CN110305602A - Electrically conductive adhesive layer carrier film and adhesive film including the electrically conductive adhesive layer carrier film - Google Patents
Electrically conductive adhesive layer carrier film and adhesive film including the electrically conductive adhesive layer carrier film Download PDFInfo
- Publication number
- CN110305602A CN110305602A CN201910235082.0A CN201910235082A CN110305602A CN 110305602 A CN110305602 A CN 110305602A CN 201910235082 A CN201910235082 A CN 201910235082A CN 110305602 A CN110305602 A CN 110305602A
- Authority
- CN
- China
- Prior art keywords
- electrically conductive
- adhesive layer
- conductive adhesive
- carrier film
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012790 adhesive layer Substances 0.000 title claims abstract description 80
- 239000002313 adhesive film Substances 0.000 title description 7
- 238000002834 transmittance Methods 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 239000010410 layer Substances 0.000 description 21
- 239000000758 substrate Substances 0.000 description 15
- 125000000524 functional group Chemical group 0.000 description 14
- 239000003795 chemical substances by application Substances 0.000 description 13
- 239000012860 organic pigment Substances 0.000 description 12
- 229920001225 polyester resin Polymers 0.000 description 11
- 239000004645 polyester resin Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 8
- 239000007800 oxidant agent Substances 0.000 description 8
- 230000001590 oxidative effect Effects 0.000 description 8
- 239000004814 polyurethane Substances 0.000 description 8
- 229920002799 BoPET Polymers 0.000 description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 7
- 238000004026 adhesive bonding Methods 0.000 description 7
- 238000012790 confirmation Methods 0.000 description 7
- 229920002647 polyamide Polymers 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 229920001187 thermosetting polymer Polymers 0.000 description 7
- 239000004952 Polyamide Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229920002396 Polyurea Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- -1 isoindolines ketone Chemical class 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000049 pigment Substances 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
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- 239000004593 Epoxy Substances 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
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- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
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- 239000001023 inorganic pigment Substances 0.000 description 2
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 2
- GWVMLCQWXVFZCN-UHFFFAOYSA-N isoindoline Chemical class C1=CC=C2CNCC2=C1 GWVMLCQWXVFZCN-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- LLBIOIRWAYBCKK-UHFFFAOYSA-N pyranthrene-8,16-dione Chemical compound C12=CC=CC=C2C(=O)C2=CC=C3C=C4C5=CC=CC=C5C(=O)C5=C4C4=C3C2=C1C=C4C=C5 LLBIOIRWAYBCKK-UHFFFAOYSA-N 0.000 description 2
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- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- ZYECOAILUNWEAL-NUDFZHEQSA-N (4z)-4-[[2-methoxy-5-(phenylcarbamoyl)phenyl]hydrazinylidene]-n-(3-nitrophenyl)-3-oxonaphthalene-2-carboxamide Chemical compound COC1=CC=C(C(=O)NC=2C=CC=CC=2)C=C1N\N=C(C1=CC=CC=C1C=1)/C(=O)C=1C(=O)NC1=CC=CC([N+]([O-])=O)=C1 ZYECOAILUNWEAL-NUDFZHEQSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- OSNILPMOSNGHLC-UHFFFAOYSA-N 1-[4-methoxy-3-(piperidin-1-ylmethyl)phenyl]ethanone Chemical compound COC1=CC=C(C(C)=O)C=C1CN1CCCCC1 OSNILPMOSNGHLC-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- XQGDNRFLRLSUFQ-UHFFFAOYSA-N 2H-pyranthren-1-one Chemical class C1=C(C2=C3C4=C56)C=CC3=CC5=C3C=CC=CC3=CC6=CC=C4C=C2C2=C1C(=O)CC=C2 XQGDNRFLRLSUFQ-UHFFFAOYSA-N 0.000 description 1
- CGLVZFOCZLHKOH-UHFFFAOYSA-N 8,18-dichloro-5,15-diethyl-5,15-dihydrodiindolo(3,2-b:3',2'-m)triphenodioxazine Chemical compound CCN1C2=CC=CC=C2C2=C1C=C1OC3=C(Cl)C4=NC(C=C5C6=CC=CC=C6N(C5=C5)CC)=C5OC4=C(Cl)C3=NC1=C2 CGLVZFOCZLHKOH-UHFFFAOYSA-N 0.000 description 1
- 238000003855 Adhesive Lamination Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000555268 Dendroides Species 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical class CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- ZLFVRXUOSPRRKQ-UHFFFAOYSA-N chembl2138372 Chemical compound [O-][N+](=O)C1=CC(C)=CC=C1N=NC1=C(O)C=CC2=CC=CC=C12 ZLFVRXUOSPRRKQ-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 210000000795 conjunctiva Anatomy 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 150000003997 cyclic ketones Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- SUXCALIDMIIJCK-UHFFFAOYSA-L disodium;4-amino-3-[[4-[4-[(1-amino-4-sulfonatonaphthalen-2-yl)diazenyl]-3-methylphenyl]-2-methylphenyl]diazenyl]naphthalene-1-sulfonate Chemical compound [Na+].[Na+].C1=CC=CC2=C(N)C(N=NC3=CC=C(C=C3C)C=3C=C(C(=CC=3)N=NC=3C(=C4C=CC=CC4=C(C=3)S([O-])(=O)=O)N)C)=CC(S([O-])(=O)=O)=C21 SUXCALIDMIIJCK-UHFFFAOYSA-L 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 235000019239 indanthrene blue RS Nutrition 0.000 description 1
- UHOKSCJSTAHBSO-UHFFFAOYSA-N indanthrone blue Chemical compound C1=CC=C2C(=O)C3=CC=C4NC5=C6C(=O)C7=CC=CC=C7C(=O)C6=CC=C5NC4=C3C(=O)C2=C1 UHOKSCJSTAHBSO-UHFFFAOYSA-N 0.000 description 1
- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 1
- PIJPYDMVFNTHIP-UHFFFAOYSA-L lead sulfate Chemical compound [PbH4+2].[O-]S([O-])(=O)=O PIJPYDMVFNTHIP-UHFFFAOYSA-L 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- WDWDWGRYHDPSDS-UHFFFAOYSA-N methanimine Chemical compound N=C WDWDWGRYHDPSDS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229960003351 prussian blue Drugs 0.000 description 1
- 239000013225 prussian blue Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- DNXIASIHZYFFRO-UHFFFAOYSA-N pyrazoline Chemical compound C1CN=NC1 DNXIASIHZYFFRO-UHFFFAOYSA-N 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- VVNRQZDDMYBBJY-UHFFFAOYSA-M sodium 1-[(1-sulfonaphthalen-2-yl)diazenyl]naphthalen-2-olate Chemical compound [Na+].C1=CC=CC2=C(S([O-])(=O)=O)C(N=NC3=C4C=CC=CC4=CC=C3O)=CC=C21 VVNRQZDDMYBBJY-UHFFFAOYSA-M 0.000 description 1
- IDVNZMQMDGSYNQ-UHFFFAOYSA-M sodium 2-(naphthalen-1-yldiazenyl)-5-sulfonaphthalen-1-olate Chemical compound [Na+].Oc1c(ccc2c(cccc12)S([O-])(=O)=O)N=Nc1cccc2ccccc12 IDVNZMQMDGSYNQ-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- JOUDBUYBGJYFFP-FOCLMDBBSA-N thioindigo Chemical class S\1C2=CC=CC=C2C(=O)C/1=C1/C(=O)C2=CC=CC=C2S1 JOUDBUYBGJYFFP-FOCLMDBBSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/02—Polyureas
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Abstract
Present invention aims at realize a kind of electrically conductive adhesive layer carrier film for being not easy to forget to peel carrier film and can easily position.Electrically conductive adhesive layer of the invention is set to the surface of electrically conductive adhesive layer (111) with carrier film (112), and total light transmittance is 30% or more, 80% hereinafter, △ E with electrically conductive adhesive layer (111)* abIt is 20 or more.
Description
Technical field
The present invention relates to electrically conductive adhesive layer carrier film and adhesive films.
Background technique
Be laminated with the conductive adhering film of electrically conductive adhesive layer and carrier film stiffening plate is installed on it is flexibility printed
It is used in the case where roadbed material etc..When stiffening plate is installed, the conductive adhering film for being cut into certain shapes is fixed on scratches first
The certain position of property printed wiring substrate.Carrier film is removed later, passes through electrically conductive adhesive lamination reinforcement plate.
To prevent from forgetting removal carrier film, existing technological means is to make carrier film is opaque, improves haze value (such as to join
According to patent document 1).
[existing technical literature]
[patent document]
[patent document 1] Japanese patent application discloses No. 2005-294294.
Summary of the invention
[technical problems to be solved by the inivention]
On the other hand, in the fixed conductive adhering film in several positions of flexible printed wiring substrate, retain carrier film and only will
Electrically conductive adhesive layer, which is partly cut to certain shapes, makes it graphically can be once solid in several positions of flexible printed wiring substrate
Determine conductive adhering film.In this case, correct to grasp conduction when conductive adhering film being fixed on flexible printed wiring substrate
Property gluing oxidant layer position and carry out positioning be critically important.In order to be properly positioned, it is preferably able to detect to lead through carrier film
The position at the edge of electrical gluing oxidant layer, according to be to improve the high film of haze value of visibility then marginal position can mould
It pastes, be difficult to detect by correct position.
Such problems, which is not only easy to produce, is also easy to result from conductive adhering film the conduction containing carrier film is equipped with
The various substrate materials of property gluing oxidant layer.
Be not easy to forget to peel carrier film technical problem to be solved by the present invention lies in realization, can also be easily visually recognizable
The electrically conductive adhesive layer carrier film of the layer of downside.
[technological means for solving technical problem]
One Technical Design of electrically conductive adhesive layer carrier film of the invention are as follows: set on the table of electrically conductive adhesive layer
Face, total light transmittance are 30% or more, 80% hereinafter, color difference (△ E with electrically conductive adhesive layer* ab) it is 20 or more.
One technical solution of electrically conductive adhesive layer carrier film can design are as follows: the L of electrically conductive adhesive layer*Value is 40
Above, 70 or less.
One Technical Design of adhesive film of the invention are as follows: including electrically conductive adhesive layer carrier film of the invention.
[invention effect]
Electrically conductive adhesive layer carrier film according to the present invention is not easy to forget to peel carrier film, moreover it is possible to easily visually recognizable
The layer of downside.
Detailed description of the invention
[Fig. 1] includes the section of the conductive adhering film of electrically conductive adhesive layer carrier film involved in an embodiment
Diagram；
Conductive adhering film is fixed on the sectional view of the state of printed wiring substrate by [Fig. 2].
Specific embodiment
As shown in Figure 1, the carrier film 112 of the electrically conductive adhesive layer of present embodiment, which is set to, contains electrically conductive adhesive
The surface of the electrically conductive adhesive layer 111 of the adhesive film 100 of layer 111.
As shown in Fig. 2, the conductive adhering film 100 of present embodiment is able to use the hemisections electrically conductive adhesive such as blanking die
Layer 111 is into the certain position for being temporarily fixed to printed wiring substrate 200 after certain figure.To penetrate carrier film on one side at this time
The position of electrically conductive adhesive layer 111 after 112 confirmations are graphical is located on one side desired by the printed wiring substrate
Position.Next stiffening plate etc. can be configured on electrically conductive adhesive layer 111, and pressurize and add by removing carrier film 112
Heat is to be bonded and printed wiring substrate 200 and stiffening plate is connected.
In order to easily carry out the positioning of electrically conductive adhesive layer 111, preferably the total light transmittance of raising carrier film 112 with
It is easy to grasp the position of electrically conductive adhesive layer 111.On the other hand, it in order to avoid forgetting to peel carrier film 112, preferably reduces and holds
The total light transmittance of film carrier 112 is to improve visibility.In general, can the easily film of the layer of visually recognizable downside full light
Line transmitance is at least 70%~80% or so, can easily confirm that the total light transmittance of its existing film is at most 20%
Left and right.But present inventor has found the total light transmittance by controlling carrier film 112 and its color with the layer of downside
Difference (△ E* ab) the layer position that can take into account visibility and downside be easy to the property grasped.
The total light transmittance of the carrier film 112 of conductive adhering film 100 of the invention be 30% or more, preferably 45% with
On, it is 80% or less, preferably 75% or less.△E*abIt is 20 or more, preferably 30 or more, more preferable 33 or more.△E*abIt is more big more
Good, but in view of range more real in color adjustment, numerical value preferably 60 is hereinafter, more preferable 50 hereinafter, further preferably
39 or less.
Thereby, it is possible to easily from the visually recognizable electrically conductive adhesive layer 111 patterned due to punching in carrier film side
And it can correctly grasp its position.It is thus, it is possible to the electrically conductive adhesive layer 111 after being properly positioned graphically and it is temporarily fixed
In printed wiring substrate 200.
In addition, by making total light transmittance and △ E* abThe visibility of carrier film 112 can be made to get higher for certain value can also subtract
The case where peeling carrier film 112 is forgotten after temporarily fixing less.
The L of the electrically conductive adhesive layer 111 of the downside of the carrier film 112 of present embodiment*Value preferably 40 or more, more preferably
50 or more, preferably 70 or less, more preferable 60 or less so that can be further improved electrically conductive adhesive layer 111 and carrier film 112
Visibility.
In addition, the △ E of the total light transmittance of carrier film 112, carrier film 112 and electrically conductive adhesive layer 111* ab, it is conductive
The L of property gluing oxidant layer 111*Value can use the measurement of method shown in embodiment.
As long as carrier film 112 meets total light transmittance and the △ E relative to electrically conductive adhesive layer 111* abIt is certain value
, material is unlimited, such as is able to use thermoplastic resin composition, compositions of thermosetting resin and active energy beam
Solidification compound etc..Such resin combination is for example able to use polyester, polyolefin, polyimides or polyphenylene sulfide etc..
In order to adjust total light transmittance and △ E* ab, various additives can be added into these resins.Additive as above is without special limit
It is fixed, it is able to use pigment, dyestuff.Pigment can enumerate organic pigment and inorganic pigment etc..
The concrete example of organic pigment can enumerate toluidine red, everbright fast maroon, Lufthansa Huang, benzidine yellow and pyrazoline
The red equal insoluble azo colours of ketone；Lithol red, HelioBordeaux, lithol fast scarlet nrh (pigment scarlet) and permanent bordeaux
The solubility azo pigments such as 2B；The derivative of the vat dyestuffss such as alizarin, indanthrene and thioindigoid maroons；The phthaleins such as phthalocyanine blue and phthalocyanine green
Cyanines class organic pigment；Quinacridone is red and the quinacridines ketone organic pigment such as quinacridone magenta, the red and classes such as scarlet
Organic pigment；The isoindolines ketone organic pigment such as isoindolinone Huang and isoindolinone orange；Pyranthrone is red and pyranthrone orange
Equal pyranthrones organic pigment；Thioindigo class organic pigment；It is condensed azo organic pigment；Benzimidazole ketone organic pigment；Quinoline
The isoindolines class organic pigments such as the quinophthalones class such as phthalein ketone Huang organic pigment, isoindoline Huang；And other pigment can enumerate
Flavanthrone (Flavanthrone Yellow), amido yellow (AcylamideYellow), nickel azo yellow, copper methylene amine
Yellow, purple cyclic ketones orange, anthracene orange, bi-anthraquinone be red and dioxazine violet etc..
In addition, the concrete example of inorganic pigment can enumerate silica, alumina, titanium oxide, barium sulfate, calcium carbonate, oxygen
It is red to change zinc, lead sulfate, chrome yellow, zinc yellow, Bengala(iron oxide (III)), cadmium red, ultramarine, Prussian blue, chrome oxide green, cobalt
Green, amber, titanium is black and synthesis iron oxide black etc..
Dyestuff is able to use known various compounds all the time.
Parting agent layer (not shown) can be set between carrier film 112 and electrically conductive adhesive layer 111.Can by by silicon class or
Non-silicon class mould release is coated on the surface of 111 side of electrically conductive adhesive layer of carrier film 112 to form parting agent layer.It is formed release
When oxidant layer, thickness can be several μm~more than ten μm or so.
In present embodiment, electrically conductive adhesive layer 111 includes thermoplastic resin, thermosetting resin or active energy beam
The resin components such as curing composition and electroconductive stuffing.
When electrically conductive adhesive layer 111 includes thermoplastic resin, thermoplastic resin is for example able to use phenylethylene tree
Rouge, vinyl acetate esters resin, polyester resin, polythylene resin, polypropylene-based resin, imide resin and acrylic acid
Resinoid etc..These resins can be used alone, can also two or more be used in combination.
When electrically conductive adhesive layer 111 include thermosetting resin when, thermosetting resin be for example able to use phenolic resin,
Epoxylite, polyurethane based resin, melamine resinoid, polyamide-based resin and alkyd based resin etc..Active-energy is penetrated
Line solidification compound is not particularly limited, such as is able to use the polymerism of at least 2 (methyl) acryloxies in molecule
Compound etc..These compositions can be used alone, can also two or more be used in combination.
Thermosetting resin such as include the 1st resin component with reactive 1st functional group and with the 1st functional group reactions
The 2nd resin component.1st functional group for example can be epoxy group, amide groups or hydroxyl etc..2nd functional group of the 2nd resin component
It is selected according to the 1st functional group, such as when the 1st functional group is epoxy group, the 2nd functional group can be hydroxyl, carboxyl, epoxy group
And amino etc..Specifically, such as when the 1st resin component is epoxy resin, the 2nd resin component is able to use epoxy-modified
Polyester resin, epoxy-modified polyamide, epoxy-modified acrylic resin, epoxy-modified polyurethane polyureas carbamide resin,
Carboxy-modified polyester resin, carboxy-modified polyamide, carboxy-modified acrylic resin, carboxy-modified polyurethane polyureas carbamide resin
And urethane modified polyester resin etc..Wherein preferred carboxy-modified polyester resin, carboxy-modified polyamide, carboxy-modified poly-
Urethane carbamide resin and urethane modified polyester resin.In addition, when the 1st functional group of the 1st resin component is hydroxyl, the 2nd resin
Ingredient is able to use epoxy-modified polyester resin, epoxy-modified polyamide, epoxy-modified acrylic resin, epoxy
Base modified polyurethane carbamide resin, carboxy-modified polyester resin, carboxy-modified polyamide, carboxy-modified acrylic resin,
Carboxy-modified polyurethane polyureas carbamide resin and urethane modified polyester resin etc..Wherein preferably carboxy-modified polyester resin, carboxyl change
Property polyamide, carboxy-modified polyurethane polyureas carbamide resin and urethane modified polyester resin.
Thermosetting resin also may include the curing agent for promoting heat cure reaction.Thermosetting resin contain the 1st functional group and
When 2 functional group, curing agent can be suitable for selection according to the type of the 1st functional group and the 2nd functional group.1st functional group is epoxy
Base, the 2nd functional group are able to use imidazole curing agent, phenol curing agent and cationic curing agent etc. when being hydroxyl.As above
Substance can be used alone a kind, also can two or more be used in combination.Other also may include defoaming agent, antioxygen as nonessential ingredient
Agent, viscosity modifier, diluent, anti-settling agent, leveling agent, coupling agent, colorant and fire retardant etc..
Electroconductive stuffing is not particularly limited, for example, be able to use metal packing, coating metal resin extender, carbon system filler and
These mixture.Metal packing can enumerate copper powder, silver powder, nickel powder, silver-coated copper powder, golden copper-clad powder, silver coated nickel powder and gold
Nickel coat powder etc..These metal powders can be made by electrolysis method, atomization or reduction method etc..Wherein preferred silver powder, silver-coated copper powder
And any one of copper powder.
From between filler contact from the viewpoint of, preferably 1 μm or more of the average grain diameter of electroconductive stuffing, it is more preferable 3 μm with
On, preferably 50 μm or less, more preferable 40 μm or less.The shape of electroconductive stuffing is not particularly limited, can be it is spherical, laminar,
Dendroid or threadiness etc..
The amount of electroconductive stuffing can be suitable for selection, the preferably all solids in electrically conductive adhesive layer depending on the application
5 mass % or more, more preferable 10 mass % or more, preferably 95 mass % or less, more preferable 90 mass % or less are accounted in ingredient.From
From the viewpoint of embeddability, preferably 70 mass % or less, more preferable 60 mass % or less.In addition, to realize anisotropic conductive
Property, preferably 40 mass % or less, more preferable 35 mass % or less.
Such as can by carrier film 112 applying conductive gluing oxidant layer with composition form electrically conductive adhesive
Layer 111.Suitable solvent is added into the resin and filler of electrically conductive adhesive layer and prepares the combination of electrically conductive adhesive layer
Object.
From the viewpoint of control embeddability, preferably 1 μm 50 μm of the thickness of electrically conductive adhesive layer 111.
According further to needs the protection film that can be removed can also be bonded on the surface of electrically conductive adhesive layer 111.Separately
Also parting agent layer etc. can be set on the two sides of carrier film 112 outside, turnup is so that wheel stream configuration carrier film 112 and electrically conductive adhesive
Layer 111.
The conductive adhering film 100 of present embodiment can in the case where retaining carrier film 112 hemisection electric conductivity gluing
Oxidant layer 111 come realize it is graphical after be temporarily fixed to printed wiring substrate 200.However, it is also possible to electrically conductive adhesive layer 111
Cut carrier film 112 together to realize that it is graphical and is temporarily fixed to printed wiring substrate 200.It can also reduce and forget at this time
The case where peeling carrier film 112 is useful.
The electrically conductive adhesive layer carrier film 112 of present embodiment can be used not only for electric conductivity stiffening plate and heat sink
Etc. the conductive adhering film for fitting in flexible printed wiring substrate, the carrier film of the electrically conductive adhesive layer as screened film etc.
It is useful.
[embodiment]
Conductive adhering film of the invention is described in detail in embodiment used below.Following embodiment is example, is not limited
Determine the intent of the present invention.
The production > of < conductive adhering film
On the surface of certain carrier film, coating non-silicon class mould release forms parting agent layer.Parting agent layer with a thickness of 0.1 μm.
Next, being carried out 100 DEG C × 3 minutes after being coated with electrically conductive adhesive layer composition with scraper (the scraping plain film of plate)
The dry electrically conductive adhesive layer for forming 60 μm of thickness, has obtained conductive adhering film.
45 mass parts of epoxy resin are mixed in 55 mass parts of the polyurethane polyureas carbamide resin preparation that acid value is 25mgKOH/g to lead
Electrical gluing oxidant layer composition.In addition, the composition of epoxy resin is as follows: the epoxy resin of phenol type (trade name jER4275,
Mitsubishi Chemical's system) 20 mass parts, phenol (line style) phenol aldehyde type epoxy resin (trade name jER152, Mitsubishi Chemical's system) 20 mass
Part, rubber modified epoxy resin (trade name ERP-4030, rising sun electrification system) 5 mass parts.It will using scraper (the scraping plain film of plate)
Its hand is applied on release treated carrier film (polyethylene terephthalate film), carries out drying in 100 DEG C × 3 minutes
Conductive adhering film is made.In addition, scraper according to the thickness for the conductive adhering film to be made suitably selected 1mil~
5mil specification.In addition, 1mil=1/1000 inches=25.4 μm.In each embodiment and each comparative example, conductive adhesive has been made
Film so that its with a thickness of certain thickness.In addition the thickness of conductive adhering film is determined with micrometer.
In addition, it is 5 μm silver powder (Fukuda Metal Foil & POwder Co., Ltd. that electroconductive stuffing, which uses average grain diameter,
System).
The measurement > of < total light transmittance
It uses haze meter (Nippon Denshoku Industries Co., Ltd.'s system, SH7000), it then follows JIS K 7361 determines the complete of carrier film
Light penetration.
< L*Evaluation >
The L of electrically conductive adhesive layer is determined using integrating sphere spectrophotometer (X-Rite corporation, Ci64, tungsten light source)*
Value.
The measurement > of < color difference
CIE76(delta E76 is followed using integrating sphere spectrophotometer (X-Rite corporation, Ci64, tungsten light source)) it determines
Color difference (the △ E of carrier film and electrically conductive adhesive layer* ab).
< visibility evaluates >
About the visibility of carrier film, the adhesive film from carrier film side observes by the naked eye the presence for having confirmed carrier film
If be judged as good (zero), be judged as bad (×) if not confirming.
The visibility of electrically conductive adhesive layer is had rated as follows.Retain carrier film, by the electrically conductive adhesive layer of adhesive film
A part be partly cut into mouthful shape form square electrically conductive adhesive layer.The viscous of hemisection is configured on polyimide film
Conjunctiva and it is located below electrically conductive adhesive layer, observes by the naked eye and be confirmed whether to have an X-rayed from carrier film side to square
Electrically conductive adhesive layer.Specifically, 4 jiaos of angle for having confirmed the electrically conductive adhesive layer of square is observed by the naked eye
It is judged as good (zero) if being 90 °, observes by the naked eye 4 jiaos of the angle that cannot confirm the electrically conductive adhesive layer of square
Degree is judged as bad (×) if being 90 °.
(embodiment 1)
Carrier film uses the PET film with a thickness of 50 μm.Total light transmittance is 50%, the L of electrically conductive adhesive layer*Value is
51.In addition, color difference (the △ E of PET film and electrically conductive adhesive layer* ab) it is 39.From carrier film side confirmation electrically conductive adhesive layer
Visibility is good (zero), and the visibility of carrier film is also good (zero).
(embodiment 2)
The milky PET film that carrier film uses with a thickness of 55 μm.Total light transmittance is 65%, electrically conductive adhesive layer
L*Value is 69.In addition △ E* abIt is 34.It is good (zero) from the visibility of carrier film side confirmation electrically conductive adhesive layer, carrier film
Visibility is also good (zero).
(embodiment 3)
The milky PET film that carrier film uses with a thickness of 50 μm.Total light transmittance is 46%, electrically conductive adhesive layer
L*Value is 41.In addition △ E* abIt is 35.It is good (zero) from the visibility of carrier film side confirmation electrically conductive adhesive layer, carrier film
Visibility is also good (zero).
(comparative example 1)
The white PET film that carrier film uses with a thickness of 38 μm.Total light transmittance is 13%, the L of electrically conductive adhesive layer*
Value is 60.In addition △ E* abIt is 40.From carrier film side confirmation electrically conductive adhesive layer visibility it is bad (×), carrier film can
Opinion property is good (zero).
(comparative example 2)
The white PET film that carrier film uses with a thickness of 50 μm.Total light transmittance is 5%, the L of electrically conductive adhesive layer*
Value is 55.In addition △ E* abIt is 32.From carrier film side confirmation electrically conductive adhesive layer visibility it is bad (×), carrier film can
Opinion property is good (zero).
(comparative example 3)
Carrier film uses 38 μm of thickness of transparent PET film.Total light transmittance is 90%, the L of electrically conductive adhesive layer*Value
It is 53.In addition △ E* abIt is 2.9.It is good (zero) from the visibility of carrier film side confirmation electrically conductive adhesive layer, carrier film it is visible
Property bad (×).
The unified result for showing each Examples and Comparative Examples of table 1.
[table 1]
[practicability]
Electrically conductive adhesive layer of the invention is not only not easy to forget to peel carrier film with carrier film, moreover it is possible under easily visually recognizable
The layer of side is useful in the various substrate materials containing electrically conductive adhesive layer.
[number explanation]
100 conductive adhering films
111 electrically conductive adhesive layers
112 carrier films
200 printed wiring substrates
Claims (3)
1. a kind of electrically conductive adhesive layer carrier film, it is characterised in that:
Set on the surface of the electrically conductive adhesive layer,
Total light transmittance is 30% or more, 80% hereinafter, △ E with the electrically conductive adhesive layer* abIt is 20 or more.
2. electrically conductive adhesive layer carrier film according to claim 1, it is characterised in that:
The L of the electrically conductive adhesive layer*Value is 40 or more, 70 or less.
3. a kind of conductive adhering film, it is characterised in that:
Including electrically conductive adhesive layer carrier film of any of claims 1 or 2.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018059276A JP6405482B1 (en) | 2018-03-27 | 2018-03-27 | Carrier film for conductive adhesive layer and bonding film provided therewith |
| JP2018-059276 | 2018-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110305602A true CN110305602A (en) | 2019-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910235082.0A Pending CN110305602A (en) | 2018-03-27 | 2019-03-27 | Electrically conductive adhesive layer carrier film and adhesive film including the electrically conductive adhesive layer carrier film |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6405482B1 (en) |
| KR (1) | KR102509846B1 (en) |
| CN (1) | CN110305602A (en) |
| TW (1) | TWI735811B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002331614A (en) * | 2001-05-09 | 2002-11-19 | Teijin Ltd | Mold release film |
| CN1653561A (en) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | Transparent conductive laminate film, touch panel having this transparent conductive laminate film, and production method for this transparent conductive laminate film |
| CN103717392A (en) * | 2011-08-05 | 2014-04-09 | 三菱工程塑料株式会社 | Panel and panel installation structure |
| JP5683734B1 (en) * | 2014-07-01 | 2015-03-11 | グンゼ株式会社 | Transparent conductive laminate, touch panel, and method for producing transparent conductive laminate |
| CN105047759A (en) * | 2015-08-20 | 2015-11-11 | 福建铂阳精工设备有限公司 | Method for reducing surface chromatic aberration of film silicon assembly |
| CN107004590A (en) * | 2014-12-15 | 2017-08-01 | 琳得科株式会社 | Diced chip joint fastener |
| CN107112074A (en) * | 2015-05-27 | 2017-08-29 | 日东电工株式会社 | Transparent conducting film |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4011712B2 (en) * | 1998-01-20 | 2007-11-21 | 日東電工株式会社 | Double-sided adhesive sheet |
| JP2001001475A (en) * | 1999-06-22 | 2001-01-09 | Teijin Ltd | Release film |
| JP3956771B2 (en) * | 2002-05-21 | 2007-08-08 | 東レ株式会社 | Adhesive sheet for semiconductor device, semiconductor connection substrate and semiconductor device |
| JP2005294294A (en) | 2004-03-31 | 2005-10-20 | Kyocera Chemical Corp | Method of manufacturing bonding sheet for printed wiring board and complex multilayered printed wiring board |
| JP2007266394A (en) * | 2006-03-29 | 2007-10-11 | Toray Ind Inc | Adhesive sheet for semiconductor, substrate for connecting semiconductor using the same, and semiconductor device |
| JP2012160546A (en) * | 2011-01-31 | 2012-08-23 | Hitachi Chem Co Ltd | Adhesive film for circuit connection and circuit connection structure |
| JP5885791B2 (en) * | 2013-08-20 | 2016-03-15 | Ｊｘ金属株式会社 | Surface-treated copper foil and laminate using the same, copper foil with carrier, copper foil, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board |
-
2018
- 2018-03-27 JP JP2018059276A patent/JP6405482B1/en active Active
- 2018-10-25 TW TW107137738A patent/TWI735811B/en active
-
2019
- 2019-03-20 KR KR1020190031950A patent/KR102509846B1/en active IP Right Grant
- 2019-03-27 CN CN201910235082.0A patent/CN110305602A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002331614A (en) * | 2001-05-09 | 2002-11-19 | Teijin Ltd | Mold release film |
| CN1653561A (en) * | 2002-05-23 | 2005-08-10 | 日本油脂株式会社 | Transparent conductive laminate film, touch panel having this transparent conductive laminate film, and production method for this transparent conductive laminate film |
| CN103717392A (en) * | 2011-08-05 | 2014-04-09 | 三菱工程塑料株式会社 | Panel and panel installation structure |
| JP5683734B1 (en) * | 2014-07-01 | 2015-03-11 | グンゼ株式会社 | Transparent conductive laminate, touch panel, and method for producing transparent conductive laminate |
| CN107004590A (en) * | 2014-12-15 | 2017-08-01 | 琳得科株式会社 | Diced chip joint fastener |
| CN107112074A (en) * | 2015-05-27 | 2017-08-29 | 日东电工株式会社 | Transparent conducting film |
| CN105047759A (en) * | 2015-08-20 | 2015-11-11 | 福建铂阳精工设备有限公司 | Method for reducing surface chromatic aberration of film silicon assembly |
Also Published As
| Publication number | Publication date |
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| JP6405482B1 (en) | 2018-10-17 |
| TW201942215A (en) | 2019-11-01 |
| KR20190113601A (en) | 2019-10-08 |
| KR102509846B1 (en) | 2023-03-13 |
| TWI735811B (en) | 2021-08-11 |
| JP2019172722A (en) | 2019-10-10 |
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