JP6074890B2 - Circuit board with conducting wire and manufacturing method thereof - Google Patents

Circuit board with conducting wire and manufacturing method thereof Download PDF

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JP6074890B2
JP6074890B2 JP2012028188A JP2012028188A JP6074890B2 JP 6074890 B2 JP6074890 B2 JP 6074890B2 JP 2012028188 A JP2012028188 A JP 2012028188A JP 2012028188 A JP2012028188 A JP 2012028188A JP 6074890 B2 JP6074890 B2 JP 6074890B2
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wire
heat
welding
circuit board
insulating substrate
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優 村田
優 村田
幸治 安藤
幸治 安藤
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Denso Corp
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Description

本発明は、高温環境下で使用されるセンサやアクチュエータ、又は、発熱を伴うセンサやアクチュエータを制御すべく、ロウ濡れ性やハンダ濡れ性の悪い耐熱性導線が接続された導線付き回路基板とその製造方法に関する。   The present invention relates to a circuit board with a lead wire to which a heat-resistant lead wire having poor solder wettability or solder wettability is connected in order to control a sensor or actuator used in a high temperature environment, or a sensor or actuator that generates heat, and its circuit board. It relates to a manufacturing method.

近年、自動車エンジン等の内燃機関や一般産業機器の制御において高性能化が進み、様々なセンサやアクチュエータが用いられるようになっており、センサやアクチュエータとそれを制御するための回路基板との接続における信頼性の向上が重要視されている。   In recent years, high performance has been advanced in the control of internal combustion engines such as automobile engines and general industrial equipment, and various sensors and actuators have been used, and connections between sensors and actuators and circuit boards for controlling them have been used. Improving the reliability in Japan is regarded as important.

特許文献１には、プリント配線基板と、該プリント配線基板に接続されかつワイヤハーネスを構成する１以上のケーブルと、該プリント配線基板及び該プリント配線基板と接続された該ケーブルの端部とが一体化して埋め込まれた樹脂構造体とを備え、該ケーブルは該樹脂構造体から各別に引き出され、該ワイヤハーネスと一体化されたことを特徴とする電子ユニットが開示されている。
特許文献１にあるような、従来の回路基板においては、ワイヤハーネスが、プリント基板の導体部に直接ハンダ付けされたり、プリント基板に予め接続されたコネクタと嵌合するコネクタを介して間接的に接続されたりしている。 Patent Document 1 includes a printed wiring board, one or more cables connected to the printed wiring board and constituting a wire harness, and the printed wiring board and an end portion of the cable connected to the printed wiring board. There is disclosed an electronic unit comprising a resin structure integrated and embedded, wherein the cables are separately drawn from the resin structure and integrated with the wire harness.
In the conventional circuit board as disclosed in Patent Document 1, the wire harness is soldered directly to the conductor portion of the printed circuit board or indirectly through a connector that is fitted to a connector that is connected in advance to the printed circuit board. It is connected.

一方、エンジン冷却水温、吸気温度、燃焼排気温度等を測定する温度センサや、酸素センサ、空燃比センサ、ＮＯｘセンサ、アンモニアセンサ、ＰＭセンサ等の燃焼排気を被測定ガスとして、被測定ガス中に含まれる特定成分の濃度を検出するガスセンサ等の検出部は、エンジンルーム内や、排気流路等、比較的高温に晒される環境に設けられ、これらのセンサを制御する回路基板は、検出結果の安定化を図るために高温に晒されない比較的安定した温度環境に載置するのが望ましく、検出部とは別体に設けられ、検出部と耐熱性導線を介して接続されている。
また、グロープラグやヒータ等のアクチュエータは、高温環境に晒されるだけでなく、それ自身が発熱するため、このような発熱を伴うアクチュエータと回路基板との接続にも耐熱性導線を用いる必要がある。
このような耐熱性導線には、２００℃以上の高温に対する耐熱性が要求され、例えば、導電性の高い軟銅線と耐熱性の高いステンレス線とを撚り線とした耐熱性芯線や、導電性の高い銅線に耐熱性を向上させるためのニッケルメッキ等を施して撚り線とした耐熱性芯線等を、例えば、フッ素ゴム、シリコーンゴム、ポリイミド、架橋ポリエチレン、架橋塩化ビニル、ガラス繊維等の耐熱性の絶縁被覆で覆ったものが用いられている。 On the other hand, temperature sensors that measure engine coolant temperature, intake air temperature, combustion exhaust gas temperature, etc., and combustion exhaust gases such as oxygen sensors, air-fuel ratio sensors, NOx sensors, ammonia sensors, PM sensors, etc. A detection unit such as a gas sensor for detecting the concentration of a specific component contained is provided in an environment exposed to a relatively high temperature, such as in an engine room or an exhaust passage, and the circuit board that controls these sensors In order to stabilize, it is desirable to place it in a relatively stable temperature environment that is not exposed to high temperatures, and it is provided separately from the detector and is connected to the detector via a heat-resistant conductive wire.
In addition, an actuator such as a glow plug or a heater is not only exposed to a high temperature environment, but also generates heat. Therefore, it is necessary to use a heat-resistant conductive wire for the connection between the actuator that generates such heat and the circuit board. .
Such a heat-resistant conductive wire is required to have heat resistance against a high temperature of 200 ° C. or higher. For example, a heat-resistant core wire made of a highly conductive annealed copper wire and a highly heat-resistant stainless steel wire, Heat-resistant core wires, etc. made of stranded wires by applying nickel plating to improve heat resistance on high copper wires, for example, heat resistance of fluorine rubber, silicone rubber, polyimide, crosslinked polyethylene, crosslinked vinyl chloride, glass fiber, etc. The one covered with an insulating coating is used.

ところが、このような耐熱性芯線は、ハンダ濡れ性が悪く、回路基板の電極部やコネクタに直接ハンダ付けによって固定することが困難である。
このため、このようなハンダ濡れ性の悪い耐熱性導線と回路基板との接続には、特許文献２にあるように、予め、耐熱性芯線の端末部に金属製の圧着端子を圧着固定した後、回路基板に圧着端子の端末部を挿入し、ハンダ付けやロウ付け等により回路基板上に形成された電極部と接続することによって行われている。 However, such a heat-resistant core wire has poor solder wettability, and is difficult to fix directly to the electrode part or connector of the circuit board by soldering.
For this reason, after connecting a crimp terminal made of metal to a terminal portion of a heat resistant core wire in advance, as described in Patent Document 2, for connection between such a heat resistant lead wire having poor solder wettability and a circuit board. The terminal part of the crimp terminal is inserted into the circuit board and connected to the electrode part formed on the circuit board by soldering or brazing.

しかし、耐熱性芯線の接続された状態の圧着端子を回路基板に挿入固定する作業を自動化するのは容易ではない。
一方、予め、圧着端子を制御回路に実装した後、耐熱性導線を圧着しようとすると、複数の耐熱性導線を接続するには、複数の耐熱性導線間に圧着作業を行うためのスペースが必要となり、回路基板の体格が増大する虞がある。
さらに、圧着端子と耐熱性芯線との密着性が不十分であると接触抵抗が大きくなり、センサの検出精度の低下やアクチュエータの制御精度の低下を招く虞がある。 However, it is not easy to automate the work of inserting and fixing the crimp terminal with the heat-resistant core wire connected to the circuit board.
On the other hand, if a heat-resistant conductor is to be crimped after mounting a crimp terminal in the control circuit in advance, a space is required to perform crimping work between the plurality of heat-resistant conductors in order to connect multiple heat-resistant conductors. Thus, the physique of the circuit board may increase.
Furthermore, if the adhesiveness between the crimp terminal and the heat-resistant core wire is insufficient, the contact resistance increases, which may lead to a decrease in sensor detection accuracy and a decrease in actuator control accuracy.

また、特許文献３には、異種の金属材料からなる端子と電線とを接続する際に発生するガルバニック腐食を防止し、低コスト、かつ、優れた接続強度及び接続抵抗を有する端子付き電線の接続方法として、圧着端子に導電防食層を設けた上で、電線と超音波溶接によって一体化する方法が開示されている。   Patent Document 3 discloses a connection of a terminal-attached electric wire that prevents galvanic corrosion that occurs when connecting a terminal made of a different metal material and an electric wire, has low connection cost, and has excellent connection strength and connection resistance. As a method, a method is disclosed in which a conductive anticorrosion layer is provided on a crimp terminal and then integrated with an electric wire by ultrasonic welding.

ところが、超音波溶接によって異種の金属材料を含む電線を直接、回路基板の電極部に接続するためには、回路基板を挟んだ状態で、電線と電極部とを加圧しながら超音波振動を加えることになり、回路基板に用いられているガラスエポキシ樹脂などの絶縁性基板に超音波振動が吸収され溶接が困難であった。   However, in order to directly connect an electric wire containing a different metal material to the electrode part of the circuit board by ultrasonic welding, an ultrasonic vibration is applied while pressing the electric wire and the electrode part with the circuit board sandwiched therebetween. As a result, the ultrasonic vibration was absorbed by an insulating substrate such as a glass epoxy resin used for the circuit board, and welding was difficult.

そこで、本発明は、かかる実情に鑑み、ロウ濡れ性の悪い耐熱性導線と回路基板との接続に当たり、圧着端子を必要としない簡易な構成で、しかも、溶接による高い接合強度と高い導通信頼性を備えた導線付き回路基板と、標準化、自動化が容易な導線付き回路基板の製造方法とを提供することを目的とする。   Therefore, in view of such circumstances, the present invention has a simple configuration that does not require a crimp terminal for connection between a heat-resistant lead wire having poor solderability and a circuit board, and has high bonding strength and high conduction reliability by welding. And a method for manufacturing a circuit board with a conductor that can be easily standardized and automated.

請求項１の発明では、
回路配線部（１２１、２２１、３２１）と電極部（１２０、２２０、３２０）とからなる導体部（１２、２２、３２）と、該導体部（１２、２２、３２）を形成した絶縁性基板（１０）と、該絶縁性基板（１０）に実装した回路部品（１６）と、上記電極部（１２０、２２０、３２０）と外部との接続を図る導線（１５）とを含む導線付き回路基板（１、２、３）であって、
上記導線（１５）は、錫メッキ又はニッケルメッキを施した軟銅線、ニッケルメッキを施した軟銅線とステンレス線とからなる線、ステンレス線、及びアルミニウム線のうちのいずれかである耐熱性芯線（１５０）と、該耐熱性芯線（１５０）を覆う耐熱性絶縁被覆（１５１）とを有し、
上記絶縁性基板（１０）には、
銅、ニッケル、ニッケル合金（Ｎｉ／ＳＵＳ／Ｎｉクラッド鋼）、４２アロイ（鉄ニッケル合金）、黄銅、青銅、及びニッケル・銅・パラジウム・銀・錫・白金・金のメッキを施した鋼材のうちのいずれかの金属材料からなる金属片端子部（１４、２４、３４）が、上記電極部（１２０、２２０、３２０）にロウ接手段（１３）を介して固定されており、
上記耐熱性芯線（１５０）の上記耐熱性絶縁被覆（１５１）を有さない端末部と、上記金属片端子部（１４、２４、３４）を溶接固定した溶接部（ＰＷＬＤ）に直交する方向の溶接軸（ＡＸＷＬＤ）上に上記絶縁性基板（１０）が存在しないように上記絶縁性基板（１０）の外周縁の一部を内側に向かって切り欠いた基板切り欠き部（１１）が設けられ、
上記金属片端子部（１４、２４、３４）と上記絶縁性基板（１０）に囲まれた、上記基板切り欠き部（１１）の内側の空間において、上記耐熱性絶縁被覆（１５１）の先端が上記絶縁性基板（１０）の外周縁より内側に引き込まれた状態で、上記端末部が溶接固定されていることを特徴とする。 In the invention of claim 1,
Conductor portions (12, 22, 32 ) composed of circuit wiring portions (121, 221, 321) and electrode portions (120, 220, 320 ) and the conductor portions (12, 22, 32 ) were formed. An insulating substrate (10 ) , a circuit component (16) mounted on the insulating substrate (10 ) , and a lead wire ( 15) for connecting the electrode portions (120, 220, 320 ) to the outside A circuit board (1, 2, 3) with a conductor including
The conducting wire ( 15) is a heat-resistant core wire which is one of a annealed copper wire subjected to tin plating or nickel plating, a wire composed of annealed copper wire subjected to nickel plating and a stainless wire, a stainless steel wire, and an aluminum wire. (150) and a heat resistant insulation coating (151) covering the heat resistant core wire (150),
The insulating substrate (10 ) includes
Among steel materials plated with copper, nickel, nickel alloy (Ni / SUS / Ni clad steel), 42 alloy (iron nickel alloy) , brass, bronze, nickel, copper, palladium, silver, tin, platinum, gold metal piece terminal part consisting of either a metal material (14,24,3 4) are fixed via the brazing means (13) to the electrode unit (120,220,32 0)
The end portion of the heat-resistant core wire (150) not having the heat-resistant insulating coating (151) is orthogonal to the welded portion (P WLD ) where the metal piece terminal portions (14, 24, 34 ) are fixed by welding. direction of the welding axis (AX WLD) the insulating substrate (1 0) is the substrate cutout a portion of the outer peripheral edge was notched toward the inside of the insulating substrate so as not to exist (1 0) on ( 1 1) is provided,
In the space inside the substrate notch ( 11) surrounded by the metal piece terminal portions (14, 24, 34 ) and the insulating substrate (10 ) , the heat-resistant insulating coating (151) The terminal portion is welded and fixed in a state in which the front end is drawn inward from the outer peripheral edge of the insulating substrate (10) .

請求項２の発明では、上記ロウ接手段が、軟ロウであるハンダ、又は、硬ロウである銅ロウ、又は、銀ロウのいずれかである。 In the invention of claim 2, the brazing means is either solder that is soft solder, copper solder that is hard solder, or silver solder.

請求項３の発明では、上記耐熱性芯線（１５０）は撚り線である。 In the invention of claim 3, the heat-resistant core wire (150 ) is a stranded wire.

請求項４の発明では、上記耐熱性絶縁被覆が、フッ素ゴム、フッ素樹脂、シリコーンゴム、シリコーン樹脂、ポリイミド、架橋ポリエチレン、架橋塩化ビニル、ガラス繊維のいずれかである。 In the invention of claim 4, the heat-resistant insulating coating is any one of fluorine rubber, fluorine resin, silicone rubber, silicone resin, polyimide, crosslinked polyethylene, crosslinked vinyl chloride, and glass fiber.

請求項５の発明では、請求項１ないし４のいずれか記載の回路基板の製造方法であって、少なくとも、上記回路配線部と電極部とからなる導体部を形成した上記絶縁性基板の実装面に、上記回路部品と上記金属片端子部とを実装する実装工程と、上記溶接軸（ＡＸＷＬＤ）上に上記絶縁性基板（１０）が存在しない位置において上記金属片端子部（１４、２４、３４）と上記耐熱性芯線（１５０）の端末部とを接合する端子接合工程を具備する。 According to a fifth aspect of the present invention, there is provided a method for manufacturing a circuit board according to any one of the first to fourth aspects, wherein the insulating substrate is mounted on at least a conductor portion composed of the circuit wiring portion and the electrode portion. In addition, the mounting step of mounting the circuit component and the metal piece terminal portion, and the metal piece terminal portion (14, 24 ) at a position where the insulating substrate (10 ) does not exist on the welding shaft (AX WLD ). 34 ) and the terminal joining process which joins the terminal part of the said heat resistant core wire (150).

請求項６の発明では、上記端子接合工程で用いられる接合手段が、超音波溶接（ＵＳＷ）、抵抗溶接（ＲＷ）、又は、レーザ溶接（ＬＷ）のいずれかである。 In invention of Claim 6, the joining means used at the said terminal joining process is either ultrasonic welding (USW), resistance welding (RW), or laser welding (LW).

本発明の回路基板では、上記金属片端子部と上記耐熱性芯線の端末部とが、圧着端子を用いることなく溶接によって接合されているので、原子、分子レベルで両者が結合しており、回路基板と外部との接続を図る導線とが高い接合強度で接続されており、高い導通信頼性を発揮できる。   In the circuit board of the present invention, since the metal piece terminal portion and the end portion of the heat-resistant core wire are joined by welding without using a crimp terminal, both are bonded at the atomic and molecular level, and the circuit The conductive wire for connecting the substrate and the outside is connected with high bonding strength, and high conduction reliability can be exhibited.

一方、本発明の回路基板の製造方法では、上記金属片端子部と上記耐熱性芯線との接続に際して、圧着端子を使用していないので複雑なハンドリングが必要となる圧着工程が不要となり、また、上記金属片端子部と上記耐熱性芯線の端末部とが溶接軸方向に上記絶縁性基板が存在しない位置において溶接される。
溶接手段として、超音波溶接を用いた場合には、溶接部を形成する際の加圧軸方向に絶縁性基板が介在せず、溶接チップとアンビルとで金属片端子部と耐熱性芯線の端末部とを挟み込んで超音波振動を加えることが出来るため、上記絶縁性基板によって振動が吸収されることがない。 On the other hand, in the method of manufacturing a circuit board according to the present invention, a crimping step that requires complicated handling is not required because a crimp terminal is not used when connecting the metal piece terminal portion and the heat-resistant core wire, The metal piece terminal portion and the end portion of the heat-resistant core wire are welded at a position where the insulating substrate does not exist in the welding axis direction.
When ultrasonic welding is used as a welding means, an insulating substrate is not interposed in the direction of the pressure axis when forming the welded portion, and the metal piece terminal portion and the end of the heat resistant core wire between the welding tip and the anvil. Since the ultrasonic vibration can be applied with the portion sandwiched, the insulating substrate does not absorb the vibration.

また、耐熱性導線を、上記絶縁性基板の外部方向からスライドさせ、耐熱性芯線の端末部を金属片端子部の表面に移動させ、上記絶縁性基板の上下方向から超音波溶接機の溶接チップ及びアンビルで挟み込むようにして溶接作業を行うことができるので、動作が単純で自動化が極めて容易である。
この際、上記絶縁性基板と上記金属片端子部の段差を利用することで上記耐熱芯線がバラバラにならず纏まるため作業性が向上し、専用の治具等も不要とすることができる。 Further, the heat-resistant conductive wire is slid from the outside direction of the insulating substrate, the end portion of the heat-resistant core wire is moved to the surface of the metal piece terminal portion, and the welding tip of the ultrasonic welding machine is moved from the vertical direction of the insulating substrate. Since the welding operation can be performed so as to be sandwiched by the anvil, the operation is simple and automation is extremely easy.
At this time, by using the step between the insulating substrate and the metal piece terminal portion, the heat-resistant core wires are gathered together without being separated, so that workability is improved and a dedicated jig or the like can be dispensed with.

溶接手段として、抵抗溶接（ＲＷ）を用いた場合には、上記金属片端子部と上記耐熱性芯線の端末部とを溶接する際に溶接部の溶接軸方向に上記絶縁性基板存在しないので、上記溶接軸方向の両側から、上記金属片端子部と上記耐熱性芯線の端末部とを挟み込むようにして一対の電極を移動させ溶接を行うことが可能で、自動化も極めて容易である。
加えて、上下方向から一対の電極で挟み込むことによって、溶接の出来栄え（接合強度）が安定する効果も発揮される。 When resistance welding (RW) is used as a welding means, since the insulating substrate does not exist in the weld axis direction of the welded portion when welding the metal piece terminal portion and the end portion of the heat resistant core wire, It is possible to perform welding by moving a pair of electrodes so as to sandwich the metal piece terminal portion and the end portion of the heat-resistant core wire from both sides in the welding axis direction, and automation is extremely easy.
In addition, by sandwiching between the pair of electrodes from above and below, the effect of stabilizing the welding performance (joining strength) is also exhibited.

溶接手段として、レーザ溶接（ＬＷ）を用いた場合には、上記金属片端子部と耐熱性芯線との溶接部の溶接軸方向に絶縁性基板が存在しない位置において溶接されるので、耐熱性芯線として、電導率の高い銅線に耐熱性の高いニッケルメッキを施した耐熱性導体を撚り線としたものや、アルミニウム等が用いられていても、溶接部となる部分の周囲に損傷を受ける基板が存在しないため、溶融温度の高い耐熱性導体を芯線として用いた耐熱性芯線を溶接できる程度の比較的高い出力のレーザ光を用いて溶接を行うことができ、自動化も容易である。   When laser welding (LW) is used as a welding means, the welding is performed at a position where no insulating substrate exists in the welding axis direction of the welded portion between the metal piece terminal portion and the heat resistant core wire. As a heat-resistant conductor made of high-conductivity copper wire with high heat-resistant nickel plating, or a substrate that is damaged around the portion to be welded even if aluminum is used Therefore, welding can be performed using a laser beam having a relatively high output that can weld a heat-resistant core wire using a heat-resistant conductor having a high melting temperature as a core wire, and automation is also easy.

本発明の第１の実施形態における回路基板の概要を示し、（ａ）は、上面図、（ｂ）は断面図、（ｃ）は、要部拡大断面図、（ｄ）は、下面図。BRIEF DESCRIPTION OF THE DRAWINGS The outline | summary of the circuit board in the 1st Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing, (c) is a principal part expanded sectional view, (d) is a bottom view. 図１の回路基板の製造方法について（ａ）〜（ｃ）の順を追って説明するための斜視図。The perspective view for demonstrating later on in order of the manufacturing method of the circuit board of FIG. 1 (a)-(c). 図１の回路基板を用いた回路パケージモジュールの一例を示す透過斜視図。FIG. 2 is a transparent perspective view showing an example of a circuit package module using the circuit board of FIG. 1. （ａ）、（ｂ）の順を追って、図３に続く工程を説明するための要部断面図。Sectional drawing for demonstrating the process following FIG. 3 in order of (a) and (b). 本発明の第２の実施形態における回路基板の概要を示し、（ａ）は、上面図、（ｂ）は断面図、（ｃ）は、下面図。The outline | summary of the circuit board in the 2nd Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing, (c) is a bottom view. 本発明の第３の実施形態における回路基板の概要を示し、（ａ）は、上面図、（ｂ）は断面図、（ｃ）は、下面図。The outline | summary of the circuit board in the 3rd Embodiment of this invention is shown, (a) is a top view, (b) is sectional drawing, (c) is a bottom view. 本発明の参考形態である第４、第５の形態における回路基板の概要を示し、（ａ−１）、（ｂ−１）は、斜視図、(ａ―２)、（ａ―３）、（ｂ−２）、（ｂ−３）は、断面図。The fourth is a reference embodiment of the present invention, an overview of the circuit board in the fifth embodiment, (a-1), ( b-1) is a perspective view, (a-2), ( a-3), (B-2) and (b-3) are sectional views. 本発明の参考形態である第６、第７の形態における回路基板の概要を示し、（ａ−１）、（ｂ−１）は、斜視図、(ａ―２)、（ａ―３）、（ｂ−２）、（ｂ−３）は、断面図。The outline | summary of the circuit board in the 6th, 7th form which is a reference form of this invention is shown, (a-1), (b-1) is a perspective view, (a-2), (a-3), (B-2) and (b-3) are sectional views. 本発明の適用し得る他の溶接手段を示し、（ａ）は、抵抗溶接機を用いた場合の断面図、（ｃ）は、レーザ溶接機を用いた場合の断面図。The other welding means which can apply this invention are shown, (a) is sectional drawing at the time of using a resistance welding machine, (c) is sectional drawing at the time of using a laser welding machine.

図１〜３を参照して、本発明の第１の実施形態における導線付き回路基板１（以下、適宜、回路基板１と称する。）について説明する。なお、本発明において、特に制御回路の機能を限定するものではなく、高温環境下に晒されるセンサの制御や、発熱体等の温度上昇を伴うアクチュエータの制御など、被制御部との接続に２００℃以上の高耐熱性を必要としロウ濡れ性の悪い耐熱性芯線１５０を耐熱性絶縁被覆１５１で覆った耐熱性導線１５が外部との接続に用いられる導線付き回路基板に適宜採用し得るものである。
また、本発明の導線付き回路基板の製造方法については、各実施形態の説明とあわせて適宜説明する。 With reference to FIGS. 1-3, the circuit board 1 with a conducting wire in the 1st Embodiment of this invention (henceforth the circuit board 1 is suitably called) is demonstrated. In the present invention, the function of the control circuit is not particularly limited, and connection to a controlled part such as control of a sensor exposed to a high temperature environment or control of an actuator accompanying a temperature rise of a heating element or the like is 200. A heat-resistant conductor 15 in which a heat-resistant core wire 150 having a high heat resistance of at least ° C. and having poor wettability is covered with a heat-resistant insulating coating 151 can be suitably adopted for a circuit board with a conductor used for connection to the outside. is there.
Moreover, about the manufacturing method of the circuit board with a conducting wire of this invention, it demonstrates suitably with description of each embodiment.

回路基板１は、絶縁性基板１０に所定の配線パターンが形成された回路配線部１２１と電極部１２０とからなる導体部１２が形成され、抵抗、コンデンサ、コイル等の受動部品及び制御ＩＣ、半導体等の能動部品からなる所定の回路部品１６が実装されている。
電極部１２０には、ロウ接手段１３を用いてロウ濡れ性の良い金属片端子部１４がロウ接されている。
なお、ロウ濡れ性が良いとは、ロウ材を加熱したときに、母材となる電極部１２０、又は、金属片端子部１４をできるだけ溶融することなく濡れ広がる状態をいう。
ロウ接手段１３には、軟ロウであるハンダ、又は、硬ロウである銀ロウ、銅ロウのいずれのロウ材を用いても良い。
ただし、硬ロウを用いる場合には、ロウ材の溶融温度が高くなるので、回路基板１の耐熱性を考慮して、電極部１２０が絶縁性基板１０から剥がれてしまうような場合には、比較的低い温度で濡れ広がるハンダを用いるのが望ましい。
ロウ接用の金属片端子部１４には、ロウ濡れ性の悪い耐熱性導芯線１５０の端末部が後述する溶接手段によって溶接固定されている。
絶縁性基板１０は、ガラスエポキシ樹脂、セラミックス等の公知の絶縁性材料が用いられている。
また、絶縁性基板１０は、基板内部に回路を設けた、いわゆる、多層基板であっても良い。 The circuit board 1 is formed with a conductor part 12 including a circuit wiring part 121 having a predetermined wiring pattern formed on an insulating substrate 10 and an electrode part 120, a passive component such as a resistor, a capacitor, and a coil, a control IC, and a semiconductor. A predetermined circuit component 16 made of an active component such as is mounted.
The electrode part 120 is brazed with the metal piece terminal part 14 having good wettability using the brazing means 13.
The term “better wettability” means a state in which the electrode part 120 or the metal piece terminal part 14 serving as a base material is wetted and spread as much as possible when the brazing material is heated.
For the brazing means 13, any solder such as solder that is soft solder, silver solder that is hard solder, or copper solder may be used.
However, in the case of using a hard solder, the melting temperature of the brazing material becomes high. Therefore, in consideration of the heat resistance of the circuit board 1, the case where the electrode part 120 is peeled off from the insulating substrate 10 is compared. It is desirable to use solder that spreads out at low temperatures.
A terminal portion of a heat-resistant lead wire 150 having poor solderability is welded and fixed to the brazing metal piece terminal portion 14 by welding means described later.
The insulating substrate 10 is made of a known insulating material such as glass epoxy resin or ceramic.
The insulating substrate 10 may be a so-called multilayer substrate in which a circuit is provided inside the substrate.

本実施形態においては、耐熱性芯線１５０の端末部を溶接固定した溶接部ＰＷＬＤに直交する方向の溶接軸ＡＸＷＬＤ上に絶縁性基板１０が存在しないように、絶縁性基板１０の外周縁端部には、図１（ｂ）、（ｃ）、（ｄ）、図２に示すように、絶縁性基板１０の外周縁の一部を内側に向かって切り欠いた基板切り欠き部１１が形成されている。
図１（ｄ）及び、図２（ａ）に示すように、導体部１２の端末に形成された電極部１２０は、切り欠き部１１の周囲に設けられ、略コ字形に形成されている。
なお、本実施形態においては、切り欠き部１１の端縁との間に一定の間隙を設けてその周囲を覆うように、略コ字形に形成した例を示したが、電極部１２０は、必ずしも、電極部１２０と切り欠き部１１の端縁との間に隙間を設ける必要はなく切り欠き部１１の端縁まで引き伸ばしても良い。
さらに、図１（ｃ）、図２（ａ）に示すように、ロウ接手段１３を介して、略平板状の金属片端子部１４が実装され、金属片端子部１４の２辺、又は、３辺が絶縁性基板１０の実装面に形成された電極部１２０に固定されている。
本実施形態においては、ロウ接手段１３が、電極部１２０の全面を覆うような略コ字形に設けた例を示したが、ロウ接手段１３は必ずしも、電極部１２０の全面を覆う必要はなく、金属片端子部１４と電極部１２０との十分な接合強度が発揮できれば、電極部１２０の複数個所を部分的に覆うように矩形状に形成して、複数個所に配設しても良い。
金属片端子部１４は、回路部品１６と同様にチップマウンタ、ハンダリフロー等の公知の実装手段を用いた実装工程において絶縁性基板１０上に容易に実装し、固定することが可能である。
なお、金属片端子部１４には、方向性（上下・左右・表裏）がないので極めて容易に実装することができる。
金属片端子部１４には、銅、ニッケル、ニッケル合金（Ｎｉ／ＳＵＳ／Ｎｉクラッド鋼等）、４１アロイ（鉄ニッケル合金）、黄銅、青銅、ニッケル・銅・パラジウム・銀・錫・白金・金等のメッキを施した鋼材等のハンダ濡れ性、ロウ濡れ性の良い材料が用いられている。 In the present embodiment, the outer peripheral edge of the insulating substrate 10 is such that the insulating substrate 10 does not exist on the welding axis AX WLD in the direction orthogonal to the welded portion P WLD where the end portion of the heat resistant core wire 150 is welded and fixed. As shown in FIGS. 1 (b), (c), (d), and FIG. 2, a substrate cutout portion 11 is formed in the portion by cutting out a part of the outer peripheral edge of the insulating substrate 10 inward. Has been.
As shown in FIG. 1D and FIG. 2A, the electrode part 120 formed at the end of the conductor part 12 is provided around the notch part 11 and is formed in a substantially U-shape.
In the present embodiment, an example in which a constant gap is provided between the cutout portion 11 and the periphery thereof is provided so as to cover the periphery of the cutout portion 11 is shown. In addition, it is not necessary to provide a gap between the electrode part 120 and the edge of the notch part 11, and the electrode part 120 may be extended to the edge of the notch part 11.
Furthermore, as shown in FIG. 1C and FIG. 2A, a substantially flat metal piece terminal portion 14 is mounted via the brazing means 13, and two sides of the metal piece terminal portion 14 or Three sides are fixed to the electrode part 120 formed on the mounting surface of the insulating substrate 10.
In the present embodiment, the brazing means 13 is provided in a substantially U shape so as to cover the entire surface of the electrode part 120. However, the brazing means 13 does not necessarily need to cover the entire surface of the electrode part 120. As long as sufficient bonding strength between the metal piece terminal portion 14 and the electrode portion 120 can be exhibited, the metal piece terminal portion 14 may be formed in a rectangular shape so as to partially cover the plurality of portions of the electrode portion 120 and may be disposed at the plurality of portions.
Similarly to the circuit component 16, the metal piece terminal portion 14 can be easily mounted and fixed on the insulating substrate 10 in a mounting process using a known mounting means such as a chip mounter or solder reflow.
In addition, since the metal piece terminal part 14 does not have directionality (up and down, left and right, front and back), it can be mounted very easily.
For the metal piece terminal portion 14, copper, nickel, nickel alloy (Ni / SUS / Ni clad steel, etc.), 41 alloy (iron nickel alloy), brass, bronze, nickel, copper, palladium, silver, tin, platinum, gold A material having good solder wettability and solder wettability such as a steel material plated with the above is used.

金属片端子部１４の一方の表面が、図１（ｃ）、図２（ｂ）に示すように、基板切り欠き部１１から露出し、その表面に導線１５の耐熱性芯線の端末部１５０が後述する溶接手段を用いた端子溶接工程において溶接固定されている。
導線１５は、例えば、導電性の高い銅線と耐熱性の高いステンレス線とを撚り線としたものや、導電性の高い軟銅線に耐熱性を向上させるための錫メッキやニッケルメッキ等を施して撚り線としたものを耐熱性芯線１５０とし、フッ素ゴム、フッ素樹脂、シリコーンゴム、シリコーン樹脂、ポリイミド、架橋ポリエチレン、架橋塩化ビニル、ガラス繊維等からなる耐熱性絶縁被覆１５１で覆ったもの等が用いられている。
また、金属片端子部１４に、ニッケル、ニッケル合金、チタン、チタン合金等の導電防食層を形成することに加え、後述する接合方法の選択により、アルミニウム線を芯線に用いた耐熱性導線の利用も可能となる。 As shown in FIG. 1C and FIG. 2B, one surface of the metal piece terminal portion 14 is exposed from the substrate cutout portion 11, and the end portion 150 of the heat-resistant core wire of the conducting wire 15 is formed on the surface. It is fixed by welding in a terminal welding process using a welding means described later.
For example, the conductive wire 15 is formed by twisting a highly conductive copper wire and a highly heat-resistant stainless steel wire, or by applying tin plating or nickel plating for improving heat resistance to a highly conductive annealed copper wire. What was made into a stranded wire was made into a heat resistant core wire 150, covered with a heat resistant insulating coating 151 made of fluorine rubber, fluorine resin, silicone rubber, silicone resin, polyimide, crosslinked polyethylene, crosslinked vinyl chloride, glass fiber, etc. It is used.
Further, in addition to forming a conductive anticorrosion layer such as nickel, nickel alloy, titanium, titanium alloy or the like on the metal piece terminal portion 14, use of a heat-resistant conductive wire using an aluminum wire as a core wire by selecting a joining method to be described later Is also possible.

図２（ｃ）に示すように、導線１５の耐熱性芯線１５０の端末部が切り欠き部１１から露出する金属片端子部１４に配設され、耐熱性芯線１５０と金属片端子部１４とが後述する端子溶接工程によって溶接固定される。
このとき、切り欠き部１１は、耐熱性芯線１５０の端末部を金属片端子部１４に案内するガイドの役割を果たすと共に、絶縁被覆１５１の先端を保持する機能も発揮することができる。 As shown in FIG. 2C, the end portion of the heat resistant core wire 150 of the conducting wire 15 is disposed on the metal piece terminal portion 14 exposed from the notch portion 11, and the heat resistant core wire 150 and the metal piece terminal portion 14 are arranged. It is welded and fixed by a terminal welding process to be described later.
At this time, the notch 11 serves as a guide for guiding the terminal portion of the heat-resistant core wire 150 to the metal piece terminal portion 14, and can also function to hold the tip of the insulating coating 151.

ここで、図３を参照して、本発明に適用される端子溶接工程の一例について説明する。本実施形態においては、溶接手段として公知の超音波溶接機ＵＳＷを用いる。
超音波溶接機ＵＳＷは、トランスデューサＴＲＳで電気信号を超音波振動に変換し、超音波ホーンＨＲＮを介して、溶接チップＣＨＰに伝達すると共に、溶接チップＣＨＰを加圧することによって、アンビルＡＮＶで支えられた金属片端子部１４と耐熱性芯線１５０の端末部とに中庸的な圧力を加えながら並行振動させることによって金属片端子部１４と耐熱性芯線１５０の端末部との間で原子拡散を誘起させ、金属原子レベルでの結合を引起し、溶接部ＰＷＬＤを形成するものである。 Here, with reference to FIG. 3, an example of the terminal welding process applied to this invention is demonstrated. In the present embodiment, a known ultrasonic welder USW is used as the welding means.
The ultrasonic welder USW is supported by the anvil ANV by converting the electrical signal into ultrasonic vibration by the transducer TRS and transmitting it to the welding tip CHP via the ultrasonic horn HRN and pressurizing the welding tip CHP. The atomic diffusion is induced between the metal piece terminal portion 14 and the end portion of the heat resistant core wire 150 by causing parallel vibration while applying moderate pressure to the metal piece terminal portion 14 and the end portion of the heat resistant core wire 150. , Causing a bond at the metal atom level to form the welded portion P WLD .

本発明では、絶縁性基板１０に切り欠き部１１が形成されているため、溶接部ＰＷＬＤを形成する際の加圧軸方向に絶縁性基板１０が介在せず、溶接チップＣＨＰとアンビルＡＮＶとで金属片端子部１４と耐熱性芯線１５０の端末部とを挟み込んで超音波振動を加えたときに絶縁性基板１０によって振動が吸収されることがない。
また、導線１５を、絶縁性基板１０の側面方向からスライドさせ、耐熱性芯線１５０の端末部を金属片端子部１４の表面に移動させ、上下方向から超音波溶接機ＵＳＷの溶接チップＣＨＰ及びアンビルＡＮＶで挟み込むようにして溶接作業を行うことができるので、動作が単純で自動化が極めて容易である。
加えて、切り欠き部１１が耐熱性芯線１５０の端末部を挿通するガイドの役割を果たすため、専用の治具を必要とせず、さらに自動化が容易となっている。 In the present invention, since the notch 11 is formed in the insulating substrate 10, the insulating substrate 10 is not interposed in the pressure axis direction when forming the welded portion P WLD , and the welding tip CHP, the anvil ANV, Thus, when the ultrasonic vibration is applied between the metal piece terminal portion 14 and the end portion of the heat-resistant core wire 150, the vibration is not absorbed by the insulating substrate 10.
Moreover, the conducting wire 15 is slid from the side surface direction of the insulating substrate 10, the end portion of the heat-resistant core wire 150 is moved to the surface of the metal piece terminal portion 14, and the welding tip CHP and the anvil of the ultrasonic welding machine USW from the vertical direction. Since the welding work can be performed so as to be sandwiched by ANV, the operation is simple and automation is extremely easy.
In addition, since the notch portion 11 serves as a guide for inserting the end portion of the heat-resistant core wire 150, a dedicated jig is not required, and automation is further facilitated.

以上の工程を経て、回路部品１６が実装され、金属片端子部１４を介して、導線１５が接続された絶縁性基板１０によって回路基板１が完成し、例えば、ＰＰＳ、ＰＢＴ、ＰＡＩ等の熱可塑性樹脂、又は、エポキシ樹脂、シリコーン樹脂、フェノール樹脂、メラミン樹脂、尿素樹脂、ポリイミド、ポリウレタン等の熱硬化性樹脂を用いて、回路基板１の周囲を覆うように樹脂成形部１７を形成して、図４に示すような、回路パケージモジュール１００が完成する。
なお、回路基板１の機能に応じて、絶縁性基板１０に実装される回路部品１６、金属片端子部１４、及び、接続される耐熱導線１５の数は適宜選変更し得る。
当然のことながら、本発明は、ロウ濡れ性の悪い、導線１５のみが接続された回路基板に限定される訳ではなく、導線１５以外に、通常のハンダ付けによって接続可能な通常の導線を含むものにも適宜採用し得るものである。
さらに、上記実施形態においては、回路基板１の一面にのみ回路部品を実装した例を示したが、両面実装を施しても良い。 Through the above steps, the circuit board 1 is completed by the insulating substrate 10 on which the circuit component 16 is mounted and the conductive wire 15 is connected via the metal piece terminal portion 14, and for example, heat such as PPS, PBT, PAI, etc. The resin molding part 17 is formed so as to cover the periphery of the circuit board 1 by using a thermosetting resin such as a plastic resin, an epoxy resin, a silicone resin, a phenol resin, a melamine resin, a urea resin, a polyimide, or a polyurethane. A circuit package module 100 as shown in FIG. 4 is completed.
In addition, according to the function of the circuit board 1, the number of the circuit components 16, the metal piece terminal portions 14, and the heat-resistant conductive wires 15 to be connected can be appropriately selected and changed.
As a matter of course, the present invention is not limited to the circuit board to which only the conductive wire 15 is connected, which has poor solderability, and includes a normal conductive wire that can be connected by normal soldering in addition to the conductive wire 15. It can also be adopted as appropriate.
Furthermore, in the said embodiment, although the example which mounted the circuit component only on the one surface of the circuit board 1 was shown, you may give double-sided mounting.

図５を参照して本発明の第２の実施形態における回路基板２について説明する。なお、上記実施形態と同じ構成については、同じ符号を付したので説明を省略する（以下の実施例においても同様である）。
上記実施形態では、金属片端子部１４を略矩形平板状に形成した例を示したが、本実施形態においては、図５（ａ）に示すように、導体部２２の端末部、接合手段２３、及び、金属片端子部２４を略Ｈ字形に形成し、隣り合う金属片端子部２４が、交互に位置をずらして千鳥に並べた点が相違する。
このような構成とすることで、金属片端子部２４の接合強度を低下させることなく、複数の導線１５の配置間隔を短くし幅方向の体格を小さくすることができる。
なお、電極部１２０、及び、ロウ接手段１３は、必ずしも、全てが回路配線部１２１と導通するように形成する必要はなく、本図に示すように、一部が回路配線部１２１と切り離されて島状に点在するように設けてあっても良い。
本実施形態における回路基板１を用いて、幅方向の体格を小さくした場合に、導線方向の体格が却って長くなる虞があるが、その分は、導線１５の長さの調整により対応することができ、特に、車両用エンジン等の搭載スペースが限られている場合に、ガスセンサやヒータ等の制御装置において、搭載性向上に優れた効果を発揮する。
本実施形態においても、切り欠き部１１から金属片端子部２４の表面が露出しており、溶接軸ＡＸＷＬＤ上に絶縁性基板１０が存在しないので、金属片端子部２４と導線１５の耐熱性芯線１５０の端末部とを容易に溶接することが可能である。 With reference to FIG. 5, the circuit board 2 in the 2nd Embodiment of this invention is demonstrated. In addition, about the same structure as the said embodiment, since the same code | symbol was attached | subjected, description is abbreviate | omitted (it is the same also in a following example).
In the above embodiment, an example in which the metal piece terminal portion 14 is formed in a substantially rectangular flat plate shape is shown. However, in this embodiment, as shown in FIG. The difference is that the metal piece terminal portions 24 are formed in a substantially H shape, and the adjacent metal piece terminal portions 24 are alternately shifted in a staggered manner.
By setting it as such a structure, without arrange | positioning the joining strength of the metal piece terminal part 24, the arrangement space | interval of the some conducting wire 15 can be shortened and the physique of the width direction can be made small.
Note that the electrode part 120 and the brazing means 13 are not necessarily formed so as to be all conductive with the circuit wiring part 121, and a part thereof is separated from the circuit wiring part 121 as shown in this figure. It may be provided so as to be scattered like islands.
When the physique in the width direction is reduced using the circuit board 1 in the present embodiment, the physique in the conductor direction may become longer, but this can be accommodated by adjusting the length of the conductor 15. In particular, when a mounting space for a vehicle engine or the like is limited, a control device such as a gas sensor or a heater exhibits an excellent effect of improving the mounting property.
Also in this embodiment, since the surface of the metal piece terminal portion 24 is exposed from the notch portion 11 and the insulating substrate 10 does not exist on the welding axis AX WLD , the heat resistance of the metal piece terminal portion 24 and the conductive wire 15 is achieved . The terminal portion of the core wire 150 can be easily welded.

図６を参照して本発明の第３の実施形態における回路基板３について説明する。上記実施形態においては、金属片端子部１４を略矩形平板状に形成した例、及び、金属片端子部２４を略Ｈ字形に形成した例を示したが、本実施形態においては、本図に示すように、導体部３２の端末部や金属片端子部３４において、角部をＲ形状にした点が相違する。
本実施形態においても上記実施形態と同様の効果を発揮するのに加え、金属片端子部３４の角部をＲ形状にしてあるので電界集中による端子間の短絡や角部への応力集中が抑制され、回路基板３の信頼性の向上を図ることもできる。
また、本実施形態のように上記第２の実施形態における金属片端子部２４の角部をＲ形状にしても良い。 A circuit board 3 according to a third embodiment of the present invention will be described with reference to FIG. In the said embodiment, although the example which formed the metal piece terminal part 14 in the substantially rectangular flat plate shape and the example which formed the metal piece terminal part 24 in the substantially H shape were shown, in this embodiment, in this figure As shown in the figure, the terminal portion of the conductor portion 32 and the metal piece terminal portion 34 are different in that the corner portions have an R shape.
In this embodiment, in addition to exhibiting the same effect as the above embodiment, the corner of the metal piece terminal portion 34 is formed in an R shape, so that short circuit between terminals due to electric field concentration and stress concentration at the corner are suppressed. In addition, the reliability of the circuit board 3 can be improved.
Moreover, you may make the corner | angular part of the metal piece terminal part 24 in the said 2nd Embodiment into R shape like this embodiment.

図７を参照して、本発明の参考形態としての第４の形態における回路基板４、４ａ、第５の形態における回路基板５、５ａについて説明する。
上記実施形態においては、絶縁性基板１０の端縁から切り欠き部１１を形成したが、第４の形態においては、本図（ａ―１）、（ａ―２）、（ａ―１３）に示すように、絶縁性基板４０の端縁から内側に引き込んだ位置に貫通孔４１を穿設して、金属片端子部４４と耐熱性芯線１５０の端末部との溶接を可能とした点が相違する。
また、本図（ａ―２）に示すように、導線１５を金属片端子部４４の実装面側に溶接しても良いし、本図（ａ―３）に示すように、導線１５ａの耐熱性芯線１５０ａを屈曲させて、金属片端子部４４の裏面側に溶接しても良い。
さらに、上記実施形態においては、金属片端子部１４の端縁が絶縁性基板１０の外周縁よりも内側に引き込んだ位置となるように、配設して、切り欠き部１１を耐熱性芯線１５０の挿通ガイドとして利用した例を示したが、第５の形態においては、本図（ｂ−１）、（ｂ−２）、（ｂ−３）に示すように、絶縁性基体１０の端縁よりも外側にはみ出すように配設しても良い。
加えて、本図（ｂ−２）に示すように、上記実施形態と同様、耐熱性芯線１５０を切り欠き部１１に挿通する方向に向けて溶接しても良いし、本図（ｂ−３）に示すように、金属片端子部５４の外周側にはみ出した部分を利用して、絶縁性基体１０の端縁に平行な方向に向けて耐熱性芯線１５０を配設して溶接しても良い。
この場合、溶接部ＰＷＬＤが絶縁性基板１０の外周端縁の外側に位置するので、切り欠き部１１がなくても、金属片端子部５４と耐熱性芯線１５０の端末部との溶接が可能となる。 Referring to FIG. 7, the circuit board 4,4a in the fourth embodiment of the reference embodiment of the present invention, the circuit board 5,5a in the fifth embodiment will be described.
In the above embodiment, the cutout portion 11 is formed from the edge of the insulating substrate 10, but in the fourth embodiment , (a-1), (a-2), and (a-13) in FIG. As shown in the figure, a through hole 41 is formed at a position drawn inward from the edge of the insulating substrate 40 to enable welding of the metal piece terminal portion 44 and the end portion of the heat resistant core wire 150. To do.
Moreover, as shown in this figure (a-2), the conducting wire 15 may be welded to the mounting surface side of the metal piece terminal portion 44, and as shown in this figure (a-3), the heat resistance of the conducting wire 15a is reduced. The conductive core wire 150 a may be bent and welded to the back side of the metal piece terminal portion 44.
Furthermore, in the said embodiment, it arrange | positions so that the edge of the metal piece terminal part 14 may become the position pulled inward rather than the outer periphery of the insulating board | substrate 10, and the notch part 11 is the heat-resistant core wire 150. In the fifth embodiment , as shown in FIGS. (B-1), (b-2), and (b-3), the edge of the insulating base 10 is used. You may arrange | position so that it may protrude outside.
In addition, as shown in this figure (b-2), as in the above embodiment, the heat-resistant core wire 150 may be welded in the direction of insertion into the notch 11, or this figure (b-3). As shown in FIG. 5, the heat-resistant core wire 150 is disposed and welded in the direction parallel to the edge of the insulating base 10 using the portion protruding from the outer peripheral side of the metal piece terminal portion 54. good.
In this case, since the welded part PWLD is located outside the outer peripheral edge of the insulating substrate 10, the metal piece terminal part 54 and the end part of the heat resistant core wire 150 can be welded without the notch part 11. Become.

図８を参照して、本発明の参考形態である第６の形態における回路基板６、６ａと第７の形態における回路基板７、７ａについて説明する。
上記実施形態においては、いずれも、金属片端子部１４、２４、３４、４４、５４を略平板状に形成した例を示したが、金属片端子部６４、７４と、耐熱性芯線１５０の端末部とを溶接固定した溶接部ＰＷＬＤに直交する方向の溶接軸ＡＸＷＬＤ上に絶縁性基板６０、７０が存在しないように金属片端子部６４、７４の一部を絶縁性基板６０、７０に対して垂直方向、又は、水平方向に伸びる延接部６１、７１を設けて立体的な形状に形成した
金属片端子部６４、７４を用いた点が相違する。
このような構成とすることにより、上記実施形態と同様の効果に加え、本図（ａ―２）、（ａ―３）、（ｂ−２）、（ｂ−３）に示すように、導線１５の配線方向の自由度が増す。 Referring to FIG. 8, a description will be given of the circuit board 7,7a in the circuit board 6,6a and seventh embodiment in the sixth embodiment is a reference embodiment of the present invention.
In the above embodiment, the metal piece terminal portions 14, 24, 34, 44 and 54 are all formed in a substantially flat plate shape, but the metal piece terminal portions 64 and 74 and the end of the heat resistant core wire 150 are shown. Part of the metal piece terminal portions 64 and 74 to the insulating substrates 60 and 70 so that the insulating substrates 60 and 70 do not exist on the welding axis AX WLD in the direction orthogonal to the welded portion P WLD in which the portions are fixed by welding. On the other hand, the point which used the metal piece terminal parts 64 and 74 which provided the extended contact parts 61 and 71 extended in a perpendicular direction or a horizontal direction, and was formed in the three-dimensional shape is different.
By adopting such a configuration, in addition to the same effects as those of the above embodiment, as shown in the drawings (a-2), (a-3), (b-2), and (b-3), the conductive wire The degree of freedom in 15 wiring directions is increased.

図９を参照して、本発明に適用できる他の溶接方法について説明する。
上記実施形態においては、超音波溶接機ＵＳＷを用いて、異種金属を含み、ハンダ濡れ性の悪い耐熱性芯線１５０の端末部と金属片端子部１４とを溶接する方法について説明したが、本発明では、耐熱性芯線１５０に用いられる金属の特性に応じて本図（ａ）に示すような、抵抗溶接機ＲＷや、本図（ｂ）に示すようなレーザ溶接機ＬＷを適宜採用することも可能である。
例えば、導線１５として、軟導線の表面に錫メッキを施して耐熱性を向上させた耐熱性芯線１５０ｂが用いられている場合には、上述の超音波溶接ＵＳＷは勿論のこと、公知の抵抗溶接機ＲＷによっても溶接が可能である。
抵抗溶接機ＲＷは、金属片端子部１４と耐熱性芯線１５０ｂの端末部とを密接させた状態で、電極ＥＬ１、ＥＬ２を押し当てて加圧しながら、例えば、数十〜数万アンペアの大きな電流を数ミリ秒〜数百ミリ秒程度の極短い時間だけ流して、金属抵抗によるジュール熱を発生させて溶融することによって、金属片端子部１４と耐熱性芯線１５０ｂの端末部との合金からなる溶接部ＰＷＬＤを形成する。
この場合においても、絶縁性基板１０に設けられた切り欠き部１１によって金属片端子部１４と耐熱性芯線１５０ｂの端末部とを溶接する際に溶接部ＰＷＬＤの溶接軸ＡＸＷＬＤ方向に絶縁性基板１０が存在しないので、上下方向から、金属片端子部１４と耐熱性芯線１５０の端末部とを挟み込むようにして溶接を行うことが可能で、自動化も極めて容易である。
加えて、一対の電極ＥＬ１、ＥＬ２で金属片端子部１４と耐熱性芯線１５０の端末部とを上下方向から挟み込むことによって、金属片端子部１４と耐熱性芯線１５０の端末部とが密接した状態で溶接されるので、溶接の出来栄え（接合強度）が安定する効果も発揮される。 With reference to FIG. 9, another welding method applicable to the present invention will be described.
In the said embodiment, although the ultrasonic welding machine USW was used and the method of welding the terminal part and the metal piece terminal part 14 of the heat resistant core wire 150 which contains a dissimilar metal and has poor solder wettability, this invention was demonstrated. Then, depending on the characteristics of the metal used for the heat-resistant core wire 150, a resistance welding machine RW as shown in FIG. 5A or a laser welding machine LW as shown in FIG. Is possible.
For example, when the heat-resistant core wire 150b in which the surface of the soft wire is tin-plated to improve the heat resistance is used as the conductive wire 15, the above-described ultrasonic welding USW is well known resistance welding. Welding is also possible with the machine RW.
The resistance welder RW presses the electrodes EL 1 and EL 2 and pressurizes them while keeping the metal piece terminal portion 14 and the end portion of the heat-resistant core wire 150b in close contact with each other, for example, several tens to several tens of thousands of amperes. An alloy between the metal piece terminal portion 14 and the end portion of the heat-resistant core wire 150b by flowing a large current for several milliseconds to several hundred milliseconds for an extremely short time, generating Joule heat due to metal resistance and melting. A weld zone P WLD is formed.
Even in this case, when the metal piece terminal part 14 and the end part of the heat-resistant core wire 150b are welded by the notch part 11 provided in the insulating substrate 10, the insulating part 10 is insulated in the welding axis AX WLD direction of the weld part P WLD . Since the substrate 10 does not exist, welding can be performed by sandwiching the metal piece terminal portion 14 and the end portion of the heat-resistant core wire 150 from above and below, and automation is extremely easy.
In addition, the metal piece terminal portion 14 and the end portion of the heat resistant core wire 150 are in close contact with each other by sandwiching the metal piece terminal portion 14 and the end portion of the heat resistant core wire 150 with the pair of electrodes EL 1 and EL 2. Since it welds in the state which carried out, the effect that the quality (welding strength) of welding is stabilized is also exhibited.

従来の回路基板上の配線パターンに電線を溶接する場合には、基板の損傷を防ぐ必要性などから、レーザ溶接によって接続できる線材及びレーザ出力などに制限があり、異種金属材料を含む、耐熱性導体、例えば、２５０℃程度の耐熱性の耐熱性芯線１５０ｂとする導線１５ｂを絶縁性基板１０上の導体部１２に直接溶接することが困難であった。
しかし、本実施形態では、金属片端子部１４と耐熱性芯線１５０ｂとの溶接部ＰＷＬＤの溶接軸ＡＸＷＬＤ方向に絶縁性基板１０が存在しない位置において溶接されるので、耐熱性芯線１５０ｂとして、電導率の高い銅線に耐熱性の高いニッケルメッキを施した耐熱性導体を撚り線としたものや、アルミニウム等が用いられていても、溶接部ＰＷＬＤとなる部分の周囲に損傷を受ける基板が存在しないため、溶融温度の高い耐熱性導体を芯線として用いた耐熱性芯線１５０ｂを溶接できる程度の比較的高い出力のレーザ光を用いて溶接を行うことができる。 When welding electric wires to wiring patterns on conventional circuit boards, there is a limit to the wire that can be connected by laser welding, laser output, etc. due to the need to prevent damage to the board, heat resistance including dissimilar metal materials It was difficult to directly weld a conductor, for example, a conductive wire 15b, which is a heat-resistant core wire 150b having a heat resistance of about 250 ° C., to the conductor portion 12 on the insulating substrate 10.
However, in this embodiment, since welding is performed at a position where the insulating substrate 10 does not exist in the welding axis AX WLD direction of the welded portion P WLD between the metal piece terminal portion 14 and the heat resistant core wire 150b, as the heat resistant core wire 150b, A substrate in which a heat-resistant conductor obtained by applying nickel plating with high heat resistance to a copper wire with high electrical conductivity is used as a stranded wire, or even if aluminum or the like is used, damage is caused around the portion to become the welded portion P WLD. Therefore, welding can be performed using a laser beam with a relatively high output that can weld the heat-resistant core wire 150b using a heat-resistant conductor having a high melting temperature as the core wire.

本発明は、上記実施形態に限定するものではなく、絶縁性基板１０の一部を切り欠いたり、金属片端子部１４の一部を伸ばしたりすることによって、耐熱性芯線１５０の端末部と金属片端子部１４とを溶接する際に、溶接軸ＡＸＷＬＤ上に絶縁性基板１０が存在しないようにして、溶接作業を容易にすると共に、溶接の品質を向上させて信頼性の高い回路基板１を実現しようとする本発明の趣旨に反しない限りにおいて適宜変更可能であり、例えば、回路基板１は、通常のハンダ付けによって接続可能な通常の導線で高温環境下に置かれていない他の入出力装置との接続を可能にしたものであっても良い。 The present invention is not limited to the above-described embodiment, and by cutting out a part of the insulating substrate 10 or extending a part of the metal piece terminal part 14, the end part of the heat-resistant core wire 150 and the metal When welding the single terminal portion 14, the insulating substrate 10 is not present on the welding axis AX WLD to facilitate the welding operation and improve the quality of the welding to improve the reliability of the circuit board 1. The circuit board 1 can be appropriately changed as long as it does not contradict the gist of the present invention. For example, the circuit board 1 is a normal conductor that can be connected by ordinary soldering and is not placed in a high temperature environment. It may be possible to connect to an output device.

１ 第１の実施形態における回路基板
１０ 絶縁性基板
１００ 回路パケージモジュール
１１ 基板切り欠き部（溶接可能化手段）
１２ 導体部
１２０ 電極部
１２１ 回路配線部
１３ ハンダ部／ロウ付け部（実装手段）
１４ 金属片端子部
１５ 耐熱性導線
１５０ 芯線端末部
１５１ 耐熱性絶縁被覆
１６ 回路部品（受動部品及び能動部品）
１７ 樹脂成形部
２ 第２の実施形態における回路基板
３ 第３の実施形態における回路基板
４ 第４の実施形態における回路基板
５ 第５の実施形態における回路基板
６ 第６の形態における回路基板
７ 第７の形態における回路基板
ＡＸＷＬＤ 溶接軸
ＰＷＬＤ 溶接部
ＵＳＷ 超音波溶接機
ＲＷ 抵抗溶接機
ＬＷ レーザ溶接機 DESCRIPTION OF SYMBOLS 1 Circuit board 10 in 1st Embodiment Insulating board | substrate 100 Circuit package module 11 Board | substrate notch part (weldable means)
12 conductor part 120 electrode part 121 circuit wiring part 13 solder part / brazing part (mounting means)
14 Metal piece terminal portion 15 Heat resistant lead wire 150 Core wire terminal portion 151 Heat resistant insulation coating 16 Circuit component (passive component and active component)
17 Resin molding part
2 Circuit board 3 in the second embodiment Circuit board 4 in the third embodiment Circuit board 5 in the fourth embodiment 5 Circuit board 6 in the fifth embodiment Circuit board 7 in the sixth embodiment 7 In the seventh embodiment Circuit board AX WLD welding axis P WLD welding part USW Ultrasonic welding machine RW Resistance welding machine LW Laser welding machine

２００９−２９５９４５号公報2009-295945 ２０１０−５３０５４１号公報2010-530541 ２０１１−１６５６１８号公報2011-165618

Claims (6)

回路配線部（１２１、２２１、３２１）と電極部（１２０、２２０、３２０）とからなる導体部（１２、２２、３２）と、該導体部（１２、２２、３２）を形成した絶縁性基板（１０）と、該絶縁性基板（１０）に実装した回路部品（１６）と、上記電極部（１２０、２２０、３２０）と外部との接続を図る導線（１５）とを含む導線付き回路基板（１、２、３）であって、
上記導線（１５）は、錫メッキ又はニッケルメッキを施した軟銅線、ニッケルメッキを施した軟銅線とステンレス線とからなる線、ステンレス線、及びアルミニウム線のうちのいずれかである耐熱性芯線（１５０）と、該耐熱性芯線（１５０）を覆う耐熱性絶縁被覆（１５１）とを有し、
上記絶縁性基板（１０）には、
銅、ニッケル、ニッケル合金（Ｎｉ／ＳＵＳ／Ｎｉクラッド鋼）、４２アロイ（鉄ニッケル合金）、黄銅、青銅、及びニッケル・銅・パラジウム・銀・錫・白金・金のメッキを施した鋼材のうちのいずれかの金属材料からなる金属片端子部（１４、２４、３４）が、上記電極部（１２０、２２０、３２０）にロウ接手段（１３）を介して固定されており、
上記耐熱性芯線（１５０）の上記耐熱性絶縁被覆（１５１）を有さない端末部と、上記金属片端子部（１４、２４、３４）を溶接固定した溶接部（ＰＷＬＤ）に直交する方向の溶接軸（ＡＸＷＬＤ）上に上記絶縁性基板（１０）が存在しないように上記絶縁性基板（１０）の外周縁の一部を内側に向かって切り欠いた基板切り欠き部（１１）が設けられ、
上記金属片端子部（１４、２４、３４）と上記絶縁性基板（１０）に囲まれた、上記基板切り欠き部（１１）の内側の空間において、上記耐熱性絶縁被覆（１５１）の先端が上記絶縁性基板（１０）の外周縁より内側に引き込まれた状態で、上記端末部が溶接固定されていることを特徴とする導線付き回路基板。 Conductor portions (12, 22, 32 ) composed of circuit wiring portions (121, 221, 321) and electrode portions (120, 220, 320 ) and the conductor portions (12, 22, 32 ) were formed. An insulating substrate (10 ) , a circuit component (16) mounted on the insulating substrate (10 ) , and a lead wire ( 15) for connecting the electrode portions (120, 220, 320 ) to the outside A circuit board (1, 2, 3) with a conductor including
The conducting wire ( 15) is a heat-resistant core wire which is one of a annealed copper wire subjected to tin plating or nickel plating, a wire composed of annealed copper wire subjected to nickel plating and a stainless wire, a stainless steel wire, and an aluminum wire. (150) and a heat resistant insulation coating (151) covering the heat resistant core wire (150),
The insulating substrate (10 ) includes
Among steel materials plated with copper, nickel, nickel alloy (Ni / SUS / Ni clad steel), 42 alloy (iron nickel alloy) , brass, bronze, nickel, copper, palladium, silver, tin, platinum, gold metal piece terminal part consisting of either a metal material (14,24,3 4) are fixed via the brazing means (13) to the electrode unit (120,220,32 0)
The end portion of the heat-resistant core wire (150) not having the heat-resistant insulating coating (151) is orthogonal to the welded portion (P WLD ) where the metal piece terminal portions (14, 24, 34 ) are fixed by welding. direction of the welding axis (AX WLD) the insulating substrate (1 0) is the substrate cutout a portion of the outer peripheral edge was notched toward the inside of the insulating substrate so as not to exist (1 0) on ( 1 1) is provided,
In the space inside the substrate notch ( 11) surrounded by the metal piece terminal portions (14, 24, 34 ) and the insulating substrate (10 ) , the heat-resistant insulating coating (151) A circuit board with a conductive wire, wherein the terminal portion is welded and fixed in a state where the tip of the wire is drawn inward from the outer peripheral edge of the insulating substrate (10) . 上記ロウ接手段が、軟ロウであるハンダ、又は、硬ロウである銅ロウ、又は、銀ロウのいずれかである請求項１に記載の導線付き回路基板。   2. The circuit board with a conductor according to claim 1, wherein the soldering means is one of solder that is soft solder, copper solder that is hard solder, or silver solder. 上記耐熱性芯線（１５０）は、撚り線である請求項１又は２に記載の導線付き回路基板。 The circuit board with a conducting wire according to claim 1 or 2, wherein the heat-resistant core wire (150) is a stranded wire . 上記耐熱性絶縁被覆（１５１）が、フッ素ゴム、フッ素樹脂、シリコーンゴム、シリコーン樹脂、ポリイミド、架橋ポリエチレン、架橋塩化ビニル、ガラス繊維のいずれかである請求項１ないし３のいずれかに記載の導線付き回路基板。 The lead wire according to any one of claims 1 to 3, wherein the heat-resistant insulating coating (151) is any one of fluororubber, fluororesin, silicone rubber, silicone resin, polyimide, crosslinked polyethylene, crosslinked vinyl chloride, and glass fiber. Circuit board with. 請求項１ないし４のいずれかに記載の導線付き回路基板の製造方法であって、It is a manufacturing method of the circuit board with a lead according to any one of claims 1 to 4,
上記回路配線部（１２１）と上記電極部（１２０）とからなる上記導体部（１２）を形成した上記絶縁性基板（１０、４０）の実装面に、上記回路部品（１６）と上記金属片端子部（１４、２４、３４）とを実装する実装工程と、The circuit component (16) and the metal piece are mounted on the mounting surface of the insulating substrate (10, 40) on which the conductor portion (12) including the circuit wiring portion (121) and the electrode portion (120) is formed. A mounting step of mounting the terminal portions (14, 24, 34);
上記溶接軸（ＡＸThe welding shaft (AX ＷＬＤWLD ）上に上記絶縁性基板（１０）が存在しない位置において上記金属片端子部（１４、２４、３４）と上記耐熱性芯線（１５０）の端末部とを溶接する端子溶接工程を具備することを特徴とする導線付き回路基板の製造方法。A terminal welding step of welding the metal piece terminal portions (14, 24, 34) and the end portions of the heat resistant core wires (150) at positions where the insulating substrate (10) does not exist. A method of manufacturing a circuit board with a conducting wire, which is characterized. 上記端子溶接工程で用いられる溶接手段が、超音波溶接（ＵＳＷ）、抵抗溶接（ＲＷ）、又は、レーザ溶接（ＬＷ）のいずれかである請求項５に記載の導線付き回路基板の製造方法。6. The method for manufacturing a circuit board with a conductor according to claim 5, wherein the welding means used in the terminal welding step is any one of ultrasonic welding (USW), resistance welding (RW), and laser welding (LW).
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