TWI744351B - 基板載體 - Google Patents

基板載體 Download PDF

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TWI744351B
TWI744351B TW106122817A TW106122817A TWI744351B TW I744351 B TWI744351 B TW I744351B TW 106122817 A TW106122817 A TW 106122817A TW 106122817 A TW106122817 A TW 106122817A TW I744351 B TWI744351 B TW I744351B
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substrate carrier
substantially planar
carrier according
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維傑Ｄ 帕克
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美商應用材料股份有限公司
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Abstract

於此提供基板載體及製造該基板載體之方法的實施例。在一些實施例中，基板載體包含一實質平面主體；及複數個維持元件，該複數個維持元件排列於該實質平面主體的一表面上，其中該複數個維持元件經配置以維持該實質平面主體的該表面上的複數個基板，且其中該複數個維持元件包含至少三個維持元件，繞著該複數個基板之每一者的一對應位置來設置該至少三個維持元件。

Description

基板載體
本揭示案的實施例一般相關於基板處理設施。
使用載體傳送欲處理基板至不同腔室及區域，該載體致能在一時間多個基板的傳送。使用於氮化鋁沉積中以用於發光二極體(LED)應用的一個該載體為300 mm的矽晶圓載體，其中使用2至6吋之間的基板。矽晶圓載體由單晶矽形成，以口袋部加工該載體以載送基板。然而，在處理、清理及/或翻新期間矽晶圓載體易於破裂。選擇地，可使用碳化矽(SiC)晶圓載體，因為SiC晶圓較矽晶圓稠密約40%。然而，因為增加的密度，SiC晶圓較重且因此可損壞放置SiC晶圓於其上的基板支撐。SiC晶圓載體也可因為形成口袋部而造成載體中的應力而破裂。
據此，發明人提供改良的基板載體之實施例，如此處所揭露。
於此提供基板載體及製造該基板載體之方法的實施例。在一些實施例中，基板載體包含一實質平面主體；及複數個維持元件，該複數個維持元件排列於該主體的一表面上，其中該複數個維持元件經配置以維持該主體的該表面上的複數個基板，且其中該複數個維持元件包含至少三個維持元件，繞著該複數個基板之每一者的一對應位置來設置該至少三個維持元件。
在一些實施例中，基板載體包含一實質平面主體，在一下方層上堆疊一上方層而形成該實質平面主體；及複數個口袋部，該複數個口袋部在該實質平面主體中形成，該複數個口袋部之每一者包含環繞該口袋部的一支撐表面以支撐一基板。
在一些實施例中，基板載體包含一實質平面主體，在一碳化矽層上堆疊一鉬層而形成該實質平面主體；及複數個口袋部，該複數個口袋部在該實質平面主體中形成，該複數個口袋部之每一者包含環繞該口袋部的一支撐表面以支撐一基板，其中該碳化矽層包含穿過該碳化矽層而形成的兩個或更多個孔洞，且其中該鉬層包含自該鉬層的一下方表面延伸進入該兩個或更多個孔洞的兩個或更多個對應突出部。
下方描述本揭示案其他及進一步的實施例。
於此提供基板載體的實施例。發明的基板載體優勢地減低或消除了應力，該應力相關聯於藉由放置而在基板載體中形成口袋部或在沒有口袋部的基板載體表面上形成維持元件。
第1圖根據本揭示案的一些實施例圖示基板載體100。在一些實施例中，基板載體100包含實質平面主體102及排列於主體102表面上的複數個維持元件104以維持表面上的一個或更多個基板106、107(以假想展示)。在一些實施例中，主體102可由矽、碳化矽、或鉬來形成。主體102可具有約750微米至約1000微米之間的厚度。在一些實施例中，主體102可具有約300 mm的直徑，雖然也可使用其他直徑。複數個維持元件104防止基板106、107在實質平行於主體102的表面之方向上的動作。繞著每一基板位置設置至少三個維持元件104以確保基板106、107在其位中足夠被維持住。
維持元件104的位置取決於欲在基板載體100上載送的基板106、107的大小。例如，針對具有主體102(具有300 mm的直徑)之基板載體，可排列維持元件104以容納具有約2吋至約6吋之間的直徑之基板。在第1圖中所描繪的範例中，基板載體100可經配置以維持呈圓形陣列的具有約4吋及6吋之間的直徑的五個第一基板106及位於主體102中央處的具有約2吋及4吋之間的直徑的第二基板107。維持元件可形成或耦合至基板載體100的主體102。
第2圖根據本揭示案的一些實施例圖示第1圖中沿著線2-2’取得的橫截面。在一些實施例中，維持元件104耦合至主體102。在一些實施例中，晶圓被切成複數個片，將每一片使用為維持元件104。在一些實施例中，維持元件由與主體102相同的材料形成。在一些實施例中，維持元件由與主體102不同的材料形成。在一些實施例中，為了便於每一切片耦合至主體102，在主體102表面上視所需排列維持元件104(亦即，以支撐複數個基板，如此處所描述)，且接著以約攝氏500度至約攝氏1000度之預先決定溫度來加熱約10分鐘至約240分鐘的週期，以將維持元件104擴散鍵合(diffusion bond)至主體102。在一些實施例中，時間週期為約120分鐘。
在一些實施例中，每一維持元件104具有約300微米至約500微米之間的厚度。在一些實施例中，每一維持元件104為具有約2 mm至約15 mm之間的第一側及約2 mm及約15 mm之間的第二側的正方形或矩形。在一些實施例中，每一維持元件104為具有約5 mm至約10 mm之間的第一側及約5 mm及約10 mm之間的第二側的正方形或矩形。在一些實施例中，每一維持元件可為具有約2 mm及約15 mm之間的直徑的圓形。在一些實施例中，每一維持元件可為具有約5 mm及約10 mm之間的直徑的圓形。
選擇地或組合地，可在主體102表面上形成至少一些維持元件104。例如，維持元件104可為使用遮罩以噴灑至主體102表面上的電漿以在所需位置處形成複數個維持元件104。噴灑至主體102上以形成複數個維持元件104的材料為具有以下特徵之材料：可使用相對容易、足夠附著性來噴灑至主體102表面、具有與處理期間置於基板載體100上的基板上所沉積之材料相似的熱膨脹係數、及對清理/翻新具有阻抗性。在一些實施例中，噴灑材料可為矽、鉬、鋁、氧化物、諸如此類。例如，在主體102由矽形成之實施例中，噴灑材料可為鉬，因為鉬對矽的附著性較矽噴灑材料為佳。在一些實施例中，噴灑塗佈的厚度可為約250微米至約500微米。
在一些實施例中，維持元件104可為三維(3D)列印至主體102表面上。在該實施例中，在3D列印之前粗糙化對應至維持元件104的所需位置之主體102表面以改良3D列印材料至主體102的附著性。在一些實施例中，例如，可使用氫氧化鉀(KOH)苛性溶液來粗糙化所需位置。
第3圖根據本揭示案的一些實施例圖示第1圖中沿著線2-2’取得的橫截面。在第3圖中所圖示的實施例中，在主體102表面中形成每一維持元件104。例如，可使用電子束或雷射以在主體102表面中產生凸塊304以形成每一維持元件104。為了達到此效果，自環繞凸塊位置的區域305移除(例如，熔化)材料以產生凸塊304。結果，區域305包含凹部，該凹部係材料所移除處。在一些實施例中，每一凸塊具有約1 mm至約10 mm或約2 mm的厚度。在一些實施例中，每一凸塊具有主體102表面上方約200微米至約500微米的高度。
參考第4A至4B圖進行以下描述。第4A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。第4B圖描繪第4A圖之基板載體沿著線B-B’取得的橫截面視圖。在一些實施例中，具有複數個維持元件404的基板載體400可由兩個堆疊層402a、402b形成以改良基板載體400的剛性。例如，在一些實施例中，由鉬形成且具有第一厚度t1 的上方層402a可堆疊於由碳化矽形成且具有第二厚度t2 的下方層402b上。在一些實施例中，第一厚度t1 可為約0.2 mm及約0.5 mm之間，且第二厚度t2 可小於或等於約1.5 mm。在一些實施例中，基板載體400的總重量可小於約250克。
在一些實施例中，兩個層可經配置以防止兩個層的相對移動，且確保堆疊期間兩個層的適當相對定向。例如，在一些實施例中，下方層402b可包含兩個或更多個孔洞406(展示兩個)，與基板載體400的中央410相距第一距離408以預先決定角度α相對於彼此來設置該等孔洞。在基板載體具有約300 mm的直徑之實施例中，第一距離408可為約75 mm。在一些實施例中，預先決定角度α可為相對於彼此約90度及約180度之間。在一些實施例中，預先決定角度α可為約175度。上方層402a可包含在對應於兩個或更多個孔洞406的位置處自上方層402a的下方表面延伸的兩個或更多個對應突出部407，使得在上方層402a堆疊於下方層402b上時，突出部407延伸進入孔洞406以正確地相對於彼此放置兩個層402a、402b且防止兩個層402a、402b的相對移動。
參考第5A至5B圖進行以下描述。第5A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。第5B圖描繪第5A圖之基板載體沿著線B-B’取得的橫截面視圖。在一些實施例中，基板載體500由上方層502a堆疊於下方層502b上而形成，如上方相關於基板載體400所載。因此，為了清晰，此處不會描述或在第5A、5B圖中展示層的描述及兩個層的耦合。然而，基板載體500的層可相似於基板載體400的層而配置。
在一些實施例中，基板載體500包含複數個口袋部506(展示五個)，每一口袋部由向上延伸的輪緣504界定以界定用於支撐基板的支撐表面。藉由在上方層502a中形成孔洞及彎曲緊接地相鄰於該孔洞的上方層502a之部分向上來形成輪緣504。所得輪緣504的外直徑與欲置於輪緣504頂上的基板S的直徑約相同(在第5A圖中以假想展示)。在一些實施例中，可調整原本在上方層502a中形成的孔洞的大小，使得所得輪緣的外直徑為約4吋。上方層502a的上方表面上方的輪緣504的高度h1 為約0.5 mm及約1 mm之間。在一些實施例中，基板載體500可額外地包含相似於相關於上述第1至4B圖之維持元件，以防止輪緣504上方設置的基板之徑向移動。
參考第6A至6B圖進行以下描述。第6A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。第6B圖描繪第6A圖之基板載體沿著線B-B’取得的橫截面視圖。在一些實施例中，基板載體600由上方層602a堆疊於下方層602b上而形成，如上方相關於基板載體400所載。因此，為了清晰，此處不會描述或在第6A、6B圖中展示層的描述及兩個層的耦合。然而，基板載體600的層可相似於基板載體400的層而配置。除了口袋部606的配置以外，基板載體600相似於基板載體500。
對照基板載體500的口袋部506，口袋部606不包含輪緣。反之，穿過上方層602a形成孔洞，且僅彎曲緊接地相鄰於上方層602a的部分向上以形成複數個垂片(tab)604(展示三個)而形成用於支撐基板S的支撐表面(在第6A圖中以假想展示)。可軸對稱地繞著每一口袋部606來設置複數個垂片604。環繞複數個垂片604的圓之外直徑與欲置於複數個垂片604頂上的基板S的直徑約相同。在一些實施例中，基板載體600可額外地包含相似於相關於上述第1至4B圖之維持元件，以防止複數個垂片604上方設置的基板之徑向移動。
雖然已描述基板載體的實施例之特定範例，可使用所揭露的實施例之多種組合或排序。例如，維持元件104可選擇地為珠爆式(bead-blasted)或自主體102加工出來或處於兩層載體，如上述相關於第4A至6B圖。進一步地，雖然所揭露的實施例圖示特定數量的維持元件或口袋部，發明的基板載體可經配置以容納視所需盡可能多的基板。
前述係本揭示案的實施例，可修改本揭示案的其他及進一步的實施例而不遠離其基本範圍。
100‧‧‧基板載體102‧‧‧主體104‧‧‧維持元件106‧‧‧基板107‧‧‧基板304‧‧‧凸塊305‧‧‧區域400‧‧‧基板載體402a‧‧‧上方層402b‧‧‧下方層404‧‧‧維持元件406‧‧‧孔洞407‧‧‧突出部408‧‧‧第一距離410‧‧‧中央500‧‧‧基板載體502a‧‧‧上方層502b‧‧‧下方層504‧‧‧輪緣506‧‧‧口袋部600‧‧‧基板載體602a‧‧‧上方層602b‧‧‧下方層604‧‧‧垂片606‧‧‧口袋部
可藉由參考本揭示案圖示的實施例(描繪於所附圖式中)而理解本揭示案的實施例(簡短總結如上且下方更詳細討論)。然而，所附圖式僅圖示本揭示案典型的實施例，因此不考慮限制其範圍，因為本揭示案可允許其他等效實施例。
第1圖根據本揭示案的一些實施例描繪基板載體的示意等距視圖。
第2圖根據本揭示案的一些實施例描繪第1圖之基板載體沿著線2-2’取得的橫截面視圖。
第3圖根據本揭示案的一些實施例描繪第1圖之基板載體沿著線2-2’取得的橫截面視圖。
第4A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。
第4B圖描繪第4A圖之基板載體沿著線B-B’取得的橫截面視圖。
第5A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。
第5B圖描繪第5A圖之基板載體沿著線B-B’取得的橫截面視圖。
第6A圖根據本揭示案的一些實施例描繪基板載體的示意頂部視圖。
第6B圖描繪第6A圖之基板載體沿著線B-B’取得的橫截面視圖。
為了便於理解，儘可能使用相同參考數字以標示圖式中常見的相同元件。圖式並非依比例繪製且可為了清晰而簡化。一個實施例的元件及特徵可有利地併入其他實施例中，而無須進一步敘述。
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無
100‧‧‧基板載體
102‧‧‧主體
104‧‧‧維持元件
106‧‧‧基板
107‧‧‧基板

Claims (19)

  1. 一種基板載體，包括：一實質平面主體；及複數個維持元件，該複數個維持元件排列於該實質平面主體的一表面上，其中該複數個維持元件經配置以維持該實質平面主體的該表面上的複數個基板，且其中該複數個維持元件包含至少三個維持元件，繞著該複數個基板之每一者的一對應位置來設置該至少三個維持元件，其中該實質平面主體由矽、碳化矽、或鉬形成。
  2. 如請求項1所述之基板載體，其中該複數個維持元件之每一者由矽形成且擴散鍵合至該實質平面主體。
  3. 如請求項1所述之基板載體，其中該複數個維持元件之每一者由矽、鉬、鋁、或塗佈至該實質平面主體上的一氧化物噴灑形成。
  4. 如請求項1至3之任一者所述之基板載體，其中該複數個維持元件之每一者為在該實質平面主體的該表面中形成的一凸塊。
  5. 如請求項1至3之任一者所述之基板載體，其中該複數個維持元件係三維列印至該實質平面主體上。
  6. 如請求項1至3之任一者所述之基板載體，其中該實質平面主體包含在一下方層上方堆疊的一上方層。
  7. 如請求項6所述之基板載體，其中該上方層具有約0.2mm及約0.5mm之間的一第一厚度，且該下方層具有小於或等於約1.5mm的一第二厚度。
  8. 如請求項6所述之基板載體，其中該上方層由鉬形成，且該下方層由碳化矽形成。
  9. 如請求項6所述之基板載體，其中該下方層包含穿過該下方層而形成的兩個或更多個孔洞，且該上方層包含自該上方層的一下方表面延伸進入該兩個或更多個孔洞的兩個或更多個對應突出部。
  10. 如請求項9所述之基板載體，其中以一預先決定角度相對於彼此設置該兩個或更多個孔洞。
  11. 如請求項10所述之基板載體，其中該預先決定角度為約90度及約180度之間。
  12. 一種基板載體，包括：一實質平面主體，在一下方層上堆疊一上方層而形成該實質平面主體；及複數個口袋部，該複數個口袋部在該實質平面主體中形成，該複數個口袋部之每一者包含環繞該口袋部的一支撐表面以支撐一基板。
  13. 如請求項12所述之基板載體，其中由界定該口袋部的一輪緣來形成該支撐表面，其中藉由形成穿過該上方層的一孔洞且彎曲該上方層緊接地向上環繞該孔洞來形成該輪緣。
  14. 如請求項13所述之基板載體，其中該輪緣的一外直徑為約4吋。
  15. 如請求項13至14之任一者所述之基板載體，其中該上方層的一上方表面上方的該輪緣的一第一高度為約0.5mm及約1mm之間。
  16. 如請求項12所述之基板載體，其中由複數個垂片(tab)來形成該支撐表面，其中藉由形成穿過該上方層的一孔洞且彎曲相鄰於該孔洞的該上方層之部分向上來形成該複數個垂片之每一者。
  17. 如請求項16所述之基板載體，其中該複數個垂片繞著該口袋部軸對稱地設置。
  18. 如請求項16至17之任一者所述之基板載體，其中圍繞該複數個垂片之一圓具有約4吋的一直徑。
  19. 一種基板載體，包括：一實質平面主體，在一碳化矽層上堆疊一鉬層而形成該實質平面主體；及複數個口袋部，該複數個口袋部在該實質平面主體 中形成，該複數個口袋部之每一者包含環繞該口袋部的一支撐表面以支撐一基板，其中該碳化矽層包含穿過該碳化矽層而形成的兩個或更多個孔洞，且其中該鉬層包含自該鉬層的一下方表面延伸進入該兩個或更多個孔洞的兩個或更多個對應突出部。
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