TWI747338B - 熱硬化性樹脂組成物、其硬化物及包含該硬化物之構造體 - Google Patents

熱硬化性樹脂組成物、其硬化物及包含該硬化物之構造體 Download PDF

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Publication number
TWI747338B
TWI747338B TW109121098A TW109121098A TWI747338B TW I747338 B TWI747338 B TW I747338B TW 109121098 A TW109121098 A TW 109121098A TW 109121098 A TW109121098 A TW 109121098A TW I747338 B TWI747338 B TW I747338B
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TW
Taiwan
Prior art keywords
resin composition
compound
thermosetting resin
group
carbon atoms
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Application number
TW109121098A
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English (en)
Chinese (zh)
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TW202116908A (zh
Inventor
峯崎千佳
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日商昭和電工股份有限公司
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW109121098A 2019-10-09 2020-06-22 熱硬化性樹脂組成物、其硬化物及包含該硬化物之構造體 TWI747338B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019185745 2019-10-09
JP2019-185745 2019-10-09

Publications (2)

Publication Number Publication Date
TW202116908A TW202116908A (zh) 2021-05-01
TWI747338B true TWI747338B (zh) 2021-11-21

Family

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TW109121098A TWI747338B (zh) 2019-10-09 2020-06-22 熱硬化性樹脂組成物、其硬化物及包含該硬化物之構造體

Country Status (3)

Country Link
JP (1) JP7367766B2 (enrdf_load_stackoverflow)
TW (1) TWI747338B (enrdf_load_stackoverflow)
WO (1) WO2021070416A1 (enrdf_load_stackoverflow)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201607382A (zh) * 2014-04-25 2016-02-16 Taiyo Ink Mfg Co Ltd 永久絕緣膜用樹脂組成物、由其硬化物所成之永久絕緣膜、使用其所製造之多層印刷配線板及其製造方法
TW201811848A (zh) * 2016-09-09 2018-04-01 昭和電工股份有限公司 硬化性樹脂混合物及硬化性樹脂組成物之製造方法
JP2019048933A (ja) * 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体
CN110248970A (zh) * 2017-04-19 2019-09-17 昭和电工株式会社 固化性树脂组合物、其固化物及包含该固化物的结构体

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767610A (en) * 1980-10-15 1982-04-24 Semedain Kk Anaerobic curable composition
JPS62161820A (ja) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd エポキシ樹脂組成物
JP6494444B2 (ja) * 2014-07-08 2019-04-03 昭和電工株式会社 ポリアルケニルフェノール化合物の製造方法
JP6771369B2 (ja) 2016-12-09 2020-10-21 昭和電工株式会社 熱硬化性樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201607382A (zh) * 2014-04-25 2016-02-16 Taiyo Ink Mfg Co Ltd 永久絕緣膜用樹脂組成物、由其硬化物所成之永久絕緣膜、使用其所製造之多層印刷配線板及其製造方法
TW201811848A (zh) * 2016-09-09 2018-04-01 昭和電工股份有限公司 硬化性樹脂混合物及硬化性樹脂組成物之製造方法
CN110248970A (zh) * 2017-04-19 2019-09-17 昭和电工株式会社 固化性树脂组合物、其固化物及包含该固化物的结构体
JP2019048933A (ja) * 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体

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JPWO2021070416A1 (enrdf_load_stackoverflow) 2021-04-15
TW202116908A (zh) 2021-05-01
WO2021070416A1 (ja) 2021-04-15
JP7367766B2 (ja) 2023-10-24

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