MY196583A - Heater Chip Unit - Google Patents

Heater Chip Unit

Info

Publication number
MY196583A
MY196583A MYPI2022004865A MYPI2022004865A MY196583A MY 196583 A MY196583 A MY 196583A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY PI2022004865 A MYPI2022004865 A MY PI2022004865A MY 196583 A MY196583 A MY 196583A
Authority
MY
Malaysia
Prior art keywords
trowel
heater chip
contact
temperature measuring
anchoring
Prior art date
Application number
MYPI2022004865A
Inventor
Shinichiro Suga
Original Assignee
Apollo Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Giken Co Ltd filed Critical Apollo Giken Co Ltd
Publication of MY196583A publication Critical patent/MY196583A/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04Heating appliances

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Abstract

There is provided a heater chip unit (1) that allows a temperature measuring portion of a temperature sensor to be brought into sufficient contact with an anchoring portion of a heater chip (2). Specifically, in a heater chip unit (1) in which a thermocouple (3) is attached to a plate-shaped heater chip (2) for thermally press-fitting a terminal lead wire to a terminal member, the heater chip (2) includes a trowel portion (6) having a trowel tip portion (13) to be in contact with the terminal lead wire in a trowel main body (11); a pair of connecting arm portions (7) that are extended upward from left and right end portions of the trowel main body (11) while spaced from each other, and causes current from a power supply to flow into the trowel main body (11) to increase a temperature of the trowel portion (6); and a temperature measuring anchoring portion (35) which is provided to the trowel portion (6) and to which a temperature measuring contact (3a) of the thermocouple (3) is anchored, the temperature measuring anchoring portion (35) includes a pair of anchoring contact surfaces (35a) with which the temperature measuring contact (3a) comes into contact, and an interval distance between the anchoring contact surfaces (35a) is set to gradually increase as going upward from a trowel portion (6) side. (Figure 3)
MYPI2022004865A 2020-09-09 2021-07-20 Heater Chip Unit MY196583A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151045A JP7137237B2 (en) 2020-09-09 2020-09-09 heater chip unit
PCT/JP2021/027196 WO2022054421A1 (en) 2020-09-09 2021-07-20 Heater tip unit

Publications (1)

Publication Number Publication Date
MY196583A true MY196583A (en) 2023-04-19

Family

ID=80632533

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022004865A MY196583A (en) 2020-09-09 2021-07-20 Heater Chip Unit

Country Status (6)

Country Link
JP (1) JP7137237B2 (en)
KR (1) KR20220130802A (en)
CN (1) CN115461180A (en)
MY (1) MY196583A (en)
TW (1) TW202211744A (en)
WO (1) WO2022054421A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115889928B (en) * 2022-12-15 2023-09-05 东莞顺为半导体有限公司 Welding head structure and welding head temperature compensation method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
US5297716A (en) * 1993-04-12 1994-03-29 Honeywell Inc. Soldering tool with attached thermocouple
JP3968205B2 (en) 2000-03-30 2007-08-29 太陽誘電株式会社 Heater chip for thermocompression bonding and manufacturing method thereof
JP4224050B2 (en) * 2005-10-31 2009-02-12 日本アビオニクス株式会社 Heater chip thermocouple mounting structure and thermocouple mounting method
KR20120004484A (en) * 2009-03-27 2012-01-12 에이티에스 오토메이션 툴링 시스템즈 인코포레이티드 Thermode, clamping arrangement therefor, and method of manufacture
JP2010253503A (en) * 2009-04-23 2010-11-11 Miyachi Technos Corp Heater chip and joining apparatus
JP5457107B2 (en) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 Heater chip and joining device
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method
US10799977B2 (en) * 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (en) * 2015-09-25 2020-04-08 株式会社 工房Pda Heater chip, joining device and joining method
JP6851610B2 (en) * 2016-07-19 2021-03-31 株式会社 工房Pda Heater tip and joining device and joining method

Also Published As

Publication number Publication date
JP7137237B2 (en) 2022-09-14
WO2022054421A1 (en) 2022-03-17
CN115461180A (en) 2022-12-09
TW202211744A (en) 2022-03-16
KR20220130802A (en) 2022-09-27
JP2022045444A (en) 2022-03-22

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