TWI739801B - 聚烯烴系樹脂組成物及聚烯烴系樹脂薄膜 - Google Patents
聚烯烴系樹脂組成物及聚烯烴系樹脂薄膜 Download PDFInfo
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- TWI739801B TWI739801B TW106104864A TW106104864A TWI739801B TW I739801 B TWI739801 B TW I739801B TW 106104864 A TW106104864 A TW 106104864A TW 106104864 A TW106104864 A TW 106104864A TW I739801 B TWI739801 B TW I739801B
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- polyolefin
- polyolefin resin
- ion
- resin composition
- mass
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- 229920005672 polyolefin resin Polymers 0.000 title claims abstract description 154
- 239000011342 resin composition Substances 0.000 title claims abstract description 59
- 229910052751 metal Inorganic materials 0.000 claims abstract description 42
- 239000002184 metal Substances 0.000 claims abstract description 42
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 150000003839 salts Chemical class 0.000 claims abstract description 32
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims abstract description 29
- 229920001281 polyalkylene Polymers 0.000 claims abstract description 28
- 238000002844 melting Methods 0.000 claims abstract description 20
- 230000008018 melting Effects 0.000 claims abstract description 20
- 238000000465 moulding Methods 0.000 claims abstract description 9
- -1 tetrafluoroborate ion Chemical class 0.000 claims description 93
- 229920000379 polypropylene carbonate Polymers 0.000 claims description 15
- 239000004698 Polyethylene Substances 0.000 claims description 9
- 150000001450 anions Chemical class 0.000 claims description 9
- 150000001768 cations Chemical class 0.000 claims description 9
- 229920000573 polyethylene Polymers 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 7
- 229910001416 lithium ion Inorganic materials 0.000 claims description 7
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims description 6
- 229910001414 potassium ion Inorganic materials 0.000 claims description 6
- 229910001415 sodium ion Inorganic materials 0.000 claims description 6
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 claims description 5
- FKNQFGJONOIPTF-UHFFFAOYSA-N Sodium cation Chemical compound [Na+] FKNQFGJONOIPTF-UHFFFAOYSA-N 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 4
- 229940063013 borate ion Drugs 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 claims description 4
- BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 claims description 3
- JLVVSXFLKOJNIY-UHFFFAOYSA-N Magnesium ion Chemical compound [Mg+2] JLVVSXFLKOJNIY-UHFFFAOYSA-N 0.000 claims description 3
- 229910001424 calcium ion Inorganic materials 0.000 claims description 3
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 claims description 3
- 229910001425 magnesium ion Inorganic materials 0.000 claims description 3
- 150000008051 alkyl sulfates Chemical class 0.000 claims description 2
- ULFHSQLFQYTZLS-UHFFFAOYSA-N difluoroamine Chemical compound FNF ULFHSQLFQYTZLS-UHFFFAOYSA-N 0.000 claims description 2
- 150000002367 halogens Chemical class 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000010408 film Substances 0.000 description 62
- 238000000034 method Methods 0.000 description 31
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 24
- 239000003054 catalyst Substances 0.000 description 23
- 238000006116 polymerization reaction Methods 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000004743 Polypropylene Substances 0.000 description 13
- 125000002947 alkylene group Chemical group 0.000 description 13
- 239000001569 carbon dioxide Substances 0.000 description 12
- 229910002092 carbon dioxide Inorganic materials 0.000 description 12
- 229920001155 polypropylene Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 150000001336 alkenes Chemical class 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 7
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 229920006026 co-polymeric resin Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000005022 packaging material Substances 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000011701 zinc Substances 0.000 description 6
- 229910052725 zinc Inorganic materials 0.000 description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 5
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 230000000379 polymerizing effect Effects 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000007810 chemical reaction solvent Substances 0.000 description 3
- 229910017052 cobalt Inorganic materials 0.000 description 3
- 239000010941 cobalt Substances 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000004128 high performance liquid chromatography Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZXMGHDIOOHOAAE-UHFFFAOYSA-N 1,1,1-trifluoro-n-(trifluoromethylsulfonyl)methanesulfonamide Chemical compound FC(F)(F)S(=O)(=O)NS(=O)(=O)C(F)(F)F ZXMGHDIOOHOAAE-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- GHKOFFNLGXMVNJ-UHFFFAOYSA-N Didodecyl thiobispropanoate Chemical compound CCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCC GHKOFFNLGXMVNJ-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- DTQVDTLACAAQTR-UHFFFAOYSA-N Trifluoroacetic acid Chemical compound OC(=O)C(F)(F)F DTQVDTLACAAQTR-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 239000003242 anti bacterial agent Substances 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- BJFLSHMHTPAZHO-UHFFFAOYSA-N benzotriazole Chemical compound [CH]1C=CC=C2N=NN=C21 BJFLSHMHTPAZHO-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 229940006460 bromide ion Drugs 0.000 description 2
- QARVLSVVCXYDNA-UHFFFAOYSA-N bromobenzene Chemical compound BrC1=CC=CC=C1 QARVLSVVCXYDNA-UHFFFAOYSA-N 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- PWWSSIYVTQUJQQ-UHFFFAOYSA-N distearyl thiodipropionate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)CCSCCC(=O)OCCCCCCCCCCCCCCCCCC PWWSSIYVTQUJQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
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- 239000003063 flame retardant Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002608 ionic liquid Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSZMZKBZAYQGRS-UHFFFAOYSA-N lithium;bis(trifluoromethylsulfonyl)azanide Chemical compound [Li+].FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F QSZMZKBZAYQGRS-UHFFFAOYSA-N 0.000 description 2
- SXAPNULOVYUSAO-UHFFFAOYSA-M lithium;n,n-dimethylformamide;bromide Chemical compound [Li+].[Br-].CN(C)C=O SXAPNULOVYUSAO-UHFFFAOYSA-M 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- 239000012188 paraffin wax Substances 0.000 description 2
- ZQBAKBUEJOMQEX-UHFFFAOYSA-N phenyl salicylate Chemical compound OC1=CC=CC=C1C(=O)OC1=CC=CC=C1 ZQBAKBUEJOMQEX-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 230000037048 polymerization activity Effects 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 2
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 2
- 238000012552 review Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- QEDNBHNWMHJNAB-UHFFFAOYSA-N tris(8-methylnonyl) phosphite Chemical compound CC(C)CCCCCCCOP(OCCCCCCCC(C)C)OCCCCCCCC(C)C QEDNBHNWMHJNAB-UHFFFAOYSA-N 0.000 description 2
- 150000003752 zinc compounds Chemical class 0.000 description 2
- 239000011787 zinc oxide Substances 0.000 description 2
- KTQVJAPIQPIIPF-IOBHVTPZSA-N (1Z,2Z)-N,N'-dihydroxyethanediimidoyl dichloride Chemical compound O\N=C(/Cl)\C(\Cl)=N\O KTQVJAPIQPIIPF-IOBHVTPZSA-N 0.000 description 1
- GJEZBVHHZQAEDB-SYDPRGILSA-N (1s,5r)-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC[C@H]2O[C@H]21 GJEZBVHHZQAEDB-SYDPRGILSA-N 0.000 description 1
- SKDNDVDHYMEGNJ-UHFFFAOYSA-N (2-bromo-2-nitroethenyl)benzene Chemical compound [O-][N+](=O)C(Br)=CC1=CC=CC=C1 SKDNDVDHYMEGNJ-UHFFFAOYSA-N 0.000 description 1
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- RBACIKXCRWGCBB-UHFFFAOYSA-N 1,2-Epoxybutane Chemical compound CCC1CO1 RBACIKXCRWGCBB-UHFFFAOYSA-N 0.000 description 1
- 150000004345 1,2-dihydroxyanthraquinones Chemical class 0.000 description 1
- KEQGZUUPPQEDPF-UHFFFAOYSA-N 1,3-dichloro-5,5-dimethylimidazolidine-2,4-dione Chemical compound CC1(C)N(Cl)C(=O)N(Cl)C1=O KEQGZUUPPQEDPF-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- GELKGHVAFRCJNA-UHFFFAOYSA-N 2,2-Dimethyloxirane Chemical compound CC1(C)CO1 GELKGHVAFRCJNA-UHFFFAOYSA-N 0.000 description 1
- FMNZAHDAULEOSO-UHFFFAOYSA-N 2,2-dibromo-2-nitroethanol Chemical compound OCC(Br)(Br)[N+]([O-])=O FMNZAHDAULEOSO-UHFFFAOYSA-N 0.000 description 1
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 description 1
- SLWOPZBLNKPZCQ-UHFFFAOYSA-N 2-(naphthalen-1-ylmethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1CC1CO1 SLWOPZBLNKPZCQ-UHFFFAOYSA-N 0.000 description 1
- QYYCPWLLBSSFBW-UHFFFAOYSA-N 2-(naphthalen-1-yloxymethyl)oxirane Chemical compound C=1C=CC2=CC=CC=C2C=1OCC1CO1 QYYCPWLLBSSFBW-UHFFFAOYSA-N 0.000 description 1
- AQZRARFZZMGLHL-UHFFFAOYSA-N 2-(trifluoromethyl)oxirane Chemical compound FC(F)(F)C1CO1 AQZRARFZZMGLHL-UHFFFAOYSA-N 0.000 description 1
- BSPCSKHALVHRSR-UHFFFAOYSA-N 2-chlorobutane Chemical compound CCC(C)Cl BSPCSKHALVHRSR-UHFFFAOYSA-N 0.000 description 1
- RFVNOJDQRGSOEL-UHFFFAOYSA-N 2-hydroxyethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCCO RFVNOJDQRGSOEL-UHFFFAOYSA-N 0.000 description 1
- ROIMNSWDOJCBFR-UHFFFAOYSA-N 2-iodothiophene Chemical compound IC1=CC=CS1 ROIMNSWDOJCBFR-UHFFFAOYSA-N 0.000 description 1
- GCAXGCSCRRVVLF-UHFFFAOYSA-N 3,3,4,4-tetrachlorothiolane 1,1-dioxide Chemical compound ClC1(Cl)CS(=O)(=O)CC1(Cl)Cl GCAXGCSCRRVVLF-UHFFFAOYSA-N 0.000 description 1
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Abstract
提供抗靜電性能優異的聚烯烴系樹脂組成物及由該組成物成形的聚烯烴系樹脂薄膜。更具體來說,提供一種聚烯烴系樹脂組成物,含有:聚烯烴系樹脂、聚伸烷碳酸酯樹脂及熔點高於100℃的金屬鹽。又,提供一種聚烯烴系樹脂薄膜,係成形該聚烯烴系樹脂組成物而成且至少沿單軸方向延伸。
Description
發明領域 本發明是關於聚烯烴系樹脂組成物及使用該聚烯烴系樹脂組成物製得的聚烯烴系樹脂薄膜。
發明背景 聚烯烴系樹脂廉價,物理性質的平衡也優異,而使用於廣泛的用途。特別是聚烯烴系樹脂薄膜因為具有優秀的比強度與化學穩定性,廣泛地作為包裝材料使用。但聚烯烴系樹脂的表面比電阻率非常大,容易因摩擦等而帶電,因此成形成薄膜等之後,塵埃等的附著會造成問題。特別是使用於電子構件等精密機器的包裝時,由於必須避免塵埃的附著,藉由進行摻合各種導電性物質,使聚烯烴系樹脂的表面比電阻率降低,而賦予抗靜電功能。例如,專利文獻1中揭示有藉由在聚丙烯樹脂中混入表面改質奈米碳管,而製造抗靜電性能優秀的聚烯烴樹脂組成物。專利文獻2中揭示有藉由將聚苯乙烯系樹脂與離子聚合物樹脂摻混於聚烯烴,而製造抗靜電性能優秀的聚烯烴樹脂組成物。
先前技術文獻 專利文獻 專利文獻1:特開2009-249241號公報 專利文獻2:特開2011-162761號公報
發明概要 發明欲解決之課題 由於聚烯烴系樹脂是非極性樹脂,與具有極性的導電性物質非常難以混合,為了使聚烯烴系樹脂具有抗靜電效果,必須大量混入導電性物質。因此,會有使聚烯烴系樹脂的機械強度降低,或有起因於導電性物質而產生的染色之虞。
本發明人等在早於本發明前發現,藉由將聚伸烷碳酸酯樹脂與離子液體摻混於聚烯烴系樹脂而成的樹脂組成物至少沿單軸方向延伸,相較於之前的聚烯烴系樹脂,表面電阻率大幅地降低。然而,由於離子液體是黏度非常高的液體,混練時必須有注入高黏度液體用的裝置,又因高黏度而定量性有困難,因此期望可實現更優秀的作業性。
本發明為鑑於上述內容而作成的發明,目的是提供藉著將導電性物質添加於聚烯烴系樹脂而獲得抗靜電性能,且製造時可實現優異作業性的聚烯烴系樹脂組成物,及由該組成物成形的聚烯烴系樹脂薄膜。
本發明人等反覆檢討的結果發現,藉由將聚伸烷碳酸酯樹脂與熔點高於100℃的金屬鹽摻混至聚烯烴系樹脂而成的樹脂組成物至少沿單軸方向延伸,與原本的聚烯烴系樹脂比較表面電阻率大幅降低,更經過重重檢討以至完成本發明。
本發明例如包含下述之聚烯烴系樹脂組成物及聚烯烴系樹脂薄膜。 項1. 一種聚烯烴系樹脂組成物,含有:聚烯烴系樹脂、聚伸烷碳酸酯樹脂及熔點高於100℃的金屬鹽。 項2. 如項1記載之聚烯烴系樹脂組成物,其中相對於聚烯烴系樹脂100質量份,含有聚伸烷碳酸酯樹脂0.05~20質量份、熔點高於100℃的金屬鹽0.01~5質量份。 項3. 如項1或2記載之聚烯烴系樹脂組成物,聚伸烷碳酸酯樹脂是聚碳酸丙烯酯。 項4. 如項1~3任一項記載之聚烯烴系樹脂組成物,其中聚烯烴系樹脂是聚乙烯。 項5. 一種聚烯烴系樹脂薄膜,係將項1~4中任一項記載之聚烯烴系樹脂組成物成形而成,且至少沿單軸方向延伸。 項6. 如項5記載之聚烯烴系樹脂薄膜,其在前述單軸方向上的延伸倍率是1.01~20。
發明效果 本發明之聚烯烴系樹脂組成物維持了用來製得該組成物使用的聚烯烴系樹脂的物理性質,又,將該聚烯烴系樹脂組成物至少沿單軸方向延伸而形成的薄膜,表面電阻率大幅降低而抗靜電性提升。因此,可減少如塵埃附著之類使用上的不良狀況。
用以實施發明之形態 以下,詳細說明本發明的實施形態。
[聚烯烴系樹脂組成物] 聚烯烴系樹脂組成物含有:聚烯烴系樹脂、聚伸烷碳酸酯樹脂、熔點高於100℃的金屬鹽。
上述聚烯烴系樹脂是指含有源自於烯烴之單體單元的聚合物,例如可舉:聚乙烯系樹脂、聚丙烯系樹脂、乙烯-羧酸烯烴酯共聚物樹脂、乙烯-不飽和羧酸烷基酯共聚物樹脂、聚丁烯系樹脂、聚(4-甲基-1-戊烯)系樹脂等。
作為上述聚乙烯系樹脂,較佳可例示聚乙烯。作為聚乙烯並未特別限制,例如可使用低密度聚乙烯、線性低密度聚乙烯、中密度聚乙烯、高密度聚乙烯、超高分子量聚乙烯等。
作為聚丙烯系樹脂,聚丙烯或丙烯與其他烯烴的共聚物為佳。在此,作為「其他烯烴」例如可舉:乙烯、丁烯、戊烯、己烯、辛烯等。該等之「其他烯烴」可單獨使用1種或組合2種以上來使用。若是共聚物的情況,可以是嵌段共聚物、隨機共聚物及交替共聚物任一種態樣。作為聚丙烯系樹脂,具體來說,以聚丙烯,或丙烯-乙烯共聚物、丙烯-乙烯-丁烯共聚物、丙烯-丁烯共聚物、丙烯-己烯共聚物、丙烯-辛烯共聚物等為佳,聚丙烯更佳。作為聚丙烯並未特別限制,例如可使用同排聚丙烯、間規聚丙烯等。
作為乙烯-羧酸烯烴酯共聚物樹脂的「羧酸烯烴酯」例示有乙酸乙烯酯、丙酸乙烯酯、丁酸乙烯酯、乙酸異丙烯酯、乙酸烯丙酯等。其中乙酸乙烯酯為佳。作為乙烯-羧酸烯烴酯共聚物樹脂,具體來說,乙烯-乙酸乙烯酯共聚物特別佳。
作為乙烯-不飽和羧酸烷基酯共聚物樹脂的「不飽和羧酸烷基酯」例示有丙烯酸甲酯、丙烯酸乙酯、丙烯酸丙酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸丙酯等。其中丙烯酸甲酯、甲基丙烯酸甲酯為佳。作為乙烯-不飽和羧酸烷基酯共聚物樹脂,具體來說,乙烯-丙烯酸甲酯共聚物、乙烯-甲基丙烯酸甲酯共聚物特別佳。
聚烯烴系樹脂可單獨使用1種或組合2種以上使用。聚烯烴系樹脂之中,從與聚伸烷碳酸酯樹脂的相溶性佳的觀點來看,聚乙烯系樹脂或聚丙烯系樹脂為佳,選自於由聚乙烯、聚丙烯及乙烯與其他烯烴的共聚物所構成群組中之至少一種更佳,聚乙烯、聚丙烯特別佳。
作為聚烯烴系樹脂的製造方法並未特別限制,可以用周知的方法。例如可舉,使用過氧化物等起始劑將烯烴自由基聚合之方法,在聚合觸媒存在下利用氣相法、溶液法等將烯烴聚合之方法等。作為聚合觸媒,可使用戚格勒・納他觸媒、飛利浦觸媒、茂金屬觸媒等。
上述聚烯烴系樹脂的分子量並未特別限制,但例如質量平均分子量較佳的下限為20,000、較佳的上限為6,000,000,更佳的下限為50,000、更佳的上限為3,000,000,特別佳的下限為100,000、特別佳的上限為1,000,000。聚烯烴系樹脂的質量平均分子量在20,000以上時,製得的聚烯烴系樹脂組成物的機械強度會更加地提升而足以實際使用。又,聚烯烴系樹脂的質量平均分子量在6,000,000以下時,製得的聚烯烴系樹脂組成物的成形加工會變得更容易。
再者,該質量平均分子量是調製聚烯烴系樹脂濃度為0.5%的1,2-二氯苯溶液,並利用高效能液相層析法測定,再與已在同一條件下測定的已知質量平均分子量的聚苯乙烯進行比較,而藉以算出之值。測定條件如下。
管柱:GPC管柱 (Tosoh Corporation的商品名,TSKgel GMHHR-H HT) 管柱溫度:140℃ 溶出液:1,2-二氯苯 流速:1mL/min
樹脂的流動性,是以例如JIS K 7210:1999中規定的方法所測定的熔流速率(MFR,單位:g/10分)來表示。上述聚烯烴系樹脂藉由該方法,在溫度230℃、負重2.16kg實測的MFR值的下限在0.5為佳,上限在100為佳。上述MFR值的下限在1更佳,上述MFR值的上限在50(g/10分)更佳。聚烯烴系樹脂的MFR值在0.5以上時,製得的聚烯烴系樹脂組成物的流動性不會太低,可藉由擠壓成形法或吹模成形法等良好地成形。又,聚烯烴系樹脂的MFR值在100以下時,可藉由射出成形法等良好地成形。
再者,聚烯烴系樹脂組成物中含有的聚烯烴系樹脂量並未特別限制,可在不損及本發明效果的範圍內適當設定。例如可為50質量%以上、60質量%以上、70質量%以上、80質量%以上、90質量%以上、95質量%以上、99質量%以上或99.9質量%以上。
作為聚伸烷碳酸酯樹脂並未特別限定,例如可舉:使環氧烷與二氧化碳聚合而成的聚合物(即,環氧烷與二氧化碳的共聚物)、使環狀碳酸酯開環聚合而成的聚合物。其中,使用環氧烷與二氧化碳的共聚物為佳。再者,環氧烷與二氧化碳的聚合反應可在金屬觸媒的存在下而良好地進行。
作為環氧烷例如可舉:環氧乙烷、環氧丙烷、1-環氧丁烷、2-環氧丁烷、伸異丁氧、1-環氧戊烷、2-環氧戊烷、1-環氧己烷、1-環氧辛烷、1-環氧癸烷、環氧環戊烷、環氧環己烷、氧化苯乙烯、乙烯基環氧環己烷、3-苯基環氧丙烷、3,3,3-三氟環氧丙烷、3-萘基環氧丙烷、3-苯氧基環氧丙烷、3-萘氧基環氧丙烷、一環氧丁二烯、3-乙烯氧基環氧丙烷及3-三甲基矽氧基環氧丙烷等。該等環氧烷中,從與二氧化碳有高聚合反應性的觀點來看,環氧乙烷及環氧丙烷較佳,環氧丙烷更佳。再者,該等環氧烷可分別單獨使用,或組合2種以上使用。
作為前述金屬觸媒,例如可舉:鋁觸媒、鋅觸媒等。其中,從對環氧烷與二氧化碳的聚合反應有高聚合活性的觀點來看,宜使用鋅觸媒。
作為前述鋅觸媒,例如可舉:醋酸鋅、二乙基鋅、二丁基鋅等有機鋅觸媒,或,一級胺、2價苯酚、2價芳香族羧酸、芳香族羥酸、脂肪族二羧酸、脂肪族單羧酸等化合物與鋅化合物反應而製得的有機鋅觸媒等。該等有機鋅觸媒中,從有高聚合活性的觀點來看,使鋅化合物與脂肪族二羧酸、脂肪族單羧酸反應而製得的有機鋅觸媒較佳。作為有機鋅觸媒,具體來說較適當的可例示二甲基鋅、二乙基鋅、二苯基鋅。
用於聚合反應的前述金屬觸媒的使用量,相對於環氧烷100質量份,下限在0.001質量份為佳,上限在20質量份為佳,下限在0.01質量份更佳,上限在10質量份更佳。金屬觸媒的使用量在0.001質量份以上時,可使聚合反應迅速進行。又,金屬觸媒的使用量在20質量份以下時,可良好地得到相應於使用量的效果。
作為使環氧烷與二氧化碳在金屬觸媒的存在下聚合反應的方法並未特別限定,例如可舉:在熱壓器中加入前述環氧烷、金屬觸媒,並視情況需要加入反應溶劑,混合之後,壓入二氧化碳使之反應的方法。
作為前述聚合反應中視情況需要而使用的反應溶劑並未特別限定,可使用各種有機溶劑。作為前述有機溶劑,具體來說例如可舉:戊烷、己烷、辛烷、癸烷、環己烷等脂肪族烴系溶劑;苯、甲苯、二甲苯等芳香族烴系溶劑;二氯甲烷、三氯甲烷、四氯化碳、1,1-二氯乙烷、1,2-二氯乙烷、氯乙烷、三氯乙烷、1-氯丙烷、2-氯丙烷、1-氯丁烷、2-氯丁烷、1-氯-2-甲基丙烷、氯苯、溴苯等鹵化烴系溶劑;四氫呋喃、1,3-二草酸酯、1,4-二烷、1,2-二甲氧乙烷等醚系溶劑;乙酸乙酯、醋酸丁酯等酯系溶劑;丙酮、甲基乙基酮、甲基異丁基酮等酮系溶劑;碳酸二甲酯、碳酸二乙酯、碳酸丙烯酯等碳酸酯系溶劑等。
前述反應溶劑的使用量,從使反應順利地進行的觀點來看,相對於環氧烷100質量份,在100~10,000質量份為佳。
前述聚合反應的二氧化碳的使用壓力並未特別限定,通常下限在0.1MPa為佳,上限在20MPa為佳,下限在0.2MPa較佳,上限在10MPa較佳,下限在0.5MPa更佳,上限在5MPa更佳。
前述聚合反應中的聚合反應溫度並未特別限定,不過下限在30℃為佳,上限在100℃為佳,下限在40℃更佳,上限在80℃更佳。聚合反應溫度在30℃以上時,聚合反應可更迅速進行。又,聚合反應溫度在100℃以下時副反應不易產生,聚合物的產率得以更加提升。聚合反應時間會因聚合反應溫度、觸媒量、環氧烷的種類而異,因此無法一概而論,但通常在2~40小時為佳。
聚合反應結束後,藉由過濾等濾出,視必要以溶劑等洗淨後,使之乾燥便可製得聚伸烷碳酸酯樹脂。
構成上述聚烯烴系樹脂組成物的聚伸烷碳酸酯樹脂可以是單獨1種,也可以是2種以上的組合。
聚伸烷碳酸酯樹脂的質量平均分子量較佳的下限為10,000、較佳的上限為2,000,000,更佳的下限為30,000、更佳的上限為1,000,000,特別佳的下限為50,000、特別佳的上限為750,000。再者,該質量平均分子量是藉由調製聚伸烷碳酸酯樹脂濃度為0.5%的N,N-二甲基甲醯胺溶液,並利用高效能液相層析法測定,將之與在同一條件下測定的已知質量平均分子量的聚苯乙烯進行比較,而藉以算出之值。測定條件如下。
管柱:GPC管柱 (昭和電工(股)的商品名,Shodex OHPac SB-800系列) 管柱溫度:40℃ 溶出液:0.03mol/L 溴化鋰-N,N-二甲基甲醯胺溶液 流速:0.65mL/min
聚伸烷碳酸酯樹脂的質量平均分子量在10,000以上時,製得的聚烯烴系樹脂組成物的機械強度會更加地提升。又,聚烯烴系樹脂的質量平均分子量在2,000,000以下時,對聚烯烴系樹脂的分散性會更提升。
聚烯烴系樹脂組成物中,作為聚伸烷碳酸酯樹脂的含量,相對於聚烯烴系樹脂100質量份,下限在0.05質量份為佳,上限在20質量份為佳,下限在0.5質量份較佳,上限在17.5質量份較佳,下限在1質量份更佳,上限在15質量份更佳。聚伸烷碳酸酯樹脂的含量超過20質量份時,聚烯烴系樹脂組成物的機械強度或斷裂應變會稍微減低。聚伸烷碳酸酯樹脂的含量低於0.05質量份時,會無法得到較大的聚烯烴系樹脂組成物的改質效果。
熔點高於100℃的金屬鹽是由金屬陽離子與陰離子構成。作為金屬陽離子例如可舉:鋰離子、鈉離子、鉀離子、銫離子、鎂離子、鈣離子、鈧離子、鋇離子、鋁離子、鐵離子、銅離子、銀離子等,較佳可舉:鋰離子、鈉離子、鉀離子,更佳可舉鋰離子。
作為構成前述金屬鹽的陰離子例如可舉:鹵素離子、磷酸離子、硝酸離子、硫酸離子、硫酸氫離子、磺酸離子、甲苯磺酸離子、過氯酸離子、鋁酸離子、二鋁酸離子、硼酸離子、醯胺離子、二氰胺離子、琥珀酸離子、硫氰酸離子、羧酸離子等,具體來說,較佳可例示氯化物、溴化物、碘化物、四氟硼化物、烷基硼化物、芳基硼化物、鹵磷酸鹽、硝酸鹽、磺酸鹽、硫酸氫鹽、烷基硫酸鹽、硫氰酸鹽、全氟醯胺、二氰醯胺、雙(全氟烷基磺醯基)醯胺、醋酸、三氟醋酸等的陰離子。
構成聚烯烴系樹脂組成物的前述金屬鹽是鹼金屬鹽或鹼土金屬鹽為佳。
又,前述金屬鹽的陽離子與陰離子的組合,宜為選自於由鋰離子、鈉離子、鉀離子、鎂離子、鈣離子所構成群組中之一種陽離子,與選自於由鹵素離子(例如氟化物離子、氯化物離子、溴化物離子、碘化物離子)、四氟硼酸離子、烷基硼酸離子、芳基硼酸離子、鹵磷酸離子、硝酸離子、磺酸離子、硫酸氫離子、烷基硫酸離子、硫氰酸離子、羧酸離子、全氟醯胺離子、二氰醯胺離子及雙(全氟烷基磺醯基)醯胺離子所構成群組中之一種陰離子的組合,更宜為選自於由鋰離子、鈉離子、鉀離子所構成群組中之一種陽離子,與選自於由鹵素、羧酸鹽、六氟磷酸鹽、四氟硼酸離子及雙(全氟烷基磺醯基)醯胺所構成群組中之一種陰離子的組合。另外,雙(全氟烷基磺醯基)醯胺中,以雙(三氟甲磺醯基)醯胺特別佳。
上述的組合之中,陽離子是鋰離子、鈉離子或鉀離子,陰離子是雙(三氟甲磺醯基)醯胺或鹵素離子(特別是氟化物離子、氯化物離子、溴化物離子或碘化物離子)之組合特別佳。具體來說,作為前述金屬鹽較佳可例示雙(三氟甲磺醯基)醯胺鋰、溴化鋰、碘化鉀等。
聚烯烴系樹脂組成物之中,作為前述金屬鹽的含量,相對於聚烯烴系樹脂100質量份,下限在0.01質量份為佳,上限在10質量份為佳,下限在0.1質量份較佳,上限在7.5質量份較佳,下限在0.5質量份更佳,上限在5質量份更佳。前述金屬鹽的含量在前述範圍內時,聚烯烴系樹脂組成物的其他物理性質不會大幅降低,並可提升抗靜電性能。
作為聚烯烴系樹脂組成物的製造方法並未特別限定,例如可舉:將聚烯烴系樹脂、聚伸烷碳酸酯樹脂及金屬鹽以任意的順序,用亨舍爾混合機、帶式摻合機、摻合機等混合後,將該混合物熔融混練的方法;將已預先熔融混練了聚伸烷碳酸酯樹脂與金屬鹽而得之物與聚烯烴系樹脂混合並熔融混練的方法;以及,將聚烯烴系樹脂、聚伸烷碳酸酯樹脂及金屬鹽溶解於溶劑而混合後,除去前述溶劑之方法等。該等之製造方法中,從容易製造組成物而生產性高,且可得到均一的組成物的觀點來看,將聚烯烴系樹脂、聚伸烷碳酸酯樹脂及金屬鹽熔融混練的方法為佳。例如可適當地使用下述方法:將聚伸烷碳酸酯樹脂與金屬鹽溶解於溶劑並混合後除去前述溶劑而得混合物,更添加聚烯烴系樹脂至該混合物中並熔融混練的方法。作為在此使用的溶劑,可適宜地選擇合適的有機溶劑,例如丙酮為佳。
作為聚烯烴系樹脂、聚伸烷碳酸酯樹脂及金屬鹽熔融混練的方法並未特別限定,但可舉用單軸擠壓機、雙軸擠壓機、斑伯里混合機、捏合機、輥式捏和機等進行熔融混練的方法。
聚烯烴系樹脂組成物的形狀並未限制,可以是絞繩狀、片狀、平板狀或粒狀等任意的形狀。特別是為了易於供給於成形加工機,以粒狀為佳。另外,聚烯烴系樹脂組成物是固體組成物為佳。
聚烯烴系樹脂組成物中,在不損及本發明效果的範圍內,可使用其他添加劑,例如抗氧化劑、紫外線吸收劑、光穩定劑等穩定劑,阻燃劑、抗靜電劑、抗菌劑、成核劑、潤滑劑、抗結塊劑、著色劑、填料等。
作為抗氧化劑可舉例如:2,6-雙三級丁基對甲苯酚(BHT)、2,2’-亞甲基雙(4-甲基-6-三級丁苯酚)、四[亞甲基-3,5-雙三級丁基-4-羥基氫化桂皮酸酯)]甲烷、二月桂基-3,3’-硫代二丙酸酯(DLTDP)、二硬脂基-3,3’-硫代二丙酸酯(DSTDP)、亞磷酸三苯酯(TPP)、亞磷酸三異癸基酯(TDP)、辛基化二苯胺、N-正丁基對胺苯酚、N,N-二異丙基-對苯二胺等。
作為紫外線吸收劑例如可舉:2-羥基二苯基酮、2,4-二羥苯基苯基酮、柳酸苯酯、2,4-雙三級丁苯-3,5-雙三級丁基-4-羥苯甲酸)、2’-羥苯基)苯并三唑、(2’-羥基-5’-甲苯基)苯并三唑、乙基-2-氰基-3,3-二苯丙烯酸酯、甲基-2-甲氧甲醯基-3-(對甲氧苯甲基)丙烯酸酯等。
作為光穩定劑可舉:2,2,6,6-四甲基-4-哌啶基硬脂酸脂、雙 (2,2,6,6-四甲基-4-哌啶基)癸二酸酯、四(2,2,6,6-四甲基-4-哌啶基)-1,2,3,4-丁烷四羧酸酯、雙 (2,2,6,6-四甲基-4-哌啶基)二(十三基)-1,2,3,4-丁烷四羧酸酯 、雙(1,2,2,4,4-五甲基-4-哌啶基)-2-丁基-2-(3,5-雙三級丁基-4-羥苄基)丙二酸酯、1-(2-羥乙基) -2,2,6,6-四甲基-4-哌啶醇/琥珀酸二乙酯聚縮合物、1,5,8,12-四[2,4-雙(N-丁基-N-(2,2,6,6-四甲基-4-哌啶基)胺基)-s-三-6-基]-1,5,8,12-四氮雜十二烷、1,5,8,12-四[2,4-雙(N-丁基-N-(1,2,2,6,6-五甲基-4-哌啶基)胺基)-s-三-6-基]-1,5,8-12-四氮雜十二烷等。
作為阻燃劑可舉磷酸三甲苯酯、磷酸三(2,3-二溴丙基)酯、十溴聯苯醚、十溴雙酚A、三氧化二銻、氫氧化鎂、硼酸鋅、偏硼酸鋇、氫氧化鋁、赤磷、聚磷酸銨及氯橋酸等。
作為抗靜電劑例如可舉:聚環氧乙烷、聚環氧丙烷、聚乙二醇、聚酯醯胺、聚醚酯醯胺等。
作為抗菌劑可舉例如:2-溴-2-硝基-1,3-丙二醇、2,2-二溴-2-硝乙醇、二硫氰基甲烷、1,4-雙溴乙醯氧基-2-丁烯、六溴二甲基碸、5-氯-2,4,6-三氟間二氰苯、四氯間二氰苯、二甲二硫代胺甲酸酯、4,5-二氯-1,2-二醇-3-酮、3,3,4,4-四氯四氫噻吩-1,1-二氧化物、三碘烯丙醇、溴硝苯乙烯、戊二醛、苯二甲醛、間苯二甲醛、對苯二甲醛、二氯乙二醛二肟、α-氯苯醛肟、α-乙酸氯苯醛肟、1,3-二氯-5,5-二甲基海因、1,3-二溴-5,5-二甲基海因等。
作為成核劑可舉例如:1 • 3,2 • 4-二苯亞基山梨糖醇、2,2’-亞甲基-二(4,6-雙三級丁基)磷酸鈉、雙(2,4,8,10-四三級丁基-羥基-12H-二苯并[d,g][1,3,2]雙二氧雜磷雜環辛烯-6-氧化物)、苯甲酸鋁、己二酸鈉、噻吩甲酸鈉、吡咯羧酸鈉等。
作為潤滑劑可舉例如:液體石蠟、天然石蠟、微晶石蠟、聚乙烯蠟、硬脂酸、硬脂醯胺、棕櫚醯胺、亞甲基雙硬脂醯胺、硬脂酸丁酯、氫化蓖麻油、乙二醇單硬脂酸酯等。
作為抗結塊劑可舉例如:滑石、氧化矽、碳酸鈣、合成沸石、澱粉、硬脂酸雙醯胺等。
作為著色劑可舉例如:二氧化鈦、鋅鋇白、鉛白、氧化鋅、鈷黃、鈷綠、天藍、鈷藍、鈷紫、氧化鐵、鐵藍、氧化鉻、鉻酸鉛、鉻酸鋇、硫化鎘、鎘黃、群青等無機顏料;偶氮色淀(azo lake)系、單偶氮系、雙偶氮系、螫合偶氮系等偶氮顏料、苯并咪唑酮系、酞青素系、喹吖酮系、雙 系、異吲哚啉酮系、硫靛藍系、苝系、喹啉黃系及蒽醌系的多環式顏料等的有機顏料;偶氮系、蒽醌系、靛系、硫化系、三苯甲烷系、吡唑哢系、二苯乙烯系、二苯甲烷系、二苯并哌喃系、茜素系、吖啶系、醌亞胺系、噻唑系、次甲基系、硝基系、亞硝基系等苯胺系染料等。
作為填料可舉例如:碳酸鈣、滑石、粘土、矽酸、矽酸鹽、石棉、雲母、玻璃纖維、玻璃氣球(glass balloon)、碳纖維、金屬纖維、陶瓷晶鬚、鈦晶鬚等無機填料,及尿素、硬脂酸鈣、有機交聯微粒子(例如環氧系或胺甲酸乙酯系)、纖維素纖維、木粉等有機填料。
上述其他添加劑可單獨使用1種或組合2種以上使用。
混入上述其他添加劑時的添加量,相對於聚烯烴系樹脂100質量份,下限在0.01質量份為佳,上限在100質量份為佳,下限在0.5質量份較佳,上限在50質量份較佳,下限在0.1質量份更佳,上限在10質量份更佳。
[聚烯烴系樹脂薄膜] 聚烯烴系樹脂薄膜是聚烯烴系樹脂組成物成形為薄膜而成,特別是至少沿單軸方向延伸而形成的薄膜。
上述聚烯烴系樹脂薄膜因為是將上述聚烯烴系樹脂組成物至少沿單軸方向延伸而成形而成,因此機械物理性質可維持,且表面電阻率大幅減低而抗靜電性能提升。藉此,上述聚烯烴系樹脂薄膜也可減少如塵埃附著這類使用上的不良狀況。
作為上述聚烯烴系樹脂薄膜的製造方法並未特別限定,可在製造上述聚烯烴系樹脂組成物後,藉由T字模成形法、充氣成形法、壓延成形法、溶劑澆鑄法、熱壓法等方法成形為薄膜狀,並將該薄膜至少沿單軸方向延伸而製得。
將聚烯烴系樹脂薄膜至少沿單軸方向延伸的方法並未特別限定,可舉:藉由輥延伸法、拉幅延伸法、管狀延伸法等以單軸或雙軸延伸加工的方法。
將聚烯烴系樹脂薄膜延伸加工時,可一邊加熱該薄膜一邊進行。藉由加熱可在高延伸倍率下均一地延伸。加熱溫度的下限在聚烯烴系樹脂的玻璃轉移溫度以上的溫度為佳,比玻璃轉移溫度高30℃以上的溫度較佳,比玻璃轉移溫度高50℃以上的溫度更佳。加熱溫度的上限在聚烯烴系樹脂的熔點以下的溫度為佳,比熔點低5℃以上的溫度較佳,比熔點低10℃以上的溫度更佳。
聚烯烴系樹脂薄膜的延伸方向並未特別限定,可向該薄膜的任意方向延伸。例如若是藉由擠壓成形或射出成形製得的聚烯烴系樹脂薄膜,至少向成形時樹脂的流動方向(MD方向)及該垂直方向(TD方向)中一方向延伸即可。
上述聚烯烴系樹脂薄膜的延伸倍率並未特別限定。例如上述聚烯烴系樹脂薄膜的延伸倍率可做成1.01~20。上述聚烯烴系樹脂組成物易於成形沒有缺陷的薄膜,又該組成物延伸而成的上述聚烯烴系樹脂薄膜有優良的抗靜電性能。延伸倍率的下限值在不損及本發明的效果的範圍內可適宜設定,例如1.1、1.2、1.3、1.4、1.5、1.6、1.7、1.8、1.9或2。又,延伸倍率的上限值在不損及本發明效果的範圍內也可適宜設定,例如10、9、8、7、6或5。從提升聚烯烴系樹脂薄膜的抗靜電性能的觀點來看,延伸倍率的下限值為1.5倍為佳,2倍更佳。同樣的觀點來看,延伸倍率的上限值為10倍為佳,5倍更佳。
又,聚烯烴系樹脂薄膜有樹脂流動方向(MD方向)及該垂直方向(TD方向)時,從可成形為沒有缺陷的薄膜,且展現充分地抗靜電性能的觀點來看,對MD方向及TD方向中至少一方向上之延伸倍率為1.01~20倍為佳。從更提升聚烯烴系樹脂薄膜的抗靜電性能的觀點來看,在MD方向及TD方向中至少一方向上延伸倍率比的下限值為1.5倍更佳,2倍特別佳。又,從相同的觀點來看,在MD方向及TD方向中至少一方向上延伸倍率的上限值為10倍更佳,5倍特別佳。
上述聚烯烴系樹脂薄膜的厚度並未特別限定,但例如可作成0.01~10mm。厚度在此範圍的話,易於製得保持良好的成形性並抗靜電性能優良的聚烯烴系樹脂薄膜。較佳的厚度是0.05~1mm。
如上述經過延伸加工的聚烯烴系樹脂薄膜,與未經過延伸加工的聚烯烴系樹脂薄膜比起來表面電阻率降低。表面電阻率的值因樹脂的種類而異,但例如低至1/10~1/10000為佳。更具體來說,例如延伸倍率為2倍時,延伸加工後的表面電阻率相較於延伸加工前宜低至1/10~1/1000,延伸倍率為9倍時,延伸加工後的表面電阻率相較於延伸加工前宜低至1/100~1/10000。這種情況下,經過延伸加工的聚烯烴系樹脂薄膜具有充分的抗靜電性能。
以一個更提升上述聚烯烴系樹脂薄膜的抗靜電性能的機制而言,咸認或是因為包含金屬鹽的聚伸烷碳酸酯樹脂的區域(domain)藉延伸變形成線條,導電路徑藉此形成。更具體地說明,聚烯烴系樹脂組成物中,聚伸烷碳酸酯樹脂相對於聚烯烴系樹脂基質呈分散存在,但該分散狀態已知是所謂的海島結構。然後,聚烯烴系樹脂組成物因該分散狀態,以無延伸來成形聚烯烴系樹脂薄膜時,導電路徑難以形成,因此製得的聚烯烴系樹脂薄膜的表面電阻率幾乎不會降低。但若將聚烯烴系樹脂薄膜延伸,聚伸烷碳酸酯樹脂的區域形狀被拉伸,因此變得易於互相接觸,藉此,以金屬鹽為媒介的導電路徑便在聚烯烴系樹脂薄膜中形成。其結果,成為該聚烯烴系樹脂薄膜的表面電阻率比延伸前低,而展現更優良的抗靜電性能之物。
聚烯烴系樹脂薄膜可使用於包裝用材料、遮蔽用材料、電子零件的包裝材料、捲帶用材料、塑膠袋、醫藥品或雜貨的包裝材料、食品用保鮮膜、輸送用包裝材料等各種用途。又,聚烯烴系樹脂薄膜可作為與紙、不織布、玻璃紙等貼合之層積膜來使用。再加上也可在其他可塑性樹脂成形品上作為標籤貼合來使用。
實施例 以下藉由製造例、實施例及比較例具體說明本發明,但本發明並非限定於該等實施例之發明。
[製造例1](有機鋅觸媒的製造) 備有攪拌機、氮氣導入管、溫度計、迪安-斯塔克(Dean-Stark)管、回流冷卻管的0.5L容量的四口燒瓶中,裝入氧化鋅7.73g(95mmol)、戊二酸12.3g(100mmol)、醋酸0.114g(2mmol)及甲苯76.0g。接下來,一邊在反應系統內以50mL/min的流量流通氮氣,一邊升溫至55℃,在同溫度下攪拌4小時使其反應,之後升溫至110℃,進一步在同溫度下攪拌2小時使共沸脫水,除去水份後,冷卻至室溫而製得含有有機鋅觸媒的漿液。
[製造例2](聚碳酸丙烯酯的製造) 預先將備有攪拌機、氣體導入管、溫度計的1L容量的熱壓器的系統內置換成氮氣環境後,裝入藉由製造例1製得的含有有機鋅觸媒的漿液39.1g(含有有機鋅觸媒45mmol)、碳酸二甲酯192.4g、環氧丙烷26.1g(450mmol)。接下來,在攪拌下添加二氧化碳,將二氧化碳填充至反應系統內直到成為1.0MPa為止。之後,升溫至60℃,一邊補給因反應而消耗掉的二氧化碳邊進行10小時的聚合反應。反應結束後,冷卻熱壓器而脫壓,過濾之後減壓乾燥而製得聚碳酸丙烯酯40g。製得的聚碳酸丙烯酯的質量平均分子量為330,000(Mw/Mn=10.02)。
再者,該質量平均分子量是調製聚碳酸丙烯酯濃度為0.5%的N,N-二甲基甲醯胺溶液,並利用高效能液相層析法測定,將之與在同一條件下測定的已知質量平均分子量的聚苯乙烯進行比較,藉以算出之值。測定條件如下。
管柱:GPC管柱 (昭和電工(股)的商品名,Shodex OHPac SB-800系列) 管柱溫度:40℃ 溶出液:0.03mol/L溴化鋰-N,N-二甲基甲醯胺溶液 流速:0.65mL/min
(實施例1) 使已在製造例2製得的聚碳酸丙烯酯粒7.5g與雙(三氟甲磺醯基)醯胺鋰(以下以Li-TSFA表示,熔點235℃)2.5g溶解於50mL的丙酮內,均一地混合後,在25℃下乾燥24小時,製得含有金屬鹽的聚碳酸丙烯酯10g。將該含有金屬鹽的聚碳酸丙烯酯粒0.15g與高密度聚乙烯(Toray(股)公司製,Mw=750,000、Mw/Mn=6.3、Tg=-120℃、熔點=134℃)4.85g加入於DSM Xplore公司製小型混練機(Microcompounder),以旋轉數50rpm、在160℃下混練5分鐘,放置於室溫下而製得聚烯烴系樹脂組成物5.0g。將製得的聚烯烴系樹脂組成物用Techno supply公司製桌上型熱壓機,以熱溫度210℃、熱壓壓力20MPa加工,製得厚度0.2mm的片狀成形體。
將製得的片狀成形體用INSTRON公司製的拉伸試驗機「MODEL4466」,在25℃、120mm/分下,分別延以伸比1.5倍、2倍及5倍3種類沿MD方向延伸加工。藉此製得厚度分別為0.18mm(1.5倍)、0.15mm(2倍)及0.04mm(5倍)3種類的聚烯烴系樹脂薄膜。
(實施例2) 將含有金屬鹽的聚碳酸丙烯酯的量改為0.75g,高密度聚乙烯的量改為4.25g以外,與實施例1相同進行,製得聚烯烴系樹脂組成物。
(實施例3) 使已在製造例2製得的聚碳酸丙烯酯粒7.5g與溴化鋰(以下以LiBr表示,熔點552℃)2.5g溶解於50mL的丙酮內,均一地混合後,在25℃下乾燥24小時,製得含有金屬鹽的聚碳酸丙烯酯10g。將該含有金屬鹽的聚碳酸丙烯酯粒0.75g與高密度聚乙烯(Toray(股)公司製,Mw=750,000、Mw/Mn=6.3、Tg=-120℃、熔點=134℃)4.75g加入於DSM Xplore公司製小型混練機,以旋轉數50rpm、在160℃下混練5分鐘,放置於室溫下而製得聚烯烴系樹脂組成物5.0g。將製得的聚烯烴系樹脂組成物用Techno supply公司製桌上型熱壓機,以熱溫度210℃、熱壓壓力20MPa加工,製得厚度0.2mm的片狀成形體。
將製得的片狀成形體用INSTRON公司製的拉伸試驗機「MODEL4466」,在25℃、120mm/分下,分別以延伸倍率1.5倍、2倍及8倍3種類沿MD方向延伸加工。藉此製得厚度分別為0.18mm(1.5倍)、0.15mm(2倍)及0.03mm(8倍)3種類的聚烯烴系樹脂薄膜。
(實施例2) 將金屬鹽的種類改為碘化鉀(以下以KI表示,熔點681℃)以外,與實施例1相同進行,製得聚烯烴系樹脂組成物。
(比較例1) 只將聚乙烯以實施例1相同的條件混練,製得聚烯烴系樹脂組成物及聚烯烴系樹脂薄膜。
(比較例2) 除了不用金屬鹽以外以實施例1相同的條件混練,製得聚烯烴系樹脂組成物及聚烯烴系樹脂薄膜。
(比較例3) 除了不用聚碳酸丙烯酯以外以實施例1相同的條件混練,但金屬鹽未混入,無法製得聚烯烴系樹脂組成物。
[評價法] (1)表面電阻率 依循JIS K 6911:1995,用以下的測定裝置測定表面電阻率。
測定機:日置電機公司製超絕緣計 SM-8220 測定溫度:23℃ 測定濕度:50%Rh 測定條件:將施加500V一分鐘時的電阻率作為測定值。
表1中顯示以實施例1~4及比較例1、2製得的延伸倍率1.5倍、2倍及9倍各自的聚烯烴系樹脂薄膜的表面電阻率的測定結果。又,作為比較對照,也顯示未延伸的聚烯烴系樹脂薄膜(1倍)的表面電阻率的測定結果。
圖1中,表示關於實施例1及比較例1中製得的薄膜的延伸倍率與表面電阻率的關係。
可知表1的實施例1~4都是藉由延伸而大幅降低表面電阻率,因此,可知藉由延伸聚烯烴系樹脂薄膜抗靜電性能會提升。
另一方面,如比較例1,只由聚烯烴系樹脂構成的薄膜延伸前後的表面電阻率幾乎沒有變化,看不出藉由延伸薄膜所獲致的抗靜電性能提升。又,由比較例2、3可知,用未含有聚碳酸丙烯酯或金屬鹽的聚烯烴系樹脂組成物成形的薄膜,也看不出藉由延伸所獲致的薄膜抗靜電性能提升。
產業上之可利用性 本發明的聚烯烴系樹脂薄膜有優異的抗靜電性能。因此,聚烯烴系樹脂薄膜不僅只是習知聚烯烴系樹脂薄膜可使用的用途,更可使用於為避免因靜電造成放電或塵埃附著而迄今被限制使用之電子材料等包裝材料用途等。
(無)
圖1是表示實施例1及比較例1製得的薄膜的延伸倍率與表面電阻率的關係的圖表。
Claims (7)
- 一種聚烯烴系樹脂組成物,含有:聚烯烴系樹脂、聚伸烷碳酸酯樹脂及熔點高於100℃的金屬鹽,其中該金屬鹽係由下列陽離子及陰離子的組合所構成:選自於由鋰離子、鈉離子、鉀離子、鎂離子、鈣離子所構成的群組之一種陽離子,以及選自於由鹵素、四氟硼酸離子、烷基硼酸離子、芳基硼酸離子、鹵磷酸離子、硝酸離子、磺酸離子、硫酸氫離子、烷基硫酸離子、硫氰酸離子、羧酸離子、全氟醯胺、二氰醯胺及雙(全氟烷基磺醯基)醯胺所構成的群組之一種陰離子。
- 如請求項1之聚烯烴系樹脂組成物,其中相對於聚烯烴系樹脂100質量份,含有聚伸烷碳酸酯樹脂0.05~20質量份、熔點高於100℃的金屬鹽0.01~5質量份。
- 如請求項1或2之聚烯烴系樹脂組成物,其中聚伸烷碳酸酯樹脂是聚碳酸丙烯酯。
- 如請求項1或2之聚烯烴系樹脂組成物,其中聚烯烴系樹脂是聚乙烯。
- 如請求項3之聚烯烴系樹脂組成物,其中聚烯烴系樹脂是聚乙烯。
- 一種聚烯烴系樹脂薄膜,係將請求項1至5中任一項之聚烯烴系樹脂組成物成形而成,且至少沿單軸方向延伸。
- 如請求項6之聚烯烴系樹脂薄膜,其在前述單軸方向上的延伸倍率是1.01~20。
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