TWI736804B - 樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法 - Google Patents

樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法 Download PDF

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Publication number
TWI736804B
TWI736804B TW107137595A TW107137595A TWI736804B TW I736804 B TWI736804 B TW I736804B TW 107137595 A TW107137595 A TW 107137595A TW 107137595 A TW107137595 A TW 107137595A TW I736804 B TWI736804 B TW I736804B
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TW
Taiwan
Prior art keywords
resin molded
molded product
mold
plate
pressure plate
Prior art date
Application number
TW107137595A
Other languages
English (en)
Chinese (zh)
Other versions
TW201916997A (zh
Inventor
市橋秀男
Original Assignee
日商Ｔｏｗａ股份有限公司
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Application filed by 日商Ｔｏｗａ股份有限公司 filed Critical 日商Ｔｏｗａ股份有限公司
Publication of TW201916997A publication Critical patent/TW201916997A/zh
Application granted granted Critical
Publication of TWI736804B publication Critical patent/TWI736804B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/64—Mould opening, closing or clamping devices
    • B29C45/66—Mould opening, closing or clamping devices mechanical
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/2602—Mould construction elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW107137595A 2017-10-25 2018-10-24 樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法 TWI736804B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017206004A JP6845781B2 (ja) 2017-10-25 2017-10-25 樹脂成形品の製造装置、樹脂成形システム、および樹脂成形品の製造方法
JP2017-206004 2017-10-25

Publications (2)

Publication Number Publication Date
TW201916997A TW201916997A (zh) 2019-05-01
TWI736804B true TWI736804B (zh) 2021-08-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137595A TWI736804B (zh) 2017-10-25 2018-10-24 樹脂成形品的製造裝置、樹脂成形系統以及樹脂成形品的製造方法

Country Status (5)

Country Link
JP (1) JP6845781B2 (cg-RX-API-DMAC10.html)
KR (1) KR102209919B1 (cg-RX-API-DMAC10.html)
CN (1) CN109702944B (cg-RX-API-DMAC10.html)
SG (1) SG10201808664WA (cg-RX-API-DMAC10.html)
TW (1) TWI736804B (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785896B2 (ja) * 2019-01-28 2020-11-18 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7856300B2 (ja) 2022-05-31 2026-05-11 ヤマハロボティクス株式会社 樹脂封止装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
TW201524736A (zh) * 2013-11-25 2015-07-01 Ｔｏｗａ股份有限公司 壓縮成形裝置及壓縮成形方法
TW201726346A (zh) * 2016-01-27 2017-08-01 Mtex Matsumura Corp 樹脂成形裝置用固定平台、樹脂成形裝置及樹脂成形裝置用固定平台之製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236038U (cg-RX-API-DMAC10.html) * 1988-09-02 1990-03-08
JPH0631736A (ja) * 1992-07-14 1994-02-08 Apic Yamada Kk 成形装置
JPH0929747A (ja) * 1995-07-19 1997-02-04 Ricoh Co Ltd 金型断熱装置
JP4625488B2 (ja) * 2007-09-10 2011-02-02 三菱重工プラスチックテクノロジー株式会社 型盤、型締め装置、射出成形機
CN204011392U (zh) * 2014-07-01 2014-12-10 比亚迪股份有限公司 汽车、igbt模块及其底板组件
JP6440599B2 (ja) * 2015-08-28 2018-12-19 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201028274A (en) * 2009-01-22 2010-08-01 Yung Shin Entpr Co Ltd Method for making PVC board
TW201524736A (zh) * 2013-11-25 2015-07-01 Ｔｏｗａ股份有限公司 壓縮成形裝置及壓縮成形方法
TW201726346A (zh) * 2016-01-27 2017-08-01 Mtex Matsumura Corp 樹脂成形裝置用固定平台、樹脂成形裝置及樹脂成形裝置用固定平台之製造方法

Also Published As

Publication number Publication date
JP2019077106A (ja) 2019-05-23
TW201916997A (zh) 2019-05-01
SG10201808664WA (en) 2019-05-30
JP6845781B2 (ja) 2021-03-24
KR20190046661A (ko) 2019-05-07
KR102209919B1 (ko) 2021-02-01
CN109702944A (zh) 2019-05-03
CN109702944B (zh) 2021-05-04

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