JP2008182078A - Chip type metallic plate resistor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip type metallic plate resistor which can increase mounting strength. <P>SOLUTION: The chip type metallic plate resistor comprises a resistance member 1 formed of a metallic plate and a pair of electrodes 2 provided at both ends of a lower surface of the resistance member 1. Since a plurality of recesses 3 are formed at the lower surfaces of the pair of electrodes 2, solder flows into the plurality of recesses when the resistor is mounted to a substrate. By such an arrangement, since a contact surface area between the solder and the electrodes can be made large, mounting strength can be increased. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a chip-type metal plate resistor used for detecting a current value of various electronic devices.

  A conventional chip type metal plate resistor of this type has a configuration including a resistor made of a metal plate and a pair of electrodes made of metal provided at both ends of the lower surface of the resistor.

As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2002-184601 A

  In the above-described conventional chip type metal plate resistor, since the lower surfaces of the pair of electrodes are smooth, when the chip type metal plate resistor is mounted on a substrate, the contact area between the solder and the electrode is large. As a result, there was a problem that a package with high mounting strength could not be obtained.

  The present invention solves the above-described conventional problems, and an object of the present invention is to provide a chip-type metal plate resistor that can increase the mounting strength.

  In order to achieve the above object, the present invention has the following configuration.

  The invention according to claim 1 of the present invention includes a resistor composed of a metal plate and a pair of electrodes provided at both ends of the lower surface of the resistor, and a plurality of electrodes are provided on the lower surface of the pair of electrodes. According to this configuration, since a plurality of recesses are provided on the lower surfaces of the pair of electrodes, the solder enters the plurality of recesses when mounted on the substrate. Since the contact area between the solder and the electrode can be increased, the effect of increasing the mounting strength can be obtained.

  The invention according to claim 2 of the present invention includes a resistor composed of a metal plate, and a pair of electrodes provided at both ends of the upper surface and the lower surface of the resistor, and both ends of the upper surface of the resistor. A plurality of recesses are provided on both the upper surface of the electrode located on the electrode and the lower surface of the electrode located on both ends of the lower surface of the resistor. According to this configuration, the electrode is positioned on both ends of the lower surface of the resistor. Since a plurality of recesses are provided on the lower surface of the electrode, when mounting on the substrate, the solder will enter the plurality of recesses, and thereby, it is possible to increase the contact area between the solder and the electrode, The mounting strength can be increased, and a plurality of recesses are provided on the upper surface of the electrode located at both ends of the upper surface of the resistor, so that the surface area of the upper surface of the electrode can be increased by the plurality of recesses. Can be generated by the resistor Since heat can be effectively dissipate, compact, and in which effect that higher power is enabled to obtain.

  As described above, the chip-type metal plate resistor of the present invention includes a resistor formed of a metal plate and a pair of electrodes provided at both ends of the lower surface of the resistor, and the lower surfaces of the pair of electrodes. Since a plurality of recesses are provided on the board, the solder enters the plurality of recesses during mounting on the substrate, and this can increase the contact area between the solder and the electrode, so that the mounting strength can be increased. It has an excellent effect that it can be strengthened.

(Embodiment 1)
Hereinafter, the first aspect of the present invention will be described with reference to the first embodiment.

  1 is a perspective view of a chip-type metal plate resistor according to Embodiment 1 of the present invention, FIG. 2 is a perspective view of the chip-type metal plate resistor with a protective film removed, and FIG. 3 is the chip-type metal plate. It is a bottom view of a resistor.

  As shown in FIGS. 1 to 3, the chip-type metal plate resistor according to the first embodiment of the present invention is provided on the resistor 1 composed of a metal plate and both ends of the lower surface of the resistor 1. A pair of electrodes 2 is provided, and a plurality of recesses 3 are provided on the lower surfaces of the pair of electrodes 2.

  In the above configuration, the resistor 1 is composed of a metal plate made of nichrome, copper nickel, manganin or the like, and has a length of 0.4 to 15 mm, a width of 0.15 to 10 mm, and a thickness of 50 to 1000 μm. ing. Further, a protective film 4 made of an insulating material such as epoxy resin or polyimide resin is formed on the lower surface of the resistor 1 where the pair of electrodes 2 are not formed and on the entire upper surface of the resistor 1, The resistor 1 is formed with a notch 5 for adjusting a resistance value.

  The pair of electrodes 2 is made of a metal made of copper or the like that is separate from the resistor 1, and its length is 1/10 to 1/3 of the length of the resistor 1. ing. The pair of electrodes 2 is formed in an L-shape, and the mounting relationship between the L-shaped electrode 2 and the resistor 1 is as shown in FIG. The L-shaped electrode 2 is provided from the lower surface to the end surface of the portion. Further, as shown in FIG. 3, a plurality of concave portions 3 regularly arranged are provided on the lower surfaces of the pair of electrodes 2, and thereby the lower surfaces of the pair of electrodes 2 are in an uneven state. The pair of electrodes 2 are joined to the resistor 1 by ultrasonic bonding at positions separated from the lower surface of the resistor 1.

  Moreover, tin plating is applied to the lower surfaces of the pair of electrodes 2, whereby the chip-type metal plate resistor is mounted on the substrate. In addition, you may form nickel plating, copper plating, and gold plating between this tin plating and the lower surface of a pair of electrode 2 as needed.

  Next, the manufacturing method of the chip-type metal plate resistor according to the first embodiment of the present invention will be described with reference to FIGS.

  First, as shown in FIG. 4A, a plate-like resistor 1 is formed by cutting a metal plate made of nichrome, copper nickel, manganin, etc., and shown in FIG. 4B. Thus, a pair of L-shaped electrodes 2 is formed by punching, pressing, or the like on a metal made of copper or the like that is separate from the resistor 1.

  Next, as shown in FIG. 4C, both ends of the resistor 1 are placed on the upper surfaces of the respective stepped portions 2a of the pair of electrodes 2, and then, as shown in FIG. The both ends of the body 1 and the pair of electrodes 2 are ultrasonically bonded. This ultrasonic bonding is performed by bringing a jig having a plurality of regularly arranged protrusions into contact with the lower surface of the electrode 2 and the upper surface of the resistor 1, respectively. At the same time as the electrode 2 is joined, the jig forms a plurality of recesses 3 regularly arranged on both ends of the upper surface of the resistor 1 and the lower surfaces of the pair of electrodes 2 as shown in FIG. Is done. At this time, it is not always necessary to form the concave portion 3 on the upper surface of the resistor 1, and in this case, a jig that does not have a plurality of convex portions may be used.

  Next, as shown in FIG. 4E, a notch 5 is formed in the resistor 1 with a laser in order to adjust the resistance value.

  Finally, as shown in FIG. 4 (f), a protective film 4 is formed on the lower surface of the resistor 1 where the electrode 2 is not formed, on the entire upper surface of the resistor 1 and on the uppermost surface of the electrode 2. Then, tin plating is formed on the lower surfaces of the pair of electrodes 2.

  In addition, since the recessed part 3 formed in the lower surface of the said pair of electrode 2 is hidden in a pair of electrode 2 in FIG.4 (d)-(f), it is not shown in figure.

  In the above-described chip-type metal plate resistor according to the first embodiment of the present invention, since the plurality of concave portions 3 regularly arranged are formed on the lower surfaces of the pair of electrodes 2, at the time of mounting on the substrate, Then, the solder enters the plurality of recesses 3, whereby a large contact area between the solder and the electrode 2 can be obtained, so that an effect that the mounting strength can be increased is obtained.

  Further, since the solder used for mounting on the substrate can be intruded into the recess 3, the amount of solder fillets can also be reduced, thereby enabling high-density mounting.

  In addition, even when the amount of solder at the time of mounting on the substrate is different at both ends of the chip-type metal plate resistor, since the solder enters the recess 3 on the side where the amount of solder is large, the Manhattan phenomenon (chip standing) is caused. This can be prevented and a greater self-alignment effect can be obtained.

  In the first embodiment of the present invention, since the recesses 3 are formed at both ends of the upper surface of the resistor 1, the both ends of the protective film 4 formed on the upper surface of the resistor 1 are also uneven. In addition, because of the presence of the recessed portion, the area of adhesion to the nozzle is reduced during mounting on the substrate, so that poor adhesion to the nozzle can be reduced.

  In the first embodiment of the present invention described above, the resistor 1 is provided so that the pair of L-shaped electrodes 2 are positioned from the lower surface to the end surface of the both ends. However, the present invention is not limited to this. The pair of electrodes 2 may be provided only on the lower surfaces of both ends of the resistor 1 instead of the one.

(Embodiment 2)
The second aspect of the present invention will be described below with reference to the second embodiment.

  5 is a perspective view of the chip-type metal plate resistor according to the second embodiment of the present invention, FIG. 6 is a top view of the chip-type metal plate resistor, and FIG. 7 is a bottom view of the chip-type metal plate resistor. . In the second embodiment of the present invention, components having the same configurations as those of the first embodiment of the present invention are denoted by the same reference numerals, and the description thereof is omitted.

  5 to 7, the second embodiment of the present invention is different from the first embodiment of the present invention described above in that a pair of electrodes 2 are formed at both ends of the upper surface of the resistor 1. A plurality of concave portions 3 regularly arranged on the upper surfaces of the pair of electrodes 2 is provided.

  Next, a manufacturing method of the chip-type metal plate resistor according to the second embodiment of the present invention will be described with reference to FIGS.

  First, as shown in FIG. 8A, a plate-like resistor 1 is formed by cutting a metal plate made of nichrome, copper nickel, manganin, etc., and shown in FIG. 8B. Thus, a pair of U-shaped electrodes 2 is formed by punching, pressing, or the like on a metal made of copper or the like that is separate from the resistor 1.

  Next, as shown in FIG. 8 (c), both ends of the resistor 1 are inserted into the missing portions 2b of the pair of electrodes 2, and then both ends of the resistor 1 are inserted as shown in FIG. 8 (d). And a pair of electrodes 2 are ultrasonically bonded. In this ultrasonic bonding, jigs having a plurality of regularly arranged projections are arranged on the upper surface of the electrode 2 positioned at both ends of the upper surface of the resistor 1 and the electrode positioned at both ends of the lower surface of the resistor 1. In this case, the resistor 1 and the pair of electrodes 2 are joined to each other, and at the same time, the resistor as shown in FIG. A plurality of recesses 3 regularly arranged on both the upper surface of the electrode 2 located at both ends of the upper surface of 1 and the lower surface of the electrode 2 located at both ends of the lower surface of the resistor 1 are formed.

  Next, as shown in FIG. 8E, a notch 5 is formed in the resistor 1 with a laser in order to adjust the resistance value.

  Finally, as shown in FIG. 8 (f), a protective film 4 is formed at a location where the electrode 2 is not formed on the upper and lower surfaces of the resistor 1, and one of the upper and lower surfaces of the pair of electrodes 2. Tin plating is formed on one side.

  Note that the recesses 3 formed on the lower surfaces of the pair of electrodes 2 located at both ends of the lower surface of the resistor 1 are hidden by the pair of electrodes 2 in FIGS. It has not been.

  In the above-described chip-type metal plate resistor according to the second embodiment of the present invention, in addition to the effects described in the first embodiment of the present invention, the resistor is formed on the upper surface of the electrode 2 located at both ends of the upper surface of the resistor 1. Since the surface area of the upper surface of the electrode 2 can be increased by the plurality of recessed portions 3 formed, the heat generated in the resistor 1 can be effectively dissipated, and thereby, the size and power consumption can be reduced. The effect that it becomes possible is acquired.

  Further, by inserting the tip of a measurement pin used for resistance value measurement or the like into the recess 3 formed on the upper surface of the electrode 2 located at both ends of the upper surface of the resistor 1, the position of the tip of the pin Can be fixed easily, so that stable measurement can be performed, and thus stable characteristics can be obtained.

  In addition, the effect described in the first embodiment of the present invention can be obtained regardless of whether the upper surface side or the lower surface side of the resistor 1 is mounted on the substrate.

  Furthermore, since the recesses 3 are formed on the upper surface of the electrode 2 located at both ends of the upper surface of the resistor 1, the area of adhesion to the nozzle becomes small when mounted on the substrate, resulting in poor adhesion to the nozzle. Can be reduced.

  In the chip-type metal plate resistor according to the second embodiment of the present invention, the pair of electrodes 2 are configured in a U shape, and both end portions of the resistor 1 are connected to the missing portion 2b in the U-shaped electrode 2. Although what was inserted was demonstrated, this pair of electrode 2 is not limited to a U-shaped thing, It is good also as a structure which provided the electrode 2 only in the upper surface and lower surface of the both ends of the resistor 1, respectively. It is.

  In the chip-type metal plate resistor according to the first and second embodiments of the present invention, the resistor 1 and the pair of electrodes 2 are ultrasonically bonded. However, welding, clad bonding, etc. May be joined. In this case, the recess 3 is formed by pressing the pair of electrodes 2 or the like.

  The chip-type metal plate resistor according to the present invention has an effect that the mounting strength can be increased at the time of mounting on a substrate by providing a plurality of recesses on the lower surfaces of a pair of electrodes. It is useful when applied to a chip-type metal plate resistor or the like used for detecting a current value of various electronic devices.

The perspective view of the chip type metal plate resistor in Embodiment 1 of this invention Perspective view of the chip type metal plate resistor with the protective film removed Bottom view of the same chip type metal plate resistor (A)-(f) Perspective view which shows the manufacturing method of the same chip type metal plate resistor The perspective view of the chip type metal plate resistor in Embodiment 2 of this invention Top view of the same chip type metal plate resistor Bottom view of the same chip type metal plate resistor (A)-(f) Perspective view which shows the manufacturing method of the same chip type metal plate resistor

Explanation of symbols

1 resistor 2 pair of electrodes 3 recess

Claims (2)

A chip-type metal plate resistor comprising a resistor composed of a metal plate and a pair of electrodes provided at both ends of the lower surface of the resistor, and having a plurality of recesses on the lower surface of the pair of electrodes. A resistor composed of a metal plate, and a pair of electrodes provided at both ends of the upper and lower surfaces of the resistor, the upper surface of the electrode positioned at both ends of the upper surface of the resistor and the resistor A chip-type metal plate resistor in which a plurality of recesses are provided on both lower surfaces of electrodes located at both ends of the lower surface.

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