JP6557912B2 - 保護膜形成用複合シート - Google Patents
保護膜形成用複合シート Download PDFInfo
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- JP6557912B2 JP6557912B2 JP2015529507A JP2015529507A JP6557912B2 JP 6557912 B2 JP6557912 B2 JP 6557912B2 JP 2015529507 A JP2015529507 A JP 2015529507A JP 2015529507 A JP2015529507 A JP 2015529507A JP 6557912 B2 JP6557912 B2 JP 6557912B2
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- protective film
- sensitive adhesive
- pressure
- film
- forming
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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- C09J2423/00—Presence of polyolefin
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- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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Description
図1は本発明の一実施形態に係る保護膜形成用複合シートの断面図である。図1に示すように、本実施形態に係る保護膜形成用複合シート1は、基材21の一方の面に粘着剤層22が積層されてなる粘着シート2と、粘着シート2の粘着剤層22側に積層された保護膜形成フィルム3と、保護膜形成フィルム3における粘着シート2とは反対側に積層された剥離シート4とを備えて構成される。ただし、剥離シート4は、保護膜形成用複合シート1の使用時に剥離されるものである。
実施形態に係る保護膜形成用複合シート1は、粘着シート2の波長532nmの光線透過率が75〜85%であることを要する。なお、本明細書における光線透過率は、積分球を使用して測定した値とし、測定器具としては分光光度計を使用する。
本実施形態に係る保護膜形成用複合シート1の粘着シート2は、基材21と、基材21の一方の面に積層された粘着剤層22とを備えて構成される。粘着シート2は、前述した光線透過率を有するようにするために、基材21および/または粘着剤層22を着色してもよいし、別途着色シートを備えてもよいし、それら両者であってもよい。ただし、製造コストを考慮すると、基材21および/または粘着剤層22を着色することが好ましく、また粘着剤層22の粘着力への影響を考慮すると、基材21を着色することが好ましい。
粘着シート2の基材21は、ワークの加工、例えば半導体ウエハのダイシングおよびエキスパンディングに適するとともに、レーザー光照射により前述した細孔が形成されるものであれば、その構成材料は特に限定されず、通常は樹脂系の材料を主材とするフィルム(以下「樹脂フィルム」という。)から構成される。
本実施形態に係る保護膜形成用複合シート1の粘着シート2が備える粘着剤層22は、単層からなってもよいし、2層以上の多層からなってもよい。単層の場合でも、多層の場合でも、粘着剤層22における少なくとも保護膜形成フィルム3と接触する部分は、エネルギー線硬化性粘着剤を硬化した材料からなることが好ましい。また、多層の場合には、保護膜形成フィルム3と接触する層(接触層)が、エネルギー線硬化性粘着剤を硬化した材料からなることが好ましい。
保護膜形成フィルム3は、未硬化の硬化性接着剤からなることが好ましい。この場合、保護膜形成フィルム3に半導体ウエハ等のワークを重ね合わせた後、保護膜形成フィルム3を硬化させることにより、保護膜をワークに強固に接着することができ、耐久性を有する保護膜をチップ等に形成することができる。また、硬化性接着剤を硬化させた後は、レーザー光照射によって良好に印字することが可能となる。
剥離シート4は、保護膜形成用複合シート1が使用されるまでの間、保護膜形成フィルム3および粘着剤層22を保護するものであり、必ずしもなくてもよい。剥離シート4の構成は任意であり、プラスチックフィルムを剥離剤等により剥離処理したものが例示される。プラスチックフィルムの具体例としては、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート等のポリエステルフィルム、およびポリプロピレンやポリエチレン等のポリオレフィンフィルムが挙げられる。剥離剤としては、シリコーン系、フッ素系、長鎖アルキル系等を用いることができるが、これらの中で、安価で安定した性能が得られるシリコーン系が好ましい。剥離シート4の厚さについては特に制限はないが、通常20〜250μm程度である。
保護膜形成用複合シート1は、好ましくは、保護膜形成フィルム3を含む第1の積層体と、粘着シート2を含む第2の積層体とを別々に作製した後、第1の積層体および第2の積層体を使用して、保護膜形成フィルム3と粘着シート2とを積層することにより製造することができるが、これに限定されるものではない。
本実施形態に係る保護膜形成用複合シート1を用いて、一例としてワークとしての半導体ウエハから保護膜付きチップを製造する方法を以下に説明する。最初に、保護膜形成用複合シート1の剥離シート4を剥離し、保護膜形成フィルム3および粘着シート2の粘着剤層22の周縁部を露出させる。
実施例1では、以下のようにして、図1および図5に示すような保護膜形成用複合シート1を製造した。
(1)保護膜形成フィルムを含む第1の積層体の作製
次の(a)〜(f)の成分を混合し、固形分濃度が50質量%となるようにメチルエチルケトンで希釈して、保護膜形成フィルム用塗布剤を調製した。
(a)バインダーポリマー:(メタ)アクリル酸エステル共重合体(ブチルアクリレート55質量部、メチルアクリレート10質量部、2−ヒドロキシエチルアクリレート15質量部、およびグリシジルメタクリレート20質量部を共重合して得た共重合体,重量平均分子量:80万)17質量部(固形分換算,以下同じ)
(b)熱硬化性成分:混合エポキシ樹脂(液状ビスフェノールA型エポキシ樹脂(エポキシ当量180−200)60質量部、固形ビスフェノールA型エポキシ樹脂(エポキシ当量800−900)10質量部、およびジシクロペンタジエン型エポキシ樹脂(エポキシ当量274−286)30質量部の混合物)17質量部
(c)硬化剤:ジシアンアミド(旭電化社製:アデカハ−ドナー3636AS)0.3質量部、および2−フェニル−4,5−ジ(ヒドロキシメチル)イミダゾール(四国化成工業社製:キュアゾール2PHZ)0.3質量部
(d)着色剤:カーボンブラック(三菱化学社製:#MA650,平均粒径:28nm)2質量部
(e)シランカップリング剤:γ−グリシドキシプロピルトリメトキシシラン(信越化学工業社製:KBM−403,メトキシ当量:12.7mmol/g,分子量:236.3)0.4質量部
(f)フィラー:不定形シリカフィラー(平均粒径:3μm)63質量部
次の(g)および(h)の成分を混合し、固形分濃度が30質量%となるようにメチルエチルケトンで希釈して、粘着剤層用塗布剤を調製した。
(g)粘着主剤:(メタ)アクリル酸エステル共重合体(ブチルアクリレート40質量部、2−エチルヘキシルアクリレート55質量部、および2−ヒドロキシルエチルアクリレート5質量部を共重合して得られた共重合体,重量平均分子量:60万)100質量部
(h)架橋剤:芳香族系ポリイソシアネート化合物(三井化学社製,タケネートD110N)10質量部
上記(1)で得られた第1の積層体から円形の第2の剥離シートを剥離し、円形の保護膜形成フィルムを露出させた。一方、上記(2)で得られた第2の積層体から剥離シートを剥離して、粘着剤層を露出させた。その粘着剤層に、上記保護膜形成フィルムが接触するように、第1の積層体と第2の積層体とを貼り合わせ、基材および粘着剤層からなる粘着シートと、保護膜形成フィルムと、第1の剥離シートとが積層されてなる第3の積層体を得た。
基材として青色PET/ポリエチレン複合フィルム(アジヤアルミ社製,厚さ:100μm)を使用する以外は、実施例1と同様にして保護膜形成用複合シートを製造した。
実施例3では、以下のようにして、図2および図5に示すような保護膜形成用複合シート1Aを製造した。
(1)保護膜形成フィルムを含む第1の積層体の作製
次の(i)および(j)の成分を混合し、固形分濃度が50質量%となるようにメチルエチルケトンで希釈して、第2の粘着剤層用塗布剤を調製した。
(i)粘着主剤:エネルギー線硬化型アクリル系共重合体(2−エチルヘキシルアクリレート80質量部および2−ヒドロキシルエチルアクリレート20質量部を共重合したものに、2−メタクリロイルオキシエチルイソシアネート21.4質量部(2−ヒドロキシルエチルアクリレートの水酸基に対して、2−メタクリロイルオキシエチルイソシアネートのイソシアネート基が80モル%となる量)を反応させて得られた共重合体,重量平均分子量:60万)100質量部
(j)架橋剤:芳香族系ポリイソシアネート化合物(トーヨーケム社製,BHS8515)0.5質量部
実施例1と同様にして、剥離シートの剥離面上に第1の粘着剤層を形成し、基材を積層した後、裁断することにより、基材(図2における基材21)と、第1の粘着剤層(図2における粘着剤層221)(厚さ:10μm)と、剥離シートとからなる第2の積層体を得た。
上記(1)で得られた第1の積層体から円形の第2の剥離シートを剥離し、第2の粘着剤層を露出させた。一方、上記(2)で得られた第2の積層体から剥離シートを剥離して、第1の粘着剤層を露出させた。その第1の粘着剤層に、上記第2の粘着剤層が接触するように、第1の積層体と第2の積層体とを貼り合わせ、基材、第1の粘着剤層および第2の粘着剤層からなる粘着シートと、保護膜形成フィルムと、第1の剥離シートとが積層されてなる第3の積層体を得た。
基材として淡青色ポリプロピレンフィルム(三菱樹脂社製,厚さ:80μm)を使用した以外は、実施例1と同様にして保護膜形成用複合シートを製造した。
基材として無色ポリオレフィンフィルム(三菱樹脂社製,厚さ:80μm)を使用した以外は実施例1と同様にして保護膜形成用複合シートを製造した。
基材として淡黒色ポリ塩化ビニルフィルム(オカモト社製,厚さ:50μm)を使用した以外は実施例1と同様にして保護膜形成用複合シートを製造した。
基材として濃黒色ポリ塩化ビニルフィルム(オカモト社製,厚さ:100μm)を使用した以外は実施例1と同様にして保護膜形成用複合シートを製造した。
基材として無色ポリオレフィンフィルム(三菱樹脂社製,厚さ:80μm)を使用し、かつ、粘着シートを含む積層体を裁断した後に、CO2ガスレーザー(パナソニック社製,YB−HCS03T04,波長:10.6μm)を用いて粘着シートに貫通孔(貫通孔直径:50μm,間隔:5.0mm)を形成した以外は、実施例1と同様にして保護膜形成用複合シートを製造した。
実施例および比較例の各粘着シートについて、分光光度計(SHIMADZU社製,UV−VIS−NIR SPECTROPHOTOMETER UV−3600)を用いて、波長300〜1200nmの領域の光の透過率を測定した。得られた測定結果より、波長532nmにおける光線透過率を算出した。測定には、分光光度計に付属する大形試料室MPC−3100を用い、分光光度計に内蔵された積分球を使用した。
テープマウンター装置(リンテック社製,RAD2700)を用いて、実施例および比較例の保護膜形成用複合シートから第1の剥離シートを剥離して露出した保護膜形成フィルムを、♯2000研磨したシリコンウエハ(直径:8インチ,厚さ:350μm)の研磨面に、70℃に加熱しながら貼付した。それとともに、露出した粘着剤層または第1の粘着剤層をリングフレームに貼付した。次いで、130℃で2時間加熱を行うことにより、保護膜形成用フィルムを硬化させて、シリコンウエハ上に保護膜を形成した。
試験例2と同様にして、リングフレームに固定された、粘着シートと保護膜付きウエハとの積層体を得た。次いで、印字装置(KEYENCE社製,MD−T1000,使用波長532nm)を用い、粘着シート側から波長532nmのレーザー光をそれぞれ照射して、保護膜にレーザー印字(文字サイズ:0.5mm×0.5mm,文字間隔:0.3mm,文字数:20文字)を行った。
A:全ての文字でガス溜まりが発生しなかった。
B:部分的にガス溜まりが発生した。
C:全ての文字でガス溜まりが発生した。
試験例3にて保護膜に形成したレーザー印字文字の、粘着シートを介した視認性について、以下に示す基準に基づき目視にて評価した。また、ガス溜まり・文字視認性が共にAである場合をレーザー印字性評価○、いずれかがA以外であった場合をレーザー印字性評価×とした。結果を表2に示す。
A:全ての文字を問題なく読むことができた。
B:不鮮明な部分があるが、全ての文字を読むことができた。
C:部分的に読めない文字があった。
D:全て又は殆どの文字を読むことができなかった。
2…粘着シート
21…基材
22,221,222…粘着剤層
201…円形
202…円弧
203…直線
3…保護膜形成フィルム
301…円形
4…剥離シート
5…治具用粘着剤層
6…半導体ウエハ
7…リングフレーム
Claims (4)
- 基材の一方の面側に粘着剤層が積層されてなる粘着シートと、
前記粘着シートの前記粘着剤層側に積層された保護膜形成フィルムと
を備えた保護膜形成用複合シートであって、
前記粘着シートは、当該粘着シートを厚さ方向に貫通する貫通孔を有しておらず、
積分球を使用して測定される前記粘着シートの波長532nmの光線透過率は、75〜85%であり、
前記粘着剤層は、側鎖にエネルギー線硬化性を有する不飽和基が導入された(メタ)アクリル酸エステル共重合体(A)を含み、
前記(メタ)アクリル酸エステル共重合体(A)は、水酸基含有モノマーから導かれる構成単位を有する(メタ)アクリル系共重合体(a1)と、前記水酸基に結合する置換基及び前記不飽和基を有する不飽和基含有化合物(a2)と、を反応させて得られるものであり、
前記(メタ)アクリル系共重合体(a1)は、前記水酸基含有モノマーから導かれる構成単位と、(メタ)アクリル酸エステルモノマーから導かれる構成単位と、からなり、
前記(メタ)アクリル系共重合体(a1)は、前記水酸基含有モノマーから導かれる構成単位を5〜40質量%の割合で有し、前記(メタ)アクリル酸エステルモノマーから導かれる構成単位を60〜95質量%の割合で有し、
前記基材の構成材料が、ポリ塩化ビニル、ポリエチレンテレフタレート、ポリエチレン又はポリプロピレンであり、
前記基材が着色剤を含有する
ことを特徴とする保護膜形成用複合シート。 - 前記粘着剤層における少なくとも前記保護膜形成フィルムと接触する部分は、前記(メタ)アクリル酸エステル共重合体(A)を含むことを特徴とする請求項1に記載の保護膜形成用複合シート。
- 前記保護膜形成フィルムは、未硬化の硬化性接着剤からなり、
前記保護膜形成フィルムの硬化後における前記粘着剤層側の表面のグロス値は、25以上であることを特徴とする請求項1又は2に記載の保護膜形成用複合シート。 - 前記保護膜形成用複合シートの貼付対象は、半導体ウエハであり、
前記保護膜形成フィルムは、前記半導体ウエハまたは前記半導体ウエハをダイシングして得られる半導体チップに保護膜を形成する層である
ことを特徴とする請求項1〜3のいずれか一項に記載の保護膜形成用複合シート。
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