KR102509846B1 - 도전성 접착제층용 캐리어 필름 및 그것을 구비한 본딩 필름 - Google Patents

도전성 접착제층용 캐리어 필름 및 그것을 구비한 본딩 필름 Download PDF

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Publication number
KR102509846B1
KR102509846B1 KR1020190031950A KR20190031950A KR102509846B1 KR 102509846 B1 KR102509846 B1 KR 102509846B1 KR 1020190031950 A KR1020190031950 A KR 1020190031950A KR 20190031950 A KR20190031950 A KR 20190031950A KR 102509846 B1 KR102509846 B1 KR 102509846B1
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KR
South Korea
Prior art keywords
conductive adhesive
carrier film
adhesive layer
film
conductive
Prior art date
Application number
KR1020190031950A
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English (en)
Korean (ko)
Other versions
KR20190113601A (ko
Inventor
요시히사 야마모토
겐지 가미노
Original Assignee
타츠타 전선 주식회사
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Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20190113601A publication Critical patent/KR20190113601A/ko
Application granted granted Critical
Publication of KR102509846B1 publication Critical patent/KR102509846B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/02—Polyureas
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
KR1020190031950A 2018-03-27 2019-03-20 도전성 접착제층용 캐리어 필름 및 그것을 구비한 본딩 필름 KR102509846B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018059276A JP6405482B1 (ja) 2018-03-27 2018-03-27 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム
JPJP-P-2018-059276 2018-03-27

Publications (2)

Publication Number Publication Date
KR20190113601A KR20190113601A (ko) 2019-10-08
KR102509846B1 true KR102509846B1 (ko) 2023-03-13

Family

ID=63855117

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190031950A KR102509846B1 (ko) 2018-03-27 2019-03-20 도전성 접착제층용 캐리어 필름 및 그것을 구비한 본딩 필름

Country Status (4)

Country Link
JP (1) JP6405482B1 (ja)
KR (1) KR102509846B1 (ja)
CN (1) CN110305602A (ja)
TW (1) TWI735811B (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331614A (ja) * 2001-05-09 2002-11-19 Teijin Ltd 離形フイルム
JP2016115804A (ja) * 2014-12-15 2016-06-23 リンテック株式会社 ダイシングダイボンディングシート

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4011712B2 (ja) * 1998-01-20 2007-11-21 日東電工株式会社 両面接着シート
JP2001001475A (ja) * 1999-06-22 2001-01-09 Teijin Ltd 離形フィルム
JP3956771B2 (ja) * 2002-05-21 2007-08-08 東レ株式会社 半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置
TWI290328B (en) * 2002-05-23 2007-11-21 Nof Corp Transparent conductive laminated film and touch panel
JP2005294294A (ja) 2004-03-31 2005-10-20 Kyocera Chemical Corp プリント配線板用ボンディングシート及び複合多層プリント配線板の製造方法
JP2007266394A (ja) * 2006-03-29 2007-10-11 Toray Ind Inc 半導体用接着剤シート、これを用いた半導体接続用基板および半導体装置
JP2012160546A (ja) * 2011-01-31 2012-08-23 Hitachi Chem Co Ltd 回路接続用接着フィルム及び回路接続構造体
CN103717392B (zh) * 2011-08-05 2016-02-03 三菱工程塑料株式会社 面板和面板设置结构
JP5885791B2 (ja) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、銅箔、プリント配線板、電子機器、電子機器の製造方法、並びに、プリント配線板の製造方法
JP5683734B1 (ja) * 2014-07-01 2015-03-11 グンゼ株式会社 透明導電性積層体、タッチパネル、および透明導電性積層体の製造方法
JP6688033B2 (ja) * 2015-05-27 2020-04-28 日東電工株式会社 透明導電性フィルム
CN105047759A (zh) * 2015-08-20 2015-11-11 福建铂阳精工设备有限公司 一种降低薄膜硅组件表面色差的方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002331614A (ja) * 2001-05-09 2002-11-19 Teijin Ltd 離形フイルム
JP2016115804A (ja) * 2014-12-15 2016-06-23 リンテック株式会社 ダイシングダイボンディングシート

Also Published As

Publication number Publication date
JP6405482B1 (ja) 2018-10-17
TW201942215A (zh) 2019-11-01
TWI735811B (zh) 2021-08-11
CN110305602A (zh) 2019-10-08
JP2019172722A (ja) 2019-10-10
KR20190113601A (ko) 2019-10-08

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