MY196750A - Heater chip and heater chip unit - Google Patents

Heater chip and heater chip unit

Info

Publication number
MY196750A
MY196750A MYPI2022004864A MYPI2022004864A MY196750A MY 196750 A MY196750 A MY 196750A MY PI2022004864 A MYPI2022004864 A MY PI2022004864A MY PI2022004864 A MYPI2022004864 A MY PI2022004864A MY 196750 A MY196750 A MY 196750A
Authority
MY
Malaysia
Prior art keywords
trowel
heater chip
main body
connecting arm
arm portions
Prior art date
Application number
MYPI2022004864A
Inventor
Shinichiro Suga
Original Assignee
Apollo Giken Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apollo Giken Co Ltd filed Critical Apollo Giken Co Ltd
Publication of MY196750A publication Critical patent/MY196750A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

A heater chip (2) and a heater chip unit (1) that can easily achieve an excellent heat generation efficiency regardless of increase or decrease of the plate thickness are provided. A heater chip (2) is a plate-shaped heater chip (2) which thermally press-fits a terminal lead wire to a terminal member, and comprises a trowel portion (6) including a trowel tip portion (13) to be in contact with the terminal lead wire while protruding downward from the trowel main body 11, and connecting arm portions (7) that are extended upward from left and right end portions of the trowel main body (11), and cause current from a power supply to flow into the trowel main body (11) to increase a temperature of the trowel portion (6), and the trowel main body (11) has a plate thickness which is set to be smaller than plate thicknesses of the connecting arm portions (7), and a cross-sectional area which is set to be smaller than cross-sectional areas of the connecting arm portions (7).
MYPI2022004864A 2020-09-09 2021-07-20 Heater chip and heater chip unit MY196750A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020151043A JP7137235B2 (en) 2020-09-09 2020-09-09 Heater chip and heater chip unit
PCT/JP2021/027194 WO2022054419A1 (en) 2020-09-09 2021-07-20 Heater chip and heater chip unit

Publications (1)

Publication Number Publication Date
MY196750A true MY196750A (en) 2023-05-03

Family

ID=80632531

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2022004864A MY196750A (en) 2020-09-09 2021-07-20 Heater chip and heater chip unit

Country Status (6)

Country Link
JP (1) JP7137235B2 (en)
KR (1) KR20220126795A (en)
CN (1) CN115443202A (en)
MY (1) MY196750A (en)
TW (1) TW202211743A (en)
WO (1) WO2022054419A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT202100026912A1 (en) 2021-10-20 2023-04-20 Ot Lucca S R L SYSTEM FOR SUPPORTING AND HANDLING A STACK OF INTERLEAVED SHEETS DURING THE PRODUCTION OF PAPER PRODUCTS IN STACKS OF INTERLEAVED SHEETS IN AN INTERLEAVED MACHINE

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
JP3968205B2 (en) 2000-03-30 2007-08-29 太陽誘電株式会社 Heater chip for thermocompression bonding and manufacturing method thereof
JP3917964B2 (en) * 2003-08-22 2007-05-23 株式会社 工房Ｐｄａ Heater chip for thermocompression bonding
JP4253273B2 (en) * 2004-05-28 2009-04-08 株式会社 工房Ｐｄａ Heater chip for wiring connection
CN201055936Y (en) * 2007-05-24 2008-05-07 昌钰接合科技有限公司 Stepped pressure welding tool
JP2010253503A (en) * 2009-04-23 2010-11-11 Miyachi Technos Corp Heater chip and joining apparatus
JP5457107B2 (en) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 Heater chip and joining device
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method
JP5794577B2 (en) * 2011-10-21 2015-10-14 株式会社アマダミヤチ Heater chip, joining device, joining method, and conductor thin wire and terminal connection structure
US10799977B2 (en) * 2015-08-28 2020-10-13 Kobo Pda Co., Ltd. Heater chip, joining apparatus and joining method
JP6677406B2 (en) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ Heater chip, joining device and joining method
JP6851610B2 (en) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ Heater tip and joining device and joining method
JP6483892B1 (en) * 2018-05-08 2019-03-13 株式会社ジャパンユニックス Tip for soldering iron
CN210677259U (en) * 2019-08-28 2020-06-05 重庆市泓禧科技股份有限公司 Flat cable hot pressing head and automatic tin wire drawing welding machine

Also Published As

Publication number Publication date
KR20220126795A (en) 2022-09-16
CN115443202A (en) 2022-12-06
JP2022045442A (en) 2022-03-22
WO2022054419A1 (en) 2022-03-17
JP7137235B2 (en) 2022-09-14
TW202211743A (en) 2022-03-16

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