CN115461180A - Heating nozzle unit - Google Patents
Heating nozzle unit Download PDFInfo
- Publication number
- CN115461180A CN115461180A CN202180027313.4A CN202180027313A CN115461180A CN 115461180 A CN115461180 A CN 115461180A CN 202180027313 A CN202180027313 A CN 202180027313A CN 115461180 A CN115461180 A CN 115461180A
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- China
- Prior art keywords
- soldering iron
- heating nozzle
- fixing
- temperature measuring
- heating
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Resistance Heating (AREA)
Abstract
The invention provides a heating nozzle unit which can make a temperature measuring part of a temperature sensor fully contact with a fixing part of a heating nozzle. A heating nozzle unit (1) is formed by mounting a thermocouple (3) on a plate-shaped heating nozzle (2) for thermally pressing a terminal lead wire to a terminal member, and the heating nozzle (2) is provided with: a soldering iron part (6) provided with a soldering iron tip (13) that abuts against a terminal lead on a soldering iron body (11); a pair of connecting arm sections (7) which extend upward from the left and right end sections of the soldering iron body in a state of being spaced apart from each other and which heat the soldering iron section by passing a current from a power supply through the soldering iron body; and a temperature measurement fixing part (35) which is provided on the soldering iron part and fixes the temperature measurement contact (3 a) of the thermocouple (3), wherein the temperature measurement fixing part is provided with a pair of fixing contact surfaces (35 a) for the temperature measurement contact to contact, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
Description
Technical Field
The present invention relates to a heating nozzle unit for thermocompression bonding a terminal lead to a terminal member.
Background
In an operation of thermocompression bonding a lead wire for a terminal to a terminal member, for example, an operation of thermocompression bonding a lead wire to a terminal portion of a core in manufacturing an electronic component such as a chip inductor (chip inductor), a heating nozzle unit for thermocompression bonding is used. Specifically, a thermocouple is attached as a temperature sensor to a heating tip, which is heated by a soldering iron, to form a heating tip unit, and the heating tip unit is attached to a tool holder (tool holder) of a thermocompression bonding apparatus. Then, the thermocompression bonding apparatus is operated to rapidly heat the terminal lead wire placed on the terminal member while pressing the terminal lead wire with the soldering iron portion of the heating tip, thereby thermocompressively bonding the terminal lead wire to the terminal member (see, for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2001-284781
Disclosure of Invention
Problems to be solved by the invention
However, in the heating nozzle (heating nozzle unit) described in the above patent document, the core wire of the thermocouple is inserted through the through hole of the heating nozzle, and arc welding is performed in this state, whereby formation of the temperature measuring contact (temperature measuring portion of the temperature sensor) and fixation (joining) of the temperature measuring contact to the heating nozzle are performed simultaneously. However, the temperature measuring contact point may not be formed due to poor welding, and only the core wire is joined to the heating tip, resulting in poor yield. Therefore, it is preferable to form a temperature measuring contact point before fixing the heating nozzle, and to fix the temperature measuring contact point (temperature measuring portion) in a state where the temperature measuring contact point is sufficiently in contact with the heating nozzle.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a heating nozzle unit capable of sufficiently bringing a temperature measuring portion of a temperature sensor into contact with a fixed portion of a heating nozzle.
Means for solving the problems
The present invention has been made to achieve the above object, and a first aspect of the present invention provides a heating nozzle unit in which a temperature sensor is attached to a plate-shaped heating nozzle for thermocompression bonding a terminal lead to a terminal member, the heating nozzle unit being characterized in that,
the heating nozzle is provided with:
a soldering iron part, wherein a soldering iron front end part abutting against the terminal lead is arranged on the soldering iron body;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is arranged on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measurement fixing part is provided with a pair of fixing contact surfaces which are contacted with the temperature measurement part, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
A heating nozzle unit according to a second aspect is the heating nozzle unit according to the first aspect, wherein the fixing contact surface is formed as a flat surface, and the temperature measuring portion is formed as a spherical body.
The heating nozzle unit of the third aspect is the heating nozzle unit according to the first or second aspect, characterized in that,
the gap between the connection arm parts is used as a lead wire receiving empty part to receive the lead wire of the temperature sensor in the lead wire receiving empty part,
the fixing contact surface is arranged at the end part of the lead wire receiving empty part.
A heating nozzle unit according to a fourth aspect is the heating nozzle unit according to any one of the first to third aspects, wherein an oxidation-resistant coating layer is formed on at least surfaces of the soldering iron portion and the temperature measurement fixing portion of the heating nozzle.
The heating nozzle unit according to a fifth aspect is the heating nozzle unit according to the fourth aspect, wherein an oxidation-resistant coating layer is formed on a surface of the temperature measuring part fixed to the temperature measuring fixing part.
A heating nozzle unit according to a sixth aspect is the heating nozzle unit according to the fourth or fifth aspect, wherein the oxidation-resistant coating layer is a nickel coating.
Effects of the invention
The present invention has the following excellent effects.
According to the first aspect of the invention, the temperature measurement fixing section includes the pair of fixing contact surfaces with which the temperature measurement section is in contact, and the distance between the fixing contact surfaces is set to be gradually increased from the soldering iron portion side toward the upper side. Therefore, the heating nozzle unit can be configured to be capable of performing excellent fixation of the temperature measuring portion to the heating nozzle and further excellent temperature measurement.
According to the second aspect of the invention, since the fixing contact surface is formed in a flat surface and the temperature measuring portion is formed in a spherical body, the temperature measuring portion can easily be brought into point contact with the fixing contact surface. Further, if the temperature measuring part is pressed against the fixing contact surface, stress is easily concentrated, and the temperature measuring part is less likely to float from the fixing contact surface. Thus, the temperature measuring part can be fixed to the heating nozzle more favorably, and the temperature of the heating nozzle can be measured more favorably.
According to the third aspect of the invention, since the gap between the connecting arm portions is used as the lead wire receiving space, the lead wire of the temperature sensor is received in the lead wire receiving space, and the fixed contact surface is placed at the end portion of the lead wire receiving space, the temperature measuring portion can be easily brought into contact with the fixed contact surface by inserting the temperature sensor into the lead wire receiving space with the temperature measuring portion as the head. Therefore, the preparation for fixing the temperature measuring part of the temperature sensor to the temperature measuring fixing part can be smoothly performed.
According to the invention of the fourth to sixth aspects, oxidation of the surface can be suppressed and durability can be improved even if temperature rise and cooling are repeated.
Drawings
Fig. 1 is a perspective view of a heating nozzle unit.
Fig. 2 is an explanatory view of the heating nozzle, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
FIG. 3 is an explanatory view of a temperature measuring fixing part of a heating nozzle, wherein (a) is a front view and (b) is a sectional view.
Fig. 4 is an explanatory view of a procedure of mounting the thermocouple to the heating nozzle, (a) is a state before inserting the thermocouple into the heating nozzle, (b) is a state after inserting the thermocouple into the heating nozzle, and (c) is a state after injecting resin as a lead stopper portion into the lead housing space and the stopper recess.
Fig. 5 is a perspective view of a heating tip provided with two iron portions.
Fig. 6 is an explanatory view of a heating tip provided with two iron portions, wherein (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
Detailed Description
The mode for carrying out the invention is explained below with reference to the drawings.
As shown in fig. 1 and 2, the heating nozzle unit 1 includes: a plate-shaped heating nozzle 2 for thermocompression bonding the terminal lead a to the terminal member B (see fig. 2 (d)); and a thermocouple 3 attached to the heating nozzle 2 as a temperature sensor. The heating nozzle 2 is a nozzle formed by machining a plate material of a conductive material (tungsten, molybdenum, an ultra-hard material, or the like) by wire electric discharge machining, and as shown in fig. 2, the heating nozzle 2 includes: a soldering iron portion 6 serving as a lower portion (a distal end portion located on the workpiece (the terminal lead a or the terminal member B)) of the heating tip 2; and a pair of right and left connecting arm portions 7 serving as upper portions (base portions). When electric current is supplied to the soldering iron portion 6 through the connecting arm portion 7, the soldering iron portion 6 can be heated by the electric resistance, and the temperature of the soldering iron portion 6 can be measured by the thermocouple 3.
The soldering iron portion 6 includes a horizontally long soldering iron body 11 connecting lower portions of the connecting arm portions 7 to each other, and the horizontal width of the soldering iron body 11 (the dimension along the horizontal direction in which the pair of connecting arm portions 7 are arranged) is set to be gradually narrowed toward the lower portion of the heating tip 2. A box-shaped soldering iron tip portion 13 is provided to protrude downward at the bottom of the soldering iron body 11 protruding slightly downward, and the bottom surface (tip surface) of the soldering iron tip portion 13 is made to be a soldering iron tip surface 13a and can be abutted to the terminal lead a. Further, a substantially rectangular iron recess 15 is formed in an upper portion (on the side of the connecting arm portion 7) of the iron body 11 on the opposite side to the iron tip portion 13, and a temperature measuring contact (temperature measuring portion) 3a of the thermocouple 3 is fixed in the iron recess 15. The structure to which the temperature measuring contact 3a is fixed will be described in detail later.
The connecting arm portions 7 are long-length components extending upward from the left and right ends of the soldering iron body 11, and are provided in a state where the connecting arm portions 7 are spaced apart from each other. Further, in the upper portion (extending end portion) of the connecting arm portion 7, a mounting hole 17 for mounting to a tip holder (not shown) of the thermocompression bonding apparatus is formed to penetrate in the plate thickness direction of the heating tip 2, and a mounting bolt (not shown) inserted through the mounting hole 17 is screwed to the tip holder, whereby the heating tip unit 1 is mounted to the tip holder with the soldering iron tip portion 13 facing downward.
In addition, in the heating nozzle unit 1 attached to the nozzle holder, one connecting arm portion 7 is electrically connected to one end of a power supply for heater (not shown) of the thermocompression bonding apparatus, and the other connecting arm portion 7 is electrically connected to the other end of the power supply for heater. When an electric current is supplied from a power source (heater power source) to the heating tip 2, the electric current flows through the connection arm portion 7 into the iron body 11, the iron body 11 generates heat due to electric resistance in the iron body 11, and the temperature of the iron tip portion 13 is raised by the heat. Further, although the current in the soldering iron body 11 flows from the one connecting arm portion 7 side toward the other connecting arm portion 7 side, the cross-sectional area of the reduced diameter portion located at the corner portion of the soldering iron recess 15 in the path through which the current flows is narrower than the cross-sectional area of the other portion, and therefore the current density becomes the highest at the reduced diameter portion, and joule heat due to electric resistance tends to occur around this portion.
As shown in fig. 1 and 2 (d), the heating tip 2 is configured such that grooves 20 as the grooves of the present invention extend in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) in the range from the lower portion of the connecting arm portion 7 to the soldering iron body 11 on both front and back surfaces of the heating tip 2, and a thin portion 21 is formed by the extension of the grooves 20 on the front and back surfaces, and the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21. In other words, the thin portion 21 is formed at a position offset from the soldering iron tip portion 13 (more specifically, closer to the connection arm portion 7 than the soldering iron tip portion 13).
As shown in fig. 2 d, the depth dimension of the front and back grooves 20 (the dimension in the thickness direction of the heating nozzle 2) is set to be the same, the centers in the thickness directions of the connection arm portion 7, the soldering iron body 11 (the thin portion 21), and the soldering iron tip portion 13 are positioned on the same plane, and the thickness of the soldering iron tip portion 13 is set to be the same as the thickness of the connection arm portion 7. The surface of the thin portion 21 that forms the bottom of the groove 20 is a side surface (front and back surfaces) of the soldering iron body 11, and the plate thickness of the soldering iron body 11 (the plate thickness of the thin portion 21) is set to be smaller than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the soldering iron body 11 (in other words, the cross-sectional area of a flow path through which current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7. The thickness t1 of the side surface of the soldering iron body 11 is formed to be thinner than the thickness t2 of the connecting arm portion 7 (more specifically, the thickness of the connecting arm portion 7 after the thin portion 21 is removed (the thickness of a portion of the connecting arm portion 7 which is shifted from the thin portion 21)) t2 (see fig. 1 and fig. 2 (d)).
Next, the structure of the thermocouple 3 attached to the heating nozzle 2 and the heating nozzle 2 to which the thermocouple 3 is attached will be described.
As shown in fig. 1 and 3, the thermocouple 3 is configured such that the tips of two types of core wires 25 are welded to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a, the core wires 25 are covered with an electrically insulating core wire covering material 26, and the core wires are bundled into one bundle by being covered with an outer covering material 27 to form a lead wire 3b. In other words, the wire 3b is constituted so as to include the core wire 25. The diameter of the temperature measuring contact 3a and the wire diameter of the lead wire 3b are set to be smaller than the thickness of the heating nozzle 2.
In the heating tip 2, a receiving portion for the lead wire 3b is provided in a gap between the connecting arm portions 7, and a fixing portion for the temperature measuring contact 3a is provided in the soldering iron portion 6. Specifically, as shown in fig. 1 and 2 (a) and (b), the gap between the connection arm portions 7 extending in the longitudinal direction of the connection arm portions 7 is set to a width (thickness, width) one turn larger than the wire diameter of the lead wire 3b, and the lead wire 3b is housed in the lead wire housing hollow portion 30 with the upper end portion thereof open, in a state in which the lead wire 3b does not protrude outward from each of the front and back surfaces of the heating nozzle 2 (more specifically, a portion of the lead wire 3b located close to the temperature measuring contact 3 a). The lead wire 3b is extended from the opening 30a at the upper end of the lead wire receiving hollow portion 30, and the lower end of the lead wire receiving hollow portion 30 is expanded to communicate with the soldering iron recess 15 (see fig. 1).
In each of the arm portions 7, a notch is formed in a part of a side surface facing the wire housing hollow portion 30, stopper concave portions 31 are formed in a state of communicating with the wire housing hollow portion 30, and a wire stopper portion 32 is provided in each of the stopper concave portions 31 and a part of the wire housing hollow portion 30 (a portion located between the stopper concave portions 31) by being cured after injecting a resin such as an ultraviolet curing resin or a thermosetting resin, and the wire stopper portion 32 prevents the wire 3b from being displaced from the wire housing hollow portion 30 and protruding from the heating tip 2.
A temperature measurement fixing portion 35 to which the temperature measurement contact 3a of the thermocouple 3 is fixed is provided in a portion facing an end portion (lower end portion) of the lead wire accommodating hollow portion 30 in the soldering iron recess 15 formed in the soldering iron portion 6 so as to protrude toward the upper connecting arm portion 7 side. As shown in fig. 3, the temperature measurement fixing portion 35 is a protrusion portion provided to protrude from the soldering iron tip portion 13 through the soldering iron body 11, and is formed to be smaller than the soldering iron tip portion 13. In addition, a pair of fixing contact surfaces 35a, which the temperature measuring contact 3a contacts, are provided at a portion facing the wire housing recess 30 (an upper portion of the temperature measuring fixing portion 35) so as to face an end portion of the wire housing recess 30, and a distance between the fixing contact surfaces 35a is set in a state in which the distance gradually increases from the soldering iron portion 6 side toward the wire housing recess 30 side upward. Further, the fixing contact surfaces 35a are formed in a flat surface, so that a V-shaped recess 36 is formed in the upper portion of the temperature measuring fixing portion 35 (the upper portion on the side of the lead accommodating space portion 30), and the temperature measuring contact 3a is received in the recess 36 to be in contact with the fixing contact surfaces 35a, and the temperature measuring contact 3a is fixed to the soldering iron portion 6 (the temperature measuring fixing portion 35) by soldering or the like in this state.
Next, a manufacturing procedure of the heating nozzle unit 1, particularly, an attaching procedure of the thermocouple 3 to the heating nozzle 2 will be described.
First, as shown in fig. 4 (a), the heating tip 2 and the thermocouple 3, which are individually manufactured in advance, are arranged in a state where the open port 30a of the lead wire accommodating hollow portion 30 faces the temperature measurement contact 3a, and the postures of the heating tip 2 and the thermocouple 3 are set so that the temperature measurement fixing portion 35, the lead wire accommodating hollow portion 30, the temperature measurement contact 3a, and the lead wire 3b are sequentially aligned on the same straight line. When the postures of the heating nozzle 2 and the thermocouple 3 are set, the thermocouple 3 is inserted into the open port 30a of the lead wire accommodating space 30 of the heating nozzle 2 with the temperature measurement contact 3a as the front end. Then, the side surface of the connecting arm portion 7 serves as a guide (guide) to guide the thermocouple 3 to the soldering iron portion 6 side.
When the thermocouple 3 is inserted deeply, the temperature measuring contact 3a passes through the lead wire accommodating space 30 and then enters the soldering iron recess 15, as shown in fig. 4 (b). Here, as shown in fig. 3 (a), in the soldering iron part 6, since the temperature measurement fixing part 35 is provided at a portion facing the lower end portion (the open end portion on the soldering iron part 6 side) of the lead wire accommodating space 30 and the V-shaped fixing contact surface 35a is opposed to the end portion of the lead wire accommodating space 30, the temperature measurement contact 3a having entered the soldering iron recess 15 reaches the temperature measurement fixing part 35 and contacts (abuts) the fixing contact surface 35a. In this way, the temperature measuring contact 3a can be simply and reliably brought into contact with the fixing contact surface 35a (temperature measuring fixing portion 35). Thus, the preparation for fixing the temperature measurement contact 3a to the temperature measurement fixing portion 35 can be smoothly performed.
Further, the temperature measuring contact 3a is kept in contact with the fixing contact surface 35a by pressing the lead wire 3b toward the temperature measuring fixing part 35, and the temperature measuring contact 3a and the fixing contact surface 35a are fixed (welded) by laser welding in this state. More specifically, the fixing contact surface 35a is heated by laser light irradiation, and the temperature measuring contact 3a is melted by the heat and fixed (welded). At this time, as shown in fig. 3 (a), the temperature measurement fixing part 35 is set in a state in which the distance between the fixing contact surfaces 35a gradually increases from the soldering iron 6 side toward the upper side, so that the temperature measurement contact 3a can be brought into sufficient contact with the temperature measurement fixing part 35. Thus, the heating nozzle unit 1 can be configured to be capable of fixing the temperature measuring contact 3a to the heating nozzle 2 well and measuring the temperature well. Further, since the fixed contact surface 35a is formed as a flat surface and the temperature measuring contact 3a is formed as a spherical body, the temperature measuring contact 3a is likely to be in point contact with the fixed contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fixed contact surface 35a, stress is easily concentrated, and the temperature measuring contact 3a is less likely to float from the fixed contact surface 35a. This enables the temperature measuring contact 3a to be more favorably fixed to the heating nozzle 2, and the temperature of the heating nozzle 2 to be more favorably measured.
When the temperature measuring contact 3a is fixed to the temperature measuring fixing portion 35, as shown in fig. 4 (c), a resin such as an ultraviolet curing resin or a thermosetting resin is injected and filled into a part of the lead housing hollow portion 30 (a portion located between the stopper recesses 31) and the stopper recesses 31 in a state before curing (a flowing state), and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin, thereby forming the lead stopper portions 32.
In the heating nozzle unit 1 configured by attaching the thermocouple 3 to the heating nozzle 2 in this manner, the lead wire 3b of the thermocouple 3 is accommodated in the lead wire accommodating hollow portion 30, so that the lead wire 3b of the thermocouple 3 can be prevented from exceeding the range of the plate thickness of the heating nozzle 2. Therefore, when a process such as an attaching operation of attaching the heating nozzle unit 1 to a thermocompression bonding apparatus is performed, or when the heating nozzle unit 1 enters a working area, a defect that the lead 3b is inadvertently caught, or a defect that the thermocouple 3 falls off from the heating nozzle, is unlikely to occur. In addition, when the plurality of heating nozzle units 1 are to be arranged in order during transportation (shipment) or storage, the heating nozzle units 1 can be stacked stably without any trouble, and the transportation operation or the storage operation can be performed smoothly.
Further, since the lead wire receiving space 30 is provided with the lead wire stopper portion 32, it is possible to prevent the defect that the received lead wire 3b is detached from the lead wire receiving space 30. Further, since the resin injected into the lead wire accommodating space 30 and cured is used as the lead wire stopper portion 32, the resin can be easily put into the gap between the connecting arm portion 7 and the lead wire 3b as the lead wire stopper portion 32, and the lead wire 3b can be sufficiently stopped. Further, since the stopper recess 31 communicating with the lead wire accommodating space 30 is provided and the resin serving as the lead wire stopper portion 32 is injected into the lead wire accommodating space 30 and the stopper recess 31 and cured, the lead wire stopper portion 32 is less likely to fall off from the lead wire accommodating space 30, and the defect that the lead wire 3b falls off from the lead wire accommodating space 30 together with the lead wire stopper portion 32 can be suppressed.
As an operation of thermocompression bonding the terminal lead a to the terminal member B using the heating tip unit 1, first, the heating tip unit 1 is mounted on the tip holder of the thermocompression bonding apparatus in a posture in which the soldering iron tip portion 13 is positioned on the lower side, and the lead 3B of the thermocouple 3 is connected to a thermocouple connection terminal (not shown) of the thermocompression bonding apparatus. Thereafter, the terminal member B and the terminal wire a are placed in an operation area (both not shown) provided below the nozzle holder, and the terminal wire a is overlapped on the upper surface of the terminal member B. When the terminal member B and the terminal lead a are mounted, the heating tip unit 1 is lowered together with the tip holder to press the soldering iron tip 13 against the terminal lead a, and the heating tip 2 is energized to heat the soldering iron body 11, thereby thermocompressively bonding the terminal lead a to the terminal member B. The temperature of the soldering iron portion 6 is measured by the thermocouple 3, and a control unit (not shown) of the thermocompression bonding apparatus controls the current supply to the heating tip 2 and further controls the temperature of the soldering iron tip portion 13 based on the measured value.
Here, in the heating tip 2 that generates heat, since the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, even if the plate thickness of the heating tip 2 is set to be thick, it is possible to suppress a defect that the current density in the iron body 11 decreases and the heat generation becomes insufficient. Accordingly, it is easy to realize a good heat generation efficiency regardless of increase or decrease in the plate thickness of the heating nozzle 2. Further, the soldering iron body 11 or the soldering iron tip portion 13 can be cooled easily and quickly while avoiding an increase in the volume of the soldering iron body 11 and an increase in the heat capacity. Further, since the groove 20 is extended from the lower portion of the arm portion 7 to the soldering iron body 11 to form the thin portion 21, and the surface of the thin portion 21 which becomes the bottom portion of the groove 20 is set as the side surface of the soldering iron body 11, the structure of the heating tip 2 in which the plate thickness of the soldering iron body 11 is thinner than the plate thickness of the arm portion 7 can be easily realized.
Further, since the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21, when foreign matter (an insulating coating of the terminal lead a or the like) adheres to the soldering iron tip portion 13 by the thermocompression bonding operation, the foreign matter can be easily removed by grinding the tip of the soldering iron tip portion 13 or the like. Further, the polishing margin of the tip end of the soldering iron tip portion 13 can be sufficiently secured, and the replacement cycle (service life) of the heating tip unit can be extended. Further, since the thin portion 21 is formed on the connection arm portion 7 side of the soldering iron tip portion 13 and the side surface of the soldering iron body 11 is formed thinner than the connection arm portion 7 from which the thin portion 21 is removed, it is possible to sufficiently secure the dimension in the thickness direction of the tip surface of the soldering iron tip portion 13 while suppressing a decrease in the current density in the soldering iron body 11. This can expand the allowable range of the size of the workpiece (the object to be thermocompression bonded) to which the heating tip 2 can be thermocompression bonded. Further, since the thin portion 21 is formed at a position shifted from the soldering iron tip portion 13 and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, it is not necessary to increase or decrease the plate thickness of the soldering iron tip portion 13 with respect to the plate thickness of the connecting arm portion 7, and the heating tip 2 can be easily manufactured.
Further, since the centers of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 in the thickness direction are located on the same plane, a bending moment is less likely to occur in the heating tip 2 during the thermocompression bonding operation, and thus a defect that an excessive load is applied to the heating tip 2 and a defect that the heating tip 2 is likely to be damaged can be suppressed. Further, since the thermocouple 3 is attached to the soldering iron portion 6 of the heating tip 2 as a temperature sensor, information on the temperature of the soldering iron portion 6 can be acquired and applied to control of heat generation of the heating tip 2. Further, the temperature sensor can be realized by a simple structure.
However, in the above embodiment, the soldering iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heating tip 2 to form the thin portions 21, but the present invention is not limited to this. In short, any type of soldering iron body 11 may be provided in the heating tip 2 as long as the plate thickness of the soldering iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the soldering iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. For example, the soldering iron body 11 may be configured by extending a groove on either the front surface or the back surface of the heating tip 2 to form the thin portion 21. However, since the soldering iron body 11 is biased to be positioned on either the front or back surface of the heating tip 2 and a bending moment is generated in the heating tip 2 during the thermocompression bonding operation, it is preferable to adopt a configuration in which the centers in the thickness direction of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 are positioned on the same plane, that is, the configuration of the above-described embodiment. The soldering iron body 11 may have a configuration including a portion having the highest resistance value (a portion serving as a heat generating portion). Therefore, the region to be thinned by the groove or the like may be located in the connecting arm portion 7, or may not be the entire region of the soldering iron body 11.
The plate thickness of the soldering iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same size, but the present invention is not limited to this. For example, if the plate thickness of the soldering iron tip portion 13 is reduced and set to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the soldering iron tip portion 13 can be increased, and the heating tip 2 can be easily designed according to the size of the workpiece (the terminal member B, the terminal lead a) to be subjected to the thermocompression bonding process. Further, as shown in fig. 3, the temperature measurement fixing portion 35 is formed to be smaller than the soldering iron tip portion 13 by one turn, but the present invention is not limited thereto. For example, if the volume of the soldering iron tip portion 13 is set to be equal to the volume of the temperature measurement fixing portion 35 so as to avoid an extreme difference between the heat capacity of the soldering iron tip portion 13 and the heat capacity of the temperature measurement fixing portion 35, the temperature change at the temperature measurement fixing portion 35 and the temperature change at the soldering iron tip portion 13 can be synchronized, and the temperature management of the soldering iron tip portion 13 can be easily performed by the temperature measurement of the temperature measurement fixing portion 35.
The fixing contact surface 35a of the temperature measurement fixing portion 35 is formed in a flat surface, but the present invention is not limited thereto. In short, the fixing contact surfaces 35a may be formed in a curved surface as long as the distance between the fixing contact surfaces 35a is set to gradually increase from the soldering iron 6 side toward the upper side. The temperature measuring contact (temperature measuring portion) 3a is not limited to the spherical shape, and may be formed in any shape as long as it can be sufficiently brought into contact with and fixed to the contact surface 35a. The temperature measuring contact 3a of the thermocouple 3 is welded and fixed to the temperature measuring fixing portion 35, but the present invention is not limited thereto. In short, as long as the temperature of the soldering iron 6 can be measured, the fixing state of the temperature measurement contact 3a and the temperature measurement fixing portion 35 is not limited. For example, the temperature measurement contact 3a and the temperature measurement fixing portion 35 may be fixed to each other by using a fixing agent (adhesive) having good heat conductivity.
In the heating nozzle 2 of the above embodiment, the wire accommodating hollow portion 30 is configured to linearly extend along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited thereto. In short, any configuration of the lead wire receiving space 30 can be applied as long as it can receive the lead wire 3b of the thermocouple 3. For example, the lead wire accommodating space 30 extending in a bent line or a curved line can be applied. Further, although a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead stopper portion 32 in the present invention, the present invention is not limited thereto. In short, the state of the lead stopper portion 32 is not limited as long as the lead 3b accommodated in the lead accommodating space 30 can be stopped to prevent the lead from falling out of the lead accommodating space 30. For example, a cap (cap) that can be fitted into the wire housing space 30 may be used as the wire stopper, or a protrusion that is integrally formed on the connecting arm portion 7 and protrudes toward the wire housing space 30 may be used as the wire stopper.
Further, the stopper recess 31 communicating with the wire housing hollow 30 is formed by a shallow notch in the side surface of the wire housing hollow 30, but the present invention is not limited thereto. In short, as long as the resin as the lead wire stopper portion 32 is injected from the lead wire housing empty portion 30 to the stopper concave portion 31 and can be cured, the stopper concave portion 31 may be configured in any manner. For example, a groove-shaped stopper recess may be formed on each of the front and back surfaces of the arm portion 7, and an end portion of the stopper recess may be connected to the lead wire housing space 30 so that the resin (the lead wire stopper portion 32) may be injected from the lead wire housing space 30 to the stopper recess.
In the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measurement contact 3a of the thermocouple 3 is exemplified as the temperature measurement unit of the present invention, but the present invention is not limited thereto. In short, any temperature sensor may be used to attach to the heating tip 2 as long as the temperature sensor is capable of measuring the temperature of the soldering iron 6 and has a temperature measuring portion provided at the end of the lead wire 3b.
However, in the above embodiment, the grooves 20 are exemplified as the gouging portion of the present invention, but the present invention is not limited thereto. In short, the gouging portion may be set in any manner as long as the thin portion is formed in the heating tip by extending the gouging portion in a direction from one connecting arm portion toward the other connecting arm portion. For example, the heating nozzle 2' of the second embodiment shown in fig. 5 and 6 is basically the same as the above-described embodiment (first embodiment), and differs therefrom in that: the soldering iron body has two legs by forming a gutter portion not only on both front and back surfaces of the heating nozzle 2', but also in an intermediate portion of the heating nozzle 2' in the plate thickness direction, and branching the lower half of the heating nozzle 2' into two branches.
Specifically, the heating tip 2' has a soldering iron space 40 as a gutter portion extending in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) formed in the middle portion of the soldering iron portion 6' in the plate thickness direction, which is located below the heating tip 2', and the soldering iron space 40 is opened downward. Further, the soldering iron body 11 and the soldering iron tip portion 13 are provided on both front and back sides of the heating tip 2' with the soldering iron space portion 40 interposed therebetween. In other words, two soldering iron bodies 11 that are separated from each other and two soldering iron tip portions 13 that are separated from each other are provided in the soldering iron portion 6 'of the heating tip 2'. In each of the soldering iron bodies 11, the groove 20 is formed on the outer surface and the groove 20' is also formed on the inner surface, and each of the soldering iron bodies is provided with a soldering iron recess 15 in which the temperature measurement fixing portion 35 is protruded, and the temperature measurement contact (temperature measurement portion) 3a of the thermocouple 3 can be fixed to each of the temperature measurement fixing portions 35, and the thickness of the soldering iron tip portion 13 is set to be thinner than the thickness of the connecting arm portion 7 at each soldering iron tip portion 13.
By configuring the heating tip 2 'including the soldering iron portion 6', the thermal compression bonding process can be simultaneously performed at two locations by the two soldering iron tip portions 13, and the efficiency of the thermal compression bonding operation can be improved. Further, the distance (pitch) between the two soldering iron tip portions 13 and the size of the soldering iron tip surface 13a of each soldering iron tip portion 13 can be adjusted depending on the work by setting the dimension of the soldering iron space portion 40 in the thickness direction.
In the above embodiment, an oxidation-resistant coating layer may be formed on the surface of the heating nozzle to improve oxidation resistance.
The oxidation-resistant coating layer will be described below.
In the heating tip, since temperature rise and cooling are repeated every time of thermocompression bonding, the surface is easily oxidized, and particularly, oxidation is remarkable in the vicinity of the soldering iron portion 6 (heat generating portion) and the portion to which the thermocouple 3 is welded. Therefore, an oxidized portion in the vicinity of the heat generating portion peels off to cause a decrease in strength, and a defect occurs in that the thermocouple is broken when pressurized, and a welded portion of the thermocouple corrodes to cause a decrease in strength, and as a result, the thermocouple comes off and cannot be used.
Therefore, in the present embodiment, the oxidation resistance is improved by forming the oxidation-resistant coating layer on the surface of the heating nozzle. Hereinafter, the production process is specifically described.
First, as a metal plate to be used as a material (base material), specifically, it is preferable to use a so-called super hard material (hardness HV900 to 2400) (formal name: super hard alloy, alloy obtained by sintering powder of hard metal carbide) which is generally used in the past and has more excellent abrasion resistance than tungsten alloy (hardness HV200 to 400) and cut a plate material of the super hard material into a predetermined shape by wire cutting. Next, the cut piece is subjected to a plating pretreatment, and then immersed in a dissolution tank and energized, thereby forming an oxidation-resistant coating layer made of nickel on the surface of the cut piece, that is, nickel plating is performed. Thereafter, the vessel is pulled up from the dissolution tank to perform post-treatment such as washing.
Further, as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fixing portion 35. In this welding, since a coating of a nickel layer is formed on the surface (fixing contact surface 35 a) of the temperature measurement fixing portion 35, wettability is improved, and thus welding reliability and welding strength are improved. Further, if the wettability during soldering is improved, the output of laser light can be suppressed more than before, damage to the base material can be suppressed, and improvement in quality and saving in energy consumption can be achieved.
After the welding of the thermocouple 3 is completed, the plating pretreatment is further performed, and the heating nozzle unit 1 having the thermocouple 3 mounted thereon is immersed in the electrolyte solution, and the nickel plating is performed on the entire surface including the temperature measurement contact 3a of the thermocouple 3.
When the heating tip unit 1 manufactured in this manner is used, the oxidation resistance is improved, and therefore peeling or strength reduction due to oxidation of the soldering iron portion 6 and the attachment portion of the thermocouple 3 can be suppressed, and thus the durability can be improved. In particular, when an ultra-hard material is used as the base material and nickel plating is performed, wettability and weldability can be improved, and durability can be reliably improved. Further, since the main component of the thermocouple is nickel, the nickel plating affinity is good. The oxidation-resistant coating is not limited to nickel plating, and may be gold plating, for example.
Furthermore, the described embodiments are illustrative in all respects and should not be construed as limiting the invention. The present invention is not limited to the above description, and should be interpreted as being represented by the claims, and includes all modifications within the meaning and range equivalent to those of the claims.
Description of the reference numerals
1. Heating nozzle unit
2. 2' heating nozzle
3. Thermocouple
3a temperature measuring contact
3b conducting wire
6. 6' soldering iron part
7. Connecting arm part
11. Iron body
13. Front end of soldering iron
Front end face of 13a soldering iron
15. Soldering iron recess
17. Mounting hole
20. 20' groove
21. Thin wall part
25. Core wire
26. Core wire coating material
27. Outer side coating material
30. Wire storage cavity
30a open mouth
31. Stop recess
32. Wire stop
35. Temperature measurement fixing part
35a fixation contact surface
36. Groove
40. A soldering iron space portion.
The claims (modification according to treaty clause 19)
1. (modified) A heating nozzle unit formed by mounting a temperature sensor on a plate-like heating nozzle for thermocompression bonding a terminal lead wire to a terminal member, the heating nozzle unit being characterized in that,
the heating nozzle is provided with:
a soldering iron part, wherein a soldering iron front end part abutting against the terminal lead is arranged on the soldering iron body;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is arranged on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measuring fixing part is provided with a pair of fixing contact surfaces which are contacted with the temperature measuring part, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper part,
the gap between the connecting arm parts is used as a lead wire receiving empty part to receive the lead wire of the temperature sensor in the lead wire receiving empty part,
the fixing contact surface is arranged at the end part of the lead wire receiving empty part.
2. The heating nozzle unit as claimed in claim 1,
the fixing contact surface is formed as a plane, and the temperature measuring portion is formed as a spheroid.
3. (deletion)
4. (modified) heating nozzle unit according to claim 1 or 2,
an oxidation-resistant coating layer is formed on at least the surfaces of the soldering iron portion and the temperature measurement fixing portion of the heating nozzle.
5. The heating nozzle unit as claimed in claim 4,
an oxidation-resistant coating layer is formed on the surface of the temperature measuring part fixed to the temperature measuring fixing part.
6. The heating nozzle unit according to claim 4 or 5,
the oxidation-resistant coating layer is a nickel coating.
Statement or declaration (modification according to treaty clause 19)
Instructions in treaty article 19 (1)
The features of the original claim 3 are added to the original claim 1.
That is, the structure of "the lead wire of the temperature sensor is accommodated in the lead wire accommodating space with the gap between the connecting arm portions as the lead wire accommodating space, and the fixed contact surface is placed at the end portion of the lead wire accommodating space" is clear.
The above structure is not described or suggested by the comparison documents.
With the above configuration, the present invention has an effect that preparation for fixing the temperature measuring part of the temperature sensor to the temperature measuring fixing part can be smoothly performed.
In claim 4, the description referring to the original claim 3 is deleted from the claims to be referred to.
Claims (6)
1. A heating nozzle unit in which a temperature sensor is attached to a plate-shaped heating nozzle for thermocompression bonding a terminal lead to a terminal member, the heating nozzle unit being characterized in that,
the heating nozzle is provided with:
a soldering iron part, wherein a soldering iron front end part abutting against the terminal lead is arranged on the soldering iron body;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is arranged on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measuring fixing part is provided with a pair of fixing contact surfaces which the temperature measuring part contacts, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
2. The heating nozzle unit as claimed in claim 1,
the fixing contact surface is formed as a plane, and the temperature measuring portion is formed as a spheroid.
3. The heating nozzle unit according to claim 1 or 2,
the gap between the connection buttocks is used as a lead wire receiving empty part, the lead wire of the temperature sensor is received in the lead wire receiving empty part,
the fixing contact surface is arranged at the end part of the lead wire receiving empty part.
4. The heating nozzle unit according to any one of claims 1 to 3,
an oxidation-resistant coating layer is formed on at least the surfaces of the soldering iron portion and the temperature measurement fixing portion of the heating nozzle.
5. The heating nozzle unit as claimed in claim 4,
an oxidation-resistant coating layer is formed on the surface of the temperature measuring part fixed to the temperature measuring fixing part.
6. The heating nozzle unit according to claim 4 or 5,
the oxidation-resistant coating layer is a nickel coating.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-151045 | 2020-09-09 | ||
| JP2020151045A JP7137237B2 (en) | 2020-09-09 | 2020-09-09 | heater chip unit |
| PCT/JP2021/027196 WO2022054421A1 (en) | 2020-09-09 | 2021-07-20 | Heater tip unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115461180A true CN115461180A (en) | 2022-12-09 |
Family
ID=80632533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180027313.4A Pending CN115461180A (en) | 2020-09-09 | 2021-07-20 | Heating nozzle unit |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7137237B2 (en) |
| KR (1) | KR20220130802A (en) |
| CN (1) | CN115461180A (en) |
| MY (1) | MY196583A (en) |
| TW (1) | TW202211744A (en) |
| WO (1) | WO2022054421A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889928A (en) * | 2022-12-15 | 2023-04-04 | 东莞顺为半导体有限公司 | Novel welding head structure and welding head temperature compensation method |
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|---|---|---|---|---|
| US5297716A (en) * | 1993-04-12 | 1994-03-29 | Honeywell Inc. | Soldering tool with attached thermocouple |
| JP2007123647A (en) * | 2005-10-31 | 2007-05-17 | Nippon Avionics Co Ltd | Structure and method for attaching thermocouple for heater chip |
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| CN102369785A (en) * | 2009-03-27 | 2012-03-07 | Ats自动化加工系统公司 | Thermode, clamping arrangement therefor, and method of manufacture |
| JP2012183552A (en) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | Heater tip, joining device, and joining method |
| JP2017062945A (en) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Ｐｄａ | Heater chip, joining device and joining method |
| JP2018012200A (en) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Ｐｄａ | Heater chip, joint device and joint method |
| CN107848063A (en) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | Heat chip, coupling apparatus and associated methods |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4424930A (en) * | 1981-06-29 | 1984-01-10 | Cooper Industries, Inc. | Carbon-based soldering and de-soldering tip and method of manufacturing same |
| JP3968205B2 (en) | 2000-03-30 | 2007-08-29 | 太陽誘電株式会社 | Heater chip for thermocompression bonding and manufacturing method thereof |
-
2020
- 2020-09-09 JP JP2020151045A patent/JP7137237B2/en active Active
-
2021
- 2021-07-20 CN CN202180027313.4A patent/CN115461180A/en active Pending
- 2021-07-20 MY MYPI2022004865A patent/MY196583A/en unknown
- 2021-07-20 KR KR1020227030266A patent/KR20220130802A/en not_active Application Discontinuation
- 2021-07-20 WO PCT/JP2021/027196 patent/WO2022054421A1/en active Application Filing
- 2021-09-06 TW TW110133049A patent/TW202211744A/en unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5297716A (en) * | 1993-04-12 | 1994-03-29 | Honeywell Inc. | Soldering tool with attached thermocouple |
| JP2007123647A (en) * | 2005-10-31 | 2007-05-17 | Nippon Avionics Co Ltd | Structure and method for attaching thermocouple for heater chip |
| CN102369785A (en) * | 2009-03-27 | 2012-03-07 | Ats自动化加工系统公司 | Thermode, clamping arrangement therefor, and method of manufacture |
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| JP2012183552A (en) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | Heater tip, joining device, and joining method |
| CN107848063A (en) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | Heat chip, coupling apparatus and associated methods |
| JP2017062945A (en) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Ｐｄａ | Heater chip, joining device and joining method |
| JP2018012200A (en) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Ｐｄａ | Heater chip, joint device and joint method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115889928A (en) * | 2022-12-15 | 2023-04-04 | 东莞顺为半导体有限公司 | Novel welding head structure and welding head temperature compensation method |
| CN115889928B (en) * | 2022-12-15 | 2023-09-05 | 东莞顺为半导体有限公司 | Welding head structure and welding head temperature compensation method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220130802A (en) | 2022-09-27 |
| TW202211744A (en) | 2022-03-16 |
| JP2022045444A (en) | 2022-03-22 |
| WO2022054421A1 (en) | 2022-03-17 |
| JP7137237B2 (en) | 2022-09-14 |
| MY196583A (en) | 2023-04-19 |
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