CN115443202A - Heating nozzle and heating nozzle unit - Google Patents
Heating nozzle and heating nozzle unit Download PDFInfo
- Publication number
- CN115443202A CN115443202A CN202180027305.XA CN202180027305A CN115443202A CN 115443202 A CN115443202 A CN 115443202A CN 202180027305 A CN202180027305 A CN 202180027305A CN 115443202 A CN115443202 A CN 115443202A
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- China
- Prior art keywords
- soldering iron
- connecting arm
- heating nozzle
- heating
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 181
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 483
- 229910052742 iron Inorganic materials 0.000 claims abstract description 237
- 238000005476 soldering Methods 0.000 claims abstract description 231
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 47
- 238000009529 body temperature measurement Methods 0.000 claims description 41
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 230000003647 oxidation Effects 0.000 claims description 17
- 238000007254 oxidation reaction Methods 0.000 claims description 17
- 239000011247 coating layer Substances 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 229920005989 resin Polymers 0.000 description 17
- 230000007547 defect Effects 0.000 description 11
- 230000020169 heat generation Effects 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000036544 posture Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
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- 238000005520 cutting process Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Resistance Heating (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electrodes For Cathode-Ray Tubes (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a heating nozzle and a heating nozzle unit which are easy to realize good heating efficiency no matter the thickness of the plate is increased or decreased. The heating nozzle is a plate-shaped heating nozzle (2) for thermocompression bonding a terminal lead to a terminal member, and the heating nozzle (2) is provided with: a soldering iron part (6) provided with a soldering iron tip part (13) which is contacted with the terminal lead in a state of protruding downwards from the soldering iron body (11); and a connecting arm section (7) which extends upward from the left and right end sections of the soldering iron body (11) and which heats the soldering iron section (6) by passing a current from a power supply through the soldering iron body (11), wherein the soldering iron body (11) is set to have a plate thickness smaller than that of the connecting arm section (7) and a cross-sectional area smaller than that of the connecting arm section (7).
Description
Technical Field
The present invention relates to a heating nozzle and a heating nozzle unit for thermocompression bonding a terminal lead to a terminal member.
Background
In an operation of thermocompression bonding a lead wire for a terminal to a terminal member, for example, in an operation of thermocompression bonding a lead wire to a terminal portion of a core in manufacturing an electronic component such as a chip inductor (chip inductor), a heating tip for thermocompression bonding that generates heat due to electric resistance at the time of energization is used. Specifically, a terminal lead wire placed on a terminal member is rapidly heated while being pressurized by a tip portion of a soldering iron of a heating tip for thermocompression bonding, and the terminal lead wire is thermocompression bonded to the terminal member (see, for example, patent document 1).
Documents of the prior art
Patent literature
Patent document 1: japanese patent laid-open No. 2001-284781
Disclosure of Invention
Problems to be solved by the invention
However, the heating tip is manufactured by cutting out a conductive plate material such as tungsten or molybdenum by wire electric discharge machining. In order to make the tip portion of the soldering iron a size suitable for the size of the workpiece (the size of the terminal member or the size of the terminal lead), the thickness of the plate material is changed.
However, when the plate thickness of the plate material (in other words, the plate thickness of the entire heating nozzle) is changed, the current density at the time of energization changes along with the cross-sectional area in the heat generating portion of the heating nozzle, and desired heat generating performance (responsiveness to temperature rise and cooling, power consumption, and the like) cannot be obtained. In particular, when the thickness of the plate material is increased to cope with an increase in the size of the workpiece, the current density becomes small and heat generation becomes difficult, and when the tip portion of the soldering iron is raised to a desired temperature, the energization time and power consumption increase and heat generation efficiency deteriorates. Further, since the heat capacity is increased by the increase in volume of the heat generating portion, it is difficult to perform rapid cooling.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a heating nozzle and a heating nozzle unit which are capable of easily achieving a good heating efficiency regardless of an increase or decrease in plate thickness.
Means for solving the problems
The present invention has been made to achieve the above object, and a first aspect of the present invention is a plate-shaped heating nozzle for thermocompression bonding a terminal lead to a terminal member, the heating nozzle comprising,
the heating nozzle is provided with:
a soldering iron portion in which a soldering iron tip portion abutting against the terminal lead is provided in a state of protruding downward (pressing direction at the time of crimping) from a soldering iron body; and
a connecting arm portion extending upward from the left and right end portions of the soldering iron body and heating the soldering iron portion by passing a current from a power supply through the soldering iron body,
the soldering iron body is set to have a thickness smaller than that of the connecting arm portion and a cross-sectional area smaller than that of the connecting arm portion.
A heating tip according to a second aspect is the heating tip according to the first aspect, wherein a thin portion is formed by extending the notch portion in a direction from one connecting arm portion toward the other connecting arm portion in a range from the lower portion of the connecting arm portion to the soldering iron body, and a surface of the thin portion that becomes a bottom portion of the notch portion is a surface of the soldering iron body.
A heating tip according to a third aspect is the heating tip according to the second aspect, characterized in that a soldering iron tip portion is provided so as to protrude below the thin portion.
A heating tip according to a fourth aspect is the heating tip according to the second aspect, wherein the thin portion is formed on a side of the connection arm portion with respect to the soldering iron tip portion, and a thickness of a side surface of the soldering iron body is formed to be thinner than a thickness of the connection arm portion after the thin portion is removed.
A heating nozzle unit according to a fifth aspect is the heating nozzle according to any one of the second to fourth aspects, wherein the thin portion is formed at a position shifted from the soldering iron tip portion, and a plate thickness of the soldering iron tip portion is set to be the same as a plate thickness of the connecting arm portion.
A heating tip unit according to a sixth aspect is the heating tip unit according to any one of the second to fourth aspects, wherein the thin portion is formed at a position shifted from the soldering iron tip portion, and a plate thickness of the soldering iron tip portion is set to be thinner than a plate thickness of the connecting arm portion.
A heating tip unit according to a seventh aspect of the present invention is the heating tip unit according to any of the first to sixth aspects, wherein centers of the connecting arm portion, the soldering iron body, and the soldering iron tip portion in the thickness direction are located on the same plane.
A heating nozzle unit according to an eighth aspect is the heating nozzle according to any one of the first to seventh aspects, wherein an oxidation-resistant coating layer is formed on at least a surface of the soldering iron portion.
A heating nozzle according to a ninth aspect is the heating nozzle according to the eighth aspect, wherein the oxidation-resistant coating layer is a nickel coating.
A heating nozzle unit according to a tenth aspect is characterized in that a temperature sensor is attached to the iron portion of the heating nozzle according to any one of the first to seventh aspects.
A heating nozzle unit according to an eleventh aspect is the heating nozzle unit according to the tenth aspect, wherein the heating nozzle includes:
a soldering iron portion in which the soldering iron body is provided with the soldering iron tip portion abutting against the terminal lead;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is provided on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measuring fixing part is provided with a pair of fixing contact surfaces which the temperature measuring part contacts, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
Effects of the invention
The present invention has the following excellent effects.
According to the first aspect of the present invention, since the soldering iron body is set to have a plate thickness smaller than that of the connecting arm portion and a cross-sectional area smaller than that of the connecting arm portion, even if the plate thickness of the heating tip is increased, it is possible to suppress a defect that the current density of the soldering iron body is decreased and heat generation becomes insufficient. Therefore, it is easy to realize a good heat generation efficiency regardless of the increase or decrease in the plate thickness of the heating nozzle.
According to the second aspect of the invention, the thin portion is formed by extending the notch portion in the direction from one connecting arm portion toward the other connecting arm portion within the range from the lower portion of the connecting arm portion to the soldering iron body, and the surface of the thin portion which becomes the bottom portion of the notch portion is the surface of the soldering iron body, so that the structure of the heating tip in which the plate thickness of the soldering iron body is thinner than the plate thickness of the connecting arm portion can be easily realized.
According to the third aspect of the invention, since the soldering iron tip portion is provided so as to protrude below the thin portion, when foreign matter adheres to the soldering iron tip portion due to the thermocompression bonding operation, the foreign matter can be easily removed by grinding the tip of the soldering iron tip portion or the like. Further, the polishing margin of the tip of the soldering iron tip can be sufficiently ensured.
According to the fourth aspect of the present invention, since the thin portion is formed on the connecting arm portion side of the soldering iron tip portion, and the thickness of the side surface of the soldering iron body is formed thinner than the thickness of the connecting arm portion from which the thin portion is removed, the dimension in the plate thickness direction can be sufficiently secured in the tip end surface of the soldering iron tip portion. This makes it possible to expand the allowable range of the size of the workpiece (the object to be thermocompression bonded) that can be thermocompression bonded by the heating nozzle.
According to the fifth aspect of the invention, since the thin portion is formed at a position displaced from the soldering iron tip portion and the plate thickness of the soldering iron tip portion is set to be the same as the plate thickness of the connecting arm portion, it is not necessary to increase or decrease the plate thickness of the soldering iron tip portion with respect to the plate thickness of the connecting arm portion, and the heating tip can be easily manufactured.
According to the sixth aspect of the present invention, since the thin portion is formed at a position displaced from the soldering iron tip portion, and the plate thickness of the soldering iron tip portion is set to be thinner than the plate thickness of the connecting arm portion, it is possible to increase the degree of freedom in the plate thickness dimension of the soldering iron tip portion, and to easily design the heating tip corresponding to the size of the workpiece.
According to the seventh aspect of the present invention, since the connecting arm portion, the soldering iron body, and the soldering iron tip portion are positioned on the same plane at the center in the thickness direction, a bending moment is less likely to occur in the heating tip during the thermocompression bonding operation, and thus a defect that an excessive load is applied to the heating tip can be suppressed, and a defect that the heating tip is likely to be damaged can be suppressed.
According to the seventh and eighth inventions, oxidation of the surface of the heating nozzle can be suppressed even if the temperature rise and cooling are repeated, and the durability can be improved.
According to the tenth aspect of the present invention, since the temperature sensor is attached to the soldering iron portion of the heating tip, information on the temperature of the soldering iron portion can be acquired and used for controlling the heat generation of the heating tip.
According to the invention of the eleventh aspect, since the temperature measurement fixing section is set in a state in which the distance between the fixing contact surfaces gradually increases from the soldering iron portion side toward the upper side, the temperature measurement section of the temperature sensor can be brought into sufficient contact with the temperature measurement fixing section, and a heating nozzle unit capable of performing good fixing of the temperature measurement section to the heating nozzle and further good temperature measurement can be configured.
Drawings
Fig. 1 is a perspective view of a heating nozzle unit.
Fig. 2 is an explanatory view of the heating nozzle, (a) is a top view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
FIG. 3 is an explanatory view of a temperature measuring fixing part of a heating nozzle, wherein (a) is a front view and (b) is a sectional view.
Fig. 4 is an explanatory view of a procedure of mounting the thermocouple to the heating nozzle, (a) is a state before inserting the thermocouple into the heating nozzle, (b) is a state after inserting the thermocouple into the heating nozzle, and (c) is a state after injecting resin as the lead stopper portion into the lead accommodating space portion and the stopper recess portion.
Fig. 5 is a perspective view of a heating tip provided with two iron portions.
Fig. 6 is an explanatory view of a heating tip provided with two iron portions, (a) is a plan view, (b) is a front view, (c) is a bottom view, and (d) is a side view.
Detailed Description
The mode for carrying out the invention is explained below with reference to the drawings.
As shown in fig. 1 and 2, the heating nozzle unit 1 includes: a plate-shaped heating nozzle 2 for thermocompression bonding the terminal lead a to the terminal member B (see fig. 2 (d)); and a thermocouple 3 attached to the heating nozzle 2 as a temperature sensor. The heating nozzle 2 is a nozzle formed by machining a plate material of a conductive material (tungsten, molybdenum, an ultra-hard material, or the like) by wire electric discharge machining, and as shown in fig. 2, the heating nozzle 2 includes: a soldering iron portion 6 serving as a lower portion (a distal end portion on the side of the workpiece (the terminal wire a or the terminal member B)) of the heating tip 2; and a pair of right and left connecting arm portions 7 serving as upper portions (base portions). When current is supplied to the soldering iron portion 6 through the connecting arm portion 7, the resistance causes the soldering iron portion 6 to generate heat, and the thermocouple 3 can measure the temperature of the soldering iron portion 6.
The soldering iron portion 6 includes a horizontally long soldering iron body 11 connecting lower portions of the connecting arm portions 7 to each other, and the horizontal width of the soldering iron body 11 (the dimension along the horizontal direction in which the pair of connecting arm portions 7 are arranged) is set to be gradually narrowed toward the lower portion of the heating tip 2. A box-shaped soldering iron tip portion 13 is provided to protrude downward from the bottom of the soldering iron body 11 that protrudes slightly downward, and the bottom surface (tip surface) of the soldering iron tip portion 13 can be brought into contact with the terminal lead a as a soldering iron tip surface 13 a. Further, a substantially rectangular iron recess 15 is formed in an upper portion (on the side of the connecting arm portion 7) of the iron body 11 on the opposite side to the iron tip portion 13, and a temperature measuring contact (temperature measuring portion) 3a of the thermocouple 3 is fixed in the iron recess 15. The structure to which the temperature measuring contact 3a is fixed will be described in detail later.
The connecting arm portions 7 are vertically long components extending upward from the left and right ends of the soldering iron body 11, and are provided in a state where the connecting arm portions 7 are spaced apart from each other. Further, the heating nozzle unit 1 is attached to the nozzle holder in a posture in which the tip end portion 13 of the soldering iron is directed downward by penetrating the attachment hole 17 for attaching to the nozzle holder (not shown) of the thermocompression bonding apparatus in the plate thickness direction of the heating nozzle 2 at the upper portion (extending end portion) of the connecting arm portion 7 and screwing the attachment bolt (not shown) inserted through the attachment hole 17 to the nozzle holder.
In addition, in the heating nozzle unit 1 attached to the nozzle holder, one connecting arm portion 7 is electrically connected to one end of a power supply for heater (not shown) of the thermocompression bonding apparatus, and the other connecting arm portion 7 is electrically connected to the other end of the power supply for heater. When an electric current is supplied from a power source (heater power source) to the heating tip 2, the electric current flows through the connection arm portion 7 into the iron body 11, the iron body 11 generates heat due to electric resistance in the iron body 11, and the temperature of the iron tip portion 13 is raised by the heat. Further, although the current in the soldering iron body 11 flows from the one connecting arm portion 7 side toward the other connecting arm portion 7 side, the cross-sectional area of the reduced diameter portion located at the corner portion of the soldering iron recess 15 in the path through which the current flows is narrower than the cross-sectional area of the other portion, and therefore the current density becomes the highest at the reduced diameter portion, and joule heat due to electric resistance tends to occur around this portion.
As shown in fig. 1 and 2 (d), the heating tip 2 is configured such that grooves 20 as the grooves of the present invention extend in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) in the range from the lower portion of the connecting arm portion 7 to the soldering iron body 11 on both front and back surfaces of the heating tip 2, and a thin portion 21 is formed by the extension of the grooves 20 on the front and back surfaces, and the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21. In other words, the thin portion 21 is formed at a position shifted from the soldering iron tip portion 13 (more specifically, closer to the connection arm portion 7 side than the soldering iron tip portion 13).
As shown in fig. 2 d, the depth dimension (the dimension in the thickness direction of the heating tip 2) of the front and back grooves 20 is set to be the same, the centers of the connecting arm portion 7, the soldering iron body 11 (the thin portion 21), and the soldering iron tip portion 13 in the thickness directions are located on the same plane, and the thickness of the soldering iron tip portion 13 is set to be the same as the thickness of the connecting arm portion 7. The surface of the thin portion 21, which is the bottom of the groove 20, is a side surface (front and back surfaces) of the soldering iron body 11, and the thickness of the soldering iron body 11 (the thickness of the thin portion 21) is set to be smaller than the thickness of the connecting arm portion 7, and the cross-sectional area of the soldering iron body 11 (in other words, the cross-sectional area of a flow path through which current flows) is set to be smaller than the cross-sectional area of the connecting arm portion 7. The thickness t1 of the side surface of the soldering iron body 11 is formed to be thinner than the thickness t2 of the connecting arm portion 7 (more specifically, the thickness of the connecting arm portion 7 after the thin portion 21 is removed (the thickness of a portion of the connecting arm portion 7 which is shifted from the thin portion 21)) (see fig. 1 and 2 (d)).
Next, the structure of the thermocouple 3 attached to the heating nozzle 2 and the heating nozzle 2 to which the thermocouple 3 is attached will be described.
As shown in fig. 1 and 3, the thermocouple 3 is configured such that the tips of two types of core wires 25 are welded to each other to form a spherical temperature measuring contact (temperature measuring portion) 3a, the core wires 25 are covered with an electrically insulating core wire covering material 26, and the core wires are bundled into a single wire by being covered with an outer covering material 27 to form a lead wire 3b. In other words, the wire 3b is constituted to include the core wire 25. The diameter of the temperature measuring contact 3a and the wire diameter of the lead wire 3b are set to be smaller than the thickness of the heating nozzle 2.
In the heating tip 2, a receiving portion for the lead wire 3b is provided in a gap between the connecting arm portions 7, and a fixing portion for the temperature measuring contact 3a is provided in the soldering iron portion 6. Specifically, as shown in fig. 1 and 2 (a) and (b), the gap between the arm portions 7 extending in the longitudinal direction of the arm portions 7 is set to a width (thickness, width) one turn larger than the wire diameter of the lead wire 3b, and the lead wire 3b is housed in the lead wire housing space 30 with the upper end portion thereof open (more specifically, a portion of the lead wire 3b located near the temperature measuring contact 3 a) in a state where the lead wire 3b does not protrude outward from each of the front and rear surfaces of the heating nozzle 2). The lead wire 3b is extended from the opening 30a at the upper end of the lead wire receiving hollow portion 30, and the lower end of the lead wire receiving hollow portion 30 is expanded to communicate with the soldering iron recess 15 (see fig. 1).
In each of the arm portions 7, a notch is formed in a part of a side surface facing the wire housing hollow portion 30, stopper concave portions 31 are formed in a state of communicating with the wire housing hollow portion 30, and a wire stopper portion 32 is provided in each of the stopper concave portions 31 and a part of the wire housing hollow portion 30 (a portion located between the stopper concave portions 31) by being cured after injecting a resin such as an ultraviolet curing resin or a thermosetting resin, and the wire stopper portion 32 prevents the wire 3b from being displaced from the wire housing hollow portion 30 and protruding from the heating tip 2.
A temperature measurement fixing portion 35 to which the temperature measurement contact 3a of the thermocouple 3 is fixed is provided in a portion facing an end portion (lower end portion) of the lead wire accommodating hollow portion 30 in the soldering iron recess 15 formed in the soldering iron portion 6 so as to protrude toward the upper connecting arm portion 7 side. As shown in fig. 3, the temperature measurement fixing part 35 is a protrusion protruding from the soldering iron tip 13 through the soldering iron body 11, and is formed to be smaller than the soldering iron tip 13 by one turn. In addition, a pair of fixing contact surfaces 35a, which the temperature measuring contact 3a contacts, are provided at a portion facing the wire housing recess 30 (an upper portion of the temperature measuring fixing portion 35) so as to face an end portion of the wire housing recess 30, and a distance between the fixing contact surfaces 35a is set in a state in which the distance gradually increases from the soldering iron portion 6 side toward the wire housing recess 30 side upward. Further, the fixing contact surfaces 35a are formed in a flat surface, so that a V-shaped recess 36 is formed in the upper portion of the temperature measuring fixing portion 35 (the upper portion on the side of the lead accommodating space portion 30), and the temperature measuring contact 3a is received in the recess 36 to be in contact with the fixing contact surfaces 35a, and the temperature measuring contact 3a is fixed to the soldering iron portion 6 (the temperature measuring fixing portion 35) by soldering or the like in this state.
Next, a manufacturing procedure of the heating nozzle unit 1, particularly, an attaching procedure of the thermocouple 3 to the heating nozzle 2 will be described.
First, as shown in fig. 4 (a), the heating tip 2 and the thermocouple 3, which are individually manufactured in advance, are arranged in a state where the open port 30a of the lead wire accommodating hollow portion 30 faces the temperature measurement contact 3a, and the postures of the heating tip 2 and the thermocouple 3 are set so that the temperature measurement fixing portion 35, the lead wire accommodating hollow portion 30, the temperature measurement contact 3a, and the lead wire 3b are sequentially aligned on the same straight line. When the postures of the heating nozzle 2 and the thermocouple 3 are set, the thermocouple 3 is inserted into the opening 30a of the lead wire accommodating space 30 of the heating nozzle 2 with the temperature measuring contact point 3a as the front end. Then, the side surface of the connecting arm portion 7 serves as a guide (guide) to guide the thermocouple 3 to the soldering iron portion 6 side.
When the thermocouple 3 is inserted deeply, the temperature measuring contact 3a passes through the lead wire accommodating space 30 and then enters the soldering iron recess 15, as shown in fig. 4 (b). Here, as shown in fig. 3 (a), in the soldering iron part 6, since the temperature measurement fixing part 35 is provided at a portion facing the lower end portion (the open end portion on the soldering iron part 6 side) of the lead wire accommodating space 30 and the V-shaped fixing contact surface 35a is opposed to the end portion of the lead wire accommodating space 30, the temperature measurement contact 3a having entered the soldering iron recess 15 reaches the temperature measurement fixing part 35 and contacts (abuts) the fixing contact surface 35a. In this way, the temperature measuring contact 3a can be simply and reliably brought into contact with the fixing contact surface 35a (temperature measuring fixing portion 35). Thus, the preparation for fixing the temperature measurement contact 3a to the temperature measurement fixing portion 35 can be smoothly performed.
Further, the temperature measuring contact 3a is kept in contact with the fixing contact surface 35a by pressing the lead wire 3b toward the temperature measuring fixing part 35, and the temperature measuring contact 3a and the fixing contact surface 35a are fixed (welded) by laser welding in this state. More specifically, the fixing contact surface 35a is heated by laser light irradiation, and the temperature measuring contact 3a is melted by the heat and fixed (welded). At this time, as shown in fig. 3 (a), the temperature measurement fixing portion 35 is set in a state in which the distance between the fixing contact surfaces 35a gradually increases from the soldering iron portion 6 side toward the upper side, so that the temperature measurement contact 3a can be brought into sufficient contact with the temperature measurement fixing portion 35. Thus, the heating nozzle unit 1 can be configured to be capable of fixing the temperature measuring contact 3a to the heating nozzle 2 well and measuring the temperature well. Further, since the fixing contact surface 35a is formed as a flat surface and the temperature measuring contact 3a is formed as a spherical body, the temperature measuring contact 3a is likely to be in point contact with the fixing contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fixed contact surface 35a, stress is easily concentrated, and the temperature measuring contact 3a is less likely to float from the fixed contact surface 35a. This enables the temperature measuring contact 3a to be more favorably fixed to the heating nozzle 2, and the temperature of the heating nozzle 2 to be more favorably measured.
When the temperature measuring contact 3a is fixed to the temperature measuring fixing portion 35, as shown in fig. 4 (c), a resin such as an ultraviolet curing resin or a thermosetting resin is injected and filled into a part of the lead housing hollow portion 30 (a portion located between the stopper recesses 31) and the stopper recesses 31 in a state before curing (a flowing state), and then a resin curing treatment such as ultraviolet irradiation or heating is performed to cure the resin, thereby forming the lead stopper portions 32.
In the heating nozzle unit 1 configured by attaching the thermocouple 3 to the heating nozzle 2 in this manner, the lead wire 3b of the thermocouple 3 is accommodated in the lead wire accommodating hollow portion 30, so that the lead wire 3b of the thermocouple 3 can be prevented from exceeding the range of the plate thickness of the heating nozzle 2. Therefore, when a mounting operation of the heating nozzle unit 1 to the thermocompression bonding apparatus is performed, or when the heating nozzle unit 1 enters a working area, a defect that the lead wire 3b is inadvertently caught, or a defect that the thermocouple 3 falls off from the heating nozzle, is unlikely to occur. In addition, when the plurality of heating nozzle units 1 are to be arranged in order during transportation (shipment) or storage, the heating nozzle units 1 can be stacked stably without any trouble, and the transportation operation or the storage operation can be performed smoothly.
Further, since the lead wire receiving space 30 is provided with the lead wire stopper portion 32, it is possible to prevent the defect that the received lead wire 3b is detached from the lead wire receiving space 30. Further, since the resin injected into the lead wire accommodating space 30 and cured is used as the lead wire stopper portion 32, the resin can be easily put into the gap between the connecting arm portion 7 and the lead wire 3b as the lead wire stopper portion 32, and the lead wire 3b can be sufficiently stopped. Further, since the stopper recess 31 communicating with the wire housing space 30 is provided and the resin serving as the wire stopper portion 32 is injected into the wire housing space 30 and the stopper recess 31 and cured, the wire stopper portion 32 is less likely to come off from the wire housing space 30, and the defect that the wire 3b comes off from the wire housing space 30 together with the wire stopper portion 32 can be suppressed.
As an operation of thermocompression bonding the terminal lead a to the terminal member B using the heating tip unit 1, first, the heating tip unit 1 is mounted on the tip holder of the thermocompression bonding apparatus in a posture in which the soldering iron tip portion 13 is positioned on the lower side, and the lead 3B of the thermocouple 3 is connected to a thermocouple connection terminal (not shown) of the thermocompression bonding apparatus. Thereafter, the terminal member B and the terminal wire a are placed in an operation area (both not shown) provided below the nozzle holder, and the terminal wire a is overlapped on the upper surface of the terminal member B. When the terminal member B and the terminal lead a are mounted, the heating tip unit 1 is lowered together with the tip holder to press the soldering iron tip 13 against the terminal lead a, and the heating tip 2 is energized to heat the soldering iron body 11, thereby thermocompressively bonding the terminal lead a to the terminal member B. The temperature of the soldering iron portion 6 is measured by the thermocouple 3, and a control unit (not shown) of the thermocompression bonding apparatus controls the current supply to the heating tip 2 and further controls the temperature of the soldering iron tip portion 13 based on the measured value.
Here, in the heating tip 2 that generates heat, since the plate thickness of the iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7, even if the plate thickness of the heating tip 2 is set to be thick, it is possible to suppress a defect that the current density in the iron body 11 decreases and the heat generation becomes insufficient. Therefore, excellent heat generation efficiency can be easily achieved regardless of increase or decrease in the plate thickness of the heating nozzle 2. Further, the soldering iron body 11 or the soldering iron tip portion 13 can be cooled easily and quickly while avoiding an increase in the volume of the soldering iron body 11 and an increase in the heat capacity. Further, since the groove 20 is extended from the lower portion of the arm portion 7 to the soldering iron body 11 to form the thin portion 21, and the surface of the thin portion 21 which becomes the bottom portion of the groove 20 is set as the side surface of the soldering iron body 11, the structure of the heating tip 2 in which the plate thickness of the soldering iron body 11 is thinner than the plate thickness of the arm portion 7 can be easily realized.
Further, since the soldering iron tip portion 13 is provided so as to protrude below the thin portion 21, when foreign matter (e.g., an insulating coating of the terminal lead a) adheres to the soldering iron tip portion 13 by the thermocompression bonding operation, the foreign matter can be easily removed by grinding the tip of the soldering iron tip portion 13 or the like. Further, the polishing margin of the tip end of the soldering iron tip portion 13 can be sufficiently secured, and the replacement cycle (service life) of the heating nozzle unit can be extended. Further, since the thin portion 21 is formed on the connecting arm portion 7 side with respect to the soldering iron tip portion 13 and the thickness of the side surface of the soldering iron body 11 is formed to be thinner than the thickness of the connecting arm portion 7 after the thin portion 21 is removed, it is possible to sufficiently secure the dimension in the thickness direction of the tip surface of the soldering iron tip portion 13 while suppressing a decrease in the current density in the soldering iron body 11. This can expand the allowable range of the size of the workpiece (the object to be thermocompression bonded) to which the heating tip 2 can be thermocompression bonded. Further, since the thin portion 21 is formed at a position shifted from the soldering iron tip portion 13 and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, it is not necessary to increase or decrease the plate thickness of the soldering iron tip portion 13 with respect to the plate thickness of the connecting arm portion 7, and the heating tip 2 can be easily manufactured.
Further, since the centers of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 in the thickness direction are located on the same plane, a bending moment is less likely to occur in the heating tip 2 during the thermocompression bonding operation, and thus a defect that an excessive load is applied to the heating tip 2 and a defect that the heating tip 2 is likely to be damaged can be suppressed. Further, since the thermocouple 3 is attached to the soldering iron portion 6 of the heating nozzle 2 as a temperature sensor, information on the temperature of the soldering iron portion 6 can be acquired and applied to control of heat generation of the heating nozzle 2. Further, the temperature sensor can be realized by a simple structure.
However, in the above embodiment, the soldering iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heating tip 2 to form the thin portions 21, but the present invention is not limited to this. In short, any type of soldering iron body 11 may be provided in the heating tip 2 as long as the plate thickness of the soldering iron body 11 is set to be thinner than the plate thickness of the connecting arm portion 7 and the cross-sectional area of the soldering iron body 11 is set to be smaller than the cross-sectional area of the connecting arm portion 7. For example, the soldering iron body 11 may be configured by forming the thin portion 21 by extending a groove on either the front surface or the back surface of the heating tip 2. However, since the soldering iron body 11 is biased to be positioned on either the front or back surface of the heating tip 2 and a bending moment is generated in the heating tip 2 during the thermocompression bonding operation, it is preferable to adopt a configuration in which the centers in the thickness direction of the connecting arm portion 7, the soldering iron body 11, and the soldering iron tip portion 13 are positioned on the same plane, that is, the configuration of the above-described embodiment. The soldering iron body 11 may have a configuration including a portion having the highest resistance value (a portion serving as a heat generating portion). Therefore, the region to be thinned by the groove or the like may be formed in the connecting arm portion 7, or may not be the entire region of the soldering iron body 11.
The plate thickness of the soldering iron tip portion 13 and the plate thickness of the connecting arm portion 7 are set to the same size, but the present invention is not limited to this. For example, if the plate thickness of the soldering iron tip portion 13 is reduced and set to be thinner than the plate thickness of the connecting arm portion 7, the degree of freedom in the plate thickness dimension of the soldering iron tip portion 13 can be increased, and the heating tip 2 can be easily designed according to the size of the workpiece (the terminal member B, the terminal lead a) to be subjected to the thermocompression bonding process. As shown in fig. 3, the temperature measurement fixing part 35 is formed to be smaller than the soldering iron tip part 13 by one turn, but the present invention is not limited thereto. For example, if the volume of the soldering iron tip portion 13 is set to be equal to the volume of the temperature measurement fixing portion 35 so as to avoid an extreme difference between the heat capacity of the soldering iron tip portion 13 and the heat capacity of the temperature measurement fixing portion 35, the temperature change at the temperature measurement fixing portion 35 and the temperature change at the soldering iron tip portion 13 can be synchronized, and the temperature management of the soldering iron tip portion 13 can be easily performed by the temperature measurement of the temperature measurement fixing portion 35.
The fixing contact surface 35a of the temperature measurement fixing part 35 is formed in a flat surface, but the present invention is not limited thereto. In short, the fixing contact surfaces 35a may be formed in a curved surface as long as the distance between the fixing contact surfaces 35a is set to gradually increase from the soldering iron 6 side toward the upper side. The temperature measuring contact (temperature measuring portion) 3a is not limited to the spherical shape, and may be formed in any shape as long as it can be sufficiently brought into contact with and fixed to the contact surface 35a. The temperature measuring contact 3a of the thermocouple 3 is welded and fixed to the temperature measuring fixing portion 35, but the present invention is not limited thereto. In short, as long as the temperature of the soldering iron 6 can be measured, the fixing state of the temperature measurement contact 3a and the temperature measurement fixing portion 35 is not limited. For example, the temperature measurement contact 3a and the temperature measurement fixing portion 35 may be fixed to each other by using a fixing agent (adhesive) having good heat conductivity.
In the heating nozzle 2 of the above embodiment, the wire accommodating hollow portion 30 is configured to extend linearly along the longitudinal direction of the connecting arm portion 7, but the present invention is not limited thereto. In short, any configuration of the lead wire receiving space 30 can be applied as long as it can receive the lead wire 3b of the thermocouple 3. For example, the lead wire accommodating space 30 extending in a bent line shape or a curved line shape can be applied. Further, although a resin such as an ultraviolet curable resin or a thermosetting resin is exemplified as the lead stopper portion 32 in the present invention, the present invention is not limited thereto. In short, the state of the lead stopper portion 32 is not limited as long as the lead 3b accommodated in the lead accommodating space 30 can be stopped to prevent the lead from falling out of the lead accommodating space 30. For example, a cap (cap) that can be fitted into the wire housing space 30 may be used as the wire stopper, or a protrusion that is integrally formed on the connecting arm portion 7 and protrudes toward the wire housing space 30 may be used as the wire stopper.
Further, the stopper recess 31 communicating with the wire housing hollow 30 is formed by a shallow notch in the side surface of the wire housing hollow 30, but the present invention is not limited thereto. In short, as long as the resin as the lead wire stopper portion 32 is injected from the lead wire housing empty portion 30 to the stopper concave portion 31 and can be cured, the stopper concave portion 31 may be configured in any manner. For example, a groove-shaped stopper recess may be formed on each of the front and back surfaces of the arm portion 7, and an end portion of the stopper recess may be connected to the lead wire housing space 30 so that the resin (the lead wire stopper portion 32) may be injected from the lead wire housing space 30 to the stopper recess.
In the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measurement contact 3a of the thermocouple 3 is exemplified as the temperature measurement portion of the present invention, but the present invention is not limited thereto. In short, any temperature sensor may be used to attach to the heating tip 2 as long as the temperature sensor is capable of measuring the temperature of the soldering iron 6 and has a temperature measuring portion provided at the end of the lead wire 3b.
However, in the above embodiment, the grooves 20 are exemplified as the gouging portion of the present invention, but the present invention is not limited thereto. In short, the gouging portion may be set in any manner as long as the thin portion is formed in the heating tip by extending the gouging portion in a direction from one connecting arm portion toward the other connecting arm portion. For example, the heating nozzle 2' of the second embodiment shown in fig. 5 and 6 is basically the same as the above-described embodiment (first embodiment), and differs therefrom in that: the soldering iron body has two legs by forming a gutter portion not only on both front and back surfaces of the heating nozzle 2', but also in an intermediate portion of the heating nozzle 2' in the plate thickness direction, and branching the lower half of the heating nozzle 2' into two branches.
Specifically, in the heating nozzle 2', an iron space 40 extending in the left-right direction (the direction from one connecting arm portion 7 to the other connecting arm portion 7) is formed as a gutter portion in the middle portion in the plate thickness direction of the iron portion 6' located at the lower portion of the heating nozzle 2', and the iron space 40 is opened downward. Further, the soldering iron body 11 and the soldering iron tip portion 13 are provided on both front and back sides of the heating tip 2' with the soldering iron space portion 40 interposed therebetween. In other words, two soldering iron bodies 11 spaced apart from each other and two soldering iron tip portions 13 spaced apart from each other are provided in the soldering iron portion 6 'of the heating tip 2'. Further, each of the soldering iron bodies 11 has a groove 20 formed in the outer surface thereof and a groove 20' formed in the inner surface thereof, and is provided with a soldering iron recess 15 in which a temperature measurement fixing portion 35 is protruded, and a temperature measurement contact (temperature measurement portion) 3a of the thermocouple 3 can be fixed to each of the temperature measurement fixing portions 35, and the thickness of the soldering iron tip portion 13 is set to be thinner than the thickness of the connecting arm portion 7 at each of the soldering iron tip portions 13.
By configuring the heating tip 2 'including the soldering iron portion 6', the thermal compression bonding process can be simultaneously performed at two locations by the two soldering iron tip portions 13, and the efficiency of the thermal compression bonding operation can be improved. Further, the distance (pitch) between the two soldering iron tip portions 13 and the size of the soldering iron tip end face 13a of each soldering iron tip portion 13 can be adjusted depending on the work by setting the dimension of the soldering iron space portion 40 in the plate thickness direction.
In the above embodiment, an oxidation-resistant coating layer may be formed on the surface of the heating nozzle to improve oxidation resistance.
The oxidation-resistant coating layer will be described below.
In the heating tip, since the temperature is repeatedly raised and cooled every thermocompression bonding, the surface is easily oxidized, and particularly, the oxidation is remarkable in the vicinity of the soldering iron portion 6 (heat generating portion) and the portion to which the thermocouple 3 is soldered. Therefore, an oxidized portion in the vicinity of the heating portion peels off to reduce the strength, and a defect occurs in that the oxidized portion is broken when pressurized, and a welded portion of the thermocouple corrodes to reduce the strength, and as a result, the thermocouple is detached and cannot be used.
Therefore, in the present embodiment, the oxidation resistance is improved by forming the oxidation-resistant coating layer on the surface of the heating nozzle. Hereinafter, the production process is specifically described.
First, as a metal plate to be used as a material (base material), specifically, it is preferable to use a so-called super hard material (hardness HV900 to 2400) (formal name: super hard alloy, alloy obtained by sintering powder of hard metal carbide) which has been generally used in the past (hardness HV430 or so) and is more excellent in abrasion resistance than tungsten alloy (hardness HV200 to 400 or so), and cut a plate material of the super hard material into a predetermined shape by wire cutting. Next, the cut piece is subjected to a plating pretreatment, and then immersed in a dissolution tank and energized, thereby forming an oxidation-resistant coating layer made of nickel on the surface of the cut piece, that is, nickel plating is performed. Thereafter, the vessel is pulled up from the dissolution tank to perform post-treatment such as washing.
Further, as in the above-described embodiment, the temperature measuring contact 3a of the thermocouple 3 is laser-welded to the temperature measuring fixing portion 35. In this welding, since a coating of a nickel layer is formed on the surface (fixing contact surface 35 a) of the temperature measurement fixing portion 35, wettability is improved, and thus welding reliability and welding strength are improved. Further, if the wettability is improved during soldering, the output of laser light can be suppressed more than before, damage to the base material can be suppressed, and quality improvement and energy consumption saving can be achieved.
After the welding of the thermocouple 3 is completed, the plating pretreatment is further performed, and the heating nozzle unit 1 to which the thermocouple 3 is attached is immersed in the electrolyte, and the entire surface including the temperature measuring contact 3a of the thermocouple 3 is nickel-plated.
When the heating nozzle unit 1 manufactured in this manner is used, the oxidation resistance is improved, and therefore, peeling or strength reduction due to oxidation of the soldering iron portion 6 or the thermocouple 3 can be suppressed, and thus, the durability can be improved. In particular, when the substrate is made of an ultra-hard material and nickel plating is performed, wettability and weldability can be improved, and durability can be reliably improved. Further, since the thermocouple contains nickel as a main component, the nickel plating affinity is good. The oxidation-resistant coating is not limited to nickel plating, and may be gold plating, for example.
Moreover, the embodiments described are illustrative in all respects and should not be construed as limiting the invention. The present invention is not limited to the above description, and should be interpreted as being represented by the claims, and includes all modifications within the meaning and range equivalent to those of the claims.
Description of the reference numerals
1. Heating nozzle unit
2. 2' heating nozzle
3. Thermocouple
3a temperature measuring contact
3b conducting wire
6. 6' soldering iron part
7. Connecting arm part
11. Soldering iron body
13. Soldering iron front end
Front end face of 13a soldering iron
15. Soldering iron concave part
17. Mounting hole
20. 20' groove
21. Thin wall part
25. Core wire
26. Core wire coating material
27. Outer side coating material
30. Wire accommodating hollow part
30a open mouth
31. Stop recess
32. Wire stop
35. Temperature measuring fixing part
35a fixation contact surface
36. Groove
40. A soldering iron space portion.
The claims (modification according to treaty clause 19)
1. (modified) A plate-like heating tip for thermocompression bonding a terminal wire to a terminal member, characterized in that,
the heating nozzle is provided with:
a soldering iron portion provided with a soldering iron tip portion abutting against the terminal lead in a state of protruding downward from the soldering iron body; and
a connecting arm portion extending upward from the left and right end portions of the soldering iron body and heating the soldering iron portion by passing a current from a power supply through the soldering iron body,
the soldering iron body is set to have a plate thickness smaller than that of the connecting arm portion and a cross-sectional area smaller than that of the connecting arm portion,
the thin portion is formed by extending the notch portion in a direction from one connecting arm portion toward the other connecting arm portion in a range from a lower portion of the connecting arm portion to the soldering iron body, and a surface of the thin portion which becomes a bottom portion of the notch portion is a surface of the soldering iron body.
2. (deletion)
3. (modified) heating nozzle according to claim 1,
a soldering iron tip portion is provided so as to protrude below the thin portion.
4. (modified) heating nozzle according to claim 1,
the thin portion is formed on the connecting arm portion side of the soldering iron tip portion, and the side surface of the soldering iron body is formed to be thinner than the connecting arm portion after the thin portion is removed.
5. (modified) a heating nozzle according to claim 1 or 3,
the thin portion is formed at a position offset from the soldering iron tip portion, and the thickness of the soldering iron tip portion is set to be the same as the thickness of the connecting arm portion.
6. (modified) a heating nozzle according to claim 1 or 3,
the thin portion is formed at a position offset from the soldering iron tip portion, and the thickness of the soldering iron tip portion is set to be thinner than the thickness of the connecting arm portion.
7. (modified) heating nozzle according to any one of claims 1 and 3 to 6,
the center of each thickness direction of the connecting arm part, the soldering iron body and the soldering iron front end part is positioned on the same plane.
8. (modified) heating nozzle according to any one of claims 1 and 3 to 7,
an oxidation-resistant coating layer is formed on at least the surface of the soldering iron portion.
9. A heating nozzle according to claim 8,
the oxidation-resistant coating layer is a nickel coating.
10. (modified) a heating nozzle unit, characterized in that,
a temperature sensor is mounted on a soldering iron portion of the heating nozzle according to any one of claims 1 and 3 to 9.
11. (modified) heating nozzle unit according to claim 10,
the heating nozzle is provided with:
a soldering iron portion in which the soldering iron body is provided with the soldering iron tip portion abutting against the terminal lead;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is provided on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measurement fixing part is provided with a pair of fixing contact surfaces which are contacted with the temperature measurement part, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
Claims (11)
1. A plate-like heating nozzle for thermocompression bonding a terminal to a terminal member with a lead wire, characterized in that,
the heating nozzle is provided with:
a soldering iron portion provided with a soldering iron tip portion abutting against the terminal lead in a state of protruding downward from the soldering iron body; and
a connecting arm portion extending upward from the left and right end portions of the soldering iron body and heating the soldering iron portion by passing a current from a power source through the soldering iron body,
the soldering iron body is set to have a plate thickness smaller than that of the connecting arm portion and a cross-sectional area smaller than that of the connecting arm portion.
2. The heating nozzle as set forth in claim 1,
the thin portion is formed by extending the notch portion in a direction from one connecting arm portion toward the other connecting arm portion in a range from a lower portion of the connecting arm portion to the soldering iron body, and a surface of the thin portion which becomes a bottom portion of the notch portion is a surface of the soldering iron body.
3. The heating nozzle as claimed in claim 2,
a tip portion of a soldering iron is projected below the thin portion.
4. The heating nozzle as claimed in claim 2,
the thin portion is formed on the connecting arm portion side of the soldering iron tip portion, and the side surface of the soldering iron body is formed to be thinner than the connecting arm portion after the thin portion is removed.
5. The heating nozzle as claimed in any one of claims 2 to 4,
the thin portion is formed at a position offset from the soldering iron tip portion, and the thickness of the soldering iron tip portion is set to be the same as the thickness of the connecting arm portion.
6. The heating nozzle as claimed in any one of claims 2 to 4,
the thin portion is formed at a position offset from the soldering iron tip portion, and the thickness of the soldering iron tip portion is set to be thinner than the thickness of the connecting arm portion.
7. The heating nozzle as claimed in any one of claims 1 to 6,
the connecting arm, the soldering iron body and the center of the front end of the soldering iron in the thickness direction are positioned on the same plane.
8. The heating nozzle as claimed in any one of claims 1 to 7,
an oxidation-resistant coating layer is formed on at least the surface of the soldering iron portion.
9. A heating nozzle according to claim 8,
the oxidation-resistant coating layer is a nickel coating.
10. A heating nozzle unit, characterized in that,
a temperature sensor is mounted on a soldering iron portion of the heating nozzle defined in any one of claims 1 to 9.
11. The heating nozzle unit according to claim 1,
the heating nozzle is provided with:
a soldering iron portion in which the soldering iron body is provided with the soldering iron tip portion abutting against the terminal lead;
a pair of connecting arm portions extending upward from the left and right end portions of the soldering iron body in a state of being spaced apart from each other, and heating the soldering iron portion by passing a current from a power source through the soldering iron body; and
a temperature measuring fixing part which is arranged on the soldering iron part and is used for fixing the temperature measuring part of the temperature sensor,
the temperature measurement fixing part is provided with a pair of fixing contact surfaces which are contacted with the temperature measurement part, and the distance between the fixing contact surfaces is set to be gradually expanded from the soldering iron part side to the upper side.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-151043 | 2020-09-09 | ||
| JP2020151043A JP7137235B2 (en) | 2020-09-09 | 2020-09-09 | Heater chip and heater chip unit |
| PCT/JP2021/027194 WO2022054419A1 (en) | 2020-09-09 | 2021-07-20 | Heater chip and heater chip unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115443202A true CN115443202A (en) | 2022-12-06 |
Family
ID=80632531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180027305.XA Pending CN115443202A (en) | 2020-09-09 | 2021-07-20 | Heating nozzle and heating nozzle unit |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7137235B2 (en) |
| KR (1) | KR20220126795A (en) |
| CN (1) | CN115443202A (en) |
| MY (1) | MY196750A (en) |
| TW (1) | TW202211743A (en) |
| WO (1) | WO2022054419A1 (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586773A (en) * | 1981-06-29 | 1983-01-14 | ク−パ−・インダストリ−ズ・インコ−ポレイテツド | Leading end of iron for soldering and removing solder and production thereof |
| JP2001284781A (en) * | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | Heater chip for thermal bonding and method for manufacturing the same |
| JP2005340599A (en) * | 2004-05-28 | 2005-12-08 | Kobo Pda Co Ltd | Heater chip for wiring connection |
| US20070187366A1 (en) * | 2003-08-22 | 2007-08-16 | Tatsuya Ishii | Heater chip for thermocompression bonding |
| CN201055936Y (en) * | 2007-05-24 | 2008-05-07 | 昌钰接合科技有限公司 | Stepped pressure welding tool |
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| JP2012183552A (en) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | Heater tip, joining device, and joining method |
| CN103084694A (en) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | Hot pressure welding head, bonding apparatus, bonding method and junction structure of thin line and terminal |
| WO2017038282A1 (en) * | 2015-08-28 | 2017-03-09 | 株式会社工房Pda | Heater chip, bonding device, and bonding method |
| JP2017062945A (en) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Ｐｄａ | Heater chip, joining device and joining method |
| JP2018012200A (en) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Ｐｄａ | Heater chip, joint device and joint method |
| CN110449686A (en) * | 2018-05-08 | 2019-11-15 | 日本优尼可思股份有限公司 | The soldering iron tip of soldering iron |
| CN210677259U (en) * | 2019-08-28 | 2020-06-05 | 重庆市泓禧科技股份有限公司 | Flat cable hot pressing head and automatic tin wire drawing welding machine |
-
2020
- 2020-09-09 JP JP2020151043A patent/JP7137235B2/en active Active
-
2021
- 2021-07-20 WO PCT/JP2021/027194 patent/WO2022054419A1/en active Application Filing
- 2021-07-20 MY MYPI2022004864A patent/MY196750A/en unknown
- 2021-07-20 KR KR1020227030262A patent/KR20220126795A/en not_active Application Discontinuation
- 2021-07-20 CN CN202180027305.XA patent/CN115443202A/en active Pending
- 2021-09-06 TW TW110133047A patent/TW202211743A/en unknown
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS586773A (en) * | 1981-06-29 | 1983-01-14 | ク−パ−・インダストリ−ズ・インコ−ポレイテツド | Leading end of iron for soldering and removing solder and production thereof |
| JP2001284781A (en) * | 2000-03-30 | 2001-10-12 | Taiyo Yuden Co Ltd | Heater chip for thermal bonding and method for manufacturing the same |
| US20070187366A1 (en) * | 2003-08-22 | 2007-08-16 | Tatsuya Ishii | Heater chip for thermocompression bonding |
| JP2005340599A (en) * | 2004-05-28 | 2005-12-08 | Kobo Pda Co Ltd | Heater chip for wiring connection |
| CN201055936Y (en) * | 2007-05-24 | 2008-05-07 | 昌钰接合科技有限公司 | Stepped pressure welding tool |
| JP2010253503A (en) * | 2009-04-23 | 2010-11-11 | Miyachi Technos Corp | Heater chip and joining apparatus |
| JP2011000639A (en) * | 2009-05-19 | 2011-01-06 | Miyachi Technos Corp | Heater chip and welding device |
| JP2012183552A (en) * | 2011-03-04 | 2012-09-27 | Miyachi Technos Corp | Heater tip, joining device, and joining method |
| CN103084694A (en) * | 2011-10-21 | 2013-05-08 | 株式会社工房Pda | Hot pressure welding head, bonding apparatus, bonding method and junction structure of thin line and terminal |
| WO2017038282A1 (en) * | 2015-08-28 | 2017-03-09 | 株式会社工房Pda | Heater chip, bonding device, and bonding method |
| CN107848063A (en) * | 2015-08-28 | 2018-03-27 | 株式会社工房Pda | Heat chip, coupling apparatus and associated methods |
| JP2017062945A (en) * | 2015-09-25 | 2017-03-30 | 株式会社 工房Ｐｄａ | Heater chip, joining device and joining method |
| JP2018012200A (en) * | 2016-07-19 | 2018-01-25 | 株式会社 工房Ｐｄａ | Heater chip, joint device and joint method |
| CN110449686A (en) * | 2018-05-08 | 2019-11-15 | 日本优尼可思股份有限公司 | The soldering iron tip of soldering iron |
| CN210677259U (en) * | 2019-08-28 | 2020-06-05 | 重庆市泓禧科技股份有限公司 | Flat cable hot pressing head and automatic tin wire drawing welding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7137235B2 (en) | 2022-09-14 |
| JP2022045442A (en) | 2022-03-22 |
| TW202211743A (en) | 2022-03-16 |
| KR20220126795A (en) | 2022-09-16 |
| WO2022054419A1 (en) | 2022-03-17 |
| MY196750A (en) | 2023-05-03 |
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