JP7042211B2 - 半導体加工用シート - Google Patents

半導体加工用シート Download PDF

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Publication number
JP7042211B2
JP7042211B2 JP2018502547A JP2018502547A JP7042211B2 JP 7042211 B2 JP7042211 B2 JP 7042211B2 JP 2018502547 A JP2018502547 A JP 2018502547A JP 2018502547 A JP2018502547 A JP 2018502547A JP 7042211 B2 JP7042211 B2 JP 7042211B2
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JP
Japan
Prior art keywords
semiconductor processing
semiconductor
release film
adhesive layer
layer
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JP2018502547A
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English (en)
Japanese (ja)
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JPWO2017149925A1 (ja
Inventor
明徳 佐藤
優智 中村
茂之 山下
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Lintec Corp
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Lintec Corp
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Publication of JPWO2017149925A1 publication Critical patent/JPWO2017149925A1/ja
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Publication of JP7042211B2 publication Critical patent/JP7042211B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
JP2018502547A 2016-03-04 2017-01-05 半導体加工用シート Active JP7042211B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016042862 2016-03-04
JP2016042862 2016-03-04
PCT/JP2017/000186 WO2017149925A1 (fr) 2016-03-04 2017-01-05 Feuille de traitement de semi-conducteur

Publications (2)

Publication Number Publication Date
JPWO2017149925A1 JPWO2017149925A1 (ja) 2018-12-27
JP7042211B2 true JP7042211B2 (ja) 2022-03-25

Family

ID=59742699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018502547A Active JP7042211B2 (ja) 2016-03-04 2017-01-05 半導体加工用シート

Country Status (5)

Country Link
JP (1) JP7042211B2 (fr)
KR (1) KR20180122316A (fr)
CN (1) CN108271381B (fr)
TW (1) TWI747869B (fr)
WO (1) WO2017149925A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6573841B2 (ja) * 2016-03-04 2019-09-11 リンテック株式会社 半導体加工用シート
JP7316821B2 (ja) * 2019-03-29 2023-07-28 リンテック株式会社 粘着フィルム
TWI811636B (zh) * 2020-03-31 2023-08-11 日商東洋紡股份有限公司 附有保護膜之無機基板/工程塑膠薄膜積層體、積層體之堆疊、積層體的保管方法、及積層體的運輸方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090283A (ja) 2008-10-08 2010-04-22 Dynic Corp 自己粘着性フィルム及びその製造方法
JP2010202795A (ja) 2009-03-04 2010-09-16 Ricoh Co Ltd 感熱粘着材料
JP2011124495A (ja) 2009-12-14 2011-06-23 Nitto Denko Corp 樹脂封止用耐熱性粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法
JP2013021270A (ja) 2011-07-14 2013-01-31 Nitto Denko Corp 半導体装置製造用フィルム
WO2014046121A1 (fr) 2012-09-20 2014-03-27 リンテック株式会社 Stratifié de feuille pelable/feuille de découpe laser, feuille de découpe laser et procédé de fabrication de puce
JP2015063584A (ja) 2013-09-24 2015-04-09 リンテック株式会社 剥離シートおよび粘着シート
WO2016027888A1 (fr) 2014-08-22 2016-02-25 リンテック株式会社 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2060823C (fr) * 1991-02-08 2002-09-10 Naoya Omori Materiaux rigides carbones et diamantes ou de type diamantes
JP2763239B2 (ja) * 1992-10-28 1998-06-11 信越化学工業株式会社 複層セラミックスるつぼ
EP0627498B1 (fr) * 1993-05-25 2000-08-09 Ngk Spark Plug Co., Ltd Substrat à base de céramique et procédés de préparation
JP2007204595A (ja) * 2006-02-01 2007-08-16 Dainippon Ink & Chem Inc 粘着フィルム、及びポリエステル樹脂製容器
CN101636267B (zh) * 2007-03-19 2013-04-24 琳得科株式会社 剥离片及粘合体
JP5178726B2 (ja) * 2007-08-30 2013-04-10 電気化学工業株式会社 粘着シート及び電子部品の製造方法
WO2009060924A1 (fr) * 2007-11-08 2009-05-14 Lintec Corporation Feuille anti-adhésive et matériau adhésif
CN104040696B (zh) * 2011-12-26 2016-12-21 琳得科株式会社 带有保护膜形成层的切割片及芯片的制造方法
JP5610642B2 (ja) * 2012-02-28 2014-10-22 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP6005952B2 (ja) * 2012-02-28 2016-10-12 日東電工株式会社 粘着テープ用フィルムおよび粘着テープ
JP5977110B2 (ja) * 2012-07-27 2016-08-24 日東電工株式会社 粘着シート
TWI579364B (zh) * 2013-03-28 2017-04-21 琳得科股份有限公司 雙面黏著片
WO2015190230A1 (fr) * 2014-06-10 2015-12-17 リンテック株式会社 Feuille de découpage en dés

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010090283A (ja) 2008-10-08 2010-04-22 Dynic Corp 自己粘着性フィルム及びその製造方法
JP2010202795A (ja) 2009-03-04 2010-09-16 Ricoh Co Ltd 感熱粘着材料
JP2011124495A (ja) 2009-12-14 2011-06-23 Nitto Denko Corp 樹脂封止用耐熱性粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法
JP2013021270A (ja) 2011-07-14 2013-01-31 Nitto Denko Corp 半導体装置製造用フィルム
WO2014046121A1 (fr) 2012-09-20 2014-03-27 リンテック株式会社 Stratifié de feuille pelable/feuille de découpe laser, feuille de découpe laser et procédé de fabrication de puce
JP2015063584A (ja) 2013-09-24 2015-04-09 リンテック株式会社 剥離シートおよび粘着シート
WO2016027888A1 (fr) 2014-08-22 2016-02-25 リンテック株式会社 Feuille pour formation de membrane protectrice, et procédé de fabrication de puce semi-conductrice avec membrane protectrice

Also Published As

Publication number Publication date
KR20180122316A (ko) 2018-11-12
WO2017149925A1 (fr) 2017-09-08
TW201802897A (zh) 2018-01-16
CN108271381B (zh) 2022-06-07
TWI747869B (zh) 2021-12-01
JPWO2017149925A1 (ja) 2018-12-27
CN108271381A (zh) 2018-07-10

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