TWI735811B - 導電性接著劑層用承載薄膜及具備其之黏接薄膜 - Google Patents

導電性接著劑層用承載薄膜及具備其之黏接薄膜 Download PDF

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Publication number
TWI735811B
TWI735811B TW107137738A TW107137738A TWI735811B TW I735811 B TWI735811 B TW I735811B TW 107137738 A TW107137738 A TW 107137738A TW 107137738 A TW107137738 A TW 107137738A TW I735811 B TWI735811 B TW I735811B
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TW
Taiwan
Prior art keywords
conductive adhesive
adhesive layer
carrier film
film
resin
Prior art date
Application number
TW107137738A
Other languages
English (en)
Chinese (zh)
Other versions
TW201942215A (zh
Inventor
山本祥久
上農憲治
Original Assignee
日商拓自達電線股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商拓自達電線股份有限公司 filed Critical 日商拓自達電線股份有限公司
Publication of TW201942215A publication Critical patent/TW201942215A/zh
Application granted granted Critical
Publication of TWI735811B publication Critical patent/TWI735811B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/02—Polyureas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
TW107137738A 2018-03-27 2018-10-25 導電性接著劑層用承載薄膜及具備其之黏接薄膜 TWI735811B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-059276 2018-03-27
JP2018059276A JP6405482B1 (ja) 2018-03-27 2018-03-27 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム

Publications (2)

Publication Number Publication Date
TW201942215A TW201942215A (zh) 2019-11-01
TWI735811B true TWI735811B (zh) 2021-08-11

Family

ID=63855117

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107137738A TWI735811B (zh) 2018-03-27 2018-10-25 導電性接著劑層用承載薄膜及具備其之黏接薄膜

Country Status (4)

Country Link
JP (1) JP6405482B1 (ja)
KR (1) KR102509846B1 (ja)
CN (1) CN110305602A (ja)
TW (1) TWI735811B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331614A (ja) * 2001-05-09 2002-11-19 Teijin Ltd 離形フイルム
TW201531173A (zh) * 2013-08-20 2015-08-01 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4011712B2 (ja) * 1998-01-20 2007-11-21 日東電工株式会社 両面接着シート
JP2001001475A (ja) * 1999-06-22 2001-01-09 Teijin Ltd 離形フィルム
JP3956771B2 (ja) * 2002-05-21 2007-08-08 東レ株式会社 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
TWI290328B (en) * 2002-05-23 2007-11-21 Nof Corp Transparent conductive laminated film and touch panel
JP2005294294A (ja) 2004-03-31 2005-10-20 Kyocera Chemical Corp プリント配線板用ボンディングシート及び複合多層プリント配線板の製造方法
JP2007266394A (ja) * 2006-03-29 2007-10-11 Toray Ind Inc 半導体用接着剤シート、これを用いた半導体接続用基板および半導体装置
JP2012160546A (ja) * 2011-01-31 2012-08-23 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
CN103717392B (zh) * 2011-08-05 2016-02-03 三菱工程塑料株式会社 面板和面板设置结构
JP5683734B1 (ja) * 2014-07-01 2015-03-11 グンゼ株式会社 透明導電性積層体、タッチパネル、および透明導電性積層体の製造方法
JP6379389B2 (ja) * 2014-12-15 2018-08-29 リンテック株式会社 ダイシングダイボンディングシート
JP6688033B2 (ja) * 2015-05-27 2020-04-28 日東電工株式会社 透明導電性フィルム
CN105047759A (zh) * 2015-08-20 2015-11-11 福建铂阳精工设备有限公司 一种降低薄膜硅组件表面色差的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331614A (ja) * 2001-05-09 2002-11-19 Teijin Ltd 離形フイルム
TW201531173A (zh) * 2013-08-20 2015-08-01 Jx Nippon Mining & Metals Corp 表面處理銅箔、附載體銅箔、積層板、印刷配線板、電子機器、以及印刷配線板之製造方法

Also Published As

Publication number Publication date
TW201942215A (zh) 2019-11-01
CN110305602A (zh) 2019-10-08
KR20190113601A (ko) 2019-10-08
JP2019172722A (ja) 2019-10-10
JP6405482B1 (ja) 2018-10-17
KR102509846B1 (ko) 2023-03-13

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