TWI747869B - 半導體加工用板片 - Google Patents

半導體加工用板片 Download PDF

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Publication number
TWI747869B
TWI747869B TW106101502A TW106101502A TWI747869B TW I747869 B TWI747869 B TW I747869B TW 106101502 A TW106101502 A TW 106101502A TW 106101502 A TW106101502 A TW 106101502A TW I747869 B TWI747869 B TW I747869B
Authority
TW
Taiwan
Prior art keywords
semiconductor processing
adhesive layer
semiconductor
layer
film
Prior art date
Application number
TW106101502A
Other languages
English (en)
Chinese (zh)
Other versions
TW201802897A (zh
Inventor
佐藤明德
中村優智
山下茂之
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201802897A publication Critical patent/TW201802897A/zh
Application granted granted Critical
Publication of TWI747869B publication Critical patent/TWI747869B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
TW106101502A 2016-03-04 2017-01-17 半導體加工用板片 TWI747869B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016042862 2016-03-04
JP2016-042862 2016-03-04

Publications (2)

Publication Number Publication Date
TW201802897A TW201802897A (zh) 2018-01-16
TWI747869B true TWI747869B (zh) 2021-12-01

Family

ID=59742699

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106101502A TWI747869B (zh) 2016-03-04 2017-01-17 半導體加工用板片

Country Status (5)

Country Link
JP (1) JP7042211B2 (fr)
KR (1) KR20180122316A (fr)
CN (1) CN108271381B (fr)
TW (1) TWI747869B (fr)
WO (1) WO2017149925A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
JP7316821B2 (ja) * 2019-03-29 2023-07-28 リンテック株式会社 粘着フィルム
TWI811636B (zh) * 2020-03-31 2023-08-11 日商東洋紡股份有限公司 附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201424908A (zh) * 2012-09-20 2014-07-01 Lintec Corp 雷射切割片-剝離片積層體、雷射切割片及晶片體之製造方法
TW201604260A (zh) * 2014-06-10 2016-02-01 琳得科股份有限公司 切割片

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2060823C (fr) * 1991-02-08 2002-09-10 Naoya Omori Materiaux rigides carbones et diamantes ou de type diamantes
JP2763239B2 (ja) * 1992-10-28 1998-06-11 信越化学工業株式会社 複層セラミックスるつぼ
EP0627498B1 (fr) * 1993-05-25 2000-08-09 Ngk Spark Plug Co., Ltd Substrat à base de céramique et procédés de préparation
JP2007204595A (ja) * 2006-02-01 2007-08-16 Dainippon Ink & Chem Inc 粘着フィルム、及びポリエステル樹脂製容器
CN101636267B (zh) * 2007-03-19 2013-04-24 琳得科株式会社 剥离片及粘合体
JP5178726B2 (ja) * 2007-08-30 2013-04-10 電気化学工業株式会社 粘着シート及び電子部品の製造方法
WO2009060924A1 (fr) * 2007-11-08 2009-05-14 Lintec Corporation Feuille anti-adhésive et matériau adhésif
JP5343502B2 (ja) * 2008-10-08 2013-11-13 ダイニック株式会社 自己粘着性フィルム及びその製造方法
JP5375206B2 (ja) * 2009-03-04 2013-12-25 株式会社リコー 感熱粘着材料
JP5366781B2 (ja) * 2009-12-14 2013-12-11 日東電工株式会社 樹脂封止用耐熱性粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法
JP2013021270A (ja) * 2011-07-14 2013-01-31 Nitto Denko Corp 半導体装置製造用フィルム
CN104040696B (zh) * 2011-12-26 2016-12-21 琳得科株式会社 带有保护膜形成层的切割片及芯片的制造方法
JP5610642B2 (ja) * 2012-02-28 2014-10-22 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP6005952B2 (ja) * 2012-02-28 2016-10-12 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP5977110B2 (ja) * 2012-07-27 2016-08-24 日東電工株式会社 粘着シート
TWI579364B (zh) * 2013-03-28 2017-04-21 琳得科股份有限公司 雙面黏著片
JP6122368B2 (ja) * 2013-09-24 2017-04-26 リンテック株式会社 剥離シートおよび粘着シート
SG11201701270QA (en) * 2014-08-22 2017-03-30 Lintec Corp Protective coating-forming sheet and method for manufacturing semiconductor chip provided with protective coating

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201424908A (zh) * 2012-09-20 2014-07-01 Lintec Corp 雷射切割片-剝離片積層體、雷射切割片及晶片體之製造方法
TW201604260A (zh) * 2014-06-10 2016-02-01 琳得科股份有限公司 切割片

Also Published As

Publication number Publication date
KR20180122316A (ko) 2018-11-12
WO2017149925A1 (fr) 2017-09-08
TW201802897A (zh) 2018-01-16
CN108271381B (zh) 2022-06-07
JPWO2017149925A1 (ja) 2018-12-27
JP7042211B2 (ja) 2022-03-25
CN108271381A (zh) 2018-07-10

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