TWI751196B - 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 - Google Patents

含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 Download PDF

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TWI751196B
TWI751196B TW106131597A TW106131597A TWI751196B TW I751196 B TWI751196 B TW I751196B TW 106131597 A TW106131597 A TW 106131597A TW 106131597 A TW106131597 A TW 106131597A TW I751196 B TWI751196 B TW I751196B
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metal
atom
containing nitride
group
curable composition
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TW106131597A
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Chinese (zh)
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TW201815682A (zh
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浜田大輔
久保田誠
田口貴規
坂本裕貴
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日商富士軟片股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/076—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with titanium or zirconium or hafnium
    • C01B21/0763—Preparation from titanium, zirconium or hafnium halides
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G23/00—Compounds of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Environmental & Geological Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Optical Filters (AREA)
  • Materials For Photolithography (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Polymerisation Methods In General (AREA)
TW106131597A 2016-09-30 2017-09-14 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器 TWI751196B (zh)

Applications Claiming Priority (2)

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JP2016-193263 2016-09-30
JP2016193263 2016-09-30

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TW201815682A TW201815682A (zh) 2018-05-01
TWI751196B true TWI751196B (zh) 2022-01-01

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TW106131597A TWI751196B (zh) 2016-09-30 2017-09-14 含金屬氮化物粒子、分散組成物、硬化性組成物、硬化膜及它們的製造方法以及彩色濾光片、固體攝影元件、固體攝像裝置、紅外線感測器

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JP (2) JPWO2018061644A1 (ja)
KR (1) KR102294518B1 (ja)
TW (1) TWI751196B (ja)
WO (1) WO2018061644A1 (ja)

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Publication number Priority date Publication date Assignee Title
CN112400124B (zh) 2018-09-11 2022-08-12 富士胶片株式会社 遮光性组合物、固化膜、滤色器、遮光膜、固体摄像元件、图像显示装置
DE102019124713A1 (de) 2018-11-27 2020-05-28 Samsung Electronics Co., Ltd. Vorrichtungen und Verfahren zur Steuerung einer Exposition gegenüber drahtloser Kommunikation
JP2020200376A (ja) * 2019-06-07 2020-12-17 三菱ケミカル株式会社 樹脂組成物、積層フィルム、積層フィルムの製造方法及び積層フィルムの使用用途
CN113104822A (zh) * 2021-03-31 2021-07-13 攀枝花学院 氧化钛还原氮化的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222110A (ja) * 1988-04-23 1990-01-25 Tioxide Group Plc 窒素化合物
TW200631898A (en) * 2004-12-28 2006-09-16 Ishihara Sangyo Kaisha Black-type titanium oxynitride
TW201101489A (en) * 2009-02-13 2011-01-01 Semiconductor Energy Lab Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device

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JP4058850B2 (ja) * 1999-08-11 2008-03-12 住友金属鉱山株式会社 日射フィルター膜形成用塗布液
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JP5099094B2 (ja) 2008-09-18 2012-12-12 東レ株式会社 黒色樹脂組成物、樹脂ブラックマトリクス、カラーフィルターおよび液晶表示装置
EP2347996B1 (en) * 2008-10-06 2014-12-31 Showa Denko K.K. Method for producing carbonitride mixture particle or oxycarbonitride mixture particle, and use thereof
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Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0222110A (ja) * 1988-04-23 1990-01-25 Tioxide Group Plc 窒素化合物
TW200631898A (en) * 2004-12-28 2006-09-16 Ishihara Sangyo Kaisha Black-type titanium oxynitride
TW201101489A (en) * 2009-02-13 2011-01-01 Semiconductor Energy Lab Transistor, semiconductor device including the transistor, and manufacturing method of the transistor and the semiconductor device

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Publication number Publication date
JP2022079500A (ja) 2022-05-26
JPWO2018061644A1 (ja) 2019-09-05
KR20190041493A (ko) 2019-04-22
JP7373000B2 (ja) 2023-11-01
KR102294518B1 (ko) 2021-08-27
TW201815682A (zh) 2018-05-01
WO2018061644A1 (ja) 2018-04-05

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