TWI743887B - 晶粒接合裝置及半導體裝置的製造方法 - Google Patents

晶粒接合裝置及半導體裝置的製造方法 Download PDF

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Publication number
TWI743887B
TWI743887B TW109123687A TW109123687A TWI743887B TW I743887 B TWI743887 B TW I743887B TW 109123687 A TW109123687 A TW 109123687A TW 109123687 A TW109123687 A TW 109123687A TW I743887 B TWI743887 B TW I743887B
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Taiwan
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linear scale
die
aforementioned
guide
moving object
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TW109123687A
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Chinese (zh)
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TW202114105A (zh
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牧浩
望月政幸
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日商捷進科技有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)
TW109123687A 2019-09-19 2020-07-14 晶粒接合裝置及半導體裝置的製造方法 TWI743887B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019170339A JP7291586B2 (ja) 2019-09-19 2019-09-19 ダイボンディング装置および半導体装置の製造方法
JP2019-170339 2019-09-19

Publications (2)

Publication Number Publication Date
TW202114105A TW202114105A (zh) 2021-04-01
TWI743887B true TWI743887B (zh) 2021-10-21

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TW109123687A TWI743887B (zh) 2019-09-19 2020-07-14 晶粒接合裝置及半導體裝置的製造方法

Country Status (4)

Country Link
JP (1) JP7291586B2 (enrdf_load_stackoverflow)
KR (1) KR102430824B1 (enrdf_load_stackoverflow)
CN (1) CN112530839B (enrdf_load_stackoverflow)
TW (1) TWI743887B (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115770947A (zh) * 2021-09-06 2023-03-10 苏州源卓光电科技有限公司 一种重布线电路图形的处理系统及处理方法
JP2023042403A (ja) * 2021-09-14 2023-03-27 ファスフォードテクノロジ株式会社 実装装置および半導体装置の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201724287A (zh) * 2015-09-30 2017-07-01 捷進科技有限公司 黏晶機及半導體裝置的製造方法
TW201810457A (zh) * 2016-03-17 2018-03-16 捷進科技有限公司 黏晶機（ｄｉｅ ｂｏｎｄｅｒ）及接合（ｂｏｎｄｉｎｇ）方法
WO2019013274A1 (ja) * 2017-07-12 2019-01-17 株式会社新川 第１物体を第２物体に対して位置決めする装置及び方法
TW201921521A (zh) * 2017-08-28 2019-06-01 日商新川股份有限公司 相對於對象物使第一移動體和第二移動體直線移動的裝置以及方法
CN109923640A (zh) * 2016-11-09 2019-06-21 东京毅力科创株式会社 接合装置、接合系统、接合方法和计算机存储介质

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JPH0951007A (ja) * 1995-08-09 1997-02-18 Mitsubishi Electric Corp ダイボンド装置および半導体装置の製造方法
JP3482935B2 (ja) 2000-03-21 2004-01-06 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP4080149B2 (ja) * 2000-07-11 2008-04-23 松下電器産業株式会社 作業ヘッドの移動装置
KR100326757B1 (en) * 2001-08-09 2002-03-13 Justek Corp Method for correcting error of scaler according to variation of temperature in linear motor
KR20070016098A (ko) * 2004-06-03 2007-02-07 마츠시타 덴끼 산교 가부시키가이샤 부품 실장 방법 및 장치
JP2006041260A (ja) * 2004-07-28 2006-02-09 Juki Corp 電子部品搭載装置のノズル位置補正方法
JP2006313839A (ja) 2005-05-09 2006-11-16 Juki Corp 部品実装装置
JP4130838B2 (ja) * 2006-06-19 2008-08-06 住友重機械工業株式会社 ステージ装置
JP2008117968A (ja) * 2006-11-06 2008-05-22 Tokyo Seimitsu Co Ltd プローバ
JP2010135363A (ja) 2008-12-02 2010-06-17 Panasonic Corp 部品実装装置および部品実装装置におけるツール配列データ作成方法
KR20130117191A (ko) * 2012-04-18 2013-10-25 한미반도체 주식회사 작업유닛 이송장치
JP5918622B2 (ja) 2012-05-11 2016-05-18 ヤマハ発動機株式会社 部品または基板の作業装置および部品実装装置
JP5996979B2 (ja) * 2012-09-07 2016-09-21 ヤマハ発動機株式会社 電子部品実装装置および実装位置補正データ作成方法
TWI545663B (zh) * 2014-05-07 2016-08-11 新川股份有限公司 接合裝置以及接合方法
JP6510838B2 (ja) * 2015-03-11 2019-05-08 ファスフォードテクノロジ株式会社 ボンディング装置及びボンディング方法
SG11201710074TA (en) * 2015-03-31 2018-01-30 Shinkawa Kk Wire bonding apparatus and wire bonding method
JP7033878B2 (ja) * 2017-10-16 2022-03-11 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201724287A (zh) * 2015-09-30 2017-07-01 捷進科技有限公司 黏晶機及半導體裝置的製造方法
TW201810457A (zh) * 2016-03-17 2018-03-16 捷進科技有限公司 黏晶機（ｄｉｅ ｂｏｎｄｅｒ）及接合（ｂｏｎｄｉｎｇ）方法
CN109923640A (zh) * 2016-11-09 2019-06-21 东京毅力科创株式会社 接合装置、接合系统、接合方法和计算机存储介质
WO2019013274A1 (ja) * 2017-07-12 2019-01-17 株式会社新川 第１物体を第２物体に対して位置決めする装置及び方法
TW201921521A (zh) * 2017-08-28 2019-06-01 日商新川股份有限公司 相對於對象物使第一移動體和第二移動體直線移動的裝置以及方法

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Publication number Publication date
JP2021048285A (ja) 2021-03-25
CN112530839A (zh) 2021-03-19
CN112530839B (zh) 2024-03-08
KR20210033896A (ko) 2021-03-29
TW202114105A (zh) 2021-04-01
KR102430824B1 (ko) 2022-08-09
JP7291586B2 (ja) 2023-06-15

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