JP7137237B2 - heater chip unit - Google Patents

heater chip unit Download PDF

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Publication number
JP7137237B2
JP7137237B2 JP2020151045A JP2020151045A JP7137237B2 JP 7137237 B2 JP7137237 B2 JP 7137237B2 JP 2020151045 A JP2020151045 A JP 2020151045A JP 2020151045 A JP2020151045 A JP 2020151045A JP 7137237 B2 JP7137237 B2 JP 7137237B2
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heater chip
temperature measuring
soldering iron
iron
fixing
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JP2022045444A (en
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伸一郎 須賀
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APOLLO GIKEN CO., LTD.
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APOLLO GIKEN CO., LTD.
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Priority to JP2020151045A priority Critical patent/JP7137237B2/en
Priority to CN202180027313.4A priority patent/CN115461180A/en
Priority to PCT/JP2021/027196 priority patent/WO2022054421A1/en
Priority to KR1020227030266A priority patent/KR20220130802A/en
Priority to MYPI2022004865A priority patent/MY196583A/en
Priority to TW110133049A priority patent/TW202211744A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Electrodes For Cathode-Ray Tubes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)

Description

本発明は、端子用導線を端子部材に熱圧着するためのヒーターチップユニットに関するものである。 BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heater chip unit for thermocompression bonding a terminal lead wire to a terminal member.

端子用導線を端子部材に熱圧着する作業、例えば、チップインダクター等の電子部品の製造においてリード線をコアの端子部に熱圧着する作業においては、熱圧着用のヒーターチップユニットが用いられる。具体的には、コテ部が昇温するヒーターチップに温度センサーとして熱電対を取り付けてヒーターチップユニットを構成し、このヒーターチップユニットを熱圧着装置のツールホルダーへ取り付ける。そして、熱圧着装置を作動し、端子部材に載せた端子用導線をヒーターチップのコテ部により加圧しながら急加熱して、端子用導線を端子部材へ熱圧着する（例えば、特許文献１参照）。 2. Description of the Related Art A heater chip unit for thermocompression is used in the work of thermocompression bonding a terminal conductor wire to a terminal member, for example, in the work of thermocompression bonding a lead wire to a terminal portion of a core in the manufacture of an electronic component such as a chip inductor. Specifically, a heater chip unit is constructed by attaching a thermocouple as a temperature sensor to the heater chip that raises the temperature of the iron portion, and this heater chip unit is attached to the tool holder of the thermocompression bonding apparatus. Then, the thermocompression bonding apparatus is operated to rapidly heat the terminal conductor wire placed on the terminal member while pressurizing it with the soldering iron portion of the heater chip, thereby thermocompression bonding the terminal conductor wire to the terminal member (see, for example, Patent Document 1). .

特開２００１－２８４７８１号公報JP-A-2001-284781

ところで、上記特許文献に記載のヒーターチップ（ヒーターチップユニット）においては、熱電対の素線をヒーターチップの貫通孔に通し、この状態でアーク溶接を行って測温接点（温度センサーの測温部）の形成と、測温接点のヒーターチップへの止着（接合）と同時に行っている。しかしながら、溶接不良により測温接点が形成されずに素線だけがヒーターチップに接合されることもあり、歩留まりが悪い。そこで、ヒーターチップへの止着前に測温接点を予め形成しておき、この測温接点（測温部）をヒーターチップへ十分に接触させ、この状態で止着を行うことが好適である。 By the way, in the heater chip (heater chip unit) described in the above patent document, the wire of the thermocouple is passed through the through hole of the heater chip, and arc welding is performed in this state to form the temperature measuring junction (temperature measuring part of the temperature sensor ) and fixing (bonding) the temperature measuring contact to the heater chip. However, due to poor welding, only the wire may be joined to the heater chip without forming the temperature measuring junction, resulting in poor yield. Therefore, it is preferable to form a temperature-measuring junction in advance before attaching to the heater chip, bring this temperature-measuring junction (temperature-measuring portion) into sufficient contact with the heater chip, and attach in this state. .

本発明は、上記した事情に鑑みてなされたものであり、その目的は、温度センサーの測温部をヒーターチップの止着箇所へ十分に接触させることができるヒーターチップユニットを提供しようとするものである。 SUMMARY OF THE INVENTION The present invention has been made in view of the above-described circumstances, and its object is to provide a heater chip unit in which the temperature measuring portion of the temperature sensor can be brought into sufficient contact with the fixing portion of the heater chip. is.

本発明は、上記目的を達成するために提案されたものであり、請求項１に記載のものは、端子用導線を端子部材に熱圧着するための板状のヒーターチップに温度センサーを取り付けたヒーターチップユニットであって、
前記ヒーターチップは、
前記端子用導線に当接するコテ先部をコテ本体に備えたコテ部と、
前記コテ本体の左右端部から上方へ互いに離間した状態で延設され、電源からの電流をコテ本体に流してコテ部を昇温させる一対の接続腕部と、
前記コテ部に設けられ、温度センサーの測温部が止着される測温止着部と、
を備え、
前記測温止着部は、測温部が接触する一対の止着接触面を備え、止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定し、
前記接続腕部同士の隙間を導線収納空部として温度センサーの導線を導線収納空部へ収納し、
前記止着接触面を導線収納空部の端部へ対向させたことを特徴とするヒーターチップユニットである。 SUMMARY OF THE INVENTION The present invention has been proposed to achieve the above object, and the present invention is characterized in that a temperature sensor is attached to a plate-like heater chip for thermocompression bonding a terminal lead wire to a terminal member. A heater chip unit,
The heater chip is
a soldering iron part having a soldering iron body provided with a soldering tip part that abuts on the terminal conductor;
a pair of connection arms extending upward from the right and left ends of the iron body while being spaced apart from each other, and configured to flow a current from a power supply to the iron body to raise the temperature of the iron body;
a temperature measuring fixing portion provided in the iron portion and to which the temperature measuring portion of the temperature sensor is fixed;
with
The temperature measuring fixing part has a pair of fixing contact surfaces with which the temperature measuring part contacts, and the distance between the fixing contact surfaces is set to gradually widen as it goes upward from the soldering iron part side ,
The gap between the connecting arms is used as a wire storage space, and the wire of the temperature sensor is stored in the wire storage space,
The heater chip unit is characterized in that the fixing contact surface is opposed to the end of the lead wire storage space .

請求項２に記載のものは、前記止着接触面を平面で構成し、前記測温部を球状体で構成したことを特徴とする請求項１に記載のヒーターチップユニットである。 According to a second aspect of the present invention, there is provided the heater chip unit according to the first aspect, wherein the fixing contact surface is formed of a flat surface, and the temperature measuring portion is formed of a spherical body.

請求項３に記載のものは、前記ヒーターチップが、少なくとも前記コテ部と測温止着部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項１または請求項２に記載のヒーターチップユニットである。 According to claim 3 , the heater chip has an oxidation-resistant film layer formed on at least the surface of the soldering iron portion and the temperature measuring fixing portion. The heater chip unit described.

請求項４に記載のものは、前記測温止着部に止着された測温部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項３に記載のヒーターチップユニットである。 According to claim 4 , the heater chip unit according to claim 3 is characterized in that an oxidation-resistant film layer is formed on the surface of the temperature measuring part fastened to the temperature measuring fixing part. is.

請求項５に記載のものは、前記耐酸化性被膜層がニッケル被膜であることを特徴とする請求項３または請求項４に記載のヒーターチップユニットである。 According to claim 5 , the heater chip unit according to claim 3 or 4 , wherein the oxidation-resistant coating layer is a nickel coating.

本発明によれば、以下のような優れた効果を奏する。
請求項１に記載の発明によれば、前記測温止着部は、測温部が接触する一対の止着接触面を備え、止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定したので、温度センサーの測温部を測温止着部へ十分に接触させることができる。したがって、測温部のヒーターチップへの良好な止着、ひいては良好な測温が可能なヒーターチップユニットを構成することができる。
さらに、前記接続腕部同士の隙間を導線収納空部として温度センサーの導線を導線収納空部へ収納し、前記止着接触面を導線収納空部の端部へ対向させたので、測温部を先頭にした状態で温度センサーを導線収納空部へ挿し入れれば、測温部を止着接触面へ簡単に当接することができる。したがって、温度センサーの測温部を測温止着部へ止着する準備をスムーズに行うことができる。 ADVANTAGE OF THE INVENTION According to this invention, there exists the following outstanding effects.
According to the first aspect of the invention, the temperature measuring fastening part has a pair of fastening contact surfaces with which the temperature measuring part contacts, and the distance between the fastening contact surfaces is upward from the soldering iron part side. Since it is set to expand gradually as the temperature increases, the temperature measuring portion of the temperature sensor can be sufficiently brought into contact with the temperature measuring fixing portion. Therefore, it is possible to construct a heater chip unit in which the temperature measuring portion can be satisfactorily attached to the heater chip, and thus, the temperature can be satisfactorily measured.
Furthermore, since the gap between the connecting arms is used as a wire storage space and the wire of the temperature sensor is stored in the wire storage space, and the fixing contact surface is opposed to the end of the wire storage space, the temperature measuring part If the temperature sensor is inserted into the lead wire storage space with the temperature sensor facing the front, the temperature measuring part can be easily brought into contact with the fixed contact surface. Therefore, it is possible to smoothly prepare for fixing the temperature measuring portion of the temperature sensor to the temperature measuring fixing portion.

請求項２に記載の発明によれば、前記止着接触面を平面で構成し、前記測温部を球状体で構成したので、測温部が止着接触面へ点接触し易い。また、測温部を止着接触面に押し付ければ、応力が集中し易くなって測温部が止着接触面から浮き難い。これにより測温部をヒーターチップへ一層良好に止着すること、ひいては、ヒーターチップの測温を一層良好に行うことができる。 According to the second aspect of the present invention, since the fixed contact surface is formed of a flat surface and the temperature measuring portion is formed of a spherical body, the temperature measuring portion is easily in point contact with the fixed contact surface. Also, if the temperature measuring part is pressed against the fixed contact surface, the stress is likely to be concentrated, and the temperature measuring part is less likely to come off from the fixed contact surface. As a result, the temperature measuring portion can be attached to the heater chip more favorably, and the temperature of the heater chip can be measured more favorably.

請求項３から請求項５に記載の発明によれば、昇温と冷却が繰り返し行われても表面の酸化を抑制することができ、耐久性を向上させることができる。 According to the third to fifth aspects of the invention, surface oxidation can be suppressed and durability can be improved even if heating and cooling are repeatedly performed.

ヒーターチップユニットの斜視図である。It is a perspective view of a heater chip unit. ヒーターチップの説明図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は側面図である。It is explanatory drawing of a heater chip, (a) is a top view, (b) is a front view, (c) is a bottom view, (d) is a side view. ヒーターチップの測温止着部の説明図であり、（ａ）は正面図、（ｂ）は断面図である。It is explanatory drawing of the temperature-measurement sealing part of a heater chip, (a) is a front view, (b) is sectional drawing. ヒーターチップに熱電対を取り付ける手順の説明図であり、（ａ）は熱電対をヒーターチップ内に挿入する前の状態、（ｂ）は熱電対をヒーターチップ内に挿入した後の状態、（ｃ）は導線収納空部および止め凹部に導線止め部として樹脂を注入した状態である。FIG. 4 is an explanatory diagram of a procedure for attaching a thermocouple to a heater chip, (a) showing the state before inserting the thermocouple into the heater chip, (b) showing the state after inserting the thermocouple into the heater chip, and (c) ) is a state in which resin is injected into the conductor housing cavity and the retaining recess as the conductor retaining portion. ２つのコテ部を備えたヒーターチップの斜視図である。FIG. 4 is a perspective view of a heater chip having two soldering iron parts; ２つのコテ部を備えたヒーターチップの説明図であり、（ａ）は平面図、（ｂ）は正面図、（ｃ）は底面図、（ｄ）は側面図である。It is explanatory drawing of the heater chip provided with two iron parts, (a) is a top view, (b) is a front view, (c) is a bottom view, (d) is a side view.

以下、本発明を実施するための形態を図面に基づいて説明する。
ヒーターチップユニット１は、図１および図２に示すように、端子用導線Ａを端子部材Ｂに熱圧着する（図２（ｄ）参照）ための板状のヒーターチップ２と、温度センサーとしてヒーターチップ２に取り付けられた熱電対３とを備えて構成されている。ヒーターチップ２は、導電性材料（タングステン，モリブデン、超硬材等）の板材をワイヤー放電加工により加工して成形されたチップであり、図２に示すように、このヒーターチップ２の下部（ワーク（端子用導線Ａや端子部材Ｂ）側に位置する先端部）となるコテ部６と、上部（基部）となる左右一対の接続腕部７とを備えて構成されている。そして、接続腕部７を介してコテ部６へ通電したときに電気抵抗によってコテ部６を発熱可能とし、コテ部６の温度を熱電対３によって測定可能としている。 EMBODIMENT OF THE INVENTION Hereinafter, the form for implementing this invention is demonstrated based on drawing.
As shown in FIGS. 1 and 2, the heater chip unit 1 includes a plate-like heater chip 2 for thermocompression bonding the terminal conductor A to the terminal member B (see FIG. 2(d)), and a heater as a temperature sensor. and a thermocouple 3 attached to the chip 2 . The heater chip 2 is a chip formed by processing a plate material of a conductive material (tungsten, molybdenum, cemented carbide, etc.) by wire electric discharge machining, and as shown in FIG. It is composed of a soldering iron portion 6 serving as (a tip portion positioned on the side of the terminal conductor A or the terminal member B) and a pair of left and right connecting arm portions 7 serving as an upper portion (base portion). When the soldering iron 6 is energized through the connection arm 7 , the electrical resistance allows the soldering iron 6 to generate heat, and the temperature of the soldering iron 6 can be measured by the thermocouple 3 .

コテ部６は、接続腕部７の下部同士を接続する横長なコテ本体１１を備え、このコテ本体１１の横幅（一対の接続腕部７が並ぶ横方向に沿った寸法）をヒーターチップ２の下部へ向かうにつれて次第に狭くなる状態に設定している。また、僅かに下方に突出したコテ本体１１の底部には箱状のコテ先部１３を下方へ向けて突設し、このコテ先部１３の底面（先端面）をコテ先面１３ａとして端子用導線Ａへ当接可能としている。さらに、コテ本体１１のコテ先部１３と反対側に位置する上部（接続腕部７側）には略矩形状のコテ凹部１５を形成し、このコテ凹部１５内に熱電対３の測温接点（測温部）３ａを止着している。なお、測温接点３ａが止着される構成については、後で詳細に説明する。 The iron portion 6 has a horizontally long iron body 11 that connects the lower portions of the connection arms 7 to each other. It is set so that it becomes narrower toward the bottom. A box-shaped soldering iron tip 13 protrudes downward from the bottom of the soldering iron body 11, which slightly protrudes downward. Contact with the conducting wire A is enabled. Further, a substantially rectangular soldering iron recess 15 is formed in the upper portion (connecting arm 7 side) of the soldering iron main body 11 located on the opposite side of the soldering iron tip 13 . (Temperature measurement part) 3a is fixed. In addition, the structure in which the temperature measuring junction 3a is attached will be described later in detail.

接続腕部７は、コテ本体１１の左右端部から上方へ延設された縦長な構成部分であり、接続腕部７同士を互いに離間した状態で備えられている。また、接続腕部７の上部（延設端部）には、熱圧着装置のチップホルダー（図示せず）へ装着するための装着穴１７をヒーターチップ２の板厚方向へ貫通し、この装着穴１７に通した装着ボルト（図示せず）をチップホルダーへ螺合することにより、コテ先部１３を下に向けた姿勢でヒーターチップユニット１をチップホルダーへ装着するように構成されている。 The connecting arms 7 are vertically elongated components extending upward from the left and right ends of the iron body 11, and are provided in a state in which the connecting arms 7 are separated from each other. A mounting hole 17 for mounting to a chip holder (not shown) of a thermocompression bonding apparatus is formed in the upper portion (extending end) of the connecting arm 7 and penetrates the heater chip 2 in the plate thickness direction. By screwing a mounting bolt (not shown) passed through the hole 17 to the chip holder, the heater chip unit 1 is mounted to the chip holder with the soldering iron tip 13 facing downward.

なお、チップホルダーに装着されたヒーターチップユニット１においては、一方の接続腕部７が熱圧着装置のヒーター用電源（図示せず）の一端へ電気的に接続され、他方の接続腕部７がヒーター用電源の他端へ電気的に接続される。そして、電源（ヒーター用電源）からヒーターチップ２へ電流を流すと、電流が接続腕部７を介してコテ本体１１内に流れ、コテ本体１１内の電気抵抗によってコテ本体１１が発熱し、この熱によってコテ先部１３が昇温するように構成されている。また、コテ本体１１内の電流が一方の接続腕部７側から他方の接続腕部７側へ向かって流れるが、電流が流れる経路のうち、コテ凹部１５の隅部分に位置するくびれ箇所の断面積が他の箇所の断面積よりも狭くなっているため、このくびれ箇所で電流密度が最も高くなってこの部分を中心にして電気抵抗によるジュール熱を生じ易い。 In the heater chip unit 1 attached to the chip holder, one connection arm 7 is electrically connected to one end of a heater power source (not shown) of the thermocompression bonding apparatus, and the other connection arm 7 is connected to It is electrically connected to the other end of the heater power supply. When a current is supplied from a power source (heater power source) to the heater chip 2, the current flows into the iron body 11 through the connection arm 7, and the electrical resistance in the iron body 11 causes the iron body 11 to generate heat. It is configured so that the tip portion 13 of the soldering iron is heated by heat. In addition, the current in the iron body 11 flows from one connecting arm portion 7 side to the other connecting arm portion 7 side. Since the area is narrower than the cross-sectional area of other portions, the current density is highest at this constricted portion, and Joule heat due to electrical resistance is likely to occur around this portion.

さらに、ヒーターチップ２は、図１および図２（ｄ）に示すように、このヒーターチップ２の表裏両面において接続腕部７の下部からコテ本体１１に亘る範囲に、左右方向（一方の接続腕部７から他方の接続腕部７へ向かう方向）に沿って溝２０を本発明におけるえぐり部としてそれぞれ延在させ、この表裏の溝２０の延在によって薄肉部２１を形成して、コテ先部１３が薄肉部２１の下方に突設されるように構成されている。言い換えると、薄肉部２１がコテ先部１３から外れた位置（詳しくは、コテ先部１３よりも接続腕部７側）に形成されるように構成されている。 Further, as shown in FIGS. 1 and 2(d), the heater chip 2 has a lateral direction (one connecting arm The grooves 20 extend along the direction from the portion 7 toward the other connecting arm portion 7) as the gouged portion in the present invention, and the thin portion 21 is formed by the extension of the grooves 20 on the front and back sides to form the tip portion of the soldering iron. 13 is configured to protrude below the thin portion 21 . In other words, the thin portion 21 is formed at a position away from the tip portion 13 of the soldering iron (more specifically, the connecting arm portion 7 side of the tip portion 13 of the soldering iron).

また、図２（ｄ）に示すように、表裏の溝２０の深さ寸法（ヒーターチップ２の板厚方向の寸法）を同じに設定して、接続腕部７、コテ本体１１（薄肉部２１）、コテ先部１３の各厚さ方向の中央が同一平面上に位置するように構成されており、コテ先部１３の板厚を接続腕部７の板厚と同じに設定している。さらに、溝２０の底部となる薄肉部２１の表面をコテ本体１１の側面（表裏面）とし、コテ本体１１の板厚（薄肉部２１の板厚）が接続腕部７の板厚よりも薄く、且つ、コテ本体１１の断面積（言い換えると、電流が流れる流路としての断面積）が接続腕部７の断面積よりも小さく設定されるように構成されている。そして、コテ本体１１の側面の厚さｔ１を接続腕部７の厚さ（詳しくは、薄肉部２１を除いた接続腕部７の厚さ（接続腕部７のうち薄肉部２１から外れた箇所の厚さ））ｔ２よりも薄く形成している（図１および図２（ｄ）参照）。 Further, as shown in FIG. 2(d), the depth dimension of the grooves 20 on the front and back sides (the dimension in the plate thickness direction of the heater chip 2) is set to be the same, and the connecting arm portion 7 and the iron body 11 (thin portion 21) are set to be the same. ), the center of each thickness direction of the soldering iron tip 13 is positioned on the same plane, and the plate thickness of the soldering tip 13 is set to be the same as the plate thickness of the connecting arm 7 . Furthermore, the surface of the thin portion 21 that becomes the bottom of the groove 20 is the side surface (front and rear surface) of the iron body 11, and the thickness of the iron body 11 (the thickness of the thin portion 21) is thinner than the thickness of the connecting arm portion 7. In addition, the cross-sectional area of the iron body 11 (in other words, the cross-sectional area as a flow path through which current flows) is set smaller than the cross-sectional area of the connecting arm portion 7 . Then, the thickness t1 of the side surface of the iron body 11 is the thickness of the connection arm portion 7 (specifically, the thickness of the connection arm portion 7 excluding the thin portion 21 (the portion of the connection arm portion 7 that is separated from the thin portion 21). thickness)) is formed thinner than t2 (see FIGS. 1 and 2(d)).

次に、ヒーターチップ２に取り付けられている熱電対３、および、熱電対３を取り付けるためのヒーターチップ２上の構成について説明する。
熱電対３は、図１および図３に示すように、２種の素線２５の先端同士を溶接して球体状の測温接点（測温部）３ａを構成し、電気絶縁性を有する素線被覆材２６で各素線２５をそれぞれ被覆し、さらには外側被覆材２７の被覆により１本に束ねて導線３ｂを構成している。言い換えると、素線２５を含んで導線３ｂを構成している。さらに、測温接点３ａの直径および導線３ｂの線径をそれぞれヒーターチップ２の板厚よりも小さく設定している。 Next, the thermocouple 3 attached to the heater chip 2 and the structure on the heater chip 2 for attaching the thermocouple 3 will be described.
As shown in FIGS. 1 and 3, the thermocouple 3 is composed of a spherical temperature-measuring junction (temperature-measuring portion) 3a formed by welding the tips of two types of wires 25 together, and having electrical insulation. Each element wire 25 is covered with a wire covering material 26, and further covered with an outer covering material 27 so as to be bundled into one wire to constitute the conducting wire 3b. In other words, the conducting wire 3b includes the wire 25. As shown in FIG. Furthermore, the diameter of the temperature measuring junction 3a and the wire diameter of the lead wire 3b are set smaller than the plate thickness of the heater chip 2, respectively.

また、ヒーターチップ２においては、導線３ｂの収納箇所を接続腕部７同士の隙間に備え、測温接点３ａの止着箇所をコテ部６に備えている。具体的に説明すると、図１および図２（ａ），（ｂ）に示すように、接続腕部７の長手方向に沿って延在する接続腕部７同士の隙間を、上端部分が開放した導線収納空部３０として導線３ｂの線径よりもひと回り大きな広さ（太さ、幅）に設定し、この導線収納空部３０内に導線３ｂ（詳しくは、導線３ｂのうち測温接点３ａ寄りに位置する部分）をヒーターチップ２の表裏各面から導線３ｂが外方へ突出しない状態で収納している。そして、導線収納空部３０の上端部分の開放口３０ａから導線３ｂを延出し、導線収納空部３０の下端を拡開してコテ凹部１５へ連通している（図１参照）。 Further, in the heater chip 2, the space between the connection arms 7 is provided with a place for storing the conductor wire 3b, and the soldering iron portion 6 is provided with a place where the temperature measuring contact 3a is attached. Specifically, as shown in FIGS. 1 and 2(a) and (b), the gap between the connection arms 7 extending along the longitudinal direction of the connection arms 7 is opened at the upper end portion. The wire storage space 30 is set to have a width (thickness, width) slightly larger than the wire diameter of the wire 3b. ) are housed in a state in which the conductor 3b does not protrude outward from the front and back surfaces of the heater chip 2. As shown in FIG. The conductor wire 3b extends from an opening 30a at the upper end of the conductor housing space 30, and the lower end of the conductor housing space 30 is expanded to communicate with the iron recess 15 (see FIG. 1).

さらに、各接続腕部７には、導線収納空部３０に臨む側面の一部を切り欠いて止め凹部３１を導線収納空部３０に連通する状態でそれぞれ形成し、各止め凹部３１および導線収納空部３０の一部（止め凹部３１の間に位置する部分）には、紫外線硬化樹脂や熱硬化樹脂等の樹脂を注入した後に硬化（固化）して導線止め部３２を備え、この導線止め部３２により導線３ｂが導線収納空部３０からずれてヒーターチップ２から突出することを阻止している。 Further, in each connecting arm portion 7, a part of the side surface facing the conductor storage space 30 is cut away to form a stop recess 31 in a state of communicating with the wire storage space 30, and each stop recess 31 and the wire storage are formed. A portion of the empty portion 30 (the portion located between the recesses 31) is provided with a wire stopper portion 32 formed by injecting a resin such as an ultraviolet curable resin or a thermosetting resin and then hardening (hardening) the wire stopper. The portion 32 prevents the wire 3b from protruding from the heater chip 2 by being displaced from the wire storage space 30. As shown in FIG.

また、コテ部６に形成されたコテ凹部１５のうち導線収納空部３０の端部（下端部）に臨む箇所には、熱電対３の測温接点３ａが止着される測温止着部３５を上方の接続腕部７側へ突出した状態で備えている。測温止着部３５は、図３に示すように、コテ本体１１を挟んでコテ先部１３とは反対側に突設された突起部であり、コテ先部１３よりもひと回り小さく形成されている。また、導線収納空部３０側を向いた部分（この測温止着部３５の上部）には、測温接点３ａが接触する一対の止着接触面３５ａを備えて導線収納空部３０の端部へ対向させ、止着接触面３５ａ同士の離間距離がコテ部６側から上方の導線収納空部３０側へ向かうにつれて次第に拡開する状態に設定している。そして、各止着接触面３５ａをそれぞれ平面で構成することによりＶ字状の凹み３６を測温止着部３５の上部（導線収納空部３０側となる上部）に形成し、この凹み３６内に測温接点３ａを受けて止着接触面３５ａへ接触させ、この状態で溶接する等して測温接点３ａをコテ部６（測温止着部３５）へ止着している。 In addition, in a portion of the soldering iron concave portion 15 formed in the soldering iron portion 6 facing the end portion (lower end portion) of the lead wire storage space 30, there is a temperature measuring fixing portion to which the temperature measuring junction 3a of the thermocouple 3 is fixed. 35 is provided in a state of protruding toward the upper connecting arm portion 7 side. As shown in FIG. 3, the temperature measuring fixing portion 35 is a protrusion projecting on the opposite side of the soldering iron tip portion 13 with the soldering iron body 11 interposed therebetween, and is formed to be slightly smaller than the soldering iron tip portion 13 . there is A pair of fixing contact surfaces 35a with which the temperature measuring contacts 3a contact are provided in a portion (upper portion of the temperature measuring sealing portion 35) facing the conductor housing space 30 side, and the end of the conductor housing space 30 is provided with a pair of fixing contact surfaces 35a. , and the distance between the fastening contact surfaces 35a is set to gradually widen from the soldering iron portion 6 side toward the conductor wire storage cavity 30 side. A V-shaped recess 36 is formed in the upper portion of the temperature measurement fastening portion 35 (the upper portion on the side of the lead wire storage space 30) by configuring each fastening contact surface 35a as a flat surface. In this state, the temperature measuring contact 3a is fixed to the soldering iron portion 6 (temperature measuring fixing portion 35) by welding or the like.

次に、ヒーターチップユニット１の作製手順、特に、ヒーターチップ２への熱電対３の取り付け手順について説明する。
まず、図４（ａ）に示すように、予め別個に作製したヒーターチップ２と熱電対３とを、導線収納空部３０の開放口３０ａと測温接点３ａとが対向する状態で配置し、ヒーターチップ２および熱電対３の姿勢を設定して、測温止着部３５、導線収納空部３０、測温接点３ａ、導線３ｂをこの順番で同一直線上に並べる。ヒーターチップ２と熱電対３との姿勢を設定したならば、測温接点３ａを先頭にして熱電対３をヒーターチップ２の導線収納空部３０の開放口３０ａへ挿入する。すると、接続腕部７の側面がガイドとなって熱電対３をコテ部６側へ誘導する。 Next, a procedure for manufacturing the heater chip unit 1, particularly a procedure for attaching the thermocouple 3 to the heater chip 2 will be described.
First, as shown in FIG. 4(a), the heater chip 2 and the thermocouple 3, which are prepared separately in advance, are arranged in a state in which the opening 30a of the lead wire housing space 30 faces the temperature measuring junction 3a, The attitudes of the heater chip 2 and the thermocouple 3 are set, and the temperature measuring fixing portion 35, the lead wire housing space 30, the temperature measuring junction 3a, and the lead wire 3b are arranged in this order on the same straight line. After setting the postures of the heater chip 2 and the thermocouple 3, the thermocouple 3 is inserted into the opening 30a of the lead wire storage space 30 of the heater chip 2 with the temperature measuring junction 3a at the front. Then, the side surface of the connecting arm portion 7 serves as a guide to guide the thermocouple 3 toward the soldering iron portion 6 side.

さらに、熱電対３を深く挿入すると、図４（ｂ）に示すように、測温接点３ａが導線収納空部３０を通過した後にコテ凹部１５内へ進入する。ここで、図３（ａ）に示すように、コテ部６においては、導線収納空部３０の下端部（コテ部６側の開放端部）が臨む箇所に測温止着部３５を備え、Ｖ字状の止着接触面３５ａを導線収納空部３０の端部へ対向させているので、コテ凹部１５内に進入した測温接点３ａが測温止着部３５に到達して止着接触面３５ａに接触（当接）する。このようにして、測温接点３ａを止着接触面３５ａ（測温止着部３５）へ簡単且つ確実に当接することができる。したがって、測温接点３ａを測温止着部３５へ止着する準備をスムーズに行うことができる。 When the thermocouple 3 is further inserted, as shown in FIG. 4(b), the temperature measuring junction 3a enters the soldering iron recess 15 after passing through the lead wire storage cavity 30. As shown in FIG. Here, as shown in FIG. 3( a ), the soldering iron part 6 is provided with a temperature measuring fixing part 35 at a location facing the lower end of the conductor housing space 30 (the open end on the ironing part 6 side), Since the V-shaped fastening contact surface 35a is opposed to the end of the conductor housing space 30, the temperature measuring junction 3a entering the soldering iron recess 15 reaches the temperature measuring fastening portion 35 and makes fastening contact. It contacts (abuts) the surface 35a. In this way, the temperature measuring contact 3a can be brought into simple and reliable contact with the fixing contact surface 35a (temperature measuring fixing portion 35). Therefore, preparations for fixing the temperature measuring contact 3a to the temperature measuring fixing portion 35 can be smoothly performed.

そして、導線３ｂを測温止着部３５側へ押圧して測温止着部３５の止着接触面３５ａへの接触を維持し、この状態で測温止着部３５と止着接触面３５ａをレーザー溶接により止着（溶接）する。詳しくは、止着接触面３５ａにレーザーを照射して加熱し、この熱により測温接点３ａを溶かして止着（溶接）する。このとき、図３（ａ）に示すように、測温止着部３５において止着接触面３５ａ同士の離間距離がコテ部６側から上方へ向かうにつれて次第に拡開する状態に設定しているので、測温接点３ａを測温止着部３５へ十分に接触させることができる。したがって、測温接点３ａのヒーターチップ２への良好な止着、ひいては良好な測温が可能なヒーターチップユニット１を構成することができる。さらに、止着接触面３５ａを平面で構成し、測温接点３ａを球状体で構成しているので、測温接点３ａが止着接触面３５ａへ点接触し易い。また、測温接点３ａを止着接触面３５ａに押し付けることで、応力が集中し易くなって測温接点３ａが止着接触面３５ａから浮き難い。これにより測温接点３ａをヒーターチップ２へ一層良好に止着すること、ひいては、ヒーターチップ２の測温を一層良好に行うことができる。 Then, the lead wire 3b is pressed toward the temperature measuring fastening portion 35 to maintain the contact of the temperature measuring fastening portion 35 with the fastening contact surface 35a, and in this state, the temperature measuring fastening portion 35 and the fastening contact surface 35a are fixed (welded) by laser welding. More specifically, the fixing contact surface 35a is heated by irradiating it with a laser, and this heat melts and fixes (welds) the temperature measuring junction 3a. At this time, as shown in FIG. 3(a), the separation distance between the fixing contact surfaces 35a of the temperature measuring fixing portion 35 is set to gradually widen as it goes upward from the iron portion 6 side. , the temperature measuring junction 3a can be sufficiently brought into contact with the temperature measuring sealing portion 35. Therefore, it is possible to configure the heater chip unit 1 in which the temperature measuring contact 3a can be satisfactorily fixed to the heater chip 2, and thus the temperature can be satisfactorily measured. Furthermore, since the fixing contact surface 35a is formed of a flat surface and the temperature measuring contact 3a is formed of a spherical body, the temperature measuring contact 3a is easily in point contact with the fixing contact surface 35a. Further, by pressing the temperature measuring contact 3a against the fixed contact surface 35a, stress is likely to be concentrated, and the temperature measuring contact 3a is less likely to rise from the fixed contact surface 35a. As a result, the temperature measuring contact 3a can be more favorably attached to the heater chip 2, and the temperature of the heater chip 2 can be measured more favorably.

測温止着部３５に測温接点３ａを止着したならば、図４（ｃ）に示すように、導線収納空部３０の一部（止め凹部３１の間に位置する部分）および各止め凹部３１に紫外線硬化樹脂や熱硬化樹脂等の樹脂を硬化前の状態（流動状態）で注入して充填し、その後に紫外線照射や加熱等の樹脂硬化処理を施して樹脂を硬化して導線止め部３２とする。 After the temperature measuring junction 3a is fixed to the temperature measuring fixing portion 35, as shown in FIG. A resin such as an ultraviolet curable resin or a thermosetting resin is injected into the concave portion 31 in a pre-cured state (fluid state) and filled, and then subjected to a resin curing treatment such as ultraviolet irradiation or heating to cure the resin and stop the conductor. 32.

このようにして熱電対３をヒーターチップ２に取り付けて構成されたヒーターチップユニット１においては、熱電対３の導線３ｂを導線収納空部３０に収納したので、熱電対３の導線３ｂがヒーターチップ２の板厚の範囲からはみ出すことを避けることができる。したがって、熱圧着装置への装着作業等のヒーターチップユニット１の取り扱い時や、ヒーターチップユニット１の作業エリアへの進入時に、導線３ｂを不用意に引っ掛けてしまう不都合、ひいてはヒーターチップ２から熱電対３が脱落してしまう不都合が生じ難い。また、搬送（出荷）や保存の際に複数のヒーターチップユニット１をまとめようとする場合には、ヒーターチップユニット１を支障なく安定して重ねることができ、搬送作業や保存作業を滞りなく行うことができる。 In the heater chip unit 1 configured by attaching the thermocouple 3 to the heater chip 2 in this manner, the conductor wire 3b of the thermocouple 3 is housed in the conductor wire housing space 30, so that the conductor wire 3b of the thermocouple 3 is connected to the heater chip. 2 can be avoided. Therefore, when the heater chip unit 1 is handled, such as when it is attached to a thermocompression bonding apparatus, or when the heater chip unit 1 is moved into the work area, the lead wire 3b may be caught carelessly. The inconvenience of 3 dropping out is less likely to occur. In addition, when a plurality of heater chip units 1 are to be grouped together during transportation (shipment) or storage, the heater chip units 1 can be stably stacked without hindrance, and the transportation work and storage work can be performed without delay. be able to.

さらに、導線収納空部３０には導線止め部３２を備えたので、収納されている導線３ｂが導線収納空部３０から外れてしまう不都合を阻止することができる。また、導線収納空部３０内に注入されて硬化した樹脂を導線止め部３２としたので、接続腕部７と導線３ｂとの隙間に樹脂を導線止め部３２として入れ易くなり、導線３ｂを十分に止めることができる。そして、導線収納空部３０に連通する止め凹部３１を備え、導線止め部３２である樹脂が導線収納空部３０および止め凹部３１に注入されて硬化しているので、導線止め部３２が導線収納空部３０から脱落し難くなり、導線止め部３２とともに導線３ｂが導線収納空部３０から外れる不都合を抑えることができる。 Furthermore, since the conductor holding portion 32 is provided in the conductor housing space 30, the inconvenience that the housed conductor 3b comes off from the conductor housing space 30 can be prevented. In addition, since the resin that has been injected into the conductor housing space 30 and hardened is used as the conductor stopper 32, it is easy to insert the resin as the conductor stopper 32 into the gap between the connection arm 7 and the conductor 3b, and the conductor 3b is sufficiently secured. can be stopped. A stopper recess 31 that communicates with the conductor housing space 30 is provided, and the resin serving as the conductor stopper 32 is injected into the conductor housing space 30 and the stopper recess 31 and hardened, so that the conductor stopper 32 can accommodate the conductor. It becomes difficult to fall out of the space 30, and the inconvenience of the wire 3b coming off from the wire storage space 30 together with the wire stopper 32 can be suppressed.

そして、ヒーターチップユニット１を用いて端子部材Ｂに端子用導線Ａを熱圧着する作業としては、まず、熱圧着装置のチップホルダーにヒーターチップユニット１をコテ先部１３が下側となる姿勢で装着し、熱電対３の導線３ｂを熱圧着装置の熱電対接続端子（図示せず）へ接続する。その後、チップホルダーの下方に設けられた作業エリア（いずれも図示せず）に端子部材Ｂと端子用導線Ａとをセットし、端子部材Ｂの上面に端子用導線Ａを重ねる。端子部材Ｂと端子用導線Ａとをセットしたならば、チップホルダーとともにヒーターチップユニット１を下降させてコテ先部１３を端子用導線Ａへ押圧し、さらにはヒーターチップ２への通電によりコテ本体１１を発熱させて、端子部材Ｂに端子用導線Ａを熱圧着する。また、熱電対３によりコテ部６の温度を測定し、熱圧着装置の制御部（図示せず）がこの測定値に基づいてヒーターチップ２への通電制御、さらにはコテ先部１３の温度制御を行う。 Then, as the operation of thermocompression bonding the terminal conductor A to the terminal member B using the heater chip unit 1, first, the heater chip unit 1 is placed on the tip holder of the thermocompression bonding device with the iron tip 13 facing downward. After mounting, the lead wire 3b of the thermocouple 3 is connected to a thermocouple connection terminal (not shown) of the thermocompression bonding device. After that, the terminal member B and the terminal wire A are set in a working area (both not shown) provided below the chip holder, and the terminal wire A is placed on the upper surface of the terminal member B. After the terminal member B and the terminal wire A are set, the heater chip unit 1 is lowered together with the tip holder to press the iron tip 13 against the terminal wire A, and furthermore, the heater chip 2 is energized to move the iron body. 11 is heated to thermocompression bond the terminal wire A to the terminal member B. As shown in FIG. Further, the temperature of the soldering iron part 6 is measured by the thermocouple 3, and the control part (not shown) of the thermocompression bonding apparatus controls the energization to the heater chip 2 and the temperature of the soldering iron tip part 13 based on this measured value. I do.

ここで、発熱するヒーターチップ２においては、コテ本体１１の板厚を接続腕部７の板厚よりも薄く設定し、コテ本体１１の断面積を接続腕部７の断面積よりも小さく設定したので、ヒーターチップ２の板厚を厚くしたとしても、コテ本体１１での電流密度が低下して発熱が不十分となってしまう不都合を抑えることができる。したがって、ヒーターチップ２の板厚の増減に拘らず良好な発熱効率を実現し易い。また、コテ本体１１の体積の増加、ひいては熱容量の増加を避けることができ、コテ本体１１やコテ先部１３の冷却を迅速に行い易い。さらに、接続腕部７の下部からコテ本体１１に亘る範囲に溝２０を延在させて薄肉部２１を形成し、溝２０の底部となる薄肉部２１の表面をコテ本体１１の側面としたので、コテ本体１１の板厚が接続腕部７の板厚よりも薄いヒーターチップ２の構造を簡単に実現することができる。 Here, in the heater chip 2 that generates heat, the plate thickness of the iron body 11 is set thinner than the plate thickness of the connection arm portion 7, and the cross-sectional area of the iron body 11 is set smaller than the cross-sectional area of the connection arm portion 7. Therefore, even if the thickness of the heater chip 2 is increased, it is possible to prevent the problem that the current density in the iron body 11 is lowered and heat generation becomes insufficient. Accordingly, good heat generation efficiency can be easily achieved regardless of the increase or decrease in the plate thickness of the heater chip 2 . In addition, an increase in the volume of the iron body 11 and thus an increase in heat capacity can be avoided, and the iron body 11 and the tip 13 can be cooled quickly. Further, the thin portion 21 is formed by extending the groove 20 from the lower portion of the connecting arm portion 7 to the iron body 11 , and the surface of the thin portion 21 serving as the bottom of the groove 20 is used as the side surface of the iron body 11 . , the structure of the heater chip 2 in which the plate thickness of the iron body 11 is thinner than the plate thickness of the connecting arm portion 7 can be easily realized.

また、薄肉部２１の下方にコテ先部１３を突設したので、熱圧着作業によって異物（端子用導線Ａの絶縁被膜等）がコテ先部１３に付着した場合には、コテ先部１３の先端を研磨する等して異物を除去し易い。さらに、コテ先部１３の先端の研磨代を十分に確保することができ、ヒーターチップユニットの交換サイクル（使用寿命）の長期化を図ることができる。そして、薄肉部２１をコテ先部１３よりも接続腕部７側に形成して、コテ本体１１の側面の厚さを薄肉部２１を除いた接続腕部７の厚さよりも薄く形成したので、コテ本体１１での電流密度の低下を抑制しながらも、コテ先部１３の先端面における板厚方向の寸法を十分に確保することができる。これにより、ヒーターチップ２が熱圧着可能なワーク（熱圧着対象）の大きさの許容範囲を広げることができる。また、薄肉部２１をコテ先部１３から外れた位置に形成し、コテ先部１３の板厚を接続腕部７の板厚と同じに設定したので、コテ先部１３の板厚を接続腕部７の板厚に対して増減させる必要がなく、ヒーターチップ２を製造し易い。 In addition, since the soldering iron tip 13 is protruded below the thin portion 21, when a foreign matter (such as an insulating coating of the terminal lead wire A) adheres to the soldering iron tip 13 due to the thermocompression bonding operation, the soldering iron tip 13 will not be removed. Foreign matter can be easily removed by polishing the tip. Furthermore, it is possible to ensure a sufficient polishing margin for the tip of the tip 13 of the soldering iron, and to prolong the replacement cycle (service life) of the heater tip unit. The thin portion 21 is formed closer to the connecting arm portion 7 than the iron tip portion 13, and the thickness of the side surface of the iron body 11 is formed thinner than the thickness of the connecting arm portion 7 excluding the thin portion 21. It is possible to sufficiently ensure the thickness direction dimension of the tip surface of the tip portion 13 while suppressing a decrease in the current density in the iron body 11 . This makes it possible to widen the permissible range of sizes of workpieces (to be subjected to thermocompression bonding) to which the heater chip 2 can be thermocompression bonded. Further, since the thin portion 21 is formed at a position separated from the soldering iron tip portion 13 and the plate thickness of the soldering iron tip portion 13 is set to be the same as the plate thickness of the connecting arm portion 7, the plate thickness of the soldering iron tip portion 13 is equal to that of the connecting arm portion. It is not necessary to increase or decrease the plate thickness of the portion 7, and the heater chip 2 can be easily manufactured.

さらに、接続腕部７、コテ本体１１、コテ先部１３の各厚さ方向の中央が同一平面上に位置するので、熱圧着作業時にヒーターチップ２内で曲げモーメントが発生し難くなり、ヒーターチップ２に余計な負荷が掛かる不都合、ひいてはヒーターチップ２が損傷し易くなる不都合を抑えることができる。そして、ヒーターチップ２のコテ部６に温度センサーとして熱電対３を取り付けたので、コテ部６の温度の情報を取得してヒーターチップ２の発熱の制御に活用することができる。また、温度センサーを簡単な構成で実現することができる。 Furthermore, since the thickness direction centers of the connecting arm portion 7, the iron body 11, and the iron tip portion 13 are located on the same plane, it is difficult for a bending moment to occur in the heater chip 2 during the thermocompression bonding operation. It is possible to suppress the inconvenience that an extra load is applied to the heater chip 2 and eventually the inconvenience that the heater chip 2 is likely to be damaged. Since the thermocouple 3 is attached to the soldering iron portion 6 of the heater chip 2 as a temperature sensor, information on the temperature of the soldering iron portion 6 can be acquired and used to control heat generation of the heater chip 2 . Also, the temperature sensor can be realized with a simple configuration.

ところで、上記実施形態では、ヒーターチップ２の表裏両面に溝２０をそれぞれ延在させて薄肉部２１を形成することによりコテ本体１１を構成したが、本発明はこれに限定されない。要は、コテ本体１１の板厚が接続腕部７の板厚よりも薄く、且つ、コテ本体１１の断面積を接続腕部７の断面積よりも小さく設定すれば、どのような態様のコテ本体１１をヒーターチップ２に備えてもよい。例えば、ヒーターチップ２の表面または裏面のいずれかに溝を延在させて薄肉部２１を形成してコテ本体１１を構成してもよい。しかしながら、コテ本体１１がヒーターチップ２の表裏いずれかに偏って位置することになり、これにより、熱圧着作業時にはヒーターチップ２内に曲げモーメントが発生してしまうので、接続腕部７、コテ本体１１、コテ先部１３の各厚さ方向の中央が同一平面上に位置する構成、すなわち、上記実施形態の構成を採用することが好適である。なお、コテ本体１１は、電気抵抗値が最も高い部分（発熱部となる部分）を含んだ構成であればよい。このため、溝等により薄肉化を図る領域は、接続腕部７内に及んでもよいし、必ずしもコテ本体１１の全域ではなくてもよい。 By the way, in the above-described embodiment, the iron body 11 is configured by extending the grooves 20 on both the front and back surfaces of the heater chip 2 to form the thin portions 21, but the present invention is not limited to this. In short, if the iron body 11 is thinner than the connection arm 7 and the cross-sectional area of the iron body 11 is set to be smaller than the cross-sectional area of the connection arm 7, what type of iron can be used? A main body 11 may be provided on the heater chip 2 . For example, the soldering iron main body 11 may be configured by extending a groove on either the front surface or the rear surface of the heater chip 2 to form the thin portion 21 . However, the iron body 11 will be positioned biased to either the front or back of the heater chip 2, and as a result, a bending moment will be generated in the heater chip 2 during the thermocompression bonding operation. 11. It is preferable to employ the configuration in which the centers of the soldering iron tips 13 in the respective thickness directions are located on the same plane, that is, the configuration of the above embodiment. It should be noted that the iron body 11 may have any configuration as long as it includes a portion having the highest electrical resistance value (a portion serving as a heat generating portion). Therefore, the area where the thickness is reduced by the groove or the like may extend to the inside of the connecting arm portion 7, and may not necessarily be the entire area of the iron body 11. FIG.

また、コテ先部１３の板厚と接続腕部７の板厚とを同じ寸法に設定したが、本発明はこれに限定されない。例えば、コテ先部１３の板厚を削って接続腕部７の板厚よりも薄く設定すれば、コテ先部１３の板厚寸法の自由度を増すことができ、熱圧着処理を施すワーク（端子部材Ｂ，端子用導線Ａ）の大きさに対応したヒーターチップ２を設計し易い。さらに、図３に示すように、測温止着部３５をコテ先部１３よりもひと回り小さく構成したが、本発明はこれに限定されない。例えば、コテ先部１３の体積と測温止着部３５の体積とを揃えて、コテ先部１３の熱容量と測温止着部３５の熱容量との差が極端に異なることを避けるように設定すれば、測温止着部３５での温度変化とコテ先部１３での温度変化とを同期させようとすることができ、測温止着部３５の測温に基づいてコテ先部１３の温度管理を実行し易い。 Also, the thickness of the soldering iron tip 13 and the thickness of the connection arm 7 are set to be the same, but the present invention is not limited to this. For example, if the thickness of the soldering iron tip 13 is reduced to be smaller than the thickness of the connection arm 7, the thickness of the soldering iron tip 13 can be increased in flexibility, and the workpiece ( It is easy to design the heater chip 2 corresponding to the size of the terminal member B and the lead wire for terminal A). Furthermore, as shown in FIG. 3, the temperature measuring fixing part 35 is configured to be slightly smaller than the iron tip part 13, but the present invention is not limited to this. For example, the volume of the soldering iron tip 13 and the volume of the temperature measuring sealing part 35 are set to be the same so that the difference between the heat capacities of the soldering iron tip part 13 and the temperature measuring sealing part 35 is set so as to avoid an extreme difference. Then, it is possible to synchronize the temperature change at the temperature measuring fixing portion 35 with the temperature change at the soldering iron tip portion 13, and the temperature measurement of the iron tip portion 13 based on the temperature measurement of the temperature measuring fixing portion 35. Easy to implement temperature control.

さらに、測温止着部３５の止着接触面３５ａを平面で構成したが、本発明はこれに限定されない。要は、止着接触面３５ａ同士の離間距離がコテ部６側から上方へ向かうにつれて次第に拡開する状態に設定されれば、止着接触面３５ａを曲面で構成してもよい。そして、止着接触面３５ａに測温接点（測温部）３ａを十分に接触することができれば、この測温接点３ａを球状体に形成することには限定されず、どのような形状に形成してもよい。また、熱電対３の測温接点３ａと測温止着部３５とを溶接して止着しているが、本発明はこれに限定されない。要は、コテ部６の測温が可能であれば、測温接点３ａと測温止着部３５との止着態様は問わない。例えば、熱伝導が良好な止着剤（接着剤）を用いて測温接点３ａと測温止着部３５とを止着してもよい。 Furthermore, although the fixing contact surface 35a of the temperature measuring fixing part 35 is configured as a flat surface, the present invention is not limited to this. In short, the fixing contact surfaces 35a may be curved surfaces as long as the separation distance between the fixing contact surfaces 35a is set so as to gradually widen upward from the iron portion 6 side. As long as the temperature measuring junction (temperature measuring portion) 3a can be sufficiently brought into contact with the fixed contact surface 35a, the temperature measuring junction 3a is not limited to being formed in a spherical shape, and can be formed in any shape. You may Moreover, although the temperature measuring junction 3a of the thermocouple 3 and the temperature measuring fastening part 35 are welded and fastened, the present invention is not limited to this. In short, as long as the temperature of the soldering iron portion 6 can be measured, the fixing manner of the temperature measuring junction 3a and the temperature measuring fixing portion 35 does not matter. For example, the temperature measuring junction 3a and the temperature measuring fastening portion 35 may be fastened together using a fastening agent (adhesive) with good heat conductivity.

そして、上記実施形態のヒーターチップ２においては、導線収納空部３０を接続腕部７の長手方向に沿って直線状に延在させて備えているが、本発明はこれに限定されない。要は、熱電対３の導線３ｂを収納可能な構成であれば、どのような態様の導線収納空部３０を適用してもよい。例えば、屈曲線状や湾曲線状に延在する導線収納空部３０を適用してもよい。また、紫外線硬化樹脂や熱硬化樹脂等の樹脂を本発明における導線止め部３２として例示したが、本発明はこれに限定されない。要は、導線収納空部３０内に収納された導線３ｂを止めて導線収納空部３０からの脱落を阻止することができれば、導線止め部３２の態様は問わない。例えば、導線収納空部３０に嵌合可能なキャップを導線止め部として採用してもよいし、あるいは、接続腕部７に一体成形され、導線収納空部３０側へ突出した突起を導線止め部として採用してもよい。 In the heater chip 2 of the above-described embodiment, the conductor wire storage space 30 is provided so as to extend linearly along the longitudinal direction of the connection arm 7, but the present invention is not limited to this. In short, as long as it is configured to accommodate the conductive wire 3b of the thermocouple 3, any form of the conductive wire storage cavity 30 may be applied. For example, the conductor wire storage space 30 extending in a bent line shape or a curved line shape may be applied. Moreover, although resins, such as an ultraviolet curing resin and a thermosetting resin, were illustrated as the wire fixing|fastening part 32 in this invention, this invention is not limited to this. In short, the form of the wire stopper 32 does not matter as long as it can stop the wire 3b stored in the wire storage space 30 and prevent it from coming off from the wire storage space 30 . For example, a cap that can be fitted into the conductor housing space 30 may be employed as the conductor stopper, or a projection that is integrally formed on the connection arm 7 and protrudes toward the conductor housing space 30 may be used as the conductor stopper. may be adopted as

また、導線収納空部３０に連通する止め凹部３１を導線収納空部３０の側面の浅い切り欠きにより構成したが、本発明はこれに限定されない。要は、導線止め部３２である樹脂が導線収納空部３０から止め凹部３１に亘って注入されて硬化可能であれば、止め凹部３１の構成はどのような態様を採用してもよい。例えば、接続腕部７の表裏両面に溝状の止め凹部をそれぞれ形成し、この止め凹部の端部を導線収納空部３０へ連通して樹脂（導線止め部３２）が導線収納空部３０から止め凹部に亘って注入されるように構成してもよい。 Moreover, although the stop recess 31 communicating with the conductor housing space 30 is formed by a shallow notch in the side surface of the conductor housing space 30, the present invention is not limited to this. In short, as long as the resin that forms the wire stopper portion 32 can be injected from the wire storage cavity 30 to the stopper recess 31 and hardened, any configuration of the stopper recess 31 may be employed. For example, groove-like stopper recesses are formed on both the front and back surfaces of the connecting arm portion 7, respectively, and the ends of the stopper recesses are communicated with the conductor housing space 30 so that the resin (conductor stopper 32) is released from the conductor housing space 30. It may be configured to be injected across the stop recess.

さらに、上記実施形態では、熱電対３を本発明の温度センサーとして例示し、熱電対３の測温接点３ａを本発明の測温部として例示したが、これに限定されない。要は、コテ部６の測温が可能であり、導線３ｂの端部に測温部を備えて構成された温度センサーであれば、どのような態様の温度センサーを採用してヒーターチップ２に取り付けてもよい。 Furthermore, in the above embodiment, the thermocouple 3 is exemplified as the temperature sensor of the present invention, and the temperature measuring junction 3a of the thermocouple 3 is exemplified as the temperature measuring portion of the present invention, but the present invention is not limited to this. The point is that any temperature sensor that can measure the temperature of the soldering iron part 6 and has a temperature measuring part at the end of the lead wire 3b can be used for the heater chip 2. may be installed.

ところで、上記実施形態では、溝２０を本発明におけるえぐり部として例示したが、本発明はこれに限定されない。要は、一方の接続腕部から他方の接続腕部へ向かう方向に沿ってえぐり部を延在させることにより薄肉部がヒーターチップに形成されれば、えぐり部をどのような態様に設定してもよい。例えば、図５および図６に示す第２実施形態のヒーターチップ２′おいては、基本的には上記実施形態（第１実施形態）と同じであるが、ヒーターチップ２′の表裏両面だけではなく、ヒーターチップ２′の板厚方向の中間部分にもえぐり部を形成してヒーターチップ２′の下半部分を二股に分岐させ、これにより２脚のコテ本体を有している点で異なる。 By the way, in the above-described embodiment, the groove 20 is exemplified as the gouged portion in the present invention, but the present invention is not limited to this. The point is, if the thin portion is formed in the heater chip by extending the gouged portion along the direction from one connecting arm portion to the other connecting arm portion, in what form the gouged portion is set. good too. For example, the heater chip 2' of the second embodiment shown in FIGS. 5 and 6 is basically the same as the above-described embodiment (first embodiment), but only the front and back surfaces of the heater chip 2' However, a gouged portion is also formed in the middle portion of the heater chip 2' in the plate thickness direction to bifurcate the lower half of the heater chip 2', thereby providing a two-legged iron body. .

具体的に説明すると、ヒーターチップ２′は、このヒーターチップ２′の下部に位置するコテ部６′のうち板厚方向の中間部分に、左右方向（一方の接続腕部７から他方の接続腕部７へ向かう方向）に沿って延在するコテ空間部４０をえぐり部として形成し、このコテ空間部４０を下方へ開放している。そして、コテ空間部４０を挟んでヒーターチップ２′の表裏両側にコテ本体１１とコテ先部１３とをそれぞれ備えている。言い換えると、ヒーターチップ２′のコテ部６′には、互いに離間した２つのコテ本体１１、および互いに離間した２つのコテ先部１３を備えている。さらに、各コテ本体１１においては、外側の面に溝２０を形成し、内側の面にも溝２０′を形成し、また、測温止着部３５が突設されたコテ凹部１５をそれぞれ備え、各測温止着部３５に熱電対３の測温接点（測温部）３ａを止着可能とし、各コテ先部１３においては、このコテ先部１３の板厚を接続腕部７の板厚よりも薄く設定されている。 More specifically, the heater chip 2' has an intermediate portion in the plate thickness direction of the soldering iron portion 6' positioned below the heater chip 2', and is laterally (from one connecting arm portion 7 to the other connecting arm portion) an intermediate portion thereof. The soldering iron space 40 extending along the direction toward the portion 7) is formed as a gouged portion, and the soldering iron space 40 is opened downward. A soldering iron main body 11 and a soldering iron tip 13 are provided on both front and back sides of the heater chip 2' with the soldering iron space 40 interposed therebetween. In other words, the soldering iron portion 6' of the heater chip 2' includes two soldering iron bodies 11 separated from each other and two soldering iron tips 13 separated from each other. Further, each iron body 11 has a groove 20 formed on its outer surface and a groove 20' formed also on its inner surface, and has a soldering iron concave portion 15 with a temperature measuring fixing portion 35 projecting therefrom. , the temperature measuring junction (temperature measuring part) 3 a of the thermocouple 3 can be fixed to each temperature measuring fixing part 35 . It is set thinner than the plate thickness.

このようなコテ部６′を備えたヒーターチップ２′を構成すれば、２つのコテ先部１３によって同時に２箇所の熱圧着処理を行うことができ、熱圧着作業の効率の向上を図ることができる。また、コテ空間部４０の板厚方向の寸法の設定によって、２つのコテ先部１３の離間距離（ピッチ）や各コテ先部１３のコテ先面１３ａの大きさをワークに応じて調整することができる。 By constructing the heater chip 2' having such a soldering iron portion 6', the two soldering iron tips 13 can simultaneously carry out thermal compression bonding at two locations, thereby improving the efficiency of the thermal compression bonding operation. can. Also, by setting the dimension of the soldering iron space 40 in the plate thickness direction, the separation distance (pitch) between the two soldering iron tip portions 13 and the size of the soldering iron tip surface 13a of each soldering iron tip portion 13 can be adjusted according to the workpiece. can be done.

また、前記した実施形態においては、ヒーターチップの表面に耐酸化性被膜層を形成して耐酸化性を高めてもよい。 Further, in the above-described embodiment, an oxidation-resistant coating layer may be formed on the surface of the heater chip to enhance oxidation resistance.

以下、耐酸化性被膜層について説明する。
ヒーターチップにおいては、熱圧着の度に昇温、冷却を繰り返すので、表面が酸化し易く、特に、コテ部６（発熱部）近傍、および熱電対３を溶着した部分においては酸化が顕著である。このため、発熱部近傍の酸化部分が剥離して強度が低下してしまい加圧時に破損する不都合が生じたり、また、熱電対の溶着部分が腐食することで強度が低下して、遂には熱電対が離脱して使用できないなどの不都合が発生する。 The oxidation-resistant coating layer will be described below.
Since the heater chip is repeatedly heated and cooled each time it is thermocompressed, the surface is easily oxidized, and the oxidation is particularly noticeable in the vicinity of the soldering iron portion 6 (heat generating portion) and the portion where the thermocouple 3 is welded. . For this reason, the oxidized portion near the heat-generating portion peels off and the strength decreases, causing the inconvenience of breakage during pressurization. Inconvenience such as unusable due to separation of the pair occurs.

そこで、本実施形態においては、ヒーターチップの表面に耐酸化性被膜層を形成して耐酸化性を高めた。以下、製造工程を含めて具体的に説明する。
まず、素材（母材）となる金属板について、具体的には、従来一般的に用いられていたタングステン（硬度ＨＶ４３０程度）、タングステン合金（硬度ＨＶ２００～４００程度）よりも耐研磨性に優れたいわゆる超硬材（硬度ＨＶ９００～２４００）（正式名；超硬質合金、硬質の金属炭化物の粉末を焼結した合金）を使用することが望ましく、この超硬材の板材をワイヤーカットにより所定形状に切り出す。次に、この切り出し片にメッキ前処理を施し、その後に溶解槽に浸漬して通電することで前記切り出し片の表面にニッケルによる耐酸化性被膜層を形成、即ち、ニッケルメッキを施す。その後、溶解槽から引き揚げて洗浄等の後処理を施す。
そして、前記した実施形態と同様に、測温止着部３５に熱電対３の測温接点３ａをレーザー溶接する。この溶接において、測温止着部３５の表面（止着接触面３５ａ）にニッケル層の被膜が形成されているので濡れ性が高められ、これにより溶接の確実性、溶接強度が向上する。また、溶接時の濡れ性が高められるとレーザーの出力を従来よりも抑制することができるとともに母材へのダメージを抑制することができ、品質向上とエネルギー消費の節約を図ることができる。
熱電対３の溶接が終了したならば、更にメッキ前処理を施し、熱電対３を装着したヒーターチップユニット１を電解液に浸漬し、熱電対３の測温接点３ａを含めた全体の表面にニッケルメッキを施す。 Therefore, in the present embodiment, an oxidation resistant film layer is formed on the surface of the heater chip to enhance the oxidation resistance. A detailed description will be given below, including the manufacturing process.
First, with regard to the metal plate as the material (base material), specifically, it has better polishing resistance than tungsten (about HV430 in hardness) and tungsten alloy (about HV200 to 400 in hardness) that have been commonly used in the past. It is desirable to use so-called cemented carbide (hardness HV900 to 2400) (formal name: cemented carbide, alloy obtained by sintering powder of hard metal carbide), and a plate material of this cemented carbide is wire-cut into a predetermined shape. break the ice. Next, the cut piece is subjected to pre-plating treatment, and then immersed in a dissolution tank and energized to form an oxidation-resistant coating layer of nickel on the surface of the cut piece, ie, nickel plating. After that, it is pulled up from the dissolving tank and subjected to post-treatment such as cleaning.
Then, the temperature measuring junction 3a of the thermocouple 3 is laser-welded to the temperature measuring sealing portion 35 in the same manner as in the above-described embodiment. In this welding, wettability is enhanced because the nickel layer coating is formed on the surface of the temperature measuring fixing portion 35 (fixing contact surface 35a), thereby improving the reliability of welding and the welding strength. In addition, if the wettability during welding is improved, the output of the laser can be suppressed and the damage to the base material can be suppressed, so that the quality can be improved and the energy consumption can be saved.
When the welding of the thermocouple 3 is completed, the pre-plating treatment is further performed, the heater chip unit 1 with the thermocouple 3 attached is immersed in the electrolyte, and the entire surface including the temperature measuring junction 3a of the thermocouple 3 is Nickel plating.

この様にして作製したヒーターチップユニット１を使用すると、耐酸化性が向上するので、コテ部６や熱電対３の取付部分の酸化に起因する剥離や強度低下を抑制することができ、これにより耐久性を向上させることができる。特に、母材に超硬材を使用してニッケルメッキを施すと、濡れ性が向上して溶接性も向上させることができ、耐久性を確実に向上させることができる。なお、熱電対は主成分がニッケルなので、ニッケルメッキが親和性が良い。また、耐酸化性被膜は、ニッケルメッキに限らず、例えば、金メッキなどでもよい。 When the heater chip unit 1 manufactured in this way is used, the oxidation resistance is improved, so that peeling and reduction in strength due to oxidation of the soldering iron portion 6 and the attachment portion of the thermocouple 3 can be suppressed. Durability can be improved. In particular, when a cemented carbide base material is used and nickel-plated, the wettability and weldability can be improved, and the durability can be reliably improved. Since the main component of the thermocouple is nickel, nickel plating has good affinity. Moreover, the oxidation-resistant film is not limited to nickel plating, and may be gold plating, for example.

前記した実施の形態は全ての点で例示であって制限的なものではないと考えられるべきである。本発明は、上記した説明に限らず特許請求の範囲によって示され、特許請求の範囲と均等の意味及び範囲内での全ての変更が含まれるものである。 It should be considered that the above-described embodiments are illustrative in all respects and not restrictive. The present invention is defined not only by the above description but also by the scope of the claims, and includes all modifications within the scope and meaning equivalent to the scope of the claims.

１ ヒーターチップユニット
２，２′ ヒーターチップ
３ 熱電対
３ａ 測温接点
３ｂ 導線
６，６′ コテ部
７ 接続腕部
１１ コテ本体
１３ コテ先部
１３ａ コテ先面
１５ コテ凹部
１７ 装着穴
２０，２０′ 溝
２１ 薄肉部
２５ 素線
２６ 素線被覆材
２７ 外側被覆材
３０ 導線収納空部
３０ａ 開放口
３１ 止め凹部
３２ 導線止め部
３５ 測温止着部
３５ａ 止着接触面
３６ 凹み
４０ コテ空間部 1 heater chip unit 2, 2' heater chip 3 thermocouple 3a temperature measuring junction 3b lead wire 6, 6' iron part 7 connecting arm part 11 iron body 13 iron tip part 13a iron tip surface 15 iron recess part 17 mounting hole 20, 20' Groove 21 Thin portion 25 Wire 26 Wire coating material 27 Outer coating material 30 Conductor wire storage space 30a Open port 31 Stop recess 32 Conductor wire stop 35 Temperature measurement sealing portion 35a Fastening contact surface 36 Recess 40 Soldering iron space

Claims (5)

端子用導線を端子部材に熱圧着するための板状のヒーターチップに温度センサーを取り付けたヒーターチップユニットであって、
前記ヒーターチップは、
前記端子用導線に当接するコテ先部をコテ本体に備えたコテ部と、
前記コテ本体の左右端部から上方へ互いに離間した状態で延設され、電源からの電流をコテ本体に流してコテ部を昇温させる一対の接続腕部と、
前記コテ部に設けられ、温度センサーの測温部が止着される測温止着部と、
を備え、
前記測温止着部は、測温部が接触する一対の止着接触面を備え、止着接触面同士の離間距離がコテ部側から上方へ向かうにつれて次第に拡開する状態に設定し、
前記接続腕部同士の隙間を導線収納空部として温度センサーの導線を導線収納空部へ収納し、
前記止着接触面を導線収納空部の端部へ対向させたことを特徴とするヒーターチップユニット。 A heater chip unit in which a temperature sensor is attached to a plate-shaped heater chip for thermocompression bonding a terminal conductor to a terminal member,
The heater chip is
a soldering iron part having a soldering iron body provided with a soldering tip part that abuts on the terminal conductor;
a pair of connection arms extending upward from the right and left ends of the iron body while being spaced apart from each other, and configured to flow a current from a power supply to the iron body to raise the temperature of the iron body;
a temperature measuring fixing portion provided in the iron portion and to which the temperature measuring portion of the temperature sensor is fixed;
with
The temperature measuring fixing part has a pair of fixing contact surfaces with which the temperature measuring part contacts, and the distance between the fixing contact surfaces is set to gradually widen as it goes upward from the soldering iron part side ,
The gap between the connecting arms is used as a wire storage space, and the wire of the temperature sensor is stored in the wire storage space,
A heater chip unit , wherein the fixing contact surface is opposed to the end of the lead wire storage space . 前記止着接触面を平面で構成し、前記測温部を球状体で構成したことを特徴とする請求項１に記載のヒーターチップユニット。 2. A heater chip unit according to claim 1, wherein said fixing contact surface is a flat surface, and said temperature measuring portion is a spherical body. 前記ヒーターチップは、少なくとも前記コテ部と測温止着部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項１または請求項２に記載のヒーターチップユニット。3. The heater chip unit according to claim 1, wherein the heater chip has an oxidation-resistant coating layer formed on at least the surface of the soldering iron portion and the temperature measuring fixing portion. 前記測温止着部に止着された測温部の表面に耐酸化性被膜層が形成されていることを特徴とする請求項３に記載のヒーターチップユニット。4. The heater chip unit according to claim 3, wherein an oxidation-resistant coating layer is formed on the surface of the temperature measuring portion secured to the temperature measuring fixing portion. 前記耐酸化性被膜層がニッケル被膜であることを特徴とする請求項３または請求項４に記載のヒーターチップユニット。5. A heater chip unit according to claim 3, wherein said oxidation-resistant coating layer is a nickel coating.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424930A (en) * 1981-06-29 1984-01-10 Cooper Industries, Inc. Carbon-based soldering and de-soldering tip and method of manufacturing same
US5297716A (en) * 1993-04-12 1994-03-29 Honeywell Inc. Soldering tool with attached thermocouple
JP3968205B2 (en) 2000-03-30 2007-08-29 太陽誘電株式会社 Heater chip for thermocompression bonding and manufacturing method thereof
JP4224050B2 (en) * 2005-10-31 2009-02-12 日本アビオニクス株式会社 Heater chip thermocouple mounting structure and thermocouple mounting method
KR20120004484A (en) * 2009-03-27 2012-01-12 에이티에스 오토메이션 툴링 시스템즈 인코포레이티드 Thermode, clamping arrangement therefor, and method of manufacture
JP2010253503A (en) * 2009-04-23 2010-11-11 Miyachi Technos Corp Heater chip and joining apparatus
JP5457107B2 (en) * 2009-05-19 2014-04-02 ミヤチテクノス株式会社 Heater chip and joining device
JP2012183552A (en) * 2011-03-04 2012-09-27 Miyachi Technos Corp Heater tip, joining device, and joining method
JP6677406B2 (en) * 2015-09-25 2020-04-08 株式会社 工房Ｐｄａ Heater chip, joining device and joining method
JP6851610B2 (en) * 2016-07-19 2021-03-31 株式会社 工房Ｐｄａ Heater tip and joining device and joining method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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