JP4981277B2 - Circuit structure - Google Patents

Description

  The present invention relates to a circuit structure.

  For example, a circuit structure such as a printed circuit board forms a signal system control circuit through which a small current flows by mounting a semiconductor device, and is held by a control unit (see Patent Document 1). In this type of circuit structure, one that is disposed between an in-vehicle battery or the like and each electronic device and supplies power to each electronic device is known.

In this type of circuit structure, a plurality of conductive paths are formed on the front surface (one surface side) and the back surface (other surface side) of the base material. In this circuit structure, in order to improve the degree of freedom in wiring design, the conductive paths on the front surface and back surface of the base material are connected by pins, connecting members, and the like.
Japanese Patent Laid-Open No. 2003-31978

  However, the above-described circuit structure has a problem that pins, connecting members and the like protrude from the base material, and the size of the circuit structure becomes large. Furthermore, this circuit structure has a problem that pins and connecting members are required to connect the conductive paths on the front surface and back surface of the base material, and the number of parts increases.

  The present invention has been proposed in view of such a situation, and it is possible to reduce the size and reduce the number of parts and connect the conductive paths on the one surface side and the other surface side of the base material to each other. The purpose is to provide a body.

According to the first aspect of the present invention, there is provided a circuit structure having a plurality of conductive paths through a base material, wherein the base material is provided with a through-hole, and a metal body is provided on one surface side and the other surface side of the base material. The conductive path is formed by bending the conductive paths on the one surface side and the other surface side of the base material and inserting them into the through holes, and the conductive path on the one surface side of the base material and the other surface side of the base material side. A fixing connection portion that is in contact with and connected to the conductive path along the central axis of the through-hole, and the fixing connection portion includes a conductive path on one side of the base material and a conductive path on the other side superimposed on each other; An electrically connected and an end of the one-side conductive path opposite to the fixing connection; and an end of the other-surface conductive path opposite to the fixing connection; Are arranged in directions opposite to each other .

A second aspect of the present invention, in claim 1, the thickness of the conductive path of one surface and the other surface side of said substrate characterized in that it is a 70～800Myuemu.

<Invention of Claim 1>
According to the present invention, the fixing connection portion does not protrude from the base material, and the size of the circuit structure can be reduced, and the fixing connection portion is formed without using a pin, a connection member, or the like. Thus, the conductive paths on the one surface side and the other surface side of the substrate can be connected to each other.
Further, according to the present invention, the fixing connection portion is one in which the conductive paths on the one surface side and the other surface side of the base material are overlapped with each other and electrically connected, and the fixing connection portion is connected to the one surface side of the base material and It can be made strong by superimposing the conductive paths on the other side.

<Invention of Claim 2 >
According to the present invention, the thickness of the conductive path on the one surface side and the other surface side of the substrate is 70 to 800 μm, and the circuit structure of the present invention can be applied to a circuit structure for large current.

< Reference Example 1>
Reference Example 1 will be described with reference to the accompanying drawings. In this reference example , the circuit structure 1 will be described by taking a power system wiring board that allows a large current to flow as an example. 1 and 2 show an example of a power system wiring board. The illustrated power wiring board 1 is disposed between a power source such as an in-vehicle battery and each electronic device. The power system wiring board 1 is used to distribute power to each electronic device.

As shown in FIGS. 1 and 2, the power wiring board 1 of this reference example has conductive paths 20 </ b> A to 20 </ b> D formed on a front surface 11 and a back surface 15 of a base material 10 made of a plate-like insulating material, respectively. It is. Each conductive path 20A and the like are insulated by a plate-like insulating material. The base material 10 is formed of a glass epoxy resin, a ceramic substrate, or the like. As shown in FIG. 1, the base material 10 is provided with a through hole 13. This base material 10 is not limited to the example shown in the figure, and may be one having a plurality of through holes 13. In addition, although this electric power system wiring board 1 is not shown in figure, it has the conductive circuit formed of the several conductive path.

The conductive paths 20A to 20D form a wiring pattern through which a current flows, and supply power to each electronic device. The conductive paths 20A and 20B are formed on the surface 11 (one surface side) of the substrate 10 as shown in the figure. On the other hand, the conductive paths 20C and 20D are formed on the back surface 15 (other surface side) of the substrate 10 as shown in the figure. The conductive paths 20A to 20D are constituted by, for example, copper rolled materials 25A to 25D. Here, the thickness dimension of each copper rolling material 25A-25D was 420 micrometers. Each copper rolled material 25A and the like are fixed to the base material 10 by an adhesive as shown in FIG. In this reference example , as shown in FIG. 1, the conductive paths 20A and 20C are bent and substantially copper-shaped rolled materials 25A and 25C, and the conductive paths 20B and 20D are plate-shaped. Each copper rolled material 25B, 25D is constituted respectively.

Now, the power system wiring board 1 of this reference example has the fixing connection part 30A. As shown in FIG. 2, the fixing connection portion 30 </ b> A abuts the conductive path 20 </ b> A on the front surface 11 of the base material 10 and the conductive path 25 </ b> C on the back surface 15 of the base material 10 along the central axis L of the through hole 13. Connected.

  A method of forming the fixing connection portion 30A will be described with reference to FIG. As shown in FIG. 2A, one end of the rolled material 25 </ b> A (conductive path 20 </ b> A) is inserted into the through hole 13 and bonded to the surface 11 of the base material 10. Reference numeral 27A denotes an end portion of the rolled material 25A (conductive path 20A).

  On the other hand, as shown in the figure, the rolled material 25C is inserted into the through hole 13 so that one end thereof is in contact with one end of the rolled material 25A, and is bonded to the back surface 15 of the base material 10. Reference numeral 27C denotes an end portion of the rolled material 25C (conductive path 20C).

  As shown in the figure, when each conductive path 20A, 20C is arranged with one end inserted into the through-hole 13, the end 27A of the rolled material 25A comes into contact with the end 27C of the rolled material 25C. The fixing connection portion 30A is formed after the end portions 27A and 27C of the rolled material are brought into contact with each other along the central axis L of the through hole 13 as illustrated in FIGS. 2 (a) and 2 (b). The side surface 28C at one end of the rolled material 25C is formed by being soldered to the rolled material 25A (conductive path 20A) and the rolled material 25B (conductive path 20B). A symbol H in the figure is a soldered portion.

  As shown in FIGS. 2A and 2B, the fixing connecting portion 30A welds (solders) a side surface 28C of one end of the rolled material 25C to the rolled materials 25A and 25B, and a pin or a connecting member. It is formed without using etc. As a result, the number of parts such as pins can be reduced, and the conductive paths 20A and 20B on the substrate surface 11 and the conductive path 20C on the substrate back surface 15 can be electrically connected.

  Further, as shown in the drawing, the fixing connection portion 30A is formed inside the through hole 13 by bringing the end portions 27A and 27C of both rolled materials 25A and 25C into contact with each other. Accordingly, the fixing connection portion 30A does not protrude from the base material 10, and the size of the power system wiring board 1 can be suppressed.

The thickness t of the illustrated conductive path 20 is 70 to 800 μm. For example, a signal wiring board for passing a small current has a conductive path thickness of 15 μm. On the other hand, in this reference example , the wiring pattern through which a large current flows was formed with the thickness t of the conductive paths 20A to 20D being set to 70 to 800 μm. Accordingly, the conductive paths 20A to 20D can be formed in a thick film so that a large current can flow.

The thickness t of the conductive paths 20A to 20D is adjusted by stacking and joining a plurality of each of the copper rolled materials 25A to 25D or changing the thickness of each of the copper rolled materials 25A to 25D. The conductive paths 20A and 20C are formed on the front surface 11 and the back surface 15 of the base material 10, respectively, while preventing the rolling materials 25A and 25C from being broken by bending as the thickness dimensions of the copper rolled materials 25A and 25C increase. In addition, in this reference example , the thickness dimension of each copper rolling material 25A-25D was 420 micrometers. The thickness dimension of each copper rolled material 25A-25D can be adjusted between 35-70 micrometers between 70-800 micrometers.

<Embodiment 1 >
Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Here, the same components as those of the power system wiring board 1 described above are denoted by the same reference numerals, and the description thereof is omitted. The power wiring board 1A of the present embodiment has a fixing connection portion 30B. As shown in FIG. 3, the fixing connection portion 30 </ b> B is formed by electrically connecting a conductive path 20 </ b> A on the substrate surface 11 and a conductive path 20 </ b> C on the substrate back surface 15 to each other.

  A method for forming the fixing connection portion 30B will be described with reference to FIG. In addition, as can be understood from FIG. 3, the electric power wiring board 1 </ b> A is obtained by bonding the copper rolled materials 25 </ b> A to 25 </ b> D to the front surface 11 or the back surface 15 of the base material 10 to form conductive paths 20 </ b> A to 20 </ b> D. is there.

  As shown in FIG. 3A, the rolled material 25 </ b> C is inserted into the through hole 13 with one end 26 </ b> C along the left side wall 13 </ b> A of the through hole, and is bonded to the back surface 15 of the base material 10. On the other hand, the rolled material 25 </ b> A is inserted into the through hole 13 with one end 26 </ b> A along the right side wall 13 </ b> B of the through hole, and is bonded to the surface 11 of the base material 10.

  As shown in the figure, when each of the conductive paths 20A, 20C is arranged by inserting the one end 26A, 26C into the through hole 13 along the side walls 13B, 13A, one end 26A of the rolled material 25A (conductive path 20A). And one end 26 </ b> C of the rolled material 25 </ b> C (conductive path 20 </ b> C) are overlaid inside the through hole 13. As shown in FIGS. 3A and 3B, the fixing connection portion 30 </ b> B is rolled after the ends 26 </ b> A and 26 </ b> C of the rolled material are overlapped along the central axis L <b> 1 of the through-hole 13. One end 26A of the material 25A is formed by soldering with the rolled material 25B (conductive path 20B).

  As shown in FIG. 3B, the fixing connection portion 30 </ b> B is formed by overlapping the ends 26 </ b> A and 26 </ b> C of the rolled material inside the through hole 13. As a result, the fixing connection portion 30B can be made strong by superimposing the conductive path 20A and the conductive path 20C. Further, as shown in the figure, the fixing connection portion 30B is configured such that after the ends 26A, 26C of the rolled material are overlapped with each other in the through hole 13, the end 26A of the rolled material is welded (soldered) to the rolled material 25B. ) And without using pins or connecting members. As a result, the number of parts such as pins can be reduced, and the conductive paths 20A and 20B on the substrate surface 11 and the conductive path 20C on the substrate back surface 15 can be electrically connected. The fixing connecting portion 30B is formed by overlapping the ends 26A and 26C of the rolled materials 25A and 25C and using the rolled materials 25A and 25C forming the thick conductive paths 20A and 20C. The area is secured and the resistance value is lowered.

The thickness t of each of the conductive paths 20 </ b> A to 20 </ b> D is 70 to 800 μm, similar to the power wiring board 1 of Reference Example 1. In this embodiment, the thickness t of each of the conductive paths 20A to 20D is 420 μm using a single copper rolled material 25A to 25D.

  As shown in the figure, the fixing connection portion 30B is formed by overlapping the ends 26A and 26C of the rolled materials 25A and 25C inside the through hole 13. Accordingly, the fixing connection portion 30B does not protrude from the base material 10, and the size of the power system wiring board 1A can be suppressed.

<Other embodiments>
The present invention is not limited to the embodiment described above, and can be implemented by appropriately changing a part of the configuration without departing from the spirit of the invention.
(1) The power wiring boards 1 and 1A are welded by welding the conductive path of the base material surface 11 and the conductive path of the base material back surface 15, but may be welded by welding.
(2) The power system wiring boards 1 and 1A are formed using the copper rolled material 25, but may be formed using a metal foil made of copper or aluminum.
(3) The power wiring boards 1 and 1A have the width of the opening of the through hole set such that both rolled materials 25A and 25C can be inserted into the through hole without providing a gap. The size may be such that the solder is inserted into the through-hole and a sufficient amount of solder flows on the contact surface between one end 26A of the rolled material 25A and one end 26C of the rolled material 25C.
(4) Although the power system wiring boards 1 and 1A have a quadrangular opening in the through hole, they may be formed in a circular or elliptical shape.
(5) In the power wiring board 1A, the thickness dimension of the base material 10 is increased and the dimensions of the end portions 26A and 26C of both rolled materials 25A and 25C inserted into the through holes 13 are lengthened, and the fixing connection portion 30B. However, the contact area between the rolled material 25A and the rolled material 25C may be widened to further reduce the resistance value.

The exploded perspective view of the circuit composition object concerning reference example 1 (A) The figure is a schematic sectional view of the circuit structure to which the rolled material according to Reference Example 1 is bonded, and (b) is the schematic sectional view of the fixing connection part of the circuit structure. (A) The figure is a schematic sectional drawing of the circuit structure which adhered the rolling material which concerns on Embodiment 1 , (b) The figure is a schematic sectional drawing of the fixing connection part of the circuit structure.

Explanation of symbols

1, 1A ... Power system wiring board (circuit structure)
10 ... base material 11 ... base material surface (one side of base material)
13 ... through hole 15 ... back surface of substrate (other surface side of substrate)
20 ... conductive path 25 ... rolled material (metal body)
27A: Conductive path end 27C on the base material surface (one surface side of the base material) ... Conductive path ends 30A, 30B on the back surface of the base material (other surface side of the base material): Fixing connection portion L, L1... Central axis t of through-hole... Thickness of conductive path

Claims (2)

In a circuit structure comprising a plurality of conductive paths through a substrate,
A through hole is provided in the base material, and the conductive path is formed by a metal body on one surface side and the other surface side of the base material,
The conductive paths on the one surface side and the other surface side of the base material are respectively bent and inserted into the through holes, and the conductive paths on the one surface side of the base material and the conductive paths on the other surface side of the base material are connected to the through holes. It has a fixing connection part that is contacted and connected along the central axis,
The fixing connection portion is one in which the conductive paths on one side and the other side of the base material are overlapped with each other and electrically connected, and
Characterized in that the end opposite to the fixing connection portion of the conductive path of the one side, and the fixing connection portion of the conductive path of the other side and the opposite end is disposed opposite directions A circuit structure. 2. The circuit structure according to claim 1, wherein the thickness of the conductive path on one side and the other side of the substrate is 70 to 800 μm.

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