TWI740049B - 電漿處理裝置及電漿處理方法 - Google Patents
電漿處理裝置及電漿處理方法 Download PDFInfo
- Publication number
- TWI740049B TWI740049B TW107118901A TW107118901A TWI740049B TW I740049 B TWI740049 B TW I740049B TW 107118901 A TW107118901 A TW 107118901A TW 107118901 A TW107118901 A TW 107118901A TW I740049 B TWI740049 B TW I740049B
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- focus ring
- plasma processing
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- high frequency
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32366—Localised processing
- H01J37/32385—Treating the edge of the workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24564—Measurements of electric or magnetic variables, e.g. voltage, current, frequency
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-116950 | 2017-06-14 | ||
| JP2017116950A JP6826955B2 (ja) | 2017-06-14 | 2017-06-14 | プラズマ処理装置及びプラズマ処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201906006A TW201906006A (zh) | 2019-02-01 |
| TWI740049B true TWI740049B (zh) | 2021-09-21 |
Family
ID=64658264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107118901A TWI740049B (zh) | 2017-06-14 | 2018-06-01 | 電漿處理裝置及電漿處理方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10431433B2 (enExample) |
| JP (1) | JP6826955B2 (enExample) |
| KR (1) | KR102494181B1 (enExample) |
| CN (1) | CN109087843B (enExample) |
| SG (1) | SG10201804881QA (enExample) |
| TW (1) | TWI740049B (enExample) |
Families Citing this family (74)
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| CN107658203B (zh) * | 2011-05-05 | 2020-04-14 | 岛津研究实验室(欧洲)有限公司 | 操纵带电粒子的装置 |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10763081B2 (en) | 2017-07-10 | 2020-09-01 | Applied Materials, Inc. | Apparatus and methods for manipulating radio frequency power at an edge ring in plasma process device |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| US10763150B2 (en) * | 2017-09-20 | 2020-09-01 | Applied Materials, Inc. | System for coupling a voltage to spatially segmented portions of the wafer with variable voltage |
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| JP7061922B2 (ja) * | 2018-04-27 | 2022-05-02 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
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| JP6846384B2 (ja) * | 2018-06-12 | 2021-03-24 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理装置の高周波電源を制御する方法 |
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| CN112654655A (zh) | 2018-09-04 | 2021-04-13 | 应用材料公司 | 先进抛光垫配方 |
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| JP7451540B2 (ja) | 2019-01-22 | 2024-03-18 | アプライド マテリアルズ インコーポレイテッド | パルス状電圧波形を制御するためのフィードバックループ |
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| JP7220626B2 (ja) * | 2019-06-18 | 2023-02-10 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
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| US12272520B2 (en) | 2019-07-09 | 2025-04-08 | Tokyo Electron Limited | Process control enabled VDC sensor for plasma process |
| KR102290909B1 (ko) * | 2019-08-30 | 2021-08-19 | 세메스 주식회사 | 기판 처리 장치 및 챔버 클리닝 방법 |
| JP7325294B2 (ja) * | 2019-10-17 | 2023-08-14 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| JP7394601B2 (ja) * | 2019-11-28 | 2023-12-08 | 東京エレクトロン株式会社 | プラズマ処理装置及び測定方法 |
| JP7336395B2 (ja) * | 2020-01-29 | 2023-08-31 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| US11742184B2 (en) * | 2020-02-28 | 2023-08-29 | Tokyo Electron Limited | Plasma processing apparatus and plasma processing method |
| JP7390219B2 (ja) * | 2020-03-11 | 2023-12-01 | 東京エレクトロン株式会社 | エッジリングの保持方法、プラズマ処理装置、及び基板処理システム |
| JP7466432B2 (ja) * | 2020-03-24 | 2024-04-12 | 東京エレクトロン株式会社 | プラズマ処理装置及び消耗量測定方法 |
| KR102798284B1 (ko) * | 2020-05-01 | 2025-04-18 | 도쿄엘렉트론가부시키가이샤 | 에칭 장치 및 에칭 방법 |
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| US11551951B2 (en) | 2020-05-05 | 2023-01-10 | Applied Materials, Inc. | Methods and systems for temperature control for a substrate |
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| KR102560774B1 (ko) * | 2022-01-28 | 2023-07-27 | 삼성전자주식회사 | 기판 처리 장치 및 이를 이용한 기판 처리 방법 |
| TW202405868A (zh) * | 2022-04-22 | 2024-02-01 | 日商東京威力科創股份有限公司 | 電漿處理裝置及電漿處理方法 |
| US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
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| JP7639953B1 (ja) * | 2024-01-25 | 2025-03-05 | Toto株式会社 | 静電チャック |
| WO2025169734A1 (ja) * | 2024-02-06 | 2025-08-14 | 東京エレクトロン株式会社 | プラズマ処理装置 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258417A (ja) * | 2006-03-23 | 2007-10-04 | Tokyo Electron Ltd | プラズマ処理方法 |
| US20090026170A1 (en) * | 2007-03-12 | 2009-01-29 | Tokyo Electron Limited | Plasma processing apparatus and method of plasma distribution correction |
| TW201130032A (en) * | 2009-08-04 | 2011-09-01 | Tokyo Electron Ltd | Plasma processing apparatus and plasma processing method |
| TW201143549A (en) * | 2009-10-27 | 2011-12-01 | Tokyo Electron Ltd | Plasma processing apparatus and method |
| TW201344739A (zh) * | 2012-01-10 | 2013-11-01 | Tokyo Electron Ltd | 電漿處理裝置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1973363B (zh) * | 2004-06-21 | 2011-09-14 | 东京毅力科创株式会社 | 等离子体处理装置和方法 |
| JP4790458B2 (ja) * | 2006-03-22 | 2011-10-12 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5281309B2 (ja) * | 2008-03-28 | 2013-09-04 | 東京エレクトロン株式会社 | プラズマエッチング装置及びプラズマエッチング方法及びコンピュータ読み取り可能な記憶媒体 |
| JP5571996B2 (ja) * | 2010-03-31 | 2014-08-13 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| JP6396822B2 (ja) * | 2015-02-16 | 2018-09-26 | 東京エレクトロン株式会社 | プラズマ処理装置のサセプタの電位を制御する方法 |
| US10163610B2 (en) * | 2015-07-13 | 2018-12-25 | Lam Research Corporation | Extreme edge sheath and wafer profile tuning through edge-localized ion trajectory control and plasma operation |
-
2017
- 2017-06-14 JP JP2017116950A patent/JP6826955B2/ja active Active
-
2018
- 2018-06-01 TW TW107118901A patent/TWI740049B/zh active
- 2018-06-08 SG SG10201804881QA patent/SG10201804881QA/en unknown
- 2018-06-08 US US16/003,954 patent/US10431433B2/en active Active
- 2018-06-12 KR KR1020180067114A patent/KR102494181B1/ko active Active
- 2018-06-14 CN CN201810612044.8A patent/CN109087843B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007258417A (ja) * | 2006-03-23 | 2007-10-04 | Tokyo Electron Ltd | プラズマ処理方法 |
| US20090026170A1 (en) * | 2007-03-12 | 2009-01-29 | Tokyo Electron Limited | Plasma processing apparatus and method of plasma distribution correction |
| TW201130032A (en) * | 2009-08-04 | 2011-09-01 | Tokyo Electron Ltd | Plasma processing apparatus and plasma processing method |
| TW201143549A (en) * | 2009-10-27 | 2011-12-01 | Tokyo Electron Ltd | Plasma processing apparatus and method |
| TW201344739A (zh) * | 2012-01-10 | 2013-11-01 | Tokyo Electron Ltd | 電漿處理裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102494181B1 (ko) | 2023-01-31 |
| TW201906006A (zh) | 2019-02-01 |
| CN109087843B (zh) | 2020-06-09 |
| KR20180136390A (ko) | 2018-12-24 |
| CN109087843A (zh) | 2018-12-25 |
| JP6826955B2 (ja) | 2021-02-10 |
| US20180366305A1 (en) | 2018-12-20 |
| US10431433B2 (en) | 2019-10-01 |
| SG10201804881QA (en) | 2019-01-30 |
| JP2019004027A (ja) | 2019-01-10 |
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