JP7367766B2 - 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 - Google Patents
熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 Download PDFInfo
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- JP7367766B2 JP7367766B2 JP2021551143A JP2021551143A JP7367766B2 JP 7367766 B2 JP7367766 B2 JP 7367766B2 JP 2021551143 A JP2021551143 A JP 2021551143A JP 2021551143 A JP2021551143 A JP 2021551143A JP 7367766 B2 JP7367766 B2 JP 7367766B2
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- 229920001187 thermosetting polymer Polymers 0.000 title claims description 80
- 239000011342 resin composition Substances 0.000 title claims description 78
- 150000001875 compounds Chemical class 0.000 claims description 98
- 125000004432 carbon atom Chemical group C* 0.000 claims description 63
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 35
- -1 aromatic bismaleimide compound Chemical class 0.000 claims description 32
- 238000000465 moulding Methods 0.000 claims description 26
- 125000003118 aryl group Chemical group 0.000 claims description 25
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- 239000003999 initiator Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000000945 filler Substances 0.000 claims description 16
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 14
- 125000000962 organic group Chemical group 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 11
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 11
- 125000003342 alkenyl group Chemical group 0.000 claims description 9
- 125000003277 amino group Chemical group 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 9
- XBTOSRUBOXQWBO-UHFFFAOYSA-N 1h-indazol-5-amine Chemical compound NC1=CC=C2NN=CC2=C1 XBTOSRUBOXQWBO-UHFFFAOYSA-N 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- KEJFADGISRFLFO-UHFFFAOYSA-N 1H-indazol-6-amine Chemical compound NC1=CC=C2C=NNC2=C1 KEJFADGISRFLFO-UHFFFAOYSA-N 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 125000003545 alkoxy group Chemical group 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 4
- 229920001971 elastomer Polymers 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 4
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 4
- QJPUNSUXMNSPCN-UHFFFAOYSA-N 1h-indazole-5,6-diamine Chemical compound C1=C(N)C(N)=CC2=C1NN=C2 QJPUNSUXMNSPCN-UHFFFAOYSA-N 0.000 claims description 3
- KGEYZMRZVKMQBY-UHFFFAOYSA-N 5-amino-1h-indazole-3-carbonitrile Chemical compound NC1=CC=C2NN=C(C#N)C2=C1 KGEYZMRZVKMQBY-UHFFFAOYSA-N 0.000 claims description 3
- UBSUVQXJCAJWPB-UHFFFAOYSA-N 5-chloro-1h-indazol-6-amine Chemical compound C1=C(Cl)C(N)=CC2=C1C=NN2 UBSUVQXJCAJWPB-UHFFFAOYSA-N 0.000 claims description 3
- WFMLWPRGJHUSEX-UHFFFAOYSA-N 5-methyl-1h-indazol-6-amine Chemical compound C1=C(N)C(C)=CC2=C1NN=C2 WFMLWPRGJHUSEX-UHFFFAOYSA-N 0.000 claims description 3
- NJLWAEKUAVYKDC-UHFFFAOYSA-N 6-amino-1h-indazol-5-ol Chemical compound C1=C(O)C(N)=CC2=C1C=NN2 NJLWAEKUAVYKDC-UHFFFAOYSA-N 0.000 claims description 3
- VFNKPVFMEYSQMB-UHFFFAOYSA-N 6-amino-1h-indazole-5-carboxylic acid Chemical compound C1=C(C(O)=O)C(N)=CC2=C1C=NN2 VFNKPVFMEYSQMB-UHFFFAOYSA-N 0.000 claims description 3
- SEMUOWXBEVUZHY-UHFFFAOYSA-N CCC(C=C(C=NN1)C1=C1)=C1N Chemical compound CCC(C=C(C=NN1)C1=C1)=C1N SEMUOWXBEVUZHY-UHFFFAOYSA-N 0.000 claims description 3
- HTKXRTUKPXEALT-UHFFFAOYSA-N 3-bromo-2h-indazole Chemical compound C1=CC=CC2=C(Br)NN=C21 HTKXRTUKPXEALT-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 description 18
- 239000005011 phenolic resin Substances 0.000 description 17
- 150000003254 radicals Chemical class 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 11
- 239000002994 raw material Substances 0.000 description 10
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000001721 transfer moulding Methods 0.000 description 9
- 238000002156 mixing Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000007822 coupling agent Substances 0.000 description 7
- 239000011256 inorganic filler Substances 0.000 description 7
- 229910003475 inorganic filler Inorganic materials 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
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- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 6
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
- 238000005821 Claisen rearrangement reaction Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 238000006266 etherification reaction Methods 0.000 description 5
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 5
- 235000013824 polyphenols Nutrition 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000001993 wax Substances 0.000 description 4
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 125000002883 imidazolyl group Chemical group 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical group [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical group C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 125000002529 biphenylenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3C12)* 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical class C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 2
- 150000002790 naphthalenes Chemical class 0.000 description 2
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- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
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- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
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- AAAQKTZKLRYKHR-UHFFFAOYSA-N triphenylmethane Chemical compound C1=CC=CC=C1C(C=1C=CC=CC=1)C1=CC=CC=C1 AAAQKTZKLRYKHR-UHFFFAOYSA-N 0.000 description 2
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- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- FUDBHMPNYQUSSR-UHFFFAOYSA-N 1-[2,6-dibutyl-4-[[3,5-dibutyl-4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound C=1C(CCCC)=C(N2C(C=CC2=O)=O)C(CCCC)=CC=1CC(C=C1CCCC)=CC(CCCC)=C1N1C(=O)C=CC1=O FUDBHMPNYQUSSR-UHFFFAOYSA-N 0.000 description 1
- DTLOCEKBDTZQCT-UHFFFAOYSA-N 1-[2-butyl-4-[[3-butyl-4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(N2C(C=CC2=O)=O)C(CCCC)=CC=1CC(C=C1CCCC)=CC=C1N1C(=O)C=CC1=O DTLOCEKBDTZQCT-UHFFFAOYSA-N 0.000 description 1
- VAPJJJQBDRMEGC-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-2,4,6-trimethylphenyl]pyrrole-2,5-dione Chemical compound CC1=C(N2C(C=CC2=O)=O)C(C)=CC(C)=C1N1C(=O)C=CC1=O VAPJJJQBDRMEGC-UHFFFAOYSA-N 0.000 description 1
- CWYCAAQKRLBRDJ-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-ethylphenyl]pyrrole-2,5-dione Chemical compound C(C)C1=C(C=C(C=C1)N1C(C=CC1=O)=O)N1C(C=CC1=O)=O CWYCAAQKRLBRDJ-UHFFFAOYSA-N 0.000 description 1
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 description 1
- RKDDUCJHSPCBIZ-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-5-ethylphenyl]pyrrole-2,5-dione Chemical compound C(C)C=1C=C(C=C(C1)N1C(C=CC1=O)=O)N1C(C=CC1=O)=O RKDDUCJHSPCBIZ-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- QYMHAZGTGFATHT-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)benzoyl]phenyl]pyrrole-2,5-dione Chemical compound C=1C=CC(N2C(C=CC2=O)=O)=CC=1C(=O)C(C=1)=CC=CC=1N1C(=O)C=CC1=O QYMHAZGTGFATHT-UHFFFAOYSA-N 0.000 description 1
- JXSACHSFSSDFBQ-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(OC=2C=C(C=CC=2)N2C(C=CC2=O)=O)=C1 JXSACHSFSSDFBQ-UHFFFAOYSA-N 0.000 description 1
- GHTQTZRKJXWHMJ-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenyl]phenyl]pyrrole-2,5-dione Chemical group O=C1C=CC(=O)N1C1=CC=CC(C=2C=C(C=CC=2)N2C(C=CC2=O)=O)=C1 GHTQTZRKJXWHMJ-UHFFFAOYSA-N 0.000 description 1
- DCHKIJZYNLJRTB-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenyl]sulfanylphenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(SC=2C=C(C=CC=2)N2C(C=CC2=O)=O)=C1 DCHKIJZYNLJRTB-UHFFFAOYSA-N 0.000 description 1
- XMWSWKTVLCVNHO-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenyl]sulfinylphenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(=C1)S(=O)C1=CC(=CC=C1)N1C(=O)C=CC1=O XMWSWKTVLCVNHO-UHFFFAOYSA-N 0.000 description 1
- RNSJLHIBGRARKK-UHFFFAOYSA-N 1-[3-[3-(2,5-dioxopyrrol-1-yl)phenyl]sulfonylphenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(S(=O)(=O)C=2C=C(C=CC=2)N2C(C=CC2=O)=O)=C1 RNSJLHIBGRARKK-UHFFFAOYSA-N 0.000 description 1
- MUBZHCKKGIAWOG-UHFFFAOYSA-N 1-[3-[[3-(2,5-dioxopyrrol-1-yl)cyclohexyl]methyl]cyclohexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCC(CC2CCCC(C2)N2C(=O)C=CC2=O)C1 MUBZHCKKGIAWOG-UHFFFAOYSA-N 0.000 description 1
- IIWWWMXVTXGLRZ-UHFFFAOYSA-N 1-[3-[[3-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(CC=2C=C(C=CC=2)N2C(C=CC2=O)=O)=C1 IIWWWMXVTXGLRZ-UHFFFAOYSA-N 0.000 description 1
- PIXSVGBXTOZDIW-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)-2,3,5,6-tetramethylphenyl]pyrrole-2,5-dione Chemical compound CC=1C(C)=C(N2C(C=CC2=O)=O)C(C)=C(C)C=1N1C(=O)C=CC1=O PIXSVGBXTOZDIW-UHFFFAOYSA-N 0.000 description 1
- ZKWNVZJWZSWSOD-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)-2,5-dimethylphenyl]pyrrole-2,5-dione Chemical compound CC=1C=C(N2C(C=CC2=O)=O)C(C)=CC=1N1C(=O)C=CC1=O ZKWNVZJWZSWSOD-UHFFFAOYSA-N 0.000 description 1
- KNWKZOKQUOIVBL-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)-3-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC(N2C(C=CC2=O)=O)=CC=C1N1C(=O)C=CC1=O KNWKZOKQUOIVBL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- WYEOPIGTAMXOST-UHFFFAOYSA-N 1-[4-[2-[4-(2,5-dioxopyrrol-1-yl)phenyl]propan-2-yl]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1N1C(=O)C=CC1=O WYEOPIGTAMXOST-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019185745 | 2019-10-09 | ||
| JP2019185745 | 2019-10-09 | ||
| PCT/JP2020/023639 WO2021070416A1 (ja) | 2019-10-09 | 2020-06-16 | 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 |
Publications (2)
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| JP2016028129A (ja) | 2014-07-08 | 2016-02-25 | 昭和電工株式会社 | ポリアルケニルフェノール化合物の製造方法 |
| WO2018047417A1 (ja) | 2016-09-09 | 2018-03-15 | 昭和電工株式会社 | 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法 |
| JP2018095690A (ja) | 2016-12-09 | 2018-06-21 | 昭和電工株式会社 | 熱硬化性樹脂組成物 |
| JP2019048933A (ja) | 2017-09-08 | 2019-03-28 | 昭和電工株式会社 | 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体 |
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| JPS62161820A (ja) * | 1986-01-10 | 1987-07-17 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| WO2015163053A1 (ja) * | 2014-04-25 | 2015-10-29 | 太陽インキ製造株式会社 | 永久絶縁膜用樹脂組成物、永久絶縁膜、多層プリント配線板およびその製造方法 |
| CN110248970A (zh) * | 2017-04-19 | 2019-09-17 | 昭和电工株式会社 | 固化性树脂组合物、其固化物及包含该固化物的结构体 |
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| JP2016028129A (ja) | 2014-07-08 | 2016-02-25 | 昭和電工株式会社 | ポリアルケニルフェノール化合物の製造方法 |
| WO2018047417A1 (ja) | 2016-09-09 | 2018-03-15 | 昭和電工株式会社 | 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法 |
| JP2018095690A (ja) | 2016-12-09 | 2018-06-21 | 昭和電工株式会社 | 熱硬化性樹脂組成物 |
| JP2019048933A (ja) | 2017-09-08 | 2019-03-28 | 昭和電工株式会社 | 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体 |
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