JPWO2021070416A1 - - Google Patents

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Publication number
JPWO2021070416A1
JPWO2021070416A1 JP2021551143A JP2021551143A JPWO2021070416A1 JP WO2021070416 A1 JPWO2021070416 A1 JP WO2021070416A1 JP 2021551143 A JP2021551143 A JP 2021551143A JP 2021551143 A JP2021551143 A JP 2021551143A JP WO2021070416 A1 JPWO2021070416 A1 JP WO2021070416A1
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JP
Japan
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Application number
JP2021551143A
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Japanese (ja)
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JP7367766B2 (ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021551143A 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体 Active JP7367766B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019185745 2019-10-09
JP2019185745 2019-10-09
PCT/JP2020/023639 WO2021070416A1 (ja) 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体

Publications (2)

Publication Number Publication Date
JPWO2021070416A1 true JPWO2021070416A1 (enrdf_load_stackoverflow) 2021-04-15
JP7367766B2 JP7367766B2 (ja) 2023-10-24

Family

ID=75437105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551143A Active JP7367766B2 (ja) 2019-10-09 2020-06-16 熱硬化性樹脂組成物、その硬化物、及び該硬化物を含む構造体

Country Status (3)

Country Link
JP (1) JP7367766B2 (enrdf_load_stackoverflow)
TW (1) TWI747338B (enrdf_load_stackoverflow)
WO (1) WO2021070416A1 (enrdf_load_stackoverflow)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767610A (en) * 1980-10-15 1982-04-24 Semedain Kk Anaerobic curable composition
JPS62161820A (ja) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd エポキシ樹脂組成物
JP2016028129A (ja) * 2014-07-08 2016-02-25 昭和電工株式会社 ポリアルケニルフェノール化合物の製造方法
WO2018047417A1 (ja) * 2016-09-09 2018-03-15 昭和電工株式会社 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法
JP2018095690A (ja) * 2016-12-09 2018-06-21 昭和電工株式会社 熱硬化性樹脂組成物
JP2019048933A (ja) * 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015163053A1 (ja) * 2014-04-25 2015-10-29 太陽インキ製造株式会社 永久絶縁膜用樹脂組成物、永久絶縁膜、多層プリント配線板およびその製造方法
CN110248970A (zh) * 2017-04-19 2019-09-17 昭和电工株式会社 固化性树脂组合物、其固化物及包含该固化物的结构体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5767610A (en) * 1980-10-15 1982-04-24 Semedain Kk Anaerobic curable composition
JPS62161820A (ja) * 1986-01-10 1987-07-17 Hitachi Chem Co Ltd エポキシ樹脂組成物
JP2016028129A (ja) * 2014-07-08 2016-02-25 昭和電工株式会社 ポリアルケニルフェノール化合物の製造方法
WO2018047417A1 (ja) * 2016-09-09 2018-03-15 昭和電工株式会社 硬化性樹脂混合物及び硬化性樹脂組成物の製造方法
JP2018095690A (ja) * 2016-12-09 2018-06-21 昭和電工株式会社 熱硬化性樹脂組成物
JP2019048933A (ja) * 2017-09-08 2019-03-28 昭和電工株式会社 硬化性樹脂組成物、その硬化物、該硬化性樹脂組成物を用いた構造体の製造方法、及び該硬化物を含む構造体

Also Published As

Publication number Publication date
TWI747338B (zh) 2021-11-21
TW202116908A (zh) 2021-05-01
WO2021070416A1 (ja) 2021-04-15
JP7367766B2 (ja) 2023-10-24

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