not necessary to increase or decrease the plate thickness of the soldering iron tip portion 13 with respect to the plate thickness of the connecting arm portion 7, and the heating tip 2 can be easily manufactured.

Further, since the centers of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 in the thickness direction are located on the same plane, a bending moment is less likely to occur in the heating tip 2 during the thermocompression bonding operation, and thus a defect that an excessive load is applied to the heating tip 2 and a defect that the heating tip 2 is likely to be damaged can be suppressed. Further, since the thermocouple 3 is attached to the soldering iron portion 6 of the heating tip 2 as a temperature sensor, information on the temperature of the soldering iron portion 6 can be acquired and applied to control of heat generation of the heating tip 2. Further, the temperature sensor can be realized by a simple structure.

However, in the above embodiment, the soldering iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heating tip 2 to form the thin portions 21, but the present invention is not limited to this. In short, any type of soldering iron body 11 may be provided in the heating tip 2 as long as the plate thickness of the soldering iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the soldering iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. For example, the soldering iron body 11 may be configured by extending a groove on either the front surface or the back surface of the heating tip 2 to form the thin portion 21. However, since the soldering iron body 11 is biased to be positioned on either the front or back surface of the heating tip 2 and a bending moment is generated in the heating tip 2 during the thermocompression bonding operation, it is preferable to adopt a configuration in which the centers in the thickness direction of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 are positioned on the same plane, that is, the configuration of the above-described embodiment. The soldering iron body 11 may have a configuration including a portion having the highest resistance value (a portion serving as a heat generating portion). Therefore, the region to be thinned by the groove or the like may be located in the connecting arm portion 7, or may not be the entire region of the soldering iron body 11.

The plate thickness of the soldering iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same size, but the present invention is not limited to this. For example, if the plate thickness of the soldering iron tip portion 13 is reduced and set to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the soldering iron tip portion 13 can be increased, and the heating tip 2 can be easily designed according to the size of the workpiece (the terminal member B, the terminal lead a) to be subjected to the thermocompression bonding process. Further, as shown in fig. 3, the temperature measurement fixing portion 35 is formed to be smaller than the soldering iron tip portion 13 by one turn, but the present invention is not limited thereto. For example, if the volume of the soldering iron tip portion 13 is set to be equal to the volume of the temperature measurement fixing portion 35 so as to avoid an extreme difference between the heat capacity of the soldering iron tip portion 13 and the heat capacity of the temperature measurement fixing portion 35, the temperature change at the temperature measurement fixing portion 35 and the temperature change at the soldering iron tip portion 13 can be synchronized, and the temperature management of the soldering iron tip portion 13 can be easily performed by the temperature measurement of the temperature measurement fixing portion 35.

The fixing contact surface 35a of the temperature measurement fixing portion 35 is formed in a flat surface, but the present invention is not limited thereto. In short, the fixing contact surfaces 35a may be formed in a curved surface as long as the distance between the fixing contact surfaces 35a is set to gradually increase from the soldering iron 6 side toward the upper side. The temperature measuring contact (temperature measuring portion) 3a is not limited to the spherical shape, and may be formed in any shape as long as it can be sufficiently brought into contact with and fixed to the contact surface 35a. The temperature measuring contact 3a of the thermocouple 3 is welded and fixed to the temperature measuring fixing portion 35, but the present invention is not limited thereto. In short, as long as the temperature of the soldering iron 6 can be measured, the fixing state of the temperature measurement contact 3a and the temperature measurement fixing portion 35 is not limited. For example, the temperature measurement contact 3a and the temperature measurement fixing portion 35 may be fixed to each other by using a fixing agent (adhesive) having good heat conductivity.

In the heating nozzle 2 of the above embodiment, the wire accommodating hollow portion 30 is configured to linearly extend along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited thereto. In short, any configuration of the lead wire accommodating space 30 can be applied as long as the lead wire 3b of the thermocouple 3 can be accommodated. For example, the lead wire accommodating space 30 extending in a bent line shape or a curved line shape can be applied. Further, although a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead stopper portion 32 in the present invention, the present invention is not limited thereto. In short, the state of the lead stopper portion 32 is not limited as long as the lead 3b accommodated in the lead accommodating space 30 can be stopped to prevent the lead from falling out of the lead accommodating space 30. For example, a cap (cap) that can be fitted into the wire housing space 30 may be used as the wire stopper, or a protrusion that is integrally formed on the connecting arm portion 7 and protrudes toward the wire housing space 30 may be used as the wire stopper.

An example of a wire stopper portion formed by a protrusion will be described, and the heating nozzle 2 ″ of the modification shown in fig. 4-1 is basically the same as the above-described embodiment (first embodiment), except that a stopper concave portion 31 filled with resin is not formed, and instead, a rectangular protrusion-shaped wire stopper portion 37 is provided. Specifically, a plurality of (two in the present modification) lead stopper portions 37 are provided to protrude from a side surface of one of the arm portions 7 facing the lead wire housing space 30 toward the other arm portion 7 in a state of being spaced apart from each other in the longitudinal direction of the lead wire housing space 30. Further, a plurality of (two in the present modification) lead wire stoppers 37 are provided projecting toward the one connecting arm portion 7 from the side surface of the other connecting arm portion 7 facing the lead wire housing space 30 in a state of being separated from each other along the longitudinal direction of the lead wire housing space 30 and in a state of avoiding facing the lead wire stopper 37 on the one connecting arm portion 7 via the lead wire housing space 30. As shown in fig. 4-1 (d), each wire stopper 37 of one arm portion 7 is arranged at a position close to the front surface of the heating nozzle 2 ″ and each wire stopper 37 of the other arm portion 7 is arranged at a position close to the rear surface of the heating nozzle 2 ″ so that the wire stoppers 37 are positioned at positions shifted from each other in the longitudinal direction of the wire accommodating space 30.

As shown in fig. 4-1 (b), the lead wire engaging portion 37a of each lead wire stopper portion 37, which is capable of engaging the outer peripheral surface of the lead wire 3b, is configured to be curved so that the lead wire 3b and the lead wire stopper portion 37 are easily brought into surface contact with each other. In addition, when performing wire cutting (wire electric discharge machining) of a plate material to be a material of the heating tip 2 ″, the lead stopper portion 37 is formed with a rectangular protrusion in the lead housing hollow portion 30 in advance, and thereafter, an electrode for electric discharge machining (die-open electric discharge machining) is brought close to the protrusion from the outside of the lead housing hollow portion 30 to form a lead engaging portion 37a and is provided to the heating tip 2 ″. The method of forming the wire engaging portion 37a is not limited to electric discharge machining, and may be laser machining, for example.

In this way, by using the wire stopper 37 integrally formed with the connecting arm portion 7, the function of preventing the wire 3b from coming off can be realized with a simple configuration. In addition, the filling work of the resin or the waiting time until the resin is hardened is not required, and the efficiency of the manufacturing work of the heating nozzle unit can be improved.

Further, the stopper recess 31 communicating with the wire housing hollow 30 is formed by a shallow notch in the side surface of the wire housing hollow 30, but the present invention is not limited thereto. In short, as long as the resin as the lead wire stopper portion 32 is injected from the lead wire housing empty portion 30 to the stopper concave portion 31 and can be cured, the stopper concave portion 31 may be configured in any manner. For example, a groove-shaped stopper recess may be formed on each of the front and back surfaces of the arm portion 7, and an end portion of the stopper recess may be connected to the lead wire housing space 30 so that the resin (the lead wire stopper portion 32) may be injected from the lead wire housing space 30 to the stopper recess.

In the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measurement contact 3a of the thermocouple 3 is exemplified as the temperature measurement unit of the present invention, but the present invention is not limited thereto. In short, any temperature sensor may be used to attach to the heating tip 2 as long as the temperature sensor is capable of measuring the temperature of the soldering iron 6 and has a temperature measuring portion provided at the end of the lead wire 3b.

However, in the above embodiment, the grooves 20 are exemplified as the gouging portion of the present invention, but the present invention is not limited thereto. In short, the gouging portion may be set in any manner as long as the thin portion is formed in the heating tip by extending the gouging portion in a direction from one connecting arm portion toward the other connecting arm portion. For example, the heating nozzle 2' of the second embodiment shown in fig. 5 and 6 is basically the same as the above-described embodiment (first embodiment), except that: a two-leg iron body is provided by forming a grooved portion not only on both front and back surfaces of a heating tip 2', but also in the middle portion of the heating tip 2' in the thickness direction thereof, and branching the lower half portion of the heating tip 2' into two strands.

Specifically, in the heating nozzle 2', an iron space 40 extending in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) is formed as a gutter portion in the middle portion in the plate thickness direction of the iron portion 6' located at the lower portion of the heating nozzle 2', and the iron space 40 is opened downward. Further, the soldering iron body 11 and the soldering iron tip portion 13 are provided on both front and back sides of the heating nozzle 2' with the soldering iron space portion 40 therebetween. In other words, two soldering iron bodies 11 that are separated from each other and two soldering iron tip portions 13 that are separated from each other are provided in the soldering iron portion 6 'of the heating tip 2'. In each of the soldering iron bodies 11, the groove 20 is formed on the outer surface and the groove 20' is also formed on the inner surface, and each of the soldering iron bodies is provided with a soldering iron recess 15 in which the temperature measurement fixing portion 35 is protruded, and the temperature measurement contact (temperature measurement portion) 3a of the thermocouple 3 can be fixed to each of the temperature measurement fixing portions 35, and the thickness of the soldering iron tip portion 13 is set to be thinner than the thickness of the connecting arm portion 7 at each soldering iron tip portion 13.

By configuring the heating nozzle 2 'including the soldering iron portion 6' as described above, the thermal compression bonding process can be simultaneously performed at two locations by the two soldering iron tip portions 13, and the efficiency of the thermal compression bonding operation can be improved. Further, the distance (pitch) between the two soldering iron tip portions 13 and the size of the soldering iron tip end face 13a of each soldering iron tip portion 13 can be adjusted depending on the work by setting the dimension of the soldering iron space portion 40 in the plate thickness direction.

In the above embodiment, an oxidation-resistant coating layer may be formed on the surface of the heating nozzle to improve oxidation resistance.

The oxidation-resistant coating layer will be described below.

In the heating tip, since the temperature is repeatedly raised and cooled every thermocompression bonding, the surface is easily oxidized, and particularly, the oxidation is significant in the vicinity of the soldering iron portion 6 (heat generating portion) and the portion to which the thermocouple 3 is soldered. Therefore, an oxidized portion in the vicinity of the heating portion peels off to reduce the strength, and a defect occurs in that the oxidized portion is broken when pressurized, and a welded portion of the thermocouple corrodes to reduce the strength, and as a result, the thermocouple is detached and cannot be used.

Therefore, in the present embodiment, the oxidation resistance is improved by forming the oxidation-resistant coating layer on the surface of the heating nozzle. Hereinafter, the production process is specifically described.

First, as a metal plate to be used as a material (base material), specifically, it is preferable to use a so-called super hard material (hardness HV900 to 2400) (formal name: super hard alloy, alloy obtained by sintering powder of hard metal carbide) which is generally used in the past and has more excellent abrasion resistance than tungsten alloy (hardness HV200 to 400) and cut a plate material of the super hard material into a predetermined shape by wire cutting. Next, the cut piece is subjected to a plating pretreatment, and then immersed in a dissolution tank and energized, thereby forming an oxidation-resistant coating layer made of nickel on the surface of the cut piece, that is, nickel plating is performed. Thereafter, the vessel is pulled up from the dissolution tank to perform post-treatment such as washing.

Further, as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fixing portion 35. In this welding, since a coating of a nickel layer is formed on the surface (fixing contact surface 35 a) of the temperature measurement fixing portion 35, wettability is improved, and thus reliability and welding strength of welding are improved. Further, if the wettability is improved during soldering, the output of laser light can be suppressed more than before, damage to the base material can be suppressed, and quality improvement and energy consumption saving can be achieved.

After the welding of the thermocouple 3 is completed, the plating pretreatment is further performed, and the heating nozzle unit 1 to which the thermocouple 3 is attached is immersed in the electrolyte, and the entire surface including the temperature measuring contact 3a of the thermocouple 3 is nickel-plated.

When the heating tip unit 1 manufactured in this manner is used, the oxidation resistance is improved, and therefore peeling or strength reduction due to oxidation of the soldering iron portion 6 and the attachment portion of the thermocouple 3 can be suppressed, and thus the durability can be improved. In particular, when the substrate is made of an ultra-hard material and nickel plating is performed, wettability and weldability can be improved, and durability can be reliably improved. Further, since the main component of the thermocouple is nickel, the nickel plating affinity is good. The oxidation-resistant coating is not limited to nickel plating, and may be gold plating, for example.

Moreover, the embodiments described are illustrative in all respects and should not be construed as limiting the invention. The present invention is not limited to the above description, and should be interpreted as being represented by the claims, and includes all modifications within the meaning and range equivalent to those of the claims.

Description of the reference numerals

1. Heating nozzle unit

2. 2', 2' heating nozzle

3. Thermocouple

3a temperature measuring contact

3b conducting wire

6. 6' soldering iron part

7. Connecting arm part

11. Iron body

13. Soldering iron front end

Front end face of 13a soldering iron

15. Soldering iron recess

17. Mounting hole

20. 20' groove

21. Thin wall part

25. Core wire

26. Core wire coating material

27. Outer side coating material

30. Wire accommodating hollow part

30a open mouth

31. Stop recess

32. Wire stop

35. Temperature measurement fixing part

35a fixation contact surface

36. Groove

37. Wire stop

37a wire engaging part

40. A soldering iron space portion.

Claims

1. A heating nozzle unit in which a temperature sensor is attached to a plate-shaped heating nozzle for thermocompression bonding a terminal lead to a terminal member, the heating nozzle unit being characterized in that,

the heating nozzle is provided with:

the gap between the connecting arm portions is provided as a lead wire accommodating space having an open upper end portion, and a lead wire of the temperature sensor is accommodated in the lead wire accommodating space.

2. The heating nozzle unit as claimed in claim 1,

a lead stopper portion for stopping the received lead is provided in the lead receiving hollow portion.

3. The heating nozzle unit as claimed in claim 2,

the lead stopping part is resin which is injected into the lead containing hollow part and is hardened.

4. The heating nozzle unit as claimed in claim 3,

the heating nozzle unit is provided with a stopping concave part communicated with the lead wire accommodating hollow part, and resin serving as a lead wire stopping part is injected into the lead wire accommodating hollow part and the stopping concave part and is cured.

5. The heating nozzle unit as claimed in claim 2,

the wire stopper is a protrusion integrally formed on the connecting arm and protruding toward the wire receiving space.

6. The heating nozzle unit according to any one of claims 1 to 5,

a temperature measuring fixing portion to which a temperature measuring portion of a temperature sensor is fixed is provided at a position facing a lower end portion of a wire accommodating hollow portion in the soldering iron portion.

7. The heating nozzle unit as claimed in claim 6,

an oxidation-resistant coating layer is formed on at least the surfaces of the soldering iron portion and the temperature measurement fixing portion of the heating nozzle.

8. The heating nozzle unit as claimed in claim 7,

an oxidation-resistant coating layer is formed on the surface of the temperature measuring part fixed to the temperature measuring fixing part.

9. The heating nozzle unit according to claim 7 or 8,

the oxidation-resistant coating layer is a nickel coating.

10. The heating nozzle unit according to any one of claims 6 to 9,

the temperature measuring fixing part is provided with a pair of fixing contact surfaces which the temperature measuring part contacts, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.

11. The heating nozzle unit according to any one of claims 1 to 10,

the temperature sensor is a thermocouple, and a lead of the temperature sensor includes a core wire of the thermocouple.