CN110305602A - 导电性胶粘剂层用承载膜及包括该导电性胶粘剂层用承载膜的粘结膜 - Google Patents
导电性胶粘剂层用承载膜及包括该导电性胶粘剂层用承载膜的粘结膜 Download PDFInfo
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- CN110305602A CN110305602A CN201910235082.0A CN201910235082A CN110305602A CN 110305602 A CN110305602 A CN 110305602A CN 201910235082 A CN201910235082 A CN 201910235082A CN 110305602 A CN110305602 A CN 110305602A
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- Prior art keywords
- electrically conductive
- adhesive layer
- conductive adhesive
- carrier film
- film
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/02—Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059276A JP6405482B1 (ja) | 2018-03-27 | 2018-03-27 | 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム |
| JP2018-059276 | 2018-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110305602A true CN110305602A (zh) | 2019-10-08 |
Family
ID=63855117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910235082.0A Pending CN110305602A (zh) | 2018-03-27 | 2019-03-27 | 导电性胶粘剂层用承载膜及包括该导电性胶粘剂层用承载膜的粘结膜 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6405482B1 (ja) |
| KR (1) | KR102509846B1 (ja) |
| CN (1) | CN110305602A (ja) |
| TW (1) | TWI735811B (ja) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002331614A (ja) * | 2001-05-09 | 2002-11-19 | Teijin Ltd | 離形フイルム |
| CN1653561A (zh) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | 透明导电层合薄膜、含透明导电层合薄膜的接触面板以及透明导电层合薄膜的制备方法 |
| CN103717392A (zh) * | 2011-08-05 | 2014-04-09 | 三菱工程塑料株式会社 | 面板和面板设置结构 |
| JP5683734B1 (ja) * | 2014-07-01 | 2015-03-11 | グンゼ株式会社 | 透明導電性積層体、タッチパネル、および透明導電性積層体の製造方法 |
| CN105047759A (zh) * | 2015-08-20 | 2015-11-11 | 福建铂阳精工设备有限公司 | 一种降低薄膜硅组件表面色差的方法 |
| CN107004590A (zh) * | 2014-12-15 | 2017-08-01 | 琳得科株式会社 | 切割芯片接合片 |
| CN107112074A (zh) * | 2015-05-27 | 2017-08-29 | 日东电工株式会社 | 透明导电性薄膜 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4011712B2 (ja) * | 1998-01-20 | 2007-11-21 | 日東電工株式会社 | 両面接着シート |
| JP2001001475A (ja) * | 1999-06-22 | 2001-01-09 | Teijin Ltd | 離形フィルム |
| JP3956771B2 (ja) * | 2002-05-21 | 2007-08-08 | 東レ株式会社 | 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP2005294294A (ja) | 2004-03-31 | 2005-10-20 | Kyocera Chemical Corp | プリント配線板用ボンディングシート及び複合多層プリント配線板の製造方法 |
| JP2007266394A (ja) * | 2006-03-29 | 2007-10-11 | Toray Ind Inc | 半導体用接着剤シート、これを用いた半導体接続用基板および半導体装置 |
| JP2012160546A (ja) * | 2011-01-31 | 2012-08-23 | Hitachi Chem Co Ltd | 回路接続用接着フィルム及び回路接続構造体 |
| JP5885791B2 (ja) * | 2013-08-20 | 2016-03-15 | Ｊｘ金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法 |
-
2018
- 2018-03-27 JP JP2018059276A patent/JP6405482B1/ja active Active
- 2018-10-25 TW TW107137738A patent/TWI735811B/zh active
-
2019
- 2019-03-20 KR KR1020190031950A patent/KR102509846B1/ko active IP Right Grant
- 2019-03-27 CN CN201910235082.0A patent/CN110305602A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002331614A (ja) * | 2001-05-09 | 2002-11-19 | Teijin Ltd | 離形フイルム |
| CN1653561A (zh) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | 透明导电层合薄膜、含透明导电层合薄膜的接触面板以及透明导电层合薄膜的制备方法 |
| CN103717392A (zh) * | 2011-08-05 | 2014-04-09 | 三菱工程塑料株式会社 | 面板和面板设置结构 |
| JP5683734B1 (ja) * | 2014-07-01 | 2015-03-11 | グンゼ株式会社 | 透明導電性積層体、タッチパネル、および透明導電性積層体の製造方法 |
| CN107004590A (zh) * | 2014-12-15 | 2017-08-01 | 琳得科株式会社 | 切割芯片接合片 |
| CN107112074A (zh) * | 2015-05-27 | 2017-08-29 | 日东电工株式会社 | 透明导电性薄膜 |
| CN105047759A (zh) * | 2015-08-20 | 2015-11-11 | 福建铂阳精工设备有限公司 | 一种降低薄膜硅组件表面色差的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6405482B1 (ja) | 2018-10-17 |
| TW201942215A (zh) | 2019-11-01 |
| TWI735811B (zh) | 2021-08-11 |
| KR102509846B1 (ko) | 2023-03-13 |
| JP2019172722A (ja) | 2019-10-10 |
| KR20190113601A (ko) | 2019-10-08 |
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