CN114902819A - Shape transfer film - Google Patents
Shape transfer film Download PDFInfo
- Publication number
- CN114902819A CN114902819A CN202180007796.1A CN202180007796A CN114902819A CN 114902819 A CN114902819 A CN 114902819A CN 202180007796 A CN202180007796 A CN 202180007796A CN 114902819 A CN114902819 A CN 114902819A
- Authority
- CN
- China
- Prior art keywords
- shape
- transfer film
- layer
- shape transfer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/04—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Materials For Medical Uses (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
The present invention provides a shape transfer film including an uneven shape, which can impart sufficient covering properties to a transfer target object by transferring a shape derived from the uneven shape to the transfer target object, and which can be easily peeled off when the transfer target object is intentionally peeled off. The shape transfer film 1 includes, on at least one surface, an uneven shape having an interface development area ratio Sdr of 1500 to 7000% and/or a level difference Sk of a center portion of 2.0 to 7.0 [ mu ] m, and is used for transferring a shape derived from the uneven shape to a transfer object. The shape transfer film 1 includes, for example, a substrate layer 2 and a resin layer 3 provided on one surface of the substrate layer 2. The shape transfer film 1 contains, for example, a filler 4, and the uneven shape is formed by the filler 4 protruding outward from the film flat surface 3 a.
Description
Technical Field
The present invention relates to a shape transfer film. More specifically, the present invention relates to a shape transfer film for transferring a shape derived from an uneven shape included in the shape transfer film to a transfer target object.
Background
Printed wiring boards are widely used for assembling circuits into mechanisms in electronic devices such as mobile phones, video cameras, notebook-size personal computers, and the like. And is also used to connect a movable portion of the print head and a control portion. In these electronic devices, measures for shielding electromagnetic waves are required, and even printed wiring boards used in the devices, shielded printed wiring boards on which measures for shielding electromagnetic waves are applied are used.
Electromagnetic wave shielding films are used in shielding printed wiring boards. For example, an electromagnetic wave shielding film used for bonding to a printed wiring board includes a conductive adhesive layer and a protective layer for protecting the conductive adhesive layer and a shielding layer such as a metal layer provided as needed.
In recent years, in a shielded printed wiring board, a protective layer which is an outermost layer of an electromagnetic wave shielding film laminated on the printed wiring board is sometimes required to have an appearance with low surface glossiness for the purpose of hiding a circuit pattern. Examples of the protective layer having low surface glossiness include a protective layer having a surface with a concavo-convex shape. Such a protective layer can be produced, for example, as follows: a composition for forming a protective layer is cast on an uneven surface of a transfer film (shape transfer film) having an uneven shape on the surface thereof, and then cured to form a protective layer, whereby the uneven shape derived from the shape transfer film is imparted (transferred) to the surface of the protective layer, and matting is performed.
For example, patent document 1 discloses the shape transfer film.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 2017-71107.
Disclosure of Invention
Technical problem to be solved by the invention
However, since the conventional shape transfer film provided with the uneven shape for the purpose of imparting the masking property to the protective layer functions in a state of being laminated with the protective layer due to the anchor effect derived from the uneven shape, there is a problem that the shape transfer film is difficult to peel off when peeled off from the protective layer or the protective layer is peeled off together even if the shape transfer film is peeled off. When the uneven shape is made shallow, the anchoring effect can be weakened and the shape transfer film can be easily peeled off from the state of being bonded to the protective layer, but the uneven shape formed on the protective layer is also made shallow, and therefore sufficient covering properties cannot be imparted to the protective layer.
In view of the above problems, it is an object of the present invention to provide a shape transfer film including an uneven shape, which can impart sufficient covering properties to a transfer target by transferring a shape derived from the uneven shape to the transfer target, and which can be easily peeled off when the transfer target is intentionally peeled off.
Means for solving the problems
The present inventors have made diligent studies to achieve the above object and found that a shape transfer film having a specific uneven shape on the surface can impart sufficient covering properties to a transfer target by transferring a shape derived from the uneven shape to the transfer target, and can be easily peeled off when the transfer target is intentionally peeled off. The present invention has been completed based on the above findings.
The present invention provides a shape transfer film, at least one surface of which contains an uneven shape having an interface development area ratio Sdr of 1500-7000%, and which is used for transferring a shape derived from the uneven shape to a transfer object.
Preferably: the level difference Sk at the center of the concave-convex shape is 2.0-7.0 μm.
The present invention also provides a shape transfer film, at least one surface of which contains an uneven shape having a level difference Sk of 2.0 to 7.0 μm in the center portion, and which is used for transferring a shape derived from the uneven shape to a transfer target.
Preferably: the arithmetic average height Sa in the concavo-convex shape is 1.0-2.0 μm.
Preferably, the following components: the root mean square height Sq in the concave-convex shape is 1.0-2.8 μm.
Preferably: the root-mean-square inclination Sdq in the concave-convex shape is 7-15.
Preferably: the ratio [ Sdr/Sdq ] of the interface spread area ratio Sdr to the root-mean-square inclination Sdq in the concave-convex shape is 200 to 500.
Preferably: the shape transfer film includes a substrate layer and a resin layer provided on one surface of the substrate layer, and the side surface of the resin layer includes the uneven shape.
Preferably: the shape transfer film contains a filler, and the uneven shape is formed by the filler protruding outward from the film flat surface.
The present invention also provides a decal for a printed wiring board, comprising the shape transfer film and a circuit pattern masking layer directly laminated on the shape transfer film.
Preferably: in the attaching film for the printed wiring board, an adhesive layer, the circuit pattern masking layer, and the shape transfer film are laminated in sequence.
Preferably: the 85 ° glossiness of the shape transfer film side surface of the circuit pattern masking layer is 15 or less.
Effects of the invention
According to the shape transfer film of the present invention, since the surface includes the specific uneven shape, it is possible to impart sufficient covering properties to the transfer target by imparting a shape derived from the uneven shape to the transfer target, and it is possible to easily peel the transfer target when it is intentionally peeled from the transfer target. In addition, the shape transfer film is difficult to be peeled off in a case other than when the shape transfer film is intentionally peeled off from the transfer target during transportation.
Drawings
FIG. 1 is a schematic cross-sectional view of one embodiment of a shape transfer film according to the present invention;
FIG. 2 is a schematic cross-sectional view of another embodiment of the shape transfer film according to the present invention;
FIG. 3 is a schematic cross-sectional view of an embodiment of a die attach film for a printed wiring board using the shape transfer film shown in FIG. 1.
Detailed Description
[ shape transfer film ]
A shape transfer film according to an embodiment of the present invention includes an uneven shape on at least one surface, and is used to impart (transfer) a shape derived from the uneven shape to a transfer target object. The shape transfer film is particularly preferably used for imparting (transferring) a shape derived from the above-described uneven shape to an outermost layer (for example, a circuit pattern masking layer or the like described later) of a film for attachment to a printed wiring board (a printed wiring board attachment film).
In the uneven shape included in the shape transfer film, the interface development area ratio Sdr is preferably 1500 to 7000%, more preferably 2000 to 6500%, and further preferably 2500 to 6000%. The interface expansion area ratio Sdr is an index indicating how much the expansion area (surface area) of the defined region increases with respect to the area of the defined region in accordance with ISO 25178. The Sdr of the completely flat surface was 0%. When the interface development area ratio Sdr is 1500% or more, sufficient covering properties can be imparted to the transfer object to which the shape derived from the uneven shape is imparted. If the interface expansion area ratio Sdr is 7000% or less, the shape transfer film is easily peeled off from the transfer object intentionally.
In the above-mentioned uneven shape, the level difference Sk at the center portion is preferably 2.0 to 7.0. mu.m, more preferably 2.3 to 6.0. mu.m, and still more preferably 2.5 to 5.0. mu.m. The level difference Sk in the center portion is a value obtained by subtracting the minimum height from the maximum height of the center portion in the concave-convex shape in accordance with ISO 25178. The center portion is a region sandwiched by the height of 0% and 100% of the load area ratio of the equivalent straight line. When the level difference Sk in the center portion is 2.0 μm or more, the level difference Sk in the center portion is large, and sufficient covering properties can be provided to the transfer target to which the shape derived from the uneven shape is applied. When the level difference Sk in the center portion is 7.0 μm or less, the shape transfer film is easily peeled off from the transfer object.
In the above-described uneven shape, the arithmetic mean height Sa is preferably 1.0 to 2.0. mu.m, more preferably 1.0 to 1.8. mu.m, and still more preferably 1.0 to 1.6. mu.m. The arithmetic mean height Sa is an average value of absolute values of differences in heights of respective points with respect to a mean plane of a surface in accordance with ISO 25178. When the arithmetic average height Sa is 1.0 μm or more, a transfer object to which a shape derived from the above-described uneven shape is applied can be provided with more sufficient covering properties. If the arithmetic average height Sa is 2.0 μm or less, the shape transfer film is more easily peeled off from the transfer object.
In the above-mentioned uneven shape, the root mean square height Sq is preferably 1.0 to 2.8 μm, more preferably 1.1 to 2.5 μm, and still more preferably 1.3 to 2.0. mu.m. The root mean square height Sq is a parameter corresponding to the standard deviation of the distance from the average plane in accordance with ISO 25178. When the root mean square height Sq is 1.0 μm or more, a transfer target to which a shape derived from the above-described uneven shape is imparted can be imparted with more sufficient covering properties. When the root-mean-square height Sq is 2.8 μm or less, the unevenness in height in the uneven shape is small (in some cases), and the shape transfer film is more easily peeled off from the transfer object intentionally.
In the above-described uneven shape, the root-mean-square inclination Sdq is preferably 7 to 15, more preferably 8 to 14, and further preferably 9 to 13.5. The above-mentioned root mean square slope Sdq is in accordance with ISO25178, and is a parameter calculated from the root mean square of the slope at all points of the defined area. The Sdq of a completely flat surface is 0. When the root-mean-square inclination Sdq is 7 or more, a more sufficient covering property can be provided to the transfer target to which the shape derived from the uneven shape is provided. When the root-mean-square inclination Sdq is 15 or less, the unevenness in height in the uneven shape is small (in some cases), and the shape transfer film is more easily peeled off from the transfer object intentionally.
In the above-described uneven shape, the ratio [ Sdr/Sdq ] of the interface development area ratio Sdr [% ] to the root-mean-square inclination Sdq is preferably 200 to 500, more preferably 250 to 480, and further preferably 300 to 450. When the ratio is 200 or more, the surface area becomes large (that is, the unevenness is sharp), and it is estimated that a transfer object to which a shape derived from the unevenness is given can be given a more sufficient covering property. When the ratio is 500 or less, the inclination of the unevenness can be suppressed and the surface area (that is, the degree of unevenness) can be suppressed within a certain range, so that it becomes easier to intentionally peel the shape transfer film from the transfer object.
The 60 ° gloss in the above-described uneven shape is preferably 4.0 or more, more preferably 4.5 or more, and further preferably 5.0 or more. When the 60 ° gloss is 4.0 or more, it is estimated that the uneven shape is more suitable for intentional peeling, and the shape transfer film is more easily peeled from the transfer object intentionally. The 60 ° gloss in the above-described uneven shape is preferably 20 or less, more preferably 15 or less, and further preferably 10 or less. When the 60 ° gloss is 20 or less, it is estimated that the above-described uneven shape is more suitable for intentional peeling, and more sufficient masking property can be imparted to the transfer object. The above 60 ° gloss can be measured by a method according to JIS Z8741.
The gloss at 85 DEG in the above-mentioned uneven shape is preferably 2.5 to 15.0, more preferably 3.0 to 13.0. When the 85 ° gloss is 2.5 or more, the shape transfer film is more easily peeled off from the transfer object. When the 85 ° gloss is 15.0 or less, a more sufficient covering property can be provided to the transfer target. The above-mentioned 85 ° gloss can be measured by a method according to JIS Z8741.
One embodiment of the shape transfer film includes a substrate layer and a resin layer provided on at least one surface of the substrate layer, and the side surface of the resin layer includes the uneven shape. Another embodiment of the shape transfer film may include a shape transfer film in which the substrate layer surface includes the above-described uneven shape. As the shape transfer film according to the other embodiment, there can be mentioned a shape transfer film to which an uneven shape is given by pressing a mold including an uneven shape against a substrate layer.
In the shape transfer film, the uneven shape can be formed by a known or commonly used method, and the uneven shape is formed so as to include the various characteristics described above. Examples of the method for forming the above-described uneven shape include a method of physically roughening a flat surface by a method of blasting the flat surface, a method of blasting dry ice or the like to the flat surface, a method of pressing a mold containing the uneven shape, and the like, and a method of adding a filler so as to protrude outward from the flat surface of the shape transfer film. The above-mentioned method may be used alone, or two or more kinds may be used in combination.
Examples of the above-described shape transfer film in which the uneven shape is formed by adding the filler include shape transfer films shown in fig. 1 and 2. The shape transfer film 1 shown in fig. 1 includes a substrate layer 2 and a resin layer 3 provided on one surface of the substrate layer 2, and the surface of the resin layer 3 includes the above-described uneven shape. The resin layer 3 contains a filler 4, and the above-described uneven shape is formed by the filler 4 protruding outward from the flat surface 3a of the resin layer 3, which is a film flat surface.
Examples of the substrate layer include a plastic substrate (particularly, a plastic film), a porous material such as paper, cloth, or nonwoven fabric, a net, a foamed sheet, and a metal foil. The substrate layer may be a single layer or a laminate of the same or different substrates. Further, a known and commonly used surface treatment such as a physical treatment such as corona discharge treatment or plasma treatment, or a chemical treatment such as undercoating treatment may be appropriately applied to the surface of the substrate layer.
Examples of the resin constituting the plastic substrate include polyolefin resins such as low density polyethylene, linear low density polyethylene, medium density polyethylene, high density polyethylene, ultra-low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homo-polypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylate (random, alternating) copolymer, ethylene-butene copolymer, and ethylene-hexene copolymer; a polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); a polycarbonate; a polyimide; polyether ether ketone; a polyetherimide; polyamides such as aromatic polyamides and wholly aromatic polyamides; polyphenylene sulfide; a fluorocarbon resin; polyvinyl chloride; polyvinylidene chloride; a cellulose resin; silicone, and the like. The resin may be used alone or in combination of two or more.
The resin forming the resin layer is not particularly limited, and examples thereof include a thermoplastic resin, a thermosetting resin, and a curable resin such as an active energy ray curable resin. In the present specification, the "curable resin" is a concept including both a resin that can be cured to form a resin (curable resin) and a resin that is formed by curing the curable resin. Among these, the resin is preferably a curable resin from the viewpoint of being excellent in peelability from a circuit pattern masking layer described later after curing, and is particularly preferably an active energy ray curable resin from the viewpoint of being hard to change in curing degree when the adhesive film for a printed wiring board is thermally pressure-bonded to the printed wiring board. The resin may be used alone or in combination of two or more.
Examples of the thermoplastic resin include polystyrene resins, vinyl acetate resins, polyester resins, polyolefin resins (e.g., polyethylene resins, polypropylene resin compositions, etc.), polyimide resins, and acrylic resins.
Examples of the thermosetting resin include phenol resins, epoxy resins, polyurethane resins, melamine resins, alkyd resins, and silicone resins.
Examples of the epoxy resin include a bisphenol epoxy resin, a spiro (spiro) epoxy resin, a naphthalene epoxy resin, a biphenyl epoxy resin, a terpene epoxy resin, a glycidyl ether epoxy resin, a glycidyl amine epoxy resin, and a (phenol) novolac epoxy resin.
Examples of the bisphenol-type epoxy resin include bisphenol a-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, tetrabromobisphenol a-type epoxy resin, and the like. Examples of the glycidyl ether type epoxy resin include tris (glycidyl ether oxyphenyl) methane and tetrakis (glycidyl ether oxyphenyl) ethane. Examples of the glycidyl amine type epoxy resin include tetraglycidyl diaminodiphenylmethane and the like. Examples of the (novolac) type epoxy resin include cresol (novolac) type epoxy resin, phenol (novolac) type epoxy resin, α -naphthol (novolac) type epoxy resin, and brominated phenol (novolac) type epoxy resin.
Examples of the active energy ray-curable resin include polymerizable resins having at least 2 radically reactive groups (e.g., (meth) acryloyl groups) in the molecule. Examples of the active energy rays include electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, and X rays.
Examples of the filler include organic particles and inorganic particles. Examples of the organic particles include acrylic resins such as polymethyl methacrylate, polyacrylonitrile resins, polyurethane resins, polyamides, and polyimides. Examples of the inorganic particles include calcium carbonate, calcium silicate, clay, china clay, talc, silica, glass, diatomaceous earth, mica powder, alumina, magnesium oxide, zinc oxide, barium sulfate, aluminum sulfate, calcium sulfate, and magnesium carbonate. The particles may be used alone or in combination of two or more.
The median diameter (D50) of the filler is not particularly limited, but is preferably 0.5 to 20 μm, more preferably 1 to 10 μm. When D50 is within the above range, the above concave-convex shape can be easily formed. The D50 represents a particle diameter at 50% of the integrated value in the particle size distribution obtained by the laser diffraction/scattering method.
The content of the filler in the resin layer is not particularly limited, and is preferably 20 to 70 parts by mass, and more preferably 30 to 60 parts by mass, based on 100 parts by mass of the resin forming the resin layer. When the content is within the above range, the uneven shape can be easily formed.
The thickness of the resin layer (thickness between flat surfaces of both surfaces) is not particularly limited, but is preferably 0.5 to 9 μm, and more preferably 1 to 7 μm. When the thickness is within the above range, the shape of the filler protruding from the flat surface can be set within an appropriate range due to the relationship with D50 of the filler, and the uneven shape can be easily formed.
The resin layer 3 can be formed on the substrate layer 2 by a known or usual method so as to include the above-described uneven shape, thereby producing the shape transfer film 1 shown in fig. 1. Specifically, for example, the resin layer can be produced by casting a composition containing a resin or a compound forming the resin layer, a filler, and a solvent as needed on one surface of the substrate layer, and then removing the solvent or curing the composition.
In the shape transfer film 1 shown in fig. 2, the surface of the substrate layer 2 has the above-described uneven shape. The substrate layer 2 contains a filler 4, and the above-described uneven shape is formed by the filler 4 protruding outward from the flat surface 2a of the substrate layer 2, which is a film flat surface.
A release treatment layer may be provided on the surface of the substrate layer having the uneven shape. Examples of the release-treated layer include layers formed by surface-treating with a release-treating agent such as silicon, a long-chain alkyl group, fluorine, or molybdenum sulfide. When the release treatment layer is included, the thickness and shape of the release treatment layer are appropriately set so that the uneven shape on the surface of the substrate layer does not disappear, that is, the shape transfer film includes the uneven shape.
Examples of the substrate layer containing the release-treated layer include those exemplified and described as the substrate layer containing the resin layer. Examples of the substrate layer without the release treatment layer include a low-adhesion substrate made of a fluoropolymer, a low-adhesion substrate made of a nonpolar polymer, and the like. Examples of the fluorine-containing polymer in the low-bondability substrate made of the fluorine-containing polymer include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, and the like. Examples of the nonpolar polymer include olefin resins (e.g., polyethylene, polypropylene, etc.). The surface of the substrate layer may be appropriately subjected to known and commonly used surface treatments such as physical treatments such as corona discharge treatment and plasma treatment, and chemical treatments such as undercoating treatment.
Examples of the filler include those exemplified and described above as the content of the resin layer.
The median diameter (D50) of the filler is not particularly limited, but is preferably 0.5 to 20 μm, more preferably 1 to 10 μm. When D50 is within the above range, the above concave-convex shape can be easily formed. The D50 indicates a particle size at 50% of the cumulative value in the particle size distribution obtained by the laser diffraction/scattering method.
The content of the filler in the substrate layer is not particularly limited, but is preferably 10 to 70 vol%, more preferably 20 to 60 vol%, and still more preferably 30 to 50 vol% with respect to 100 vol% of the total amount of the substrate layer. When the content ratio is within the above range, the above concave-convex shape can be easily formed.
The substrate layer 2 can be formed by a known or usual method so that at least one surface thereof has the above-described uneven shape, thereby producing the shape transfer film 1 shown in fig. 2. Specifically, for example, the filler can be kneaded with a resin composition forming a substrate layer and molded. Thereafter, a release treatment agent may be applied and cured as necessary to form a release treatment layer.
The layer (resin layer, substrate layer) containing the above-described uneven shape may contain other components than the above-described components within a range not to impair the effects of the present invention. Examples of the other components include a colorant, an antistatic agent, a stabilizer, an antioxidant, an ultraviolet absorber, and a fluorescent whitening agent. The other components may be used alone or in combination of two or more.
The thickness of the shape transfer film is not particularly limited, and is, for example, 10 to 200 μm, preferably 15 to 150 μm. When the thickness is 10 μm or more, the protective performance of the transfer object is more excellent. When the thickness is 200 μm or less, peeling is more likely to occur in use.
According to the shape transfer film, since the surface includes the specific uneven shape, it is possible to impart sufficient covering property to the transfer target by imparting a shape derived from the uneven shape to the transfer target, and it is possible to easily peel the transfer target when the transfer target is intentionally peeled. And is difficult to peel off when the shape transfer film is intentionally peeled off from the circuit pattern cover layer during transportation.
[ adhesive film for printed wiring board ]
A film for attachment to a printed wiring board according to an embodiment of the present invention includes the shape transfer film and a circuit pattern cover layer directly laminated on the shape transfer film. A shape derived from the uneven shape is imparted (transferred) to a surface of the circuit pattern-covering layer directly laminated on the surface of the shape transfer film including the uneven shape. Therefore, when the shape transfer film is intentionally peeled off, the shape transfer film can be easily peeled off from the circuit pattern masking layer, and the peeled circuit pattern masking layer has sufficient masking properties.
The printed wiring board attachment film is preferably formed by laminating an adhesive layer, the circuit pattern masking layer, and the shape transfer film in this order. The adhesive film for a printed wiring board may include a layer other than the adhesive layer, the circuit pattern masking layer, and the shape transfer film.
An embodiment of the above-described adhesive film for a printed wiring board is explained below. Fig. 3 is a schematic cross-sectional view of an embodiment of the above-described adhesive film for a printed wiring board.
The printed wiring board attachment film 5 shown in fig. 3 includes an adhesive layer 7, a circuit pattern cover layer 6, and a transfer film 1 having a shape shown in fig. 1. More specifically, the adhesive film for a printed wiring board 5 has a circuit pattern masking layer 6, which is a protective layer for protecting an adhesive layer 7, directly laminated on one surface of the adhesive layer 7. When the adhesive film 5 for a printed wiring board uses a conductive adhesive layer as the adhesive layer 7, the conductive adhesive layer functions as an electromagnetic wave shielding layer and exhibits electromagnetic wave shielding performance. At this time, the attachment film for a printed wiring board 5 can be used as an electromagnetic wave shielding film. In addition, when the adhesive layer 7 has no shielding performance or needs higher shielding performance, another electromagnetic wave shielding layer such as a metal layer may be additionally included between the circuit pattern covering layer and the adhesive layer. At this time, the circuit pattern masking layer and the adhesive layer are laminated in an interlayer manner.
The shape transfer film 1 is laminated on the surface of the circuit pattern masking layer 6 opposite to the adhesive layer 7, and the circuit pattern masking layer 6 is in contact with the resin layer 3. The surface of the circuit pattern cover layer 6 is directly laminated on the surface of the shape transfer film 1 including the above-described uneven shape, and thus a shape derived from the above-described uneven shape is imparted (transferred).
(Circuit Pattern covering layer)
The circuit pattern-covering layer is a layer for covering a circuit pattern in a printed wiring board so as to be difficult to visually recognize in a state where the printed wiring board-use adhesive film is adhered to the printed wiring board, and may also contribute to design. When the above adhesive layer for a printed wiring board is attached to a printed wiring board, a circuit pattern covering layerIsThe side of the adhesive layer is located on the printed circuit boardIs/are as followsThe opposite side. In the above-mentioned adhesive film for a printed wiring board, the circuit pattern-masking layer may be a single layer or a plurality of layers (a laminate of a plurality of circuit pattern-masking layers). And when other electromagnetic wave shielding layers are additionally included between the circuit pattern covering layer and the adhesive layer, the circuit pattern covering layer can protect the other electromagnetic wave shielding layers and the adhesive layer.
The circuit pattern cover layer may contain a metal or a resin as an adhesive component. Examples of the resin include those exemplified and described above as the resin contained in the resin layer. Examples of the metal include nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and an alloy containing 1 or more of the foregoing metals. The binder component may be used alone or in combination of two or more.
Among them, the binder component is preferably a resin. The resin is preferably a curable resin from the viewpoint of being able to change the adhesion to the shape transfer film before and after curing to adjust the ease of peeling, and is particularly preferably a thermosetting resin from the viewpoint of being able to easily reduce the adhesion to the shape transfer film by curing the adhesive film for a printed wiring board when the adhesive film for a printed wiring board is thermally press-bonded to the printed wiring board.
The content ratio of the binder component in the circuit pattern masking layer is not particularly limited, and is preferably 10 to 70 mass%, more preferably 20 to 60 mass%, and further preferably 30 to 50 mass% with respect to 100 mass% of the total amount of the circuit pattern masking layer.
The circuit pattern masking layer preferably contains a black colorant from the viewpoint of making the masking layer excellent in masking property. The black colorant may be a black pigment, a mixed pigment obtained by mixing a plurality of pigments in a subtractive color to form a black color, or the like. Examples of the Black pigment include carbon Black, Ketjen Black (Ketjen Black), perylene Black, titanium Black, iron Black, and aniline Black. From the viewpoint of dispersibility in the circuit pattern masking layer, the average primary particle diameter of the black pigment is preferably 20nm or more, more preferably 100nm or less. The average primary particle size of the black pigment can be determined from the average value of about 20 primary particles that can be observed in an image magnified by a Transmission Electron Microscope (TEM) at a magnification of about 5 to 100 ten thousand times. The mixed pigment can be used by mixing, for example, red, green, blue, yellow, violet, cyan, magenta and other pigments. The content of the black colorant in the circuit pattern masking layer is, for example, 0.5 to 50% by mass, preferably 1 to 40% by mass, based on 100% by mass of the total amount of the circuit pattern masking layer.
The circuit pattern-covering layer may contain other components than the above components within a range not to impair the effects of the present invention. Examples of the other components include a defoaming agent, a viscosity modifier, an antioxidant, a diluent, an anti-settling agent, a filler, a coloring agent, a leveling agent, a coupling agent, an ultraviolet absorber, a tackifying resin, a curing accelerator, a plasticizer, a flame retardant, an anti-blocking agent, and a curing agent. The other components may be used alone or in combination of two or more.
The 60 DEG gloss of the surface of the circuit pattern masking layer to which the shape transfer film is bonded is preferably 0.3 to 5.0, more preferably 0.4 to 3.0, and still more preferably 0.5 to 2.0. When the 60 ° gloss is 0.3 or more, the intentional peeling of the shape transfer film becomes easier. When the 60 ° gloss is 5.0 or less, the covering property is higher. The above 60 ° gloss can be measured by a method according to JIS Z8741. The 60 ° gloss is measured in a state where the shape transfer film is peeled off from the adhesive film for a printed wiring board.
The 85 ° gloss of the surface of the circuit pattern masking layer to which the shape transfer film is bonded is preferably 15 or less, and more preferably less than 15. When the 85 ° gloss is 15 or less, the covering property is higher. The above-mentioned 85 ° gloss can be measured by a method according to JIS Z8741. The 85 ° gloss is measured in a state where the shape transfer film is peeled off from the printed wiring board attachment film.
The circuit pattern cover layer preferably has a total light transmittance of 20% or less, more preferably 10% or less, and still more preferably 5% or less. When the total light transmittance is 20% or less, it becomes more difficult to visually recognize the circuit pattern when the adhesive film for a printed wiring board is adhered to the printed wiring board.
The thickness of the circuit pattern-covering layer is not particularly limited, and can be appropriately set as needed. The thickness of the circuit pattern masking layer is preferably 1 μm or more, more preferably 4 μm or more, from the viewpoints of realization of the masking property, easiness of formation, and securing of flexibility. The thickness of the circuit pattern-masking layer is preferably 20 μm or less, more preferably 10 μm or less, and still more preferably 5 μm or less.
(adhesive layer)
The adhesive layer has bondability for bonding the adhesive film for a printed wiring board to a printed wiring board. The adhesive layer may be a single layer or a plurality of layers.
The adhesive layer preferably contains a binder component constituting the resin region in the adhesive layer. The binder component may be the binder component exemplified and described as the resin contained in the resin layer. The binder component may be used alone or in combination of two or more.
When the binder component includes a thermosetting resin, the component constituting the binder component may include a curing agent for promoting a thermosetting reaction. The curing agent can be appropriately selected according to the kind of the thermosetting resin. The curing agent may be used alone or in combination of two or more.
The adhesive layer may be a conductive adhesive layer. The conductive adhesive layer can exhibit electromagnetic wave shielding properties. When the adhesive layer is a conductive adhesive layer, it preferably further contains conductive particles.
Examples of the conductive particles include metal particles, metal-coated resin particles, metal fibers, and carbon-based fillers. The conductive particles may be used alone or in combination of two or more.
Examples of the metal particles, the metal constituting the coating portion of the metal-coated resin particles, and the metal constituting the metal fibers include gold, silver, copper, nickel, and zinc. The metal may be used alone or in combination of two or more.
Specifically, examples of the metal particles include copper particles, silver particles, nickel particles, silver-coated copper particles, gold-coated copper particles, silver-coated nickel particles, gold-coated nickel particles, and silver-coated alloy particles. Examples of the silver-coated alloy particles include silver-coated copper alloy particles in which copper-containing alloy particles (for example, copper alloy particles made of an alloy of copper, nickel, and zinc) are coated with silver. The metal particles can be produced by an electrolytic method, an atomization method, a reduction method, or the like.
Among them, the metal particles are preferably silver particles, silver-coated copper particles, or silver-coated copper alloy particles. Silver-coated copper particles and silver-coated copper alloy particles are particularly preferable from the viewpoint of excellent conductivity, suppression of oxidation and coagulation of metal particles, and reduction in cost of metal particles.
Examples of the shape of the conductive particles include spherical, flaky (scaly), dendritic, fibrous, amorphous (polyhedral), and the like.
The median diameter (D50) of the conductive particles is preferably 1 to 50 μm, more preferably 3 to 40 μm. When the median diameter is 1 μm or more, the dispersibility of the conductive particles is good, coagulation is suppressed, and oxidation is difficult. When the average particle diameter is 50 μm or less, the conductivity is good. The D50 indicates a particle size at 50% of the cumulative value in the particle size distribution obtained by the laser diffraction/scattering method.
The conductive adhesive layer may be a layer having isotropic conductivity or anisotropic conductivity, as required.
When the adhesive layer is a conductive adhesive layer, the content of the binder component in the adhesive layer is not particularly limited, but is preferably 5 to 60 mass%, more preferably 10 to 50 mass%, and still more preferably 20 to 40 mass% with respect to 100 mass% of the total amount of the adhesive layer. When the content is 5% by mass or more, the electromagnetic wave shielding performance is good. When the content is 60% by mass or less, the adhesiveness to a printed wiring board is more excellent.
When the adhesive layer is a conductive adhesive layer, the content of the conductive particles in the adhesive layer is not particularly limited, but is preferably 2 to 95% by mass, more preferably 5 to 80% by mass, and still more preferably 10 to 70% by mass, relative to 100% by mass of the total amount of the adhesive layer. When the content is 2% by mass or more, the conductivity is further improved. If the content is 95% by mass or less, the binder component can be sufficiently contained, and the adhesiveness to the printed wiring board is further improved.
The adhesive layer may contain other components than the above components within a range not to impair the effects of the present invention. The other components include those contained in a known or commonly used adhesive layer. Examples of the other components include a defoaming agent, a viscosity modifier, an antioxidant, a diluent, an anti-settling agent, a filler, a colorant, a leveling agent, a coupling agent, an ultraviolet absorber, a tackifying resin, a curing accelerator, a plasticizer, a flame retardant, an anti-blocking agent, and the like. The other components may be used alone or in combination of two or more.
The thickness of the adhesive layer is preferably 3 to 20 μm, and more preferably 5 to 15 μm. When the thickness is 3 μm or more, the adhesiveness to the printed wiring board is further improved.
The printed wiring board attachment film may include the shape transfer film, the circuit pattern masking layer, and a layer other than the adhesive layer. Examples of the other layer include an electromagnetic wave shielding layer other than the conductive adhesive layer, such as a metal layer provided between the circuit pattern cover layer and the adhesive layer. In the case where the other electromagnetic wave shielding layer is contained, the other layer may be an anchor coat layer provided between the circuit pattern-covering layer and the other electromagnetic wave shielding layer.
Examples of the metal constituting the metal layer include gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, and alloys of the metals. The metal layer is preferably a metal plate or a metal foil. In other words, the metal layer is preferably a copper plate (copper foil) or a silver plate (silver foil).
Examples of the material for forming the anchor coat layer include polyurethane resin, acrylic resin, core-shell type composite resin having a shell of polyurethane resin and a core of acrylic resin, epoxy resin, polyimide resin, polyamide resin, melamine resin, phenol resin, urea formaldehyde resin, blocked isocyanate obtained by reacting a blocking agent such as phenol with polyisocyanate, polyvinyl alcohol, and polyvinyl pyrrolidone. The above-mentioned material may be used alone or in combination of two or more.
In the above-mentioned sticking film for a printed wiring board, the peeling force (1 st peeling force) of the shape transfer film with respect to the circuit pattern masking layer is preferably 0.1N or more, more preferably 0.2N or more, and further preferably 0.3N or more. When the 1 st peeling force is 0.1N or more, peeling is difficult during transportation or the like, and unintentional peeling can be suppressed. The 1 st peeling force can be measured by the method described in examples.
The peeling force (the 2 nd peeling force) of the shape transfer film from the circuit pattern masking layer in a state in which the adhesive layer surface of the above-mentioned sticking film for a printed wiring board is stuck to the printed wiring board and is stuck by heating and pressing is preferably 3.0N or less, more preferably 2.0N or less, and further preferably 1.5 or less. When the 2 nd peeling force is 3.0N or less, the shape transfer film can be easily peeled off when the shape transfer film is intentionally peeled off in use. The 2 nd peeling force can be measured by the method described in examples.
The ratio of the 2 nd peel force to the 1 st peel force [ 2 nd peel force/1 st peel force ] is preferably 0.5 to 1.5, more preferably 0.6 to 1.3, and further preferably 0.7 to 1.2. When the ratio is within the above range, unintentional separation can be further suppressed, and separation can be performed more easily when peeling is intended during use.
The above-mentioned adhesive film for a printed wiring board is particularly preferably used for a flexible printed wiring board (FPC). The above-mentioned adhesive film for a printed wiring board can be suitably used as an adhesive film for a flexible printed wiring board.
(method of manufacturing adhesive film for printed Wiring Board)
A method for manufacturing the above-described adhesive film for a printed wiring board will be described. In the step of producing the printed wiring board adhesive film 5 shown in fig. 3, first, the adhesive layer 7 and the circuit pattern-masking layer 6 are separately produced. Thereafter, the separately prepared adhesive layer 7 and circuit pattern cover layer 6 are bonded (lamination method).
The adhesive layer 7 can be formed, for example, as follows: the adhesive composition for forming the adhesive layer 7 is applied (coated) on a temporary substrate such as a release film or a substrate, and is subjected to solvent removal and/or partial curing as necessary.
The adhesive composition may contain a solvent (solvent) in addition to the components contained in the adhesive layer. Examples of the solvent include toluene, acetone, methyl ethyl ketone, methanol, ethanol, propanol, and dimethylformamide. The solid content concentration of the adhesive composition is appropriately set in accordance with the thickness of the adhesive layer to be formed, and the like.
The adhesive composition can be applied by a known coating method. For example, a gravure roll coater, a reverse roll coater, an oil feed roll coater, a lip coater dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, a direct coater, a slit coater, or the like can be used.
On the other hand, when a resin is used as the binder component, the circuit pattern masking layer 6 can be formed by, for example, applying (coating) a resin composition for forming the circuit pattern masking layer 6 on the surface of the shape transfer film on which the uneven shape is formed, and curing by removing a solvent and/or partially curing as necessary. This makes it possible to impart a shape derived from the uneven surface of the shape transfer film 1 to the surface of the circuit pattern masking layer 6.
The resin composition may contain a solvent (solvent) in addition to the components contained in the circuit pattern masking layer. Examples of the solvent include the solvents exemplified above as the adhesive composition which can contain a solvent. The solid content concentration of the resin composition is appropriately set in accordance with the thickness of the circuit pattern masking layer to be formed, and the like.
The resin composition can be applied by a known coating method. Examples of the coating machine used for coating the adhesive composition include those described above.
Next, the exposed surface of the adhesive layer 7 and the exposed surface of the circuit pattern masking layer 6, which are prepared separately, are bonded to each other, thereby preparing the adhesive film 5 for a printed wiring board.
As another embodiment other than the above lamination method, the adhesive film for a printed wiring board may be produced by a method of sequentially laminating the respective layers (direct coating method). For example, the printed wiring board attachment film 5 shown in fig. 3 can be produced as follows: the resin composition for forming the circuit pattern covering layer 6 is applied (coated) on the surface of the adhesive layer 7, and the resin composition is cured by removing the solvent and/or partially curing as necessary to form the circuit pattern covering layer 6. In this case, the surface of the uneven shape of the shape transfer film 1 is laminated on the layer of the resin composition before the complete curing, and then the surface is completely cured, whereby the surface of the circuit pattern masking layer 6 to be formed can be given a shape derived from the uneven shape. Or can be made as follows: a circuit pattern cover layer 6 is formed on the uneven surface of the shape transfer film 1, an adhesive composition for forming an adhesive layer 7 is applied (coated) on the surface of the circuit pattern cover layer 6, and the adhesive layer 7 is formed by removing a solvent and/or partially curing as necessary.
Examples
The present invention will be described in further detail below with reference to examples, but the present invention is not limited to these examples.
Example 1
(production of shape transfer film)
A resin composition comprising 30 parts by mass of silica particles (D50: 6.5 μm), 100 parts by mass of a melamine-based resin, and toluene was prepared, and the resin composition was applied to the surface of a polyethylene terephthalate film having a thickness of 25 μm using a wire bar, and the solvent was removed by heating to prepare a shape transfer film comprising a resin layer having a thickness of 5 μm on the surface of a substrate layer.
(preparation of adhesive film)
A resin composition was prepared by adding 100 parts by mass of a bisphenol A type epoxy resin (trade name "JeR 1256", manufactured by Mitsubishi chemical corporation), 0.1 part by mass of a curing agent (trade name "ST 14", manufactured by Mitsubishi chemical corporation), and 15 parts by mass of carbon particles (trade name "TOKABLACK # 8300/F", manufactured by Toshii carbon corporation) as a black-based coloring agent to toluene so that the solid content became 20% by mass. The resin composition was applied to the surface of the resin layer of the shape transfer film using a wire bar, and cured by heating, thereby forming a circuit pattern masking layer having a thickness of 5 μm on the surface of the shape transfer film.
Then, 100 parts by mass of a bisphenol a type epoxy resin (trade name "jER 1256", manufactured by mitsubishi chemical corporation) and 0.1 part by mass of a curing agent (trade name "ST 14", manufactured by mitsubishi chemical corporation) were mixed with toluene so that the amount of solid components became 20% by mass, and the mixture was stirred and mixed to prepare an adhesive layer composition. The adhesive layer composition was applied to a PET film (hereinafter, referred to as a support film) whose surface was subjected to release treatment using a wire bar, and cured by heating, thereby forming an adhesive layer having a thickness of 5 μm on the surface of the support film.
Next, the circuit pattern masking layer formed on the surface of the shape transfer film and the adhesive layer formed on the surface of the support film were bonded to each other, and heated and pressed at a pressure of 5MPa using a pair of metal rolls heated to 100 ℃. The obtained adhesive film has a total light transmittance of 5% or less.
(preparation of evaluation substrate)
The adhesive film obtained by the above-described steps was laminated on a printed wiring board, and then subjected to a press at a temperature of: 170 ℃ and pressure: the substrates were joined by evacuation under 2MPa for 60 seconds and then heating and pressurizing for 180 seconds, to prepare evaluation substrates. The printed wiring board is a printed wiring board having a circuit pattern formed on a base layer made of a polyimide film. The circuit pattern was formed of a copper foil having a line width of 0.1mm and a height of 12 μm. An adhesive layer having a thickness of 25 μm and a cover film (insulating film) made of a polyimide film having a thickness of 12.5 μm were provided on the base layer, and the circuit pattern was covered therewith.
Example 2
A shape transfer film, a sticking film, and an evaluation substrate were produced in the same manner as in example 1, except that a resin layer having a thickness of 7 μm was formed on the surface of the substrate layer.
Example 3
A shape transfer film, a sticking film, and an evaluation substrate were produced in the same manner as in example 1, except that silica particles having a D50 of 4.5 μm were used.
Example 4
A shape transfer film, a sticking film, and an evaluation substrate were produced in the same manner as in example 1, except that silica particles having a D50 of 3.8 μm were used.
Comparative example 1
A shape transfer film, a sticking film, and a substrate for evaluation were produced in the same manner as in example 1, except that silica particles having a D50 of 9 μm were used.
Comparative example 2
A shape transfer film, a sticking film, and a substrate for evaluation were produced in the same manner as in example 1, except that silica particles having a D50 of 10 μm were used.
Comparative example 3
A shape transfer film, a sticking film, and a base material for evaluation were produced in the same manner as in example 1, except that silica particles having a D50 of 3.5 μm were used and a resin layer having a thickness of 3 μm was formed on the surface of the substrate layer.
Comparative example 4
A shape transfer film, a sticking film, and an evaluation substrate were produced in the same manner as in comparative example 3, except that a resin layer having a thickness of 4 μm was formed on the surface of the substrate layer.
Comparative example 5
As the shape transfer film, a film having an uneven shape having the properties shown in table 1 was used. Next, a film for attachment and a base material for evaluation were produced in the same manner as in example 1, except that the shape transfer film was used.
Comparative example 6
A film having an uneven shape having the properties shown in table 1, which was obtained by kneading a filler into a polyethylene terephthalate resin and molding, was used as a shape transfer film. Next, a film for attachment and a base material for evaluation were produced in the same manner as in example 1, except that the shape transfer film was used.
Comparative example 7
A film containing irregularities having the properties shown in table 1, which was obtained by kneading a filler into a polyethylene terephthalate resin and molding the mixture, was used as a shape transfer film. Next, a film for attachment and a base material for evaluation were produced in the same manner as in example 1, except that the shape transfer film was used.
Comparative example 8
A film obtained by sandblasting the surface of a polyethylene terephthalate film and having an uneven shape with the properties shown in table 1 was used as the shape transfer film. Next, a film for attachment and a base material for evaluation were produced in the same manner as in example 1, except that the shape transfer film was used.
(evaluation)
The transfer films, the adhesive films, and the evaluation substrates having the respective shapes obtained in examples and comparative examples were evaluated as follows. The evaluation results are set forth in the table.
(1) Surface shape
The arithmetic mean of the spread area ratio Sdr of the interface, the level difference Sk in the center portion, the arithmetic mean height Sa, the root mean square height Sq, and the root mean square inclination Sdq was measured for the uneven shape formed at any 5 positions on the surface of the resin layer of the shape transfer film according to ISO25178 using a confocal microscope (trade name "OPTELICS HYBRID", manufactured by Lasertec, 100-fold objective lens). The cutoff wavelength of the S filter is 0.0025mm, and the cutoff wavelength of the L filter is 0.8 mm.
(2) Degree of gloss
Using Gardner seed micro gloss meters (Gardner seed micro-gloss meters, manufactured by BYK corporation), the 60 ° gloss and 85 ° gloss of the uneven shape formed on the surface of the resin layer of the shape transfer film, and the 60 ° gloss and 85 ° gloss of the area to which the uneven shape was transferred on the surface of the circuit pattern-covering layer in the evaluation base material were measured. In addition, the glossiness of the surface of the circuit pattern-covered layer was measured on the surface of the evaluation substrate from which the shape transfer film was peeled.
(3) Peeling force before heating and pressing (1 st peeling force)
The peel force when the shape transfer film was peeled from the attached films (in a state before heating and pressing) produced in the above examples and comparative examples was measured as the 1 st peel force. Specifically, the peeling force (No. 1 peeling force) when the shape transfer film was peeled from the adhesive film was evaluated by fixing the adhesive film to a polyimide film having a thickness of 100 μm and using a strength tester (trade name "PFT 50S", manufactured by Parlmek corporation) under conditions of a sample width of 10mm, a peeling angle of 170 ℃ and a peeling speed of 1000 mm/min.
(4) Peeling force after heating and pressing (No. 2 peeling force)
In the production of the evaluation substrate, the peel force when the shape transfer film was peeled from the heated and pressurized state was measured as the 2 nd peel force. Specifically, the peel force (2 nd peel force) when the shape transfer film was peeled from the evaluation substrate was evaluated under the conditions of a sample width of 10mm, a peel angle of 170 ° and a peel speed of 1000 mm/min using a strength tester (trade name "PFT 50S", manufactured by parmeik corporation).
(5) Hiding property
After the evaluation substrate was placed on a flat table and the shape transfer film was peeled off, whether or not the circuit pattern could be visually recognized from the circuit pattern-covered layer side was evaluated under an environment where the illuminance of the surface of the shield circuit board was 500 lux and at an angle of 30cm and 45 ° from the height of the evaluation substrate. The circuit pattern was evaluated as good in hiding property when it could not be visually recognized (o), and as poor in hiding property when it could be visually recognized (x).
[ Table 1]
The shape transfer film of the embodiment is excellent in the masking property of the circuit pattern masking layer formed by using the shape transfer film, and is also excellent in the peelability from the circuit pattern masking layer when the peeling force (2 nd peeling force) after heating and pressing is as low as 2.0N or less. The peeling force before heating and pressing (1 st peeling force) was 0.1N or more, indicating that the shape transfer film was difficult to peel off unintentionally. On the other hand, when the area of the spread interface on the surface of the shape transfer film is larger than the sd or the level difference Sk in the center portion (comparative examples 1 and 2), the 2 nd peeling force exceeds 2.0N, and the peelability from the circuit pattern masking layer is poor. In addition, when the area of the spread interface on the surface of the shape transfer film is smaller than the sd or the level difference Sk in the center portion (comparative examples 3 to 8), the masking property of the circuit pattern masking layer is poor. In comparative example 8, the 2 nd peeling force exceeded 2.0N, and the peeling property from the circuit pattern masking layer was also poor.
Description of the numbering
1 shape transfer film
2 substrate layer
3 resin layer
4 stuffing
5 pasting film for printed circuit board
6 circuit pattern covering layer
7 adhesive layer
2a, 3a shape transfer film flat surface
Claims (12)
1. A shape transfer film characterized in that:
at least one surface of the shape transfer film contains an uneven shape having an interface development area ratio Sdr of 1500 to 7000%, and is used for transferring a shape derived from the uneven shape to a transfer object.
2. The shape transfer film according to claim 1, wherein:
the level difference Sk at the center of the concave-convex shape is 2.0-7.0 μm.
3. A shape transfer film characterized in that:
at least one surface of the shape transfer film includes an uneven shape having a level difference Sk of 2.0 to 7.0 μm in the center portion, and is used for transferring a shape derived from the uneven shape to a transfer target.
4. The shape transfer film according to any one of claims 1 to 3, wherein:
the arithmetic average height Sa in the concavo-convex shape is 1.0-2.0 μm.
5. The shape transfer film according to any one of claims 1 to 4, wherein:
the root mean square height Sq in the concave-convex shape is 1.0-2.8 μm.
6. The shape transfer film according to any one of claims 1 to 5, wherein:
the root-mean-square inclination Sdq in the concave-convex shape is 7-15.
7. The shape transfer film according to any one of claims 1 to 6, wherein:
the ratio [ Sdr/Sdq ] of the interface spread area ratio Sdr to the root-mean-square inclination Sdq in the concave-convex shape is 200 to 500.
8. The shape transfer film according to any one of claims 1 to 7, wherein:
the shape transfer film includes a substrate layer and a resin layer provided on one surface of the substrate layer,
the resin layer side surface includes the concave-convex shape.
9. The shape transfer film according to any one of claims 1 to 8, wherein:
the shape transfer film contains a filler, and the uneven shape is formed by the filler protruding outward from the film flat surface.
10. The utility model provides a printed wiring board is with pasting and attaching membrane which characterized in that:
the decal film for a printed wiring board comprises the shape transfer film according to any one of claims 1 to 9 and a circuit pattern masking layer directly laminated on the shape transfer film.
11. The attachment film for a printed wiring board according to claim 10, characterized in that:
the adhesive layer, the circuit pattern masking layer, and the shape transfer film are laminated in this order.
12. The attachment film for a printed wiring board according to claim 11, wherein:
the 85 ° glossiness of the shape transfer film side surface of the circuit pattern masking layer is 15 or less.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-001942 | 2020-01-09 | ||
| JP2020001942 | 2020-01-09 | ||
| PCT/JP2021/000419 WO2021141098A1 (en) | 2020-01-09 | 2021-01-08 | Shape transfer film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114902819A true CN114902819A (en) | 2022-08-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180007796.1A Pending CN114902819A (en) | 2020-01-09 | 2021-01-08 | Shape transfer film |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7410182B2 (en) |
| KR (1) | KR20220124685A (en) |
| CN (1) | CN114902819A (en) |
| TW (1) | TWI844723B (en) |
| WO (1) | WO2021141098A1 (en) |
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| KR20240134398A (en) * | 2022-01-31 | 2024-09-09 | 다이요 홀딩스 가부시키가이샤 | Dry film, cured product, interlayer insulating layer and wiring board made of said cured product |
| US20230256718A1 (en) * | 2022-02-11 | 2023-08-17 | Chang Chun Petrochemical Co., Ltd. | Polymer film and uses of the same |
| US20230256719A1 (en) * | 2022-02-11 | 2023-08-17 | Chang Chun Petrochemical Co., Ltd. | Polymer film and uses of the same |
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| JP2017071107A (en) * | 2015-10-06 | 2017-04-13 | 帝人フィルムソリューション株式会社 | Biaxially oriented polyester film having matte layer |
| CN107073916A (en) * | 2014-11-19 | 2017-08-18 | 帝人薄膜解决有限公司 | Double axial orientated polyester film |
| KR20190114890A (en) * | 2018-03-30 | 2019-10-10 | 타츠타 전선 주식회사 | Electromagnetic wave shield film, shield printed circuit board and method for manufacturing shield printed circuit |
| CN114650718A (en) * | 2021-02-09 | 2022-06-21 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6863908B2 (en) | 2018-01-12 | 2021-04-21 | タツタ電線株式会社 | Electromagnetic wave shield film |
| CN112136368B (en) | 2018-07-06 | 2024-05-28 | 拓自达电线株式会社 | Adhesive film for printed wiring substrate and shielding wiring substrate |
-
2020
- 2020-09-01 TW TW109129894A patent/TWI844723B/en active
-
2021
- 2021-01-08 CN CN202180007796.1A patent/CN114902819A/en active Pending
- 2021-01-08 WO PCT/JP2021/000419 patent/WO2021141098A1/en active Application Filing
- 2021-01-08 JP JP2021570095A patent/JP7410182B2/en active Active
- 2021-01-08 KR KR1020227019748A patent/KR20220124685A/en not_active Application Discontinuation
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005104638A (en) * | 2003-09-30 | 2005-04-21 | Daifuku Logistic Technology:Kk | Automatic storage and retrieval system, and method for operating the same |
| JP2010045231A (en) * | 2008-08-14 | 2010-02-25 | Nippon Steel Chem Co Ltd | Method of manufacturing circuit board |
| WO2014077406A1 (en) * | 2012-11-19 | 2014-05-22 | タツタ電線株式会社 | Multilayer film and shielded printed wiring board |
| CN104797420A (en) * | 2012-11-19 | 2015-07-22 | 大自达电线股份有限公司 | Multilayer film and shielded printed wiring board |
| JP2015185659A (en) * | 2014-03-24 | 2015-10-22 | 帝人デュポンフィルム株式会社 | Polyester film for transferring electromagnetic wave shield film |
| JP2016096217A (en) * | 2014-11-13 | 2016-05-26 | 旭化成イーマテリアルズ株式会社 | Dry resist layer transcription film roll |
| CN107073916A (en) * | 2014-11-19 | 2017-08-18 | 帝人薄膜解决有限公司 | Double axial orientated polyester film |
| JP2017071107A (en) * | 2015-10-06 | 2017-04-13 | 帝人フィルムソリューション株式会社 | Biaxially oriented polyester film having matte layer |
| KR20190114890A (en) * | 2018-03-30 | 2019-10-10 | 타츠타 전선 주식회사 | Electromagnetic wave shield film, shield printed circuit board and method for manufacturing shield printed circuit |
| CN114650718A (en) * | 2021-02-09 | 2022-06-21 | 广州方邦电子股份有限公司 | Electromagnetic shielding film and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021141098A1 (en) | 2021-07-15 |
| TW202130500A (en) | 2021-08-16 |
| JP7410182B2 (en) | 2024-01-09 |
| KR20220124685A (en) | 2022-09-14 |
| TWI844723B (en) | 2024-06-11 |
| WO2021141098A1 (en) | 2021-07-15 |
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