WO2022054419A1 - Heater chip and heater chip unit - Google Patents

Heater chip and heater chip unit Download PDF

Info

Publication number
WO2022054419A1
WO2022054419A1 PCT/JP2021/027194 JP2021027194W WO2022054419A1 WO 2022054419 A1 WO2022054419 A1 WO 2022054419A1 JP 2021027194 W JP2021027194 W JP 2021027194W WO 2022054419 A1 WO2022054419 A1 WO 2022054419A1
Authority
WO
WIPO (PCT)
Prior art keywords
iron
connecting arm
heater chip
tip
heater
Prior art date
Application number
PCT/JP2021/027194
Other languages
French (fr)
Japanese (ja)
Inventor
伸一郎 須賀
Original Assignee
株式会社アポロ技研
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社アポロ技研 filed Critical 株式会社アポロ技研
Priority to KR1020227030262A priority Critical patent/KR20220126795A/en
Priority to MYPI2022004864A priority patent/MY196750A/en
Priority to CN202180027305.XA priority patent/CN115443202A/en
Publication of WO2022054419A1 publication Critical patent/WO2022054419A1/en

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10Connecting leads to windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02Soldered or welded connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00Ohmic-resistance heating
    • H05B3/10Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Definitions

  • the present invention relates to a heater tip for thermocompression bonding a terminal lead wire to a terminal member, and a heater tip unit.
  • thermocompression bonding of terminal conductors to terminal members for example, in the work of thermocompression bonding lead wires to core terminals in the manufacture of electronic components such as chip inductors, heat is generated by electrical resistance when energized.
  • a heater chip is used. Specifically, the terminal lead wire mounted on the terminal member is rapidly heated while being pressurized by the iron tip of the heater chip for thermal crimping, and the terminal lead wire is thermally crimped to the terminal member (see, for example, Patent Document 1). ).
  • the heater chip is manufactured by cutting out from a conductive plate material such as tungsten or molybdenum by wire electric discharge machining. Then, in order to make the iron tip portion a size suitable for the work size (the size of the terminal member and the size of the terminal lead wire), the plate thickness of the plate material is changed.
  • the plate thickness of the plate material in other words, the plate thickness of the entire heater chip
  • the current density at the time of energization changes along with the cross-sectional area in the heat generating portion of the heater chip, and the desired heat generation performance (temperature rise / temperature rise). Cooling responsiveness, power consumption, etc.) cannot be obtained.
  • the plate thickness is increased in order to cope with the increase in work size, the current density becomes smaller and it becomes difficult to generate heat. It increases and the heat generation efficiency deteriorates. Further, since the heat capacity increases due to the increase in the volume of the heat generating portion, it is difficult to perform rapid cooling.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heater chip and a heater chip unit that can easily realize good heat generation efficiency regardless of an increase or decrease in plate thickness. be.
  • the present invention has been proposed to achieve the above object, and the one according to claim 1 is a plate-shaped heater chip for thermocompression bonding a terminal lead wire to a terminal member.
  • a trowel portion having a trowel tip portion that abuts on the terminal lead wire protruding downward (pressurizing direction at the time of crimping) from the trowel body, and a trowel portion. It is provided with a connecting arm portion extending upward from the left and right ends of the iron body and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
  • the iron body is a heater tip characterized in that the plate thickness is thinner than the plate thickness of the connecting arm portion and the cross-sectional area is set to be smaller than the cross-sectional area of the connecting arm portion.
  • the second aspect of the present invention is thinned by extending a gouged portion in a range extending from the lower part of the connecting arm portion to the iron body along a direction from one connecting arm portion to the other connecting arm portion.
  • the heater chip according to claim 3 is the heater chip according to claim 2, wherein the iron tip portion is projected below the thin-walled portion.
  • the thin-walled portion is formed on the connecting arm portion side of the iron tip portion, and the thickness of the side surface of the iron body is formed to be thinner than the thickness of the connecting arm portion excluding the thin-walled portion.
  • the fifth aspect of the present invention is characterized in that the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be the same as the plate thickness of the connecting arm portion.
  • the heater chip according to any one of claims 2 to 4.
  • the invention according to claim 6 is characterized in that the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be thinner than the plate thickness of the connecting arm portion.
  • the heater chip according to any one of claims 2 to 4.
  • the item according to claim 7 is any one of claims 1 to 6, wherein the center of each of the connecting arm portion, the iron body, and the iron tip portion in the thickness direction is located on the same plane.
  • the heater chip according to claim 8 is the heater chip according to any one of claims 1 to 7, wherein an oxidation-resistant coating layer is formed at least on the surface of the iron portion.
  • the heater chip unit according to claim 10 is characterized in that a temperature sensor is attached to the iron portion of the heater chip according to any one of claims 1 to 9.
  • the heater chip unit according to claim 11 is the heater chip unit according to claim 10.
  • the heater chip is A trowel portion having the trowel tip portion in contact with the terminal lead wire in the trowel body, and a trowel portion.
  • a pair of connecting arms extending upward from the left and right ends of the iron body so as to be separated from each other and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
  • a temperature measuring stop portion provided on the iron portion and to which the temperature measuring portion of the temperature sensor is fastened is provided.
  • the temperature measuring stop portion is provided with a pair of stop contact surfaces that the temperature measurement section contacts, and is set to a state in which the separation distance between the stop contact surfaces gradually expands from the iron portion side to the upper side. It is a characteristic heater chip unit.
  • the iron body is set to have a plate thickness thinner than the plate thickness of the connecting arm portion and a cross-sectional area smaller than the cross-sectional area of the connecting arm portion. Even if the plate thickness of the chip is increased, it is possible to suppress the inconvenience that the current density in the iron body decreases and the heat generation becomes insufficient. Therefore, it is easy to realize good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heater tip.
  • the gouged portion in the range from the lower part of the connecting arm portion to the iron body, extends along the direction from one connecting arm portion to the other connecting arm portion. Since the surface of the thin-walled part that becomes the bottom of the gouged part is the surface of the iron body, the structure of the heater chip whose plate thickness of the iron body is thinner than the plate thickness of the connecting arm part is easily realized. be able to.
  • the tip of the iron tip portion is projected below the thin-walled portion, when foreign matter adheres to the iron tip portion by the thermocompression bonding operation, the tip of the iron tip portion is pressed. It is easy to remove foreign matter by polishing. In addition, a sufficient polishing allowance for the tip of the iron tip can be secured.
  • the thin-walled portion is formed on the connecting arm portion side with respect to the iron tip portion, and the thickness of the side surface of the iron body is larger than the thickness of the connecting arm portion excluding the thin-walled portion. Since it is formed thin, it is possible to sufficiently secure the dimensions in the plate thickness direction on the tip surface of the iron tip portion. This makes it possible to widen the allowable range of the size of the work (thermocompression bonding target) to which the heater tip can be thermocompression bonded.
  • the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be the same as the plate thickness of the connecting arm portion. It is not necessary to increase or decrease the plate thickness of the portion with respect to the plate thickness of the connecting arm portion, and it is easy to manufacture a heater tip.
  • the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be thinner than the plate thickness of the connecting arm portion.
  • the degree of freedom in the thickness of the part can be increased, and it is easy to design a heater tip that corresponds to the size of the work.
  • oxidation of the surface of the heater chip can be suppressed even if the temperature is raised and cooled repeatedly, and the durability can be improved.
  • the temperature sensor since the temperature sensor is attached to the iron portion of the heater chip, it is possible to acquire the temperature information of the iron portion and utilize it for controlling the heat generation of the heater chip.
  • the temperature measuring anchoring portion since the temperature measuring anchoring portion is set to a state in which the separation distance between the anchoring contact surfaces gradually expands from the iron portion side toward the upper side, the temperature sensor is measured. It is possible to form a heater chip unit capable of sufficiently contacting the temperature portion with the temperature measuring stop portion, and having good adhesion to the heater chip of the temperature measuring portion, and by extension, good temperature measurement.
  • thermocouple It is a perspective view of a heater chip unit. It is explanatory drawing of a heater chip, (a) is a plan view, (b) is a front view, (c) is a bottom view, (d) is a side view. It is explanatory drawing of the temperature measuring stop part of a heater chip, (a) is a front view, (b) is a sectional view. It is explanatory drawing of the procedure of attaching a thermocouple to a heater chip, (a) is a state before inserting a thermocouple into a heater chip, (b) is a state after inserting a thermocouple into a heater chip, (c).
  • the heater chip unit 1 includes a plate-shaped heater chip 2 for thermocompression bonding the terminal lead wire A to the terminal member B (see FIG. 2D), and a heater as a temperature sensor. It is configured to include a thermocouple 3 attached to the chip 2.
  • the heater chip 2 is a chip formed by processing a plate material of a conductive material (tungsten, molybdenum, cemented carbide, etc.) by wire electric discharge machining, and as shown in FIG. 2, the lower portion (work) of the heater chip 2 is formed.
  • a trowel portion 6 (a tip portion located on the terminal lead wire A and a terminal member B) side) and a pair of left and right connecting arm portions 7 as an upper portion (base portion). Then, when the iron portion 6 is energized via the connecting arm portion 7, the iron portion 6 can generate heat by electric resistance, and the temperature of the iron portion 6 can be measured by the thermocouple 3.
  • the iron portion 6 includes a horizontally long iron main body 11 that connects the lower portions of the connecting arm portions 7, and the width of the iron main body 11 (dimensions along the lateral direction in which the pair of connecting arm portions 7 are lined up) is set to the heater tip 2. It is set to gradually narrow toward the bottom. Further, a box-shaped iron tip portion 13 is projected downward from the bottom of the iron body 11 slightly protruding downward, and the bottom surface (tip surface) of the iron tip portion 13 is used as the iron tip surface 13a for terminals. It is possible to contact the conductor A.
  • thermocouple 3a is formed in the upper portion (connecting arm 7 side) of the iron body 11 opposite to the iron tip 13, and the temperature measuring contact of the thermocouple 3 is formed in the iron recess 15. (Temperature measuring unit) 3a is fixed. The configuration in which the temperature measuring contact 3a is fixed will be described in detail later.
  • the connecting arm portion 7 is a vertically long structural portion extending upward from the left and right ends of the iron body 11, and is provided with the connecting arm portions 7 separated from each other. Further, in the upper portion (extended end portion) of the connecting arm portion 7, a mounting hole 17 for mounting on the chip holder (not shown) of the thermocompression bonding device is penetrated in the plate thickness direction of the heater chip 2 and this mounting is performed. By screwing a mounting bolt (not shown) passed through the hole 17 into the tip holder, the heater tip unit 1 is mounted on the tip holder with the iron tip portion 13 facing downward.
  • one connecting arm 7 is electrically connected to one end of the heater power supply (not shown) of the thermocompression bonding device, and the other connecting arm 7 is connected. It is electrically connected to the other end of the heater power supply. Then, when a current is passed from the power supply (power supply for the heater) to the heater tip 2, the current flows into the iron body 11 via the connecting arm portion 7, and the iron body 11 generates heat due to the electric resistance in the iron body 11, and this The iron tip portion 13 is configured to raise the temperature by heat.
  • the current in the iron body 11 flows from one connecting arm portion 7 side to the other connecting arm portion 7 side, but in the path through which the current flows, the constricted portion located at the corner portion of the iron recess 15 is cut off. Since the area is smaller than the cross-sectional area of other parts, the current density is highest at this constricted part, and Joule heat due to electric resistance is likely to be generated around this part.
  • the heater chip 2 is provided in the left-right direction (one connecting arm) in a range extending from the lower portion of the connecting arm portion 7 to the iron body 11 on both the front and back surfaces of the heater chip 2.
  • Grooves 20 are extended as gouged portions in the present invention along the direction from the portion 7 to the other connecting arm portion 7, and the extending grooves 20 on the front and back sides form a thin-walled portion 21 to form a trowel tip portion. 13 is configured to project below the thin wall portion 21.
  • the thin-walled portion 21 is configured to be formed at a position away from the iron tip portion 13 (specifically, on the connecting arm portion 7 side of the iron tip portion 13).
  • the depth dimension of the groove 20 on the front and back is set to be the same, and the connecting arm portion 7 and the iron body 11 (thin wall portion 21) are set to be the same.
  • the center of each thickness direction of the iron tip portion 13 is configured to be located on the same plane, and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7.
  • the surface of the thin wall portion 21 which is the bottom of the groove 20 is the side surface (front and back surface) of the iron body 11, and the plate thickness of the iron body 11 (plate thickness of the thin wall portion 21) is thinner than the plate thickness of the connecting arm portion 7.
  • the cross-sectional area of the iron body 11 (in other words, the cross-sectional area as a flow path through which a current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7.
  • the thickness t1 of the side surface of the iron body 11 is the thickness of the connecting arm portion 7 (specifically, the thickness of the connecting arm portion 7 excluding the thin-walled portion 21 (the portion of the connecting arm portion 7 that is separated from the thin-walled portion 21). (Thickness)) It is formed thinner than t2 (see FIGS. 1 and 2 (d)).
  • thermocouple 3 attached to the heater chip 2 and the configuration on the heater chip 2 for attaching the thermocouple 3 will be described.
  • the thermocouple 3 is a element having electrical insulation property by welding the tips of two types of strands 25 to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a.
  • Each of the strands 25 is covered with the wire covering material 26, and further bundled into one by the covering of the outer covering material 27 to form the conducting wire 3b.
  • the conductor wire 3b includes the strand 25.
  • the diameter of the temperature measuring contact 3a and the diameter of the conducting wire 3b are set smaller than the plate thickness of the heater chip 2, respectively.
  • the storage portion of the conducting wire 3b is provided in the gap between the connecting arm portions 7, and the fastening portion of the temperature measuring contact 3a is provided in the iron portion 6.
  • the upper end portion opens a gap between the connecting arm portions 7 extending along the longitudinal direction of the connecting arm portions 7.
  • the conductor storage space 30 is set to a size (thickness, width) slightly larger than the wire diameter of the conductor 3b, and the conductor 3b (specifically, the temperature measuring contact 3a of the conductor 3b is closer to the temperature measuring contact 3a) in the conductor storage space 30.
  • the portion located in) is stored in a state where the conductor 3b does not protrude outward from each of the front and back surfaces of the heater chip 2. Then, the conductor 3b extends from the opening 30a at the upper end of the conductor storage vacant portion 30, and the lower end of the conductor storage vacant portion 30 is widened to communicate with the iron recess 15 (see FIG. 1).
  • each connecting arm portion 7 is formed with a part of the side surface facing the conductor storage vacant portion 30 cut out so as to communicate with the conductor storage vacant portion 30, and each stop recess 31 and the conductor storage vacant portion 30 are formed.
  • a part of the vacant portion 30 (a portion located between the fixing recesses 31) is provided with a conducting wire fixing portion 32 which is cured (solidified) after injecting a resin such as an ultraviolet curable resin or a thermosetting resin.
  • the conductor 32 prevents the conductor 3b from shifting from the conductor accommodating empty portion 30 and protruding from the heater chip 2.
  • the temperature measuring contact 3a of the thermocouple 3 is fastened to the portion facing the end (lower end) of the conducting wire accommodating empty portion 30.
  • the 35 is provided in a state of protruding toward the upper connecting arm portion 7.
  • the temperature measuring fastening portion 35 is a protrusion portion that protrudes from the iron tip portion 13 on the opposite side of the iron body 11 and is formed to be slightly smaller than the iron tip portion 13.
  • the portion facing the conductor storage vacant portion 30 (the upper portion of the temperature measuring vacant portion 35) is provided with a pair of fastening contact surfaces 35a to which the temperature measuring contact 3a contacts, and the end of the conducting wire accommodating vacant portion 30.
  • each of the fastening contact surfaces 35a is formed on a flat surface, a V-shaped recess 36 is formed in the upper portion of the temperature measuring fastening portion 35 (the upper portion on the side of the lead wire storage vacant portion 30), and the inside of the recess 36 is formed.
  • the temperature measuring contact 3a is received and brought into contact with the fastening contact surface 35a, and the temperature measuring contact 3a is fastened to the iron portion 6 (temperature measuring fastening portion 35) by welding or the like in this state.
  • thermocouple 3 a procedure for manufacturing the heater chip unit 1, particularly a procedure for attaching the thermocouple 3 to the heater chip 2
  • the heater chip 2 and the thermocouple 3 separately prepared in advance are arranged so that the opening 30a of the conductor storage space 30 and the temperature measuring contact 3a face each other.
  • the attitudes of the heater chip 2 and the thermocouple 3 are set, and the temperature measuring stop 35, the lead wire storage empty section 30, the temperature measuring contact 3a, and the conducting wire 3b are arranged in this order on the same straight line.
  • the thermocouple 3 is inserted into the opening 30a of the lead wire storage space 30 of the heater chip 2 with the temperature measuring contact 3a at the head.
  • the side surface of the connecting arm portion 7 serves as a guide to guide the thermocouple 3 to the iron portion 6 side.
  • the temperature measuring contact 3a enters the iron recess 15 after passing through the conductor accommodating empty portion 30.
  • the iron portion 6 is provided with a temperature measuring fastening portion 35 at a position facing the lower end portion (open end portion on the iron portion 6 side) of the conductor storage empty portion 30. Since the V-shaped fastening contact surface 35a faces the end of the conductor accommodating empty portion 30, the temperature measuring contact 3a that has entered the iron recess 15 reaches the temperature measuring fastening portion 35 and makes a fastening contact. Contact (contact) with the surface 35a. In this way, the temperature measuring contact 3a can be easily and surely brought into contact with the fastening contact surface 35a (temperature measuring fastening portion 35). Therefore, it is possible to smoothly prepare for anchoring the temperature measuring contact 3a to the temperature measuring anchoring portion 35.
  • the lead wire 3b is pressed toward the temperature measuring anchoring portion 35 to maintain the contact of the temperature measuring anchoring portion 35 with the fastening contact surface 35a, and in this state, the temperature measuring anchoring portion 35 and the fastening contact surface 35a are maintained.
  • the fastening contact surface 35a is heated by irradiating it with a laser, and the temperature measuring contact 3a is melted by this heat to be fastened (welded).
  • the temperature measuring anchoring portion 35 is set to a state in which the separation distance between the anchoring contact surfaces 35a gradually expands from the iron portion 6 side toward the upper side.
  • the temperature measuring contact 3a can be sufficiently brought into contact with the temperature measuring anchoring portion 35. Therefore, it is possible to configure the heater chip unit 1 capable of good adhesion of the temperature measuring contact 3a to the heater chip 2 and thus good temperature measurement. Further, since the fastening contact surface 35a is formed of a flat surface and the temperature measuring contact 3a is formed of a spherical body, the temperature measuring contact 3a can easily make point contact with the fastening contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fastening contact surface 35a, stress is easily concentrated and the temperature measuring contact 3a is difficult to float from the fastening contact surface 35a. As a result, the temperature measuring contact 3a can be more satisfactorily attached to the heater chip 2, and thus the temperature of the heater chip 2 can be measured more satisfactorily.
  • a part of the lead wire storage empty portion 30 (a portion located between the stopping recesses 31) and each stop.
  • a resin such as an ultraviolet curable resin or a thermosetting resin is injected into the concave portion 31 in a state before curing (flow state) to fill the recesses, and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin and stop the wire. It is referred to as a part 32.
  • the lead wire 3b of the thermocouple 3 is housed in the lead wire storage empty portion 30, the lead wire 3b of the thermocouple 3 is the heater chip. It is possible to avoid protruding from the range of the plate thickness of 2. Therefore, when handling the heater chip unit 1 such as mounting work on a thermocompression bonding device, or when entering the work area of the heater chip unit 1, the inconvenience of inadvertently hooking the conductor 3b, and eventually the thermocouple from the heater chip 2. It is unlikely that the inconvenience of 3 falling off will occur.
  • the heater chip units 1 when a plurality of heater chip units 1 are to be put together at the time of transportation (shipment) or storage, the heater chip units 1 can be stably stacked without any trouble, and the transportation work and the storage work can be performed without delay. be able to.
  • the conductor storage vacant portion 30 is provided with the conductor stopper portion 32, it is possible to prevent the inconvenience that the stored conductor wire 3b comes off from the conductor storage vacant portion 30. Further, since the resin injected into the conductor storage space 30 and cured is used as the conductor stopper 32, it is easy to insert the resin into the gap between the connecting arm 7 and the conductor 3b as the conductor stopper 32, and the conductor 3b is sufficiently inserted. Can be stopped at.
  • the conductor retaining portion 31 is provided with the retaining recess 31 communicating with the conducting wire accommodating vacant portion 30, and the resin which is the conducting wire retaining portion 32 is injected into the conducting wire accommodating vacant portion 30 and the retaining recess 31 to be cured, the conducting wire retaining portion 32 accommodates the conducting wire. It becomes difficult to fall off from the vacant portion 30, and it is possible to suppress the inconvenience that the conductor 3b is detached from the conductor storage vacant portion 30 together with the conductor stop portion 32.
  • thermocompression-bonding the terminal lead wire A to the terminal member B using the heater chip unit 1 first, the heater chip unit 1 is placed on the chip holder of the thermocompression-bonding device with the iron tip portion 13 on the lower side. Attached, the lead wire 3b of the thermocouple 3 is connected to the thermocouple connection terminal (not shown) of the thermocompression bonding device. After that, the terminal member B and the terminal lead wire A are set in a work area (none of which is shown) provided below the chip holder, and the terminal lead wire A is placed on the upper surface of the terminal member B.
  • the heater tip unit 1 When the terminal member B and the terminal lead wire A are set, the heater tip unit 1 is lowered together with the tip holder to press the iron tip portion 13 against the terminal lead wire A, and further, the iron main body is energized by energizing the heater tip 2. 11 is heated, and the terminal lead wire A is thermocompression bonded to the terminal member B. Further, the temperature of the iron portion 6 is measured by the thermocouple 3, and the control unit (not shown) of the thermocompression bonding device controls the energization of the heater chip 2 based on this measured value, and further controls the temperature of the iron tip portion 13. I do.
  • the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. Therefore, even if the plate thickness of the heater chip 2 is increased, the inconvenience that the current density in the iron body 11 decreases and the heat generation becomes insufficient can be suppressed. Therefore, it is easy to realize good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heater tip 2. Further, it is possible to avoid an increase in the volume of the iron body 11 and an increase in the heat capacity, and it is easy to quickly cool the iron body 11 and the iron tip portion 13.
  • the groove 20 extends from the lower part of the connecting arm portion 7 to the iron body 11 to form the thin-walled portion 21, the surface of the thin-walled portion 21 which is the bottom of the groove 20 is the side surface of the iron body 11. , The structure of the heater tip 2 in which the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 can be easily realized.
  • the iron tip portion 13 is projected below the thin-walled portion 21, if foreign matter (insulation coating of the terminal lead wire A, etc.) adheres to the iron tip portion 13 due to thermocompression bonding work, the iron tip portion 13 It is easy to remove foreign matter by polishing the tip. Further, it is possible to sufficiently secure a polishing allowance for the tip of the iron tip portion 13, and it is possible to prolong the replacement cycle (use life) of the heater tip unit. Then, the thin-walled portion 21 was formed on the connecting arm portion 7 side of the iron tip portion 13, and the thickness of the side surface of the iron body 11 was formed to be thinner than the thickness of the connecting arm portion 7 excluding the thin-walled portion 21.
  • the thin-walled portion 21 is formed at a position separated from the iron tip portion 13 and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, the plate thickness of the iron tip portion 13 is set to the connecting arm. It is not necessary to increase or decrease the thickness with respect to the plate thickness of the portion 7, and the heater tip 2 can be easily manufactured.
  • thermocouple 3 is attached to the iron portion 6 of the heater chip 2 as a temperature sensor, it is possible to acquire the temperature information of the iron portion 6 and utilize it for controlling the heat generation of the heater chip 2.
  • the temperature sensor can be realized with a simple configuration.
  • the iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heater chip 2 to form the thin-walled portion 21, but the present invention is not limited to this.
  • the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, any mode of iron is used.
  • the main body 11 may be provided on the heater chip 2.
  • the iron body 11 may be formed by extending the groove on either the front surface or the back surface of the heater tip 2 to form the thin-walled portion 21.
  • the iron main body 11 is located unevenly on either the front or the back of the heater tip 2, which causes a bending moment in the heater tip 2 during thermocompression bonding work. Therefore, the connecting arm portion 7 and the iron main body 11. It is preferable to adopt a configuration in which the center of each thickness direction of the iron tip portion 13 is located on the same plane, that is, the configuration of the above embodiment.
  • the iron body 11 may be configured to include a portion having the highest electric resistance value (a portion serving as a heat generating portion). Therefore, the region for thinning by the groove or the like may extend to the inside of the connecting arm portion 7, and may not necessarily be the entire area of the iron body 11.
  • the plate thickness of the iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same dimensions, but the present invention is not limited to this.
  • the plate thickness of the iron tip portion 13 is cut to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the iron tip portion 13 can be increased, and the work to be subjected to thermocompression bonding treatment ( It is easy to design the heater chip 2 corresponding to the size of the terminal member B and the terminal lead wire A).
  • the temperature measuring fastening portion 35 is configured to be slightly smaller than the iron tip portion 13, but the present invention is not limited to this.
  • the volume of the iron tip portion 13 and the volume of the temperature measuring anchoring portion 35 are aligned so as to avoid an extremely different difference between the heat capacity of the iron tip portion 13 and the heat capacity of the temperature measuring anchoring portion 35. Then, it is possible to synchronize the temperature change in the temperature measuring stop 35 with the temperature change in the iron tip 13, and the iron tip 13 is based on the temperature measurement of the temperature measuring stop 35. Easy to carry out temperature control.
  • the fastening contact surface 35a of the temperature measuring fastening portion 35 is configured by a flat surface, but the present invention is not limited to this.
  • the fastening contact surface 35a may be formed of a curved surface as long as the separation distance between the fastening contact surfaces 35a is set to gradually expand from the iron portion 6 side toward the upper side. If the temperature measuring contact (temperature measuring unit) 3a can be sufficiently contacted with the fastening contact surface 35a, the temperature measuring contact 3a is not limited to being formed into a spherical shape, and is formed in any shape. You may. Further, the temperature measuring contact 3a of the thermocouple 3 and the temperature measuring fastening portion 35 are welded and fastened, but the present invention is not limited to this.
  • the fastening mode between the temperature measuring contact 3a and the temperature measuring fastening portion 35 does not matter.
  • the temperature measuring contact 3a and the temperature measuring fastening portion 35 may be fastened using a fastener (adhesive) having good heat conduction.
  • the conductor storage empty portion 30 is provided so as to extend linearly along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited to this.
  • any form of the conductor storage vacant portion 30 may be applied as long as the configuration is such that the conductor 3b of the thermocouple 3 can be stored.
  • a conductor storage vacant portion 30 extending in a curved line shape or a curved line shape may be applied.
  • a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead wire stopper 32 in the present invention, the present invention is not limited to this.
  • the mode of the conductor stop portion 32 does not matter.
  • a cap that can be fitted to the conductor storage vacant portion 30 may be adopted as the conductor stopper, or a protrusion that is integrally molded with the connecting arm portion 7 and protrudes toward the conductor storage vacant portion 30 may be used as the conductor stopper. May be adopted as.
  • the retaining recess 31 communicating with the conductor storage vacant portion 30 is configured by a shallow notch on the side surface of the conductor storage vacant portion 30, but the present invention is not limited to this.
  • any embodiment of the configuration of the fixing recess 31 may be adopted.
  • groove-shaped retaining recesses are formed on both the front and back surfaces of the connecting arm portion 7, and the end portion of the retaining recess is communicated with the conducting wire storage empty portion 30 so that the resin (conductor retaining portion 32) is transmitted from the conducting wire storage empty portion 30. It may be configured to be injected over the retaining recess.
  • thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measuring contact 3a of the thermocouple 3 is exemplified as the temperature measuring unit of the present invention, but the present invention is not limited thereto.
  • the temperature sensor is capable of measuring the temperature of the iron portion 6 and is configured to have the temperature measuring portion at the end of the conducting wire 3b, any form of the temperature sensor is adopted for the heater tip 2. It may be attached.
  • the groove 20 is exemplified as the gouged portion in the present invention, but the present invention is not limited to this.
  • the heater chip 2'of the second embodiment shown in FIGS. 5 and 6 is basically the same as the above embodiment (first embodiment), but only on both the front and back sides of the heater chip 2'. The difference is that the lower half of the heater tip 2'is bifurcated by forming a gouge in the middle part of the heater tip 2'in the plate thickness direction, which has two iron bodies. ..
  • the heater chip 2' is located in the middle portion in the plate thickness direction of the iron portion 6'located below the heater chip 2'in the left-right direction (from one connecting arm 7 to the other connecting arm).
  • the iron space portion 40 extending along the portion 7) is formed as a hollow portion, and the iron space portion 40 is opened downward.
  • the iron main body 11 and the iron tip portion 13 are provided on both the front and back sides of the heater tip 2'with the iron space portion 40 interposed therebetween.
  • the iron portion 6'of the heater tip 2'in includes two iron main bodies 11 that are separated from each other and two iron tip portions 13 that are separated from each other.
  • each iron body 11 is provided with a trowel recess 15 in which a groove 20 is formed on the outer surface, a groove 20'is also formed on the inner surface, and the temperature measuring fixing portion 35 is projected.
  • the temperature measuring contact (temperature measuring part) 3a of the thermocouple 3 can be fixed to each temperature measuring fixing part 35, and in each iron tip part 13, the plate thickness of the iron tip part 13 is connected to the connecting arm part 7. It is set thinner than the plate thickness.
  • the two trowel tip portions 13 can simultaneously perform thermocompression bonding at two locations, thereby improving the efficiency of the thermocompression bonding work. can. Further, by setting the dimensions of the iron space portion 40 in the plate thickness direction, the separation distance (pitch) between the two iron tip portions 13 and the size of the iron tip surface 13a of each iron tip portion 13 can be adjusted according to the work. Can be done.
  • an oxidation-resistant coating layer may be formed on the surface of the heater chip to enhance the oxidation resistance.
  • the oxidation resistant coating layer will be described.
  • the surface is easily oxidized, and the oxidation is particularly remarkable in the vicinity of the iron portion 6 (heating portion) and the portion where the thermocouple 3 is welded. ..
  • the oxidized part near the heat generating part is peeled off and the strength is lowered, which causes a problem of damage during pressurization.
  • the welded part of the thermocouple is corroded and the strength is lowered, and finally the thermoelectric is generated. Inconveniences such as the pair being separated and unable to be used occur.
  • an oxidation-resistant coating layer is formed on the surface of the heater chip to improve the oxidation resistance.
  • the manufacturing process will be specifically described.
  • the metal plate used as the material (base material) specifically, it is superior in abrasion resistance to the conventionally generally used tungsten (hardness HV430) and tungsten alloy (hardness HV200-400). It is desirable to use so-called cemented carbide (hardness HV900-2400) (official name; cemented carbide, alloy obtained by sintering hard metal carbide powder), and this cemented carbide plate is made into a predetermined shape by wire cutting. break the ice.
  • the cut pieces are subjected to pre-plating treatment, and then immersed in a melting tank and energized to form an oxidation-resistant coating layer made of nickel on the surface of the cut pieces, that is, nickel plating is performed. After that, it is withdrawn from the melting tank and subjected to post-treatment such as washing. Then, in the same manner as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fastening portion 35. In this welding, since the coating of the nickel layer is formed on the surface of the temperature measurement fixing portion 35 (the fixing contact surface 35a), the wettability is enhanced, thereby improving the certainty of welding and the welding strength.
  • the output of the laser can be suppressed more than before, and the damage to the base metal can be suppressed, so that the quality can be improved and the energy consumption can be saved.
  • the heater chip unit 1 equipped with the thermocouple 3 is immersed in the electrolytic solution, and the entire surface including the temperature measuring contact 3a of the thermocouple 3 is covered. Apply nickel plating.
  • the oxidation resistance is improved, so that it is possible to suppress peeling and strength decrease due to oxidation of the iron portion 6 and the attachment portion of the thermocouple 3.
  • Durability can be improved.
  • nickel plating is applied to the base material using a cemented carbide, the wettability is improved, the weldability can be improved, and the durability can be surely improved.
  • the main component of the thermocouple is nickel, nickel plating has a good affinity.
  • the oxidation resistant film is not limited to nickel plating, and may be, for example, gold plating.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Resistance Heating (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Abstract

This heater chip and this heater chip unit can easily achieve good heating efficiency regardless of increases or decreases in plate thickness. The heater chip is a plate-shaped heater chip 2 for thermal press fitting of a terminal lead to a terminal member, and comprises: a soldering iron section 6 provided with a soldering iron tip section 13 that comes into contact with the terminal lead in a state of protruding downward from a soldering iron body 11; and connecting arm sections 7 that extend upward from lateral end sections of the soldering iron body 11 and raise the temperature of the soldering iron section 6 by causing a current from a power source to flow to the soldering iron body 11. The soldering iron body 11 has: a plate thickness that is set to be less than that of the connecting arm sections 7; and a cross-sectional area that is set to be less than that of the connecting arm sections 7.

Description

ヒーターチップ、および、ヒーターチップユニットHeater tip and heater tip unit
 本発明は、端子用導線を端子部材に熱圧着するためのヒーターチップ、および、ヒーターチップユニットに関するものである。 The present invention relates to a heater tip for thermocompression bonding a terminal lead wire to a terminal member, and a heater tip unit.
 端子用導線を端子部材に熱圧着する作業、例えば、チップインダクター等の電子部品の製造においてリード線をコアの端子部に熱圧着する作業においては、通電時の電気抵抗により発熱する熱圧着用ヒーターチップが用いられる。具体的には、端子部材に載せた端子用導線を熱圧着用のヒーターチップのコテ先部により加圧しながら急加熱して、端子用導線を端子部材へ熱圧着する(例えば、特許文献1参照)。 For thermocompression bonding of terminal conductors to terminal members, for example, in the work of thermocompression bonding lead wires to core terminals in the manufacture of electronic components such as chip inductors, heat is generated by electrical resistance when energized. A heater chip is used. Specifically, the terminal lead wire mounted on the terminal member is rapidly heated while being pressurized by the iron tip of the heater chip for thermal crimping, and the terminal lead wire is thermally crimped to the terminal member (see, for example, Patent Document 1). ).
特開2001-284781号公報Japanese Unexamined Patent Publication No. 2001-284781
 ところで、ヒーターチップは、タングステンやモリブデン等の導電性板材からワイヤー放電加工により切り出す等して製造されている。そして、コテ先部をワークサイズ(端子部材の大きさや端子用導線の大きさ)に適した大きさにするには、板材の板厚を変えて対応している。 By the way, the heater chip is manufactured by cutting out from a conductive plate material such as tungsten or molybdenum by wire electric discharge machining. Then, in order to make the iron tip portion a size suitable for the work size (the size of the terminal member and the size of the terminal lead wire), the plate thickness of the plate material is changed.
 しかしながら、板材の板厚(言い換えると、ヒーターチップ全体の板厚)を変えると、ヒーターチップの発熱部分において、断面積とともに通電時の電流密度が変化してしまい、所望の発熱性能(昇温・冷却の応答性や消費電力等)を得ることができない。特に、ワークサイズの大型化に対応するために板材の板厚を厚くすると、電流密度が小さくなって発熱し難くなり、コテ先部を所望の温度まで上げようとすると、通電時間や消費電力が増大して発熱効率が悪くなってしまう。さらに、発熱部分の体積増加により熱容量が大きくなることから、迅速な冷却を行うことが難しい。 However, if the plate thickness of the plate material (in other words, the plate thickness of the entire heater chip) is changed, the current density at the time of energization changes along with the cross-sectional area in the heat generating portion of the heater chip, and the desired heat generation performance (temperature rise / temperature rise). Cooling responsiveness, power consumption, etc.) cannot be obtained. In particular, if the plate thickness is increased in order to cope with the increase in work size, the current density becomes smaller and it becomes difficult to generate heat. It increases and the heat generation efficiency deteriorates. Further, since the heat capacity increases due to the increase in the volume of the heat generating portion, it is difficult to perform rapid cooling.
 本発明は、上記した事情に鑑みてなされたものであり、その目的は、板厚の増減に拘らず良好な発熱効率を実現し易いヒーターチップ、および、ヒーターチップユニットを提供しようとするものである。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a heater chip and a heater chip unit that can easily realize good heat generation efficiency regardless of an increase or decrease in plate thickness. be.
 本発明は、上記目的を達成するために提案されたものであり、請求項1に記載のものは、端子用導線を端子部材に熱圧着するための板状のヒーターチップであって、
 前記端子用導線に当接するコテ先部をコテ本体から下方(圧着時の加圧方向)へ突出した状態で備えたコテ部と、
 前記コテ本体の左右端部から上方へ延設され、電源からの電流をコテ本体に流してコテ部を昇温させる接続腕部と、を備え、
 前記コテ本体は、板厚が接続腕部の板厚よりも薄く、且つ、断面積が接続腕部の断面積よりも小さく設定されていることを特徴とするヒーターチップである。
The present invention has been proposed to achieve the above object, and the one according to claim 1 is a plate-shaped heater chip for thermocompression bonding a terminal lead wire to a terminal member.
A trowel portion having a trowel tip portion that abuts on the terminal lead wire protruding downward (pressurizing direction at the time of crimping) from the trowel body, and a trowel portion.
It is provided with a connecting arm portion extending upward from the left and right ends of the iron body and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
The iron body is a heater tip characterized in that the plate thickness is thinner than the plate thickness of the connecting arm portion and the cross-sectional area is set to be smaller than the cross-sectional area of the connecting arm portion.
 請求項2に記載のものは、前記接続腕部の下部からコテ本体に亘る範囲には、一方の接続腕部から他方の接続腕部へ向かう方向に沿ってえぐり部を延在させることにより薄肉部が形成され、えぐり部の底部となる薄肉部の表面がコテ本体の面であることを特徴とする請求項1に記載のヒーターチップである。 The second aspect of the present invention is thinned by extending a gouged portion in a range extending from the lower part of the connecting arm portion to the iron body along a direction from one connecting arm portion to the other connecting arm portion. The heater chip according to claim 1, wherein the portion is formed and the surface of the thin-walled portion that becomes the bottom of the hollow portion is the surface of the iron body.
 請求項3に記載のものは、前記薄肉部の下方にコテ先部が突設されていることを特徴とする請求項2に記載のヒーターチップである。 The heater chip according to claim 3 is the heater chip according to claim 2, wherein the iron tip portion is projected below the thin-walled portion.
 請求項4に記載のものは、前記薄肉部が前記コテ先部よりも接続腕部側に形成されて、コテ本体の側面の厚さが薄肉部を除いた接続腕部の厚さよりも薄く形成されていることを特徴とする請求項2に記載のヒーターチップである。 According to claim 4, the thin-walled portion is formed on the connecting arm portion side of the iron tip portion, and the thickness of the side surface of the iron body is formed to be thinner than the thickness of the connecting arm portion excluding the thin-walled portion. The heater chip according to claim 2, wherein the heater chip is made.
 請求項5に記載のものは、前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚と同じに設定されていることを特徴とする請求項2から請求項4のいずれかに記載のヒーターチップである。 The fifth aspect of the present invention is characterized in that the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be the same as the plate thickness of the connecting arm portion. The heater chip according to any one of claims 2 to 4.
 請求項6に記載のものは、前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚よりも薄く設定されていることを特徴とする請求項2から請求項4のいずれかに記載のヒーターチップである。 The invention according to claim 6 is characterized in that the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be thinner than the plate thickness of the connecting arm portion. The heater chip according to any one of claims 2 to 4.
 請求項7に記載のものは、前記接続腕部、コテ本体、コテ先部の各厚さ方向の中央が同一平面上に位置することを特徴とする請求項1から請求項6のいずれかに記載のヒーターチップである。 The item according to claim 7 is any one of claims 1 to 6, wherein the center of each of the connecting arm portion, the iron body, and the iron tip portion in the thickness direction is located on the same plane. The heater chip described.
 請求項8に記載のものは、少なくとも前記コテ部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項1から請求項7のいずれかに記載のヒーターチップである。 The heater chip according to claim 8 is the heater chip according to any one of claims 1 to 7, wherein an oxidation-resistant coating layer is formed at least on the surface of the iron portion.
 請求項9に記載のものは、前記耐酸化性被膜層がニッケル被膜であることを特徴とする請求項8に記載のヒーターチップである。 The heater chip according to claim 9, wherein the oxidation-resistant coating layer is a nickel coating.
 請求項10に記載のものは、請求項1から請求項9のいずれかに記載のヒーターチップのコテ部に温度センサーを取り付けたことを特徴とするヒーターチップユニットである。
 請求項11に記載のものは、請求項10に記載のヒーターチップユニットであって、
 前記ヒーターチップは、
 前記端子用導線に当接する前記コテ先部を前記コテ本体に備えたコテ部と、
 前記コテ本体の左右端部から上方へ互いに離間した状態で延設され、電源からの電流をコテ本体に流してコテ部を昇温させる一対の接続腕部と、
 前記コテ部に設けられ、前記温度センサーの測温部が止着される測温止着部と、を備え、
 前記測温止着部は、測温部が接触する一対の止着接触面を備え、止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定したことを特徴とするヒーターチップユニットである。
The heater chip unit according to claim 10 is characterized in that a temperature sensor is attached to the iron portion of the heater chip according to any one of claims 1 to 9.
The heater chip unit according to claim 11 is the heater chip unit according to claim 10.
The heater chip is
A trowel portion having the trowel tip portion in contact with the terminal lead wire in the trowel body, and a trowel portion.
A pair of connecting arms extending upward from the left and right ends of the iron body so as to be separated from each other and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
A temperature measuring stop portion provided on the iron portion and to which the temperature measuring portion of the temperature sensor is fastened is provided.
The temperature measuring stop portion is provided with a pair of stop contact surfaces that the temperature measurement section contacts, and is set to a state in which the separation distance between the stop contact surfaces gradually expands from the iron portion side to the upper side. It is a characteristic heater chip unit.
 本発明によれば、以下のような優れた効果を奏する。
 請求項1に記載の発明によれば、前記コテ本体は、板厚が接続腕部の板厚よりも薄く、且つ、断面積が接続腕部の断面積よりも小さく設定されているので、ヒーターチップの板厚を厚くしたとしても、コテ本体での電流密度が低下して発熱が不十分となってしまう不都合を抑えることができる。したがって、ヒーターチップの板厚の増減に拘らず良好な発熱効率を実現し易い。
According to the present invention, the following excellent effects are obtained.
According to the first aspect of the present invention, the iron body is set to have a plate thickness thinner than the plate thickness of the connecting arm portion and a cross-sectional area smaller than the cross-sectional area of the connecting arm portion. Even if the plate thickness of the chip is increased, it is possible to suppress the inconvenience that the current density in the iron body decreases and the heat generation becomes insufficient. Therefore, it is easy to realize good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heater tip.
 請求項2に記載の発明によれば、前記接続腕部の下部からコテ本体に亘る範囲には、一方の接続腕部から他方の接続腕部へ向かう方向に沿ってえぐり部を延在させることにより薄肉部が形成され、えぐり部の底部となる薄肉部の表面がコテ本体の面であるので、コテ本体の板厚が接続腕部の板厚よりも薄いヒーターチップの構造を簡単に実現することができる。 According to the second aspect of the present invention, in the range from the lower part of the connecting arm portion to the iron body, the gouged portion extends along the direction from one connecting arm portion to the other connecting arm portion. Since the surface of the thin-walled part that becomes the bottom of the gouged part is the surface of the iron body, the structure of the heater chip whose plate thickness of the iron body is thinner than the plate thickness of the connecting arm part is easily realized. be able to.
 請求項3に記載の発明によれば、前記薄肉部の下方にコテ先部が突設されているので、熱圧着作業によって異物がコテ先部に付着した場合には、コテ先部の先端を研磨する等して異物を除去し易い。また、コテ先部の先端の研磨代を十分に確保することができる。 According to the third aspect of the present invention, since the iron tip portion is projected below the thin-walled portion, when foreign matter adheres to the iron tip portion by the thermocompression bonding operation, the tip of the iron tip portion is pressed. It is easy to remove foreign matter by polishing. In addition, a sufficient polishing allowance for the tip of the iron tip can be secured.
 請求項4に記載の発明によれば、前記薄肉部が前記コテ先部よりも接続腕部側に形成されて、コテ本体の側面の厚さが薄肉部を除いた接続腕部の厚さよりも薄く形成されているので、コテ先部の先端面において板厚方向の寸法を十分に確保することができる。これにより、ヒーターチップが熱圧着可能なワーク(熱圧着対象)の大きさの許容範囲を広げることができる。 According to the fourth aspect of the present invention, the thin-walled portion is formed on the connecting arm portion side with respect to the iron tip portion, and the thickness of the side surface of the iron body is larger than the thickness of the connecting arm portion excluding the thin-walled portion. Since it is formed thin, it is possible to sufficiently secure the dimensions in the plate thickness direction on the tip surface of the iron tip portion. This makes it possible to widen the allowable range of the size of the work (thermocompression bonding target) to which the heater tip can be thermocompression bonded.
 請求項5に記載の発明によれば、前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚と同じに設定されているので、コテ先部の板厚を接続腕部の板厚に対して増減させる必要がなく、ヒーターチップを製造し易い。 According to the fifth aspect of the present invention, the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be the same as the plate thickness of the connecting arm portion. It is not necessary to increase or decrease the plate thickness of the portion with respect to the plate thickness of the connecting arm portion, and it is easy to manufacture a heater tip.
 請求項6に記載の発明によれば、前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚よりも薄く設定されているので、コテ先部の板厚寸法の自由度を増すことができ、ワークの大きさに対応したヒーターチップを設計し易い。 According to the invention of claim 6, the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be thinner than the plate thickness of the connecting arm portion. The degree of freedom in the thickness of the part can be increased, and it is easy to design a heater tip that corresponds to the size of the work.
 請求項7に記載の発明によれば、前記接続腕部、コテ本体、コテ先部の各厚さ方向の中央が同一平面上に位置するので、熱圧着作業時にヒーターチップ内で曲げモーメントが発生し難くなり、ヒーターチップに余計な負荷が掛かる不都合、ひいてはヒーターチップが損傷し易くなる不都合を抑えることができる。 According to the invention of claim 7, since the centers of the connecting arm portion, the iron body, and the iron tip portion in the thickness direction are located on the same plane, a bending moment is generated in the heater tip during the thermocompression bonding operation. It becomes difficult to do so, and it is possible to suppress the inconvenience that an extra load is applied to the heater chip, and eventually the inconvenience that the heater chip is easily damaged.
 請求項8および請求項9に記載の発明によれば、昇温と冷却が繰り返し行われてもヒーターチップの表面の酸化を抑制することができ、耐久性を向上させることができる。 According to the inventions of claim 8 and 9, oxidation of the surface of the heater chip can be suppressed even if the temperature is raised and cooled repeatedly, and the durability can be improved.
 請求項10に記載の発明によれば、ヒーターチップのコテ部に温度センサーを取り付けたので、コテ部の温度の情報を取得してヒーターチップの発熱の制御に活用することができる。
 請求項11に記載の発明によれば、測温止着部において止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定しているので、温度センサーの測温部を測温止着部へ十分に接触させることができ、測温部のヒーターチップへの良好な止着、ひいては良好な測温が可能なヒーターチップユニットを構成することができる。
According to the tenth aspect of the present invention, since the temperature sensor is attached to the iron portion of the heater chip, it is possible to acquire the temperature information of the iron portion and utilize it for controlling the heat generation of the heater chip.
According to the invention of claim 11, since the temperature measuring anchoring portion is set to a state in which the separation distance between the anchoring contact surfaces gradually expands from the iron portion side toward the upper side, the temperature sensor is measured. It is possible to form a heater chip unit capable of sufficiently contacting the temperature portion with the temperature measuring stop portion, and having good adhesion to the heater chip of the temperature measuring portion, and by extension, good temperature measurement.
ヒーターチップユニットの斜視図である。It is a perspective view of a heater chip unit. ヒーターチップの説明図であり、(a)は平面図、(b)は正面図、(c)は底面図、(d)は側面図である。It is explanatory drawing of a heater chip, (a) is a plan view, (b) is a front view, (c) is a bottom view, (d) is a side view. ヒーターチップの測温止着部の説明図であり、(a)は正面図、(b)は断面図である。It is explanatory drawing of the temperature measuring stop part of a heater chip, (a) is a front view, (b) is a sectional view. ヒーターチップに熱電対を取り付ける手順の説明図であり、(a)は熱電対をヒーターチップ内に挿入する前の状態、(b)は熱電対をヒーターチップ内に挿入した後の状態、(c)は導線収納空部および止め凹部に導線止め部として樹脂を注入した状態である。It is explanatory drawing of the procedure of attaching a thermocouple to a heater chip, (a) is a state before inserting a thermocouple into a heater chip, (b) is a state after inserting a thermocouple into a heater chip, (c). ) Is a state in which resin is injected into the lead wire storage vacant part and the stop recess as the lead wire stop portion. 2つのコテ部を備えたヒーターチップの斜視図である。It is a perspective view of the heater chip provided with two iron portions. 2つのコテ部を備えたヒーターチップの説明図であり、(a)は平面図、(b)は正面図、(c)は底面図、(d)は側面図である。It is explanatory drawing of the heater chip provided with two iron portions, (a) is a plan view, (b) is a front view, (c) is a bottom view, (d) is a side view.
 以下、本発明を実施するための形態を図面に基づいて説明する。
 ヒーターチップユニット1は、図1および図2に示すように、端子用導線Aを端子部材Bに熱圧着する(図2(d)参照)ための板状のヒーターチップ2と、温度センサーとしてヒーターチップ2に取り付けられた熱電対3とを備えて構成されている。ヒーターチップ2は、導電性材料(タングステン,モリブデン、超硬材等)の板材をワイヤー放電加工により加工して成形されたチップであり、図2に示すように、このヒーターチップ2の下部(ワーク(端子用導線Aや端子部材B)側に位置する先端部)となるコテ部6と、上部(基部)となる左右一対の接続腕部7とを備えて構成されている。そして、接続腕部7を介してコテ部6へ通電したときに電気抵抗によってコテ部6を発熱可能とし、コテ部6の温度を熱電対3によって測定可能としている。
Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the heater chip unit 1 includes a plate-shaped heater chip 2 for thermocompression bonding the terminal lead wire A to the terminal member B (see FIG. 2D), and a heater as a temperature sensor. It is configured to include a thermocouple 3 attached to the chip 2. The heater chip 2 is a chip formed by processing a plate material of a conductive material (tungsten, molybdenum, cemented carbide, etc.) by wire electric discharge machining, and as shown in FIG. 2, the lower portion (work) of the heater chip 2 is formed. It is configured to include a trowel portion 6 (a tip portion located on the terminal lead wire A and a terminal member B) side) and a pair of left and right connecting arm portions 7 as an upper portion (base portion). Then, when the iron portion 6 is energized via the connecting arm portion 7, the iron portion 6 can generate heat by electric resistance, and the temperature of the iron portion 6 can be measured by the thermocouple 3.
 コテ部6は、接続腕部7の下部同士を接続する横長なコテ本体11を備え、このコテ本体11の横幅(一対の接続腕部7が並ぶ横方向に沿った寸法)をヒーターチップ2の下部へ向かうにつれて次第に狭くなる状態に設定している。また、僅かに下方に突出したコテ本体11の底部には箱状のコテ先部13を下方へ向けて突設し、このコテ先部13の底面(先端面)をコテ先面13aとして端子用導線Aへ当接可能としている。さらに、コテ本体11のコテ先部13と反対側に位置する上部(接続腕部7側)には略矩形状のコテ凹部15を形成し、このコテ凹部15内に熱電対3の測温接点(測温部)3aを止着している。なお、測温接点3aが止着される構成については、後で詳細に説明する。 The iron portion 6 includes a horizontally long iron main body 11 that connects the lower portions of the connecting arm portions 7, and the width of the iron main body 11 (dimensions along the lateral direction in which the pair of connecting arm portions 7 are lined up) is set to the heater tip 2. It is set to gradually narrow toward the bottom. Further, a box-shaped iron tip portion 13 is projected downward from the bottom of the iron body 11 slightly protruding downward, and the bottom surface (tip surface) of the iron tip portion 13 is used as the iron tip surface 13a for terminals. It is possible to contact the conductor A. Further, a substantially rectangular iron recess 15 is formed in the upper portion (connecting arm 7 side) of the iron body 11 opposite to the iron tip 13, and the temperature measuring contact of the thermocouple 3 is formed in the iron recess 15. (Temperature measuring unit) 3a is fixed. The configuration in which the temperature measuring contact 3a is fixed will be described in detail later.
 接続腕部7は、コテ本体11の左右端部から上方へ延設された縦長な構成部分であり、接続腕部7同士を互いに離間した状態で備えられている。また、接続腕部7の上部(延設端部)には、熱圧着装置のチップホルダー(図示せず)へ装着するための装着穴17をヒーターチップ2の板厚方向へ貫通し、この装着穴17に通した装着ボルト(図示せず)をチップホルダーへ螺合することにより、コテ先部13を下に向けた姿勢でヒーターチップユニット1をチップホルダーへ装着するように構成されている。 The connecting arm portion 7 is a vertically long structural portion extending upward from the left and right ends of the iron body 11, and is provided with the connecting arm portions 7 separated from each other. Further, in the upper portion (extended end portion) of the connecting arm portion 7, a mounting hole 17 for mounting on the chip holder (not shown) of the thermocompression bonding device is penetrated in the plate thickness direction of the heater chip 2 and this mounting is performed. By screwing a mounting bolt (not shown) passed through the hole 17 into the tip holder, the heater tip unit 1 is mounted on the tip holder with the iron tip portion 13 facing downward.
 なお、チップホルダーに装着されたヒーターチップユニット1においては、一方の接続腕部7が熱圧着装置のヒーター用電源(図示せず)の一端へ電気的に接続され、他方の接続腕部7がヒーター用電源の他端へ電気的に接続される。そして、電源(ヒーター用電源)からヒーターチップ2へ電流を流すと、電流が接続腕部7を介してコテ本体11内に流れ、コテ本体11内の電気抵抗によってコテ本体11が発熱し、この熱によってコテ先部13が昇温するように構成されている。また、コテ本体11内の電流が一方の接続腕部7側から他方の接続腕部7側へ向かって流れるが、電流が流れる経路のうち、コテ凹部15の隅部分に位置するくびれ箇所の断面積が他の箇所の断面積よりも狭くなっているため、このくびれ箇所で電流密度が最も高くなってこの部分を中心にして電気抵抗によるジュール熱を生じ易い。 In the heater chip unit 1 mounted on the chip holder, one connecting arm 7 is electrically connected to one end of the heater power supply (not shown) of the thermocompression bonding device, and the other connecting arm 7 is connected. It is electrically connected to the other end of the heater power supply. Then, when a current is passed from the power supply (power supply for the heater) to the heater tip 2, the current flows into the iron body 11 via the connecting arm portion 7, and the iron body 11 generates heat due to the electric resistance in the iron body 11, and this The iron tip portion 13 is configured to raise the temperature by heat. Further, the current in the iron body 11 flows from one connecting arm portion 7 side to the other connecting arm portion 7 side, but in the path through which the current flows, the constricted portion located at the corner portion of the iron recess 15 is cut off. Since the area is smaller than the cross-sectional area of other parts, the current density is highest at this constricted part, and Joule heat due to electric resistance is likely to be generated around this part.
 さらに、ヒーターチップ2は、図1および図2(d)に示すように、このヒーターチップ2の表裏両面において接続腕部7の下部からコテ本体11に亘る範囲に、左右方向(一方の接続腕部7から他方の接続腕部7へ向かう方向)に沿って溝20を本発明におけるえぐり部としてそれぞれ延在させ、この表裏の溝20の延在によって薄肉部21を形成して、コテ先部13が薄肉部21の下方に突設されるように構成されている。言い換えると、薄肉部21がコテ先部13から外れた位置(詳しくは、コテ先部13よりも接続腕部7側)に形成されるように構成されている。 Further, as shown in FIGS. 1 and 2 (d), the heater chip 2 is provided in the left-right direction (one connecting arm) in a range extending from the lower portion of the connecting arm portion 7 to the iron body 11 on both the front and back surfaces of the heater chip 2. Grooves 20 are extended as gouged portions in the present invention along the direction from the portion 7 to the other connecting arm portion 7, and the extending grooves 20 on the front and back sides form a thin-walled portion 21 to form a trowel tip portion. 13 is configured to project below the thin wall portion 21. In other words, the thin-walled portion 21 is configured to be formed at a position away from the iron tip portion 13 (specifically, on the connecting arm portion 7 side of the iron tip portion 13).
 また、図2(d)に示すように、表裏の溝20の深さ寸法(ヒーターチップ2の板厚方向の寸法)を同じに設定して、接続腕部7、コテ本体11(薄肉部21)、コテ先部13の各厚さ方向の中央が同一平面上に位置するように構成されており、コテ先部13の板厚を接続腕部7の板厚と同じに設定している。さらに、溝20の底部となる薄肉部21の表面をコテ本体11の側面(表裏面)とし、コテ本体11の板厚(薄肉部21の板厚)が接続腕部7の板厚よりも薄く、且つ、コテ本体11の断面積(言い換えると、電流が流れる流路としての断面積)が接続腕部7の断面積よりも小さく設定されるように構成されている。そして、コテ本体11の側面の厚さt1を接続腕部7の厚さ(詳しくは、薄肉部21を除いた接続腕部7の厚さ(接続腕部7のうち薄肉部21から外れた箇所の厚さ))t2よりも薄く形成している(図1および図2(d)参照)。 Further, as shown in FIG. 2D, the depth dimension of the groove 20 on the front and back (dimension in the plate thickness direction of the heater chip 2) is set to be the same, and the connecting arm portion 7 and the iron body 11 (thin wall portion 21) are set to be the same. ), The center of each thickness direction of the iron tip portion 13 is configured to be located on the same plane, and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7. Further, the surface of the thin wall portion 21 which is the bottom of the groove 20 is the side surface (front and back surface) of the iron body 11, and the plate thickness of the iron body 11 (plate thickness of the thin wall portion 21) is thinner than the plate thickness of the connecting arm portion 7. Moreover, the cross-sectional area of the iron body 11 (in other words, the cross-sectional area as a flow path through which a current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7. Then, the thickness t1 of the side surface of the iron body 11 is the thickness of the connecting arm portion 7 (specifically, the thickness of the connecting arm portion 7 excluding the thin-walled portion 21 (the portion of the connecting arm portion 7 that is separated from the thin-walled portion 21). (Thickness)) It is formed thinner than t2 (see FIGS. 1 and 2 (d)).
 次に、ヒーターチップ2に取り付けられている熱電対3、および、熱電対3を取り付けるためのヒーターチップ2上の構成について説明する。
 熱電対3は、図1および図3に示すように、2種の素線25の先端同士を溶接して球体状の測温接点(測温部)3aを構成し、電気絶縁性を有する素線被覆材26で各素線25をそれぞれ被覆し、さらには外側被覆材27の被覆により1本に束ねて導線3bを構成している。言い換えると、素線25を含んで導線3bを構成している。さらに、測温接点3aの直径および導線3bの線径をそれぞれヒーターチップ2の板厚よりも小さく設定している。
Next, the thermocouple 3 attached to the heater chip 2 and the configuration on the heater chip 2 for attaching the thermocouple 3 will be described.
As shown in FIGS. 1 and 3, the thermocouple 3 is a element having electrical insulation property by welding the tips of two types of strands 25 to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a. Each of the strands 25 is covered with the wire covering material 26, and further bundled into one by the covering of the outer covering material 27 to form the conducting wire 3b. In other words, the conductor wire 3b includes the strand 25. Further, the diameter of the temperature measuring contact 3a and the diameter of the conducting wire 3b are set smaller than the plate thickness of the heater chip 2, respectively.
 また、ヒーターチップ2においては、導線3bの収納箇所を接続腕部7同士の隙間に備え、測温接点3aの止着箇所をコテ部6に備えている。具体的に説明すると、図1および図2(a),(b)に示すように、接続腕部7の長手方向に沿って延在する接続腕部7同士の隙間を、上端部分が開放した導線収納空部30として導線3bの線径よりもひと回り大きな広さ(太さ、幅)に設定し、この導線収納空部30内に導線3b(詳しくは、導線3bのうち測温接点3a寄りに位置する部分)をヒーターチップ2の表裏各面から導線3bが外方へ突出しない状態で収納している。そして、導線収納空部30の上端部分の開放口30aから導線3bを延出し、導線収納空部30の下端を拡開してコテ凹部15へ連通している(図1参照)。 Further, in the heater chip 2, the storage portion of the conducting wire 3b is provided in the gap between the connecting arm portions 7, and the fastening portion of the temperature measuring contact 3a is provided in the iron portion 6. Specifically, as shown in FIGS. 1 and 2 (a) and 2 (b), the upper end portion opens a gap between the connecting arm portions 7 extending along the longitudinal direction of the connecting arm portions 7. The conductor storage space 30 is set to a size (thickness, width) slightly larger than the wire diameter of the conductor 3b, and the conductor 3b (specifically, the temperature measuring contact 3a of the conductor 3b is closer to the temperature measuring contact 3a) in the conductor storage space 30. The portion located in) is stored in a state where the conductor 3b does not protrude outward from each of the front and back surfaces of the heater chip 2. Then, the conductor 3b extends from the opening 30a at the upper end of the conductor storage vacant portion 30, and the lower end of the conductor storage vacant portion 30 is widened to communicate with the iron recess 15 (see FIG. 1).
 さらに、各接続腕部7には、導線収納空部30に臨む側面の一部を切り欠いて止め凹部31を導線収納空部30に連通する状態でそれぞれ形成し、各止め凹部31および導線収納空部30の一部(止め凹部31の間に位置する部分)には、紫外線硬化樹脂や熱硬化樹脂等の樹脂を注入した後に硬化(固化)して導線止め部32を備え、この導線止め部32により導線3bが導線収納空部30からずれてヒーターチップ2から突出することを阻止している。 Further, each connecting arm portion 7 is formed with a part of the side surface facing the conductor storage vacant portion 30 cut out so as to communicate with the conductor storage vacant portion 30, and each stop recess 31 and the conductor storage vacant portion 30 are formed. A part of the vacant portion 30 (a portion located between the fixing recesses 31) is provided with a conducting wire fixing portion 32 which is cured (solidified) after injecting a resin such as an ultraviolet curable resin or a thermosetting resin. The conductor 32 prevents the conductor 3b from shifting from the conductor accommodating empty portion 30 and protruding from the heater chip 2.
 また、コテ部6に形成されたコテ凹部15のうち導線収納空部30の端部(下端部)に臨む箇所には、熱電対3の測温接点3aが止着される測温止着部35を上方の接続腕部7側へ突出した状態で備えている。測温止着部35は、図3に示すように、コテ本体11を挟んでコテ先部13とは反対側に突設された突起部であり、コテ先部13よりもひと回り小さく形成されている。また、導線収納空部30側を向いた部分(この測温止着部35の上部)には、測温接点3aが接触する一対の止着接触面35aを備えて導線収納空部30の端部へ対向させ、止着接触面35a同士の離間距離がコテ部6側から上方の導線収納空部30側へ向かうにつれて次第に拡開する状態に設定している。そして、各止着接触面35aをそれぞれ平面で構成することによりV字状の凹み36を測温止着部35の上部(導線収納空部30側となる上部)に形成し、この凹み36内に測温接点3aを受けて止着接触面35aへ接触させ、この状態で溶接する等して測温接点3aをコテ部6(測温止着部35)へ止着している。 Further, in the iron recess 15 formed in the iron portion 6, the temperature measuring contact 3a of the thermocouple 3 is fastened to the portion facing the end (lower end) of the conducting wire accommodating empty portion 30. The 35 is provided in a state of protruding toward the upper connecting arm portion 7. As shown in FIG. 3, the temperature measuring fastening portion 35 is a protrusion portion that protrudes from the iron tip portion 13 on the opposite side of the iron body 11 and is formed to be slightly smaller than the iron tip portion 13. There is. Further, the portion facing the conductor storage vacant portion 30 (the upper portion of the temperature measuring vacant portion 35) is provided with a pair of fastening contact surfaces 35a to which the temperature measuring contact 3a contacts, and the end of the conducting wire accommodating vacant portion 30. It is set to face the portion and gradually expands as the separation distance between the fastening contact surfaces 35a increases from the iron portion 6 side toward the upper conductor storage vacant portion 30 side. Then, by forming each of the fastening contact surfaces 35a on a flat surface, a V-shaped recess 36 is formed in the upper portion of the temperature measuring fastening portion 35 (the upper portion on the side of the lead wire storage vacant portion 30), and the inside of the recess 36 is formed. The temperature measuring contact 3a is received and brought into contact with the fastening contact surface 35a, and the temperature measuring contact 3a is fastened to the iron portion 6 (temperature measuring fastening portion 35) by welding or the like in this state.
 次に、ヒーターチップユニット1の作製手順、特に、ヒーターチップ2への熱電対3の取り付け手順について説明する。
 まず、図4(a)に示すように、予め別個に作製したヒーターチップ2と熱電対3とを、導線収納空部30の開放口30aと測温接点3aとが対向する状態で配置し、ヒーターチップ2および熱電対3の姿勢を設定して、測温止着部35、導線収納空部30、測温接点3a、導線3bをこの順番で同一直線上に並べる。ヒーターチップ2と熱電対3との姿勢を設定したならば、測温接点3aを先頭にして熱電対3をヒーターチップ2の導線収納空部30の開放口30aへ挿入する。すると、接続腕部7の側面がガイドとなって熱電対3をコテ部6側へ誘導する。
Next, a procedure for manufacturing the heater chip unit 1, particularly a procedure for attaching the thermocouple 3 to the heater chip 2 will be described.
First, as shown in FIG. 4A, the heater chip 2 and the thermocouple 3 separately prepared in advance are arranged so that the opening 30a of the conductor storage space 30 and the temperature measuring contact 3a face each other. The attitudes of the heater chip 2 and the thermocouple 3 are set, and the temperature measuring stop 35, the lead wire storage empty section 30, the temperature measuring contact 3a, and the conducting wire 3b are arranged in this order on the same straight line. After setting the postures of the heater chip 2 and the thermocouple 3, the thermocouple 3 is inserted into the opening 30a of the lead wire storage space 30 of the heater chip 2 with the temperature measuring contact 3a at the head. Then, the side surface of the connecting arm portion 7 serves as a guide to guide the thermocouple 3 to the iron portion 6 side.
 さらに、熱電対3を深く挿入すると、図4(b)に示すように、測温接点3aが導線収納空部30を通過した後にコテ凹部15内へ進入する。ここで、図3(a)に示すように、コテ部6においては、導線収納空部30の下端部(コテ部6側の開放端部)が臨む箇所に測温止着部35を備え、V字状の止着接触面35aを導線収納空部30の端部へ対向させているので、コテ凹部15内に進入した測温接点3aが測温止着部35に到達して止着接触面35aに接触(当接)する。このようにして、測温接点3aを止着接触面35a(測温止着部35)へ簡単且つ確実に当接することができる。したがって、測温接点3aを測温止着部35へ止着する準備をスムーズに行うことができる。 Further, when the thermocouple 3 is deeply inserted, as shown in FIG. 4 (b), the temperature measuring contact 3a enters the iron recess 15 after passing through the conductor accommodating empty portion 30. Here, as shown in FIG. 3A, the iron portion 6 is provided with a temperature measuring fastening portion 35 at a position facing the lower end portion (open end portion on the iron portion 6 side) of the conductor storage empty portion 30. Since the V-shaped fastening contact surface 35a faces the end of the conductor accommodating empty portion 30, the temperature measuring contact 3a that has entered the iron recess 15 reaches the temperature measuring fastening portion 35 and makes a fastening contact. Contact (contact) with the surface 35a. In this way, the temperature measuring contact 3a can be easily and surely brought into contact with the fastening contact surface 35a (temperature measuring fastening portion 35). Therefore, it is possible to smoothly prepare for anchoring the temperature measuring contact 3a to the temperature measuring anchoring portion 35.
 そして、導線3bを測温止着部35側へ押圧して測温止着部35の止着接触面35aへの接触を維持し、この状態で測温止着部35と止着接触面35aをレーザー溶接により止着(溶接)する。詳しくは、止着接触面35aにレーザーを照射して加熱し、この熱により測温接点3aを溶かして止着(溶接)する。このとき、図3(a)に示すように、測温止着部35において止着接触面35a同士の離間距離がコテ部6側から上方へ向かうにつれて次第に拡開する状態に設定しているので、測温接点3aを測温止着部35へ十分に接触させることができる。したがって、測温接点3aのヒーターチップ2への良好な止着、ひいては良好な測温が可能なヒーターチップユニット1を構成することができる。さらに、止着接触面35aを平面で構成し、測温接点3aを球状体で構成しているので、測温接点3aが止着接触面35aへ点接触し易い。また、測温接点3aを止着接触面35aに押し付けることで、応力が集中し易くなって測温接点3aが止着接触面35aから浮き難い。これにより測温接点3aをヒーターチップ2へ一層良好に止着すること、ひいては、ヒーターチップ2の測温を一層良好に行うことができる。 Then, the lead wire 3b is pressed toward the temperature measuring anchoring portion 35 to maintain the contact of the temperature measuring anchoring portion 35 with the fastening contact surface 35a, and in this state, the temperature measuring anchoring portion 35 and the fastening contact surface 35a are maintained. Is fixed (welded) by laser welding. Specifically, the fastening contact surface 35a is heated by irradiating it with a laser, and the temperature measuring contact 3a is melted by this heat to be fastened (welded). At this time, as shown in FIG. 3A, the temperature measuring anchoring portion 35 is set to a state in which the separation distance between the anchoring contact surfaces 35a gradually expands from the iron portion 6 side toward the upper side. , The temperature measuring contact 3a can be sufficiently brought into contact with the temperature measuring anchoring portion 35. Therefore, it is possible to configure the heater chip unit 1 capable of good adhesion of the temperature measuring contact 3a to the heater chip 2 and thus good temperature measurement. Further, since the fastening contact surface 35a is formed of a flat surface and the temperature measuring contact 3a is formed of a spherical body, the temperature measuring contact 3a can easily make point contact with the fastening contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fastening contact surface 35a, stress is easily concentrated and the temperature measuring contact 3a is difficult to float from the fastening contact surface 35a. As a result, the temperature measuring contact 3a can be more satisfactorily attached to the heater chip 2, and thus the temperature of the heater chip 2 can be measured more satisfactorily.
 測温止着部35に測温接点3aを止着したならば、図4(c)に示すように、導線収納空部30の一部(止め凹部31の間に位置する部分)および各止め凹部31に紫外線硬化樹脂や熱硬化樹脂等の樹脂を硬化前の状態(流動状態)で注入して充填し、その後に紫外線照射や加熱等の樹脂硬化処理を施して樹脂を硬化して導線止め部32とする。 When the temperature measuring contact 3a is fastened to the temperature measuring fastening portion 35, as shown in FIG. 4C, a part of the lead wire storage empty portion 30 (a portion located between the stopping recesses 31) and each stop. A resin such as an ultraviolet curable resin or a thermosetting resin is injected into the concave portion 31 in a state before curing (flow state) to fill the recesses, and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin and stop the wire. It is referred to as a part 32.
 このようにして熱電対3をヒーターチップ2に取り付けて構成されたヒーターチップユニット1においては、熱電対3の導線3bを導線収納空部30に収納したので、熱電対3の導線3bがヒーターチップ2の板厚の範囲からはみ出すことを避けることができる。したがって、熱圧着装置への装着作業等のヒーターチップユニット1の取り扱い時や、ヒーターチップユニット1の作業エリアへの進入時に、導線3bを不用意に引っ掛けてしまう不都合、ひいてはヒーターチップ2から熱電対3が脱落してしまう不都合が生じ難い。また、搬送(出荷)や保存の際に複数のヒーターチップユニット1をまとめようとする場合には、ヒーターチップユニット1を支障なく安定して重ねることができ、搬送作業や保存作業を滞りなく行うことができる。 In the heater chip unit 1 configured by attaching the thermocouple 3 to the heater chip 2 in this way, since the lead wire 3b of the thermocouple 3 is housed in the lead wire storage empty portion 30, the lead wire 3b of the thermocouple 3 is the heater chip. It is possible to avoid protruding from the range of the plate thickness of 2. Therefore, when handling the heater chip unit 1 such as mounting work on a thermocompression bonding device, or when entering the work area of the heater chip unit 1, the inconvenience of inadvertently hooking the conductor 3b, and eventually the thermocouple from the heater chip 2. It is unlikely that the inconvenience of 3 falling off will occur. Further, when a plurality of heater chip units 1 are to be put together at the time of transportation (shipment) or storage, the heater chip units 1 can be stably stacked without any trouble, and the transportation work and the storage work can be performed without delay. be able to.
 さらに、導線収納空部30には導線止め部32を備えたので、収納されている導線3bが導線収納空部30から外れてしまう不都合を阻止することができる。また、導線収納空部30内に注入されて硬化した樹脂を導線止め部32としたので、接続腕部7と導線3bとの隙間に樹脂を導線止め部32として入れ易くなり、導線3bを十分に止めることができる。そして、導線収納空部30に連通する止め凹部31を備え、導線止め部32である樹脂が導線収納空部30および止め凹部31に注入されて硬化しているので、導線止め部32が導線収納空部30から脱落し難くなり、導線止め部32とともに導線3bが導線収納空部30から外れる不都合を抑えることができる。 Further, since the conductor storage vacant portion 30 is provided with the conductor stopper portion 32, it is possible to prevent the inconvenience that the stored conductor wire 3b comes off from the conductor storage vacant portion 30. Further, since the resin injected into the conductor storage space 30 and cured is used as the conductor stopper 32, it is easy to insert the resin into the gap between the connecting arm 7 and the conductor 3b as the conductor stopper 32, and the conductor 3b is sufficiently inserted. Can be stopped at. Further, since the conductor retaining portion 31 is provided with the retaining recess 31 communicating with the conducting wire accommodating vacant portion 30, and the resin which is the conducting wire retaining portion 32 is injected into the conducting wire accommodating vacant portion 30 and the retaining recess 31 to be cured, the conducting wire retaining portion 32 accommodates the conducting wire. It becomes difficult to fall off from the vacant portion 30, and it is possible to suppress the inconvenience that the conductor 3b is detached from the conductor storage vacant portion 30 together with the conductor stop portion 32.
 そして、ヒーターチップユニット1を用いて端子部材Bに端子用導線Aを熱圧着する作業としては、まず、熱圧着装置のチップホルダーにヒーターチップユニット1をコテ先部13が下側となる姿勢で装着し、熱電対3の導線3bを熱圧着装置の熱電対接続端子(図示せず)へ接続する。その後、チップホルダーの下方に設けられた作業エリア(いずれも図示せず)に端子部材Bと端子用導線Aとをセットし、端子部材Bの上面に端子用導線Aを重ねる。端子部材Bと端子用導線Aとをセットしたならば、チップホルダーとともにヒーターチップユニット1を下降させてコテ先部13を端子用導線Aへ押圧し、さらにはヒーターチップ2への通電によりコテ本体11を発熱させて、端子部材Bに端子用導線Aを熱圧着する。また、熱電対3によりコテ部6の温度を測定し、熱圧着装置の制御部(図示せず)がこの測定値に基づいてヒーターチップ2への通電制御、さらにはコテ先部13の温度制御を行う。 Then, in the work of thermocompression-bonding the terminal lead wire A to the terminal member B using the heater chip unit 1, first, the heater chip unit 1 is placed on the chip holder of the thermocompression-bonding device with the iron tip portion 13 on the lower side. Attached, the lead wire 3b of the thermocouple 3 is connected to the thermocouple connection terminal (not shown) of the thermocompression bonding device. After that, the terminal member B and the terminal lead wire A are set in a work area (none of which is shown) provided below the chip holder, and the terminal lead wire A is placed on the upper surface of the terminal member B. When the terminal member B and the terminal lead wire A are set, the heater tip unit 1 is lowered together with the tip holder to press the iron tip portion 13 against the terminal lead wire A, and further, the iron main body is energized by energizing the heater tip 2. 11 is heated, and the terminal lead wire A is thermocompression bonded to the terminal member B. Further, the temperature of the iron portion 6 is measured by the thermocouple 3, and the control unit (not shown) of the thermocompression bonding device controls the energization of the heater chip 2 based on this measured value, and further controls the temperature of the iron tip portion 13. I do.
 ここで、発熱するヒーターチップ2においては、コテ本体11の板厚を接続腕部7の板厚よりも薄く設定し、コテ本体11の断面積を接続腕部7の断面積よりも小さく設定したので、ヒーターチップ2の板厚を厚くしたとしても、コテ本体11での電流密度が低下して発熱が不十分となってしまう不都合を抑えることができる。したがって、ヒーターチップ2の板厚の増減に拘らず良好な発熱効率を実現し易い。また、コテ本体11の体積の増加、ひいては熱容量の増加を避けることができ、コテ本体11やコテ先部13の冷却を迅速に行い易い。さらに、接続腕部7の下部からコテ本体11に亘る範囲に溝20を延在させて薄肉部21を形成し、溝20の底部となる薄肉部21の表面をコテ本体11の側面としたので、コテ本体11の板厚が接続腕部7の板厚よりも薄いヒーターチップ2の構造を簡単に実現することができる。 Here, in the heater chip 2 that generates heat, the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7, and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. Therefore, even if the plate thickness of the heater chip 2 is increased, the inconvenience that the current density in the iron body 11 decreases and the heat generation becomes insufficient can be suppressed. Therefore, it is easy to realize good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heater tip 2. Further, it is possible to avoid an increase in the volume of the iron body 11 and an increase in the heat capacity, and it is easy to quickly cool the iron body 11 and the iron tip portion 13. Further, since the groove 20 extends from the lower part of the connecting arm portion 7 to the iron body 11 to form the thin-walled portion 21, the surface of the thin-walled portion 21 which is the bottom of the groove 20 is the side surface of the iron body 11. , The structure of the heater tip 2 in which the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 can be easily realized.
 また、薄肉部21の下方にコテ先部13を突設したので、熱圧着作業によって異物(端子用導線Aの絶縁被膜等)がコテ先部13に付着した場合には、コテ先部13の先端を研磨する等して異物を除去し易い。さらに、コテ先部13の先端の研磨代を十分に確保することができ、ヒーターチップユニットの交換サイクル(使用寿命)の長期化を図ることができる。そして、薄肉部21をコテ先部13よりも接続腕部7側に形成して、コテ本体11の側面の厚さを薄肉部21を除いた接続腕部7の厚さよりも薄く形成したので、コテ本体11での電流密度の低下を抑制しながらも、コテ先部13の先端面における板厚方向の寸法を十分に確保することができる。これにより、ヒーターチップ2が熱圧着可能なワーク(熱圧着対象)の大きさの許容範囲を広げることができる。また、薄肉部21をコテ先部13から外れた位置に形成し、コテ先部13の板厚を接続腕部7の板厚と同じに設定したので、コテ先部13の板厚を接続腕部7の板厚に対して増減させる必要がなく、ヒーターチップ2を製造し易い。 Further, since the iron tip portion 13 is projected below the thin-walled portion 21, if foreign matter (insulation coating of the terminal lead wire A, etc.) adheres to the iron tip portion 13 due to thermocompression bonding work, the iron tip portion 13 It is easy to remove foreign matter by polishing the tip. Further, it is possible to sufficiently secure a polishing allowance for the tip of the iron tip portion 13, and it is possible to prolong the replacement cycle (use life) of the heater tip unit. Then, the thin-walled portion 21 was formed on the connecting arm portion 7 side of the iron tip portion 13, and the thickness of the side surface of the iron body 11 was formed to be thinner than the thickness of the connecting arm portion 7 excluding the thin-walled portion 21. While suppressing the decrease in the current density in the iron body 11, it is possible to sufficiently secure the dimensions in the plate thickness direction on the tip surface of the iron tip portion 13. This makes it possible to widen the allowable range of the size of the work (target for thermal crimping) on which the heater chip 2 can be thermally crimped. Further, since the thin-walled portion 21 is formed at a position separated from the iron tip portion 13 and the plate thickness of the iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, the plate thickness of the iron tip portion 13 is set to the connecting arm. It is not necessary to increase or decrease the thickness with respect to the plate thickness of the portion 7, and the heater tip 2 can be easily manufactured.
 さらに、接続腕部7、コテ本体11、コテ先部13の各厚さ方向の中央が同一平面上に位置するので、熱圧着作業時にヒーターチップ2内で曲げモーメントが発生し難くなり、ヒーターチップ2に余計な負荷が掛かる不都合、ひいてはヒーターチップ2が損傷し易くなる不都合を抑えることができる。そして、ヒーターチップ2のコテ部6に温度センサーとして熱電対3を取り付けたので、コテ部6の温度の情報を取得してヒーターチップ2の発熱の制御に活用することができる。また、温度センサーを簡単な構成で実現することができる。 Further, since the centers of the connecting arm portion 7, the iron body 11, and the iron tip portion 13 in the thickness direction are located on the same plane, it is difficult for a bending moment to be generated in the heater tip 2 during thermocompression bonding work, and the heater tip is not easily generated. It is possible to suppress the inconvenience that an extra load is applied to 2 and the inconvenience that the heater tip 2 is easily damaged. Since the thermocouple 3 is attached to the iron portion 6 of the heater chip 2 as a temperature sensor, it is possible to acquire the temperature information of the iron portion 6 and utilize it for controlling the heat generation of the heater chip 2. In addition, the temperature sensor can be realized with a simple configuration.
 ところで、上記実施形態では、ヒーターチップ2の表裏両面に溝20をそれぞれ延在させて薄肉部21を形成することによりコテ本体11を構成したが、本発明はこれに限定されない。要は、コテ本体11の板厚が接続腕部7の板厚よりも薄く、且つ、コテ本体11の断面積を接続腕部7の断面積よりも小さく設定すれば、どのような態様のコテ本体11をヒーターチップ2に備えてもよい。例えば、ヒーターチップ2の表面または裏面のいずれかに溝を延在させて薄肉部21を形成してコテ本体11を構成してもよい。しかしながら、コテ本体11がヒーターチップ2の表裏いずれかに偏って位置することになり、これにより、熱圧着作業時にはヒーターチップ2内に曲げモーメントが発生してしまうので、接続腕部7、コテ本体11、コテ先部13の各厚さ方向の中央が同一平面上に位置する構成、すなわち、上記実施形態の構成を採用することが好適である。なお、コテ本体11は、電気抵抗値が最も高い部分(発熱部となる部分)を含んだ構成であればよい。このため、溝等により薄肉化を図る領域は、接続腕部7内に及んでもよいし、必ずしもコテ本体11の全域ではなくてもよい。 By the way, in the above embodiment, the iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heater chip 2 to form the thin-walled portion 21, but the present invention is not limited to this. In short, if the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, any mode of iron is used. The main body 11 may be provided on the heater chip 2. For example, the iron body 11 may be formed by extending the groove on either the front surface or the back surface of the heater tip 2 to form the thin-walled portion 21. However, the iron main body 11 is located unevenly on either the front or the back of the heater tip 2, which causes a bending moment in the heater tip 2 during thermocompression bonding work. Therefore, the connecting arm portion 7 and the iron main body 11. It is preferable to adopt a configuration in which the center of each thickness direction of the iron tip portion 13 is located on the same plane, that is, the configuration of the above embodiment. The iron body 11 may be configured to include a portion having the highest electric resistance value (a portion serving as a heat generating portion). Therefore, the region for thinning by the groove or the like may extend to the inside of the connecting arm portion 7, and may not necessarily be the entire area of the iron body 11.
 また、コテ先部13の板厚と接続腕部7の板厚とを同じ寸法に設定したが、本発明はこれに限定されない。例えば、コテ先部13の板厚を削って接続腕部7の板厚よりも薄く設定すれば、コテ先部13の板厚寸法の自由度を増すことができ、熱圧着処理を施すワーク(端子部材B,端子用導線A)の大きさに対応したヒーターチップ2を設計し易い。さらに、図3に示すように、測温止着部35をコテ先部13よりもひと回り小さく構成したが、本発明はこれに限定されない。例えば、コテ先部13の体積と測温止着部35の体積とを揃えて、コテ先部13の熱容量と測温止着部35の熱容量との差が極端に異なることを避けるように設定すれば、測温止着部35での温度変化とコテ先部13での温度変化とを同期させようとすることができ、測温止着部35の測温に基づいてコテ先部13の温度管理を実行し易い。 Further, the plate thickness of the iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same dimensions, but the present invention is not limited to this. For example, if the plate thickness of the iron tip portion 13 is cut to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the iron tip portion 13 can be increased, and the work to be subjected to thermocompression bonding treatment ( It is easy to design the heater chip 2 corresponding to the size of the terminal member B and the terminal lead wire A). Further, as shown in FIG. 3, the temperature measuring fastening portion 35 is configured to be slightly smaller than the iron tip portion 13, but the present invention is not limited to this. For example, the volume of the iron tip portion 13 and the volume of the temperature measuring anchoring portion 35 are aligned so as to avoid an extremely different difference between the heat capacity of the iron tip portion 13 and the heat capacity of the temperature measuring anchoring portion 35. Then, it is possible to synchronize the temperature change in the temperature measuring stop 35 with the temperature change in the iron tip 13, and the iron tip 13 is based on the temperature measurement of the temperature measuring stop 35. Easy to carry out temperature control.
 さらに、測温止着部35の止着接触面35aを平面で構成したが、本発明はこれに限定されない。要は、止着接触面35a同士の離間距離がコテ部6側から上方へ向かうにつれて次第に拡開する状態に設定されれば、止着接触面35aを曲面で構成してもよい。そして、止着接触面35aに測温接点(測温部)3aを十分に接触することができれば、この測温接点3aを球状体に形成することには限定されず、どのような形状に形成してもよい。また、熱電対3の測温接点3aと測温止着部35とを溶接して止着しているが、本発明はこれに限定されない。要は、コテ部6の測温が可能であれば、測温接点3aと測温止着部35との止着態様は問わない。例えば、熱伝導が良好な止着剤(接着剤)を用いて測温接点3aと測温止着部35とを止着してもよい。 Further, the fastening contact surface 35a of the temperature measuring fastening portion 35 is configured by a flat surface, but the present invention is not limited to this. In short, the fastening contact surface 35a may be formed of a curved surface as long as the separation distance between the fastening contact surfaces 35a is set to gradually expand from the iron portion 6 side toward the upper side. If the temperature measuring contact (temperature measuring unit) 3a can be sufficiently contacted with the fastening contact surface 35a, the temperature measuring contact 3a is not limited to being formed into a spherical shape, and is formed in any shape. You may. Further, the temperature measuring contact 3a of the thermocouple 3 and the temperature measuring fastening portion 35 are welded and fastened, but the present invention is not limited to this. In short, as long as the temperature of the iron portion 6 can be measured, the fastening mode between the temperature measuring contact 3a and the temperature measuring fastening portion 35 does not matter. For example, the temperature measuring contact 3a and the temperature measuring fastening portion 35 may be fastened using a fastener (adhesive) having good heat conduction.
 そして、上記実施形態のヒーターチップ2においては、導線収納空部30を接続腕部7の長手方向に沿って直線状に延在させて備えているが、本発明はこれに限定されない。要は、熱電対3の導線3bを収納可能な構成であれば、どのような態様の導線収納空部30を適用してもよい。例えば、屈曲線状や湾曲線状に延在する導線収納空部30を適用してもよい。また、紫外線硬化樹脂や熱硬化樹脂等の樹脂を本発明における導線止め部32として例示したが、本発明はこれに限定されない。要は、導線収納空部30内に収納された導線3bを止めて導線収納空部30からの脱落を阻止することができれば、導線止め部32の態様は問わない。例えば、導線収納空部30に嵌合可能なキャップを導線止め部として採用してもよいし、あるいは、接続腕部7に一体成形され、導線収納空部30側へ突出した突起を導線止め部として採用してもよい。 Further, in the heater chip 2 of the above embodiment, the conductor storage empty portion 30 is provided so as to extend linearly along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited to this. In short, any form of the conductor storage vacant portion 30 may be applied as long as the configuration is such that the conductor 3b of the thermocouple 3 can be stored. For example, a conductor storage vacant portion 30 extending in a curved line shape or a curved line shape may be applied. Further, although a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead wire stopper 32 in the present invention, the present invention is not limited to this. In short, as long as the conductor 3b stored in the conductor storage vacant portion 30 can be stopped to prevent the conductor from falling out of the conductor storage vacant portion 30, the mode of the conductor stop portion 32 does not matter. For example, a cap that can be fitted to the conductor storage vacant portion 30 may be adopted as the conductor stopper, or a protrusion that is integrally molded with the connecting arm portion 7 and protrudes toward the conductor storage vacant portion 30 may be used as the conductor stopper. May be adopted as.
 また、導線収納空部30に連通する止め凹部31を導線収納空部30の側面の浅い切り欠きにより構成したが、本発明はこれに限定されない。要は、導線止め部32である樹脂が導線収納空部30から止め凹部31に亘って注入されて硬化可能であれば、止め凹部31の構成はどのような態様を採用してもよい。例えば、接続腕部7の表裏両面に溝状の止め凹部をそれぞれ形成し、この止め凹部の端部を導線収納空部30へ連通して樹脂(導線止め部32)が導線収納空部30から止め凹部に亘って注入されるように構成してもよい。 Further, the retaining recess 31 communicating with the conductor storage vacant portion 30 is configured by a shallow notch on the side surface of the conductor storage vacant portion 30, but the present invention is not limited to this. In short, as long as the resin which is the conductor fixing portion 32 is injected from the conducting wire accommodating empty portion 30 over the fixing recess 31 and can be cured, any embodiment of the configuration of the fixing recess 31 may be adopted. For example, groove-shaped retaining recesses are formed on both the front and back surfaces of the connecting arm portion 7, and the end portion of the retaining recess is communicated with the conducting wire storage empty portion 30 so that the resin (conductor retaining portion 32) is transmitted from the conducting wire storage empty portion 30. It may be configured to be injected over the retaining recess.
 さらに、上記実施形態では、熱電対3を本発明の温度センサーとして例示し、熱電対3の測温接点3aを本発明の測温部として例示したが、これに限定されない。要は、コテ部6の測温が可能であり、導線3bの端部に測温部を備えて構成された温度センサーであれば、どのような態様の温度センサーを採用してヒーターチップ2に取り付けてもよい。 Further, in the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measuring contact 3a of the thermocouple 3 is exemplified as the temperature measuring unit of the present invention, but the present invention is not limited thereto. In short, if the temperature sensor is capable of measuring the temperature of the iron portion 6 and is configured to have the temperature measuring portion at the end of the conducting wire 3b, any form of the temperature sensor is adopted for the heater tip 2. It may be attached.
 ところで、上記実施形態では、溝20を本発明におけるえぐり部として例示したが、本発明はこれに限定されない。要は、一方の接続腕部から他方の接続腕部へ向かう方向に沿ってえぐり部を延在させることにより薄肉部がヒーターチップに形成されれば、えぐり部をどのような態様に設定してもよい。例えば、図5および図6に示す第2実施形態のヒーターチップ2′おいては、基本的には上記実施形態(第1実施形態)と同じであるが、ヒーターチップ2′の表裏両面だけではなく、ヒーターチップ2′の板厚方向の中間部分にもえぐり部を形成してヒーターチップ2′の下半部分を二股に分岐させ、これにより2脚のコテ本体を有している点で異なる。 By the way, in the above embodiment, the groove 20 is exemplified as the gouged portion in the present invention, but the present invention is not limited to this. The point is, if a thin-walled part is formed on the heater tip by extending the gouged part along the direction from one connecting arm part to the other connecting arm part, what kind of mode should the gouged part be set? May be good. For example, the heater chip 2'of the second embodiment shown in FIGS. 5 and 6 is basically the same as the above embodiment (first embodiment), but only on both the front and back sides of the heater chip 2'. The difference is that the lower half of the heater tip 2'is bifurcated by forming a gouge in the middle part of the heater tip 2'in the plate thickness direction, which has two iron bodies. ..
 具体的に説明すると、ヒーターチップ2′は、このヒーターチップ2′の下部に位置するコテ部6′のうち板厚方向の中間部分に、左右方向(一方の接続腕部7から他方の接続腕部7へ向かう方向)に沿って延在するコテ空間部40をえぐり部として形成し、このコテ空間部40を下方へ開放している。そして、コテ空間部40を挟んでヒーターチップ2′の表裏両側にコテ本体11とコテ先部13とをそれぞれ備えている。言い換えると、ヒーターチップ2′のコテ部6′には、互いに離間した2つのコテ本体11、および互いに離間した2つのコテ先部13を備えている。さらに、各コテ本体11においては、外側の面に溝20を形成し、内側の面にも溝20′を形成し、また、測温止着部35が突設されたコテ凹部15をそれぞれ備え、各測温止着部35に熱電対3の測温接点(測温部)3aを止着可能とし、各コテ先部13においては、このコテ先部13の板厚を接続腕部7の板厚よりも薄く設定されている。 Specifically, the heater chip 2'is located in the middle portion in the plate thickness direction of the iron portion 6'located below the heater chip 2'in the left-right direction (from one connecting arm 7 to the other connecting arm). The iron space portion 40 extending along the portion 7) is formed as a hollow portion, and the iron space portion 40 is opened downward. The iron main body 11 and the iron tip portion 13 are provided on both the front and back sides of the heater tip 2'with the iron space portion 40 interposed therebetween. In other words, the iron portion 6'of the heater tip 2'includes two iron main bodies 11 that are separated from each other and two iron tip portions 13 that are separated from each other. Further, each iron body 11 is provided with a trowel recess 15 in which a groove 20 is formed on the outer surface, a groove 20'is also formed on the inner surface, and the temperature measuring fixing portion 35 is projected. , The temperature measuring contact (temperature measuring part) 3a of the thermocouple 3 can be fixed to each temperature measuring fixing part 35, and in each iron tip part 13, the plate thickness of the iron tip part 13 is connected to the connecting arm part 7. It is set thinner than the plate thickness.
 このようなコテ部6′を備えたヒーターチップ2′を構成すれば、2つのコテ先部13によって同時に2箇所の熱圧着処理を行うことができ、熱圧着作業の効率の向上を図ることができる。また、コテ空間部40の板厚方向の寸法の設定によって、2つのコテ先部13の離間距離(ピッチ)や各コテ先部13のコテ先面13aの大きさをワークに応じて調整することができる。 If the heater tip 2'provided with such a trowel portion 6'is configured, the two trowel tip portions 13 can simultaneously perform thermocompression bonding at two locations, thereby improving the efficiency of the thermocompression bonding work. can. Further, by setting the dimensions of the iron space portion 40 in the plate thickness direction, the separation distance (pitch) between the two iron tip portions 13 and the size of the iron tip surface 13a of each iron tip portion 13 can be adjusted according to the work. Can be done.
 また、前記した実施形態においては、ヒーターチップの表面に耐酸化性被膜層を形成して耐酸化性を高めてもよい。 Further, in the above-described embodiment, an oxidation-resistant coating layer may be formed on the surface of the heater chip to enhance the oxidation resistance.
 以下、耐酸化性被膜層について説明する。
 ヒーターチップにおいては、熱圧着の度に昇温、冷却を繰り返すので、表面が酸化し易く、特に、コテ部6(発熱部)近傍、および熱電対3を溶着した部分においては酸化が顕著である。このため、発熱部近傍の酸化部分が剥離して強度が低下してしまい加圧時に破損する不都合が生じたり、また、熱電対の溶着部分が腐食することで強度が低下して、遂には熱電対が離脱して使用できないなどの不都合が発生する。
Hereinafter, the oxidation resistant coating layer will be described.
In the heater chip, since the temperature is raised and cooled repeatedly every time thermocompression bonding is performed, the surface is easily oxidized, and the oxidation is particularly remarkable in the vicinity of the iron portion 6 (heating portion) and the portion where the thermocouple 3 is welded. .. For this reason, the oxidized part near the heat generating part is peeled off and the strength is lowered, which causes a problem of damage during pressurization. In addition, the welded part of the thermocouple is corroded and the strength is lowered, and finally the thermoelectric is generated. Inconveniences such as the pair being separated and unable to be used occur.
 そこで、本実施形態においては、ヒーターチップの表面に耐酸化性被膜層を形成して耐酸化性を高めた。以下、製造工程を含めて具体的に説明する。
 まず、素材(母材)となる金属板について、具体的には、従来一般的に用いられていたタングステン(硬度HV430程度)、タングステン合金(硬度HV200~400程度)よりも耐研磨性に優れたいわゆる超硬材(硬度HV900~2400)(正式名;超硬質合金、硬質の金属炭化物の粉末を焼結した合金)を使用することが望ましく、この超硬材の板材をワイヤーカットにより所定形状に切り出す。次に、この切り出し片にメッキ前処理を施し、その後に溶解槽に浸漬して通電することで前記切り出し片の表面にニッケルによる耐酸化性被膜層を形成、即ち、ニッケルメッキを施す。その後、溶解槽から引き揚げて洗浄等の後処理を施す。
 そして、前記した実施形態と同様に、測温止着部35に熱電対3の測温接点3aをレーザー溶接する。この溶接において、測温止着部35の表面(止着接触面35a)にニッケル層の被膜が形成されているので濡れ性が高められ、これにより溶接の確実性、溶接強度が向上する。また、溶接時の濡れ性が高められるとレーザーの出力を従来よりも抑制することができるとともに母材へのダメージを抑制することができ、品質向上とエネルギー消費の節約を図ることができる。
 熱電対3の溶接が終了したならば、更にメッキ前処理を施し、熱電対3を装着したヒーターチップユニット1を電解液に浸漬し、熱電対3の測温接点3aを含めた全体の表面にニッケルメッキを施す。
Therefore, in the present embodiment, an oxidation-resistant coating layer is formed on the surface of the heater chip to improve the oxidation resistance. Hereinafter, the manufacturing process will be specifically described.
First, regarding the metal plate used as the material (base material), specifically, it is superior in abrasion resistance to the conventionally generally used tungsten (hardness HV430) and tungsten alloy (hardness HV200-400). It is desirable to use so-called cemented carbide (hardness HV900-2400) (official name; cemented carbide, alloy obtained by sintering hard metal carbide powder), and this cemented carbide plate is made into a predetermined shape by wire cutting. break the ice. Next, the cut pieces are subjected to pre-plating treatment, and then immersed in a melting tank and energized to form an oxidation-resistant coating layer made of nickel on the surface of the cut pieces, that is, nickel plating is performed. After that, it is withdrawn from the melting tank and subjected to post-treatment such as washing.
Then, in the same manner as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fastening portion 35. In this welding, since the coating of the nickel layer is formed on the surface of the temperature measurement fixing portion 35 (the fixing contact surface 35a), the wettability is enhanced, thereby improving the certainty of welding and the welding strength. Further, when the wettability at the time of welding is enhanced, the output of the laser can be suppressed more than before, and the damage to the base metal can be suppressed, so that the quality can be improved and the energy consumption can be saved.
When the welding of the thermocouple 3 is completed, further plating pretreatment is performed, the heater chip unit 1 equipped with the thermocouple 3 is immersed in the electrolytic solution, and the entire surface including the temperature measuring contact 3a of the thermocouple 3 is covered. Apply nickel plating.
 この様にして作製したヒーターチップユニット1を使用すると、耐酸化性が向上するので、コテ部6や熱電対3の取付部分の酸化に起因する剥離や強度低下を抑制することができ、これにより耐久性を向上させることができる。特に、母材に超硬材を使用してニッケルメッキを施すと、濡れ性が向上して溶接性も向上させることができ、耐久性を確実に向上させることができる。なお、熱電対は主成分がニッケルなので、ニッケルメッキが親和性が良い。また、耐酸化性被膜は、ニッケルメッキに限らず、例えば、金メッキなどでもよい。 When the heater chip unit 1 manufactured in this manner is used, the oxidation resistance is improved, so that it is possible to suppress peeling and strength decrease due to oxidation of the iron portion 6 and the attachment portion of the thermocouple 3. Durability can be improved. In particular, when nickel plating is applied to the base material using a cemented carbide, the wettability is improved, the weldability can be improved, and the durability can be surely improved. Since the main component of the thermocouple is nickel, nickel plating has a good affinity. Further, the oxidation resistant film is not limited to nickel plating, and may be, for example, gold plating.
 そして、前記した実施の形態は全ての点で例示であって制限的なものではないと考えられるべきである。本発明は、上記した説明に限らず特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれるものである。 And, it should be considered that the above-described embodiment is exemplary in all respects and is not restrictive. The present invention is not limited to the above description, but is shown by the scope of claims, and includes all modifications within the meaning and scope equivalent to the scope of claims.
 1 ヒーターチップユニット
 2,2′ ヒーターチップ
 3 熱電対
  3a 測温接点
  3b 導線
 6,6′ コテ部
 7 接続腕部
11 コテ本体
13 コテ先部
 13a コテ先面
15 コテ凹部
17 装着穴
20,20′ 溝
21 薄肉部
25 素線
26 素線被覆材
27 外側被覆材
30 導線収納空部
 30a 開放口
31 止め凹部
32 導線止め部
35 測温止着部
 35a 止着接触面
36 凹み
40 コテ空間部
1 Heater chip unit 2,2'Heater chip 3 Thermocouple 3a Temperature measuring contact 3b Conductor 6,6' Iron part 7 Connection arm 11 Iron body 13 Iron tip 13a Iron tip surface 15 Iron recess 17 Mounting holes 20, 20' Groove 21 Thin-walled part 25 Wire 26 Wire covering material 27 Outer covering material 30 Conducting wire storage vacant part 30a Opening port 31 Stopping recess 32 Conducting wire stopping part 35 Temperature measuring fixing part 35a Stopping contact surface 36 Indentation 40 Iron space part

Claims (11)

  1.  端子用導線を端子部材に熱圧着するための板状のヒーターチップであって、
     前記端子用導線に当接するコテ先部をコテ本体から下方へ突出した状態で備えたコテ部と、
     前記コテ本体の左右端部から上方へ延設され、電源からの電流をコテ本体に流してコテ部を昇温させる接続腕部と、を備え、
     前記コテ本体は、板厚が接続腕部の板厚よりも薄く、且つ、断面積が接続腕部の断面積よりも小さく設定されていることを特徴とするヒーターチップ。
    A plate-shaped heater chip for thermocompression bonding terminal conductors to terminal members.
    A trowel portion having a trowel tip portion that abuts on the terminal lead wire in a state of protruding downward from the trowel body, and a trowel portion.
    It is provided with a connecting arm portion extending upward from the left and right ends of the iron body and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
    The iron body is a heater tip characterized in that the plate thickness is thinner than the plate thickness of the connecting arm portion and the cross-sectional area is set smaller than the cross-sectional area of the connecting arm portion.
  2.  前記接続腕部の下部からコテ本体に亘る範囲には、一方の接続腕部から他方の接続腕部へ向かう方向に沿ってえぐり部を延在させることにより薄肉部が形成され、えぐり部の底部となる薄肉部の表面がコテ本体の面であることを特徴とする請求項1に記載のヒーターチップ。 In the range from the lower part of the connecting arm portion to the iron body, a thin-walled portion is formed by extending the gouged portion along the direction from one connecting arm portion to the other connecting arm portion, and the bottom portion of the gouged portion is formed. The heater chip according to claim 1, wherein the surface of the thin-walled portion is the surface of the iron body.
  3.  前記薄肉部の下方にコテ先部が突設されていることを特徴とする請求項2に記載のヒーターチップ。 The heater tip according to claim 2, wherein the iron tip portion is projected below the thin-walled portion.
  4.  前記薄肉部が前記コテ先部よりも接続腕部側に形成されて、コテ本体の側面の厚さが薄肉部を除いた接続腕部の厚さよりも薄く形成されていることを特徴とする請求項2に記載のヒーターチップ。 The claim is characterized in that the thin-walled portion is formed on the connecting arm portion side with respect to the iron tip portion, and the thickness of the side surface of the iron body is formed thinner than the thickness of the connecting arm portion excluding the thin-walled portion. Item 2. The heater chip according to Item 2.
  5.  前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚と同じに設定されていることを特徴とする請求項2から請求項4のいずれかに記載のヒーターチップ。 Any of claims 2 to 4, wherein the thin-walled portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set to be the same as the plate thickness of the connecting arm portion. The heater tip described in.
  6.  前記薄肉部がコテ先部から外れた位置に形成され、コテ先部の板厚が接続腕部の板厚よりも薄く設定されていることを特徴とする請求項2から請求項4のいずれかに記載のヒーターチップ。 Any of claims 2 to 4, wherein the thin portion is formed at a position separated from the iron tip portion, and the plate thickness of the iron tip portion is set thinner than the plate thickness of the connecting arm portion. The heater tip described in.
  7.  前記接続腕部、コテ本体、コテ先部の各厚さ方向の中央が同一平面上に位置することを特徴とする請求項1から請求項6のいずれかに記載のヒーターチップ。 The heater tip according to any one of claims 1 to 6, wherein the center of each of the connecting arm portion, the iron body, and the iron tip portion in the thickness direction is located on the same plane.
  8.  少なくとも前記コテ部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項1から請求項7のいずれかに記載のヒーターチップ。 The heater chip according to any one of claims 1 to 7, wherein an oxidation-resistant coating layer is formed at least on the surface of the iron portion.
  9.  前記耐酸化性被膜層がニッケル被膜であることを特徴とする請求項8に記載のヒーターチップ。 The heater chip according to claim 8, wherein the oxidation-resistant coating layer is a nickel coating.
  10.  請求項1から請求項9のいずれかに記載のヒーターチップのコテ部に温度センサーを取り付けたことを特徴とするヒーターチップユニット。 A heater chip unit characterized in that a temperature sensor is attached to the iron portion of the heater chip according to any one of claims 1 to 9.
  11.  前記ヒーターチップは、
     前記端子用導線に当接する前記コテ先部を前記コテ本体に備えたコテ部と、
     前記コテ本体の左右端部から上方へ互いに離間した状態で延設され、電源からの電流をコテ本体に流してコテ部を昇温させる一対の接続腕部と、
     前記コテ部に設けられ、前記温度センサーの測温部が止着される測温止着部と、を備え、
     前記測温止着部は、測温部が接触する一対の止着接触面を備え、止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定したことを特徴とする請求項1に記載のヒーターチップユニット。
     
    The heater chip is
    A trowel portion having the trowel tip portion in contact with the terminal lead wire in the trowel body, and a trowel portion.
    A pair of connecting arms extending upward from the left and right ends of the iron body so as to be separated from each other and allowing a current from a power source to flow through the iron body to raise the temperature of the iron body.
    A temperature measuring stop portion provided on the iron portion and to which the temperature measuring portion of the temperature sensor is fastened is provided.
    The temperature measuring anchoring portion is provided with a pair of anchoring contact surfaces that the temperature measuring portion contacts, and is set to a state in which the separation distance between the anchoring contact surfaces gradually expands from the iron portion side to the upper side. The heater chip unit according to claim 1.
PCT/JP2021/027194 2020-09-09 2021-07-20 Heater chip and heater chip unit WO2022054419A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020227030262A KR20220126795A (en) 2020-09-09 2021-07-20 Heater Chip and Heater Chip Unit
MYPI2022004864A MY196750A (en) 2020-09-09 2021-07-20 Heater chip and heater chip unit
CN202180027305.XA CN115443202A (en) 2020-09-09 2021-07-20 Heating nozzle and heating nozzle unit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-151043 2020-09-09
JP2020151043A JP7137235B2 (en) 2020-09-09 2020-09-09 Heater chip and heater chip unit

Publications (1)

Publication Number Publication Date
WO2022054419A1 true WO2022054419A1 (en) 2022-03-17

Family

ID=80632531

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/027194 WO2022054419A1 (en) 2020-09-09 2021-07-20 Heater chip and heater chip unit

Country Status (6)

Country Link
JP (1) JP7137235B2 (en)
KR (1) KR20220126795A (en)
CN (1) CN115443202A (en)
MY (1) MY196750A (en)
TW (1) TW202211743A (en)
WO (1) WO2022054419A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023067486A1 (en) 2021-10-20 2023-04-27 Ot Lucca S.R.L. A system for support and movement of a stack of interfolded sheets during production of paper products in stacks of interfolded sheets in an interfolding machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586773A (en) * 1981-06-29 1983-01-14 ク−パ−・インダストリ−ズ・インコ−ポレイテツド Leading end of iron for soldering and removing solder and production thereof
WO2017038282A1 (en) * 2015-08-28 2017-03-09 株式会社工房Pda Heater chip, bonding device, and bonding method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3968205B2 (en) 2000-03-30 2007-08-29 太陽誘電株式会社 Heater chip for thermocompression bonding and manufacturing method thereof
JP3917964B2 (en) * 2003-08-22 2007-05-23 株式会社 工房Pda Heater chip for thermocompression bonding
JP4253273B2 (en) * 2004-05-28 2009-04-08 株式会社 工房Pda Heater chip for wiring connection
CN201055936Y (en) * 2007-05-24 2008-05-07 昌钰接合科技有限公司 Stepped pressure welding tool
JP2010253503A (en) * 2009-04-23 2010-11-11 Miyachi Technos Corp Heater chip and joining apparatus
JP5457107B2 (en) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 Heater chip and joining device
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method
JP5794577B2 (en) * 2011-10-21 2015-10-14 株式会社アマダミヤチ Heater chip, joining device, joining method, and conductor thin wire and terminal connection structure
JP6677406B2 (en) * 2015-09-25 2020-04-08 株式会社 工房Pda Heater chip, joining device and joining method
JP6851610B2 (en) * 2016-07-19 2021-03-31 株式会社 工房Pda Heater tip and joining device and joining method
JP6483892B1 (en) * 2018-05-08 2019-03-13 株式会社ジャパンユニックス Tip for soldering iron
CN210677259U (en) * 2019-08-28 2020-06-05 重庆市泓禧科技股份有限公司 Flat cable hot pressing head and automatic tin wire drawing welding machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS586773A (en) * 1981-06-29 1983-01-14 ク−パ−・インダストリ−ズ・インコ−ポレイテツド Leading end of iron for soldering and removing solder and production thereof
WO2017038282A1 (en) * 2015-08-28 2017-03-09 株式会社工房Pda Heater chip, bonding device, and bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023067486A1 (en) 2021-10-20 2023-04-27 Ot Lucca S.R.L. A system for support and movement of a stack of interfolded sheets during production of paper products in stacks of interfolded sheets in an interfolding machine

Also Published As

Publication number Publication date
KR20220126795A (en) 2022-09-16
MY196750A (en) 2023-05-03
CN115443202A (en) 2022-12-06
JP2022045442A (en) 2022-03-22
JP7137235B2 (en) 2022-09-14
TW202211743A (en) 2022-03-16

Similar Documents

Publication Publication Date Title
JP7174899B2 (en) Semiconductor laser device
US7215020B2 (en) Semiconductor device having metal plates and semiconductor chip
JP6876933B2 (en) Semiconductor device
US10799977B2 (en) Heater chip, joining apparatus and joining method
JP5321600B2 (en) Semiconductor device manufacturing method and semiconductor device
WO2022054419A1 (en) Heater chip and heater chip unit
WO2022054421A1 (en) Heater tip unit
KR20150034695A (en) Chip card with contacting that is pasty or liquid at room temperature
TWI632623B (en) Method of manufacturing semiconductor device
JP2010092918A (en) Connection structure and connection method between plate type electrode and block type electrode
WO2022054420A1 (en) Heater chip unit
WO2022097546A1 (en) Heater tip and heater tip unit
US8282432B2 (en) Weld terminal, switch assembly and methods of attachment
EP3498413B1 (en) Dissimilar-metal bonding structure, bonding method therefor, and electrical-product production method
JP2008182078A (en) Chip type metallic plate resistor
JP2005228815A (en) Lead frame and its manufacturing method, and electronic component using the same
JP2005268410A (en) Lead frame and electronic part using the same
JPS59215757A (en) Manufacture of composite pin
JPS60182153A (en) Formation of electrode lead

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21866379

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20227030262

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21866379

Country of ref document: EP

Kind code of ref document: A1