KR20220124685A - shape transfer film - Google Patents

Abstract

A shape transfer film having a concave-convex shape, wherein, by transferring the shape derived from the concave-convex shape to the transfer object, sufficient hiding properties can be imparted to the transfer object, and can be easily peeled off when intentionally peeled from the transfer object A transfer film is provided. The shape transfer film 1 has, on at least one surface, a concave-convex shape having an interface development area ratio Sdr of 1500 to 7000% and/or a level difference Sk of a core portion of 2.0 to 7.0 µm, and a shape derived from the concave-convex shape. It is to be transcribed on a transfer object. The shape transfer film 1 includes, for example, a base layer 2 and a resin layer 3 formed on one surface of the base layer 2 . Further, the shape transfer film 1 includes, for example, a filler 4, and the concave-convex shape is formed by the filler 4 protruding outward from the film flat surface 3a.

Description

shape transfer film

The present disclosure relates to a shape transfer film. More specifically, the present disclosure relates to a shape transfer film for transferring a shape derived from the concave-convex shape of the shape transfer film to a transfer object.

BACKGROUND ART Printed wiring boards are widely used in electronic devices such as mobile phones, video cameras, and notebook computers to incorporate circuits in devices. Moreover, it is also used for connection of a movable part like a printer head, and a control part. In these electronic devices, electromagnetic wave shielding measures are essential, and also in the printed wiring board used within an apparatus, the shielded printed wiring board which implemented electromagnetic wave shielding measures is used.

An electromagnetic wave shielding film is used for a shielding printed wiring board. For example, an electromagnetic wave shielding film used by being attached to a printed wiring board has a conductive adhesive layer and a protective layer for protecting the conductive adhesive layer and a shielding layer such as a metal layer formed as necessary.

In recent years, in shielded printed wiring boards, the protective layer serving as the outermost layer of the electromagnetic wave shielding film laminated on the printed wiring board is required to show an appearance with low surface gloss for the purpose of hiding circuit patterns. . As a protective layer with low surface glossiness, the protective layer which has an uneven|corrugated shape on the surface is mentioned. Such a protective layer is formed by, for example, casting a composition forming a protective layer on the uneven surface of a transfer film (shape transfer film) having an uneven shape on the surface, and then solidifying to form a protective layer. , it can be produced by imparting (transferring) a shape derived from the uneven shape of the shape transfer film to the surface of the protective layer and deglossing.

As such a shape transfer film, the thing disclosed in patent document 1 is known, for example.

Japanese Laid-Open Patent Publication No. 2017-71107

However, in a conventional shape transfer film with an uneven shape for the purpose of imparting hiding properties to the protective layer, the anchor effect derived from the uneven shape acts in the state in which the shape transfer film is laminated with the protective layer. When peeling from a protective layer, it was difficult to peel, or even when the shape transfer film could be peeled, there existed a problem that a protective layer was accompanied and peeled. On the other hand, if the concave-convex shape is made shallow, the anchor effect is weakened and the shape transfer film can be easily peeled off from the state in which it is adhered to the protective layer. cannot be given

The present invention has been made in view of the above problems, and an object of the present invention is a shape transfer film having an uneven shape, and by transferring the shape derived from the uneven shape to a transfer object, sufficient hiding properties can be imparted to the transfer object, Further, it is to provide a shape transfer film that can be easily peeled off when intentionally peeled from a transfer object.

As a result of intensive studies to achieve the above object, the present inventors have found that, according to a shape transfer film having a specific concave-convex shape on the surface, sufficient hiding property is imparted to the transfer object by transferring the shape derived from the concave-convex shape onto the transfer object. In addition, when peeling intentionally from a transfer object, it discovered that it could peel easily. The present invention has been completed based on these findings.

The present disclosure provides a shape transfer film for transferring, on at least one surface, a shape derived from the uneven shape to a transfer object, having an uneven shape with an interface development area ratio Sdr of 1500 to 7000%.

It is preferable that the level difference Sk of the core part in the said uneven|corrugated shape is 2.0-7.0 micrometers.

Further, the present disclosure provides a shape transfer film for transferring, on at least one surface, a shape derived from the uneven shape to a transfer object, having an uneven shape in which the level difference Sk of the core part is 2.0 to 7.0 µm.

It is preferable that the arithmetic mean height Sa in the said uneven|corrugated shape is 1.0-2.0 micrometers.

It is preferable that the root mean square height Sq in the said uneven|corrugated shape is 1.0-2.8 micrometers.

It is preferable that root mean square inclination Sdq in the said uneven|corrugated shape is 7-15.

In the concave-convex shape, it is preferable that the ratio [Sdr/Sdq] of the developed area ratio Sdr of the interface to the root mean square inclination Sdq is 200 to 500.

It is preferable that the said shape transfer film is equipped with a base material layer and the resin layer formed in one surface of the said base material layer, and it is preferable that the said resin layer side surface has the said uneven|corrugated shape.

It is preferable that the said shape transfer film contains a filler, and the said uneven|corrugated shape is formed by the said filler protruding outward from the flat surface of a film.

Further, the present disclosure provides a affixed film for a printed wiring board including the shape transfer film and a circuit pattern hiding layer directly laminated with the shape transfer film.

As for the said affixing film for printed wiring boards, it is preferable that the said circuit pattern hiding layer, and the said shape transfer film are laminated|stacked in this order.

It is preferable that the 85 degree glossiness of the surface of the said shape transfer film side of the said circuit pattern hiding layer is 15 or less.

According to the shape transfer film of the present disclosure, by having the above-described specific concave-convex shape on the surface, it is possible to impart a shape derived from the concave-convex shape to the transfer object, thereby providing sufficient hiding property to the transfer object, and furthermore, the transfer object It can be easily peeled off when intentionally peeled from it. In addition, it is difficult to peel in situations other than when intentionally peeling a shape transfer film from a transfer object, such as during transportation.

BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic diagram which shows one Embodiment of the shape transfer film of this indication.
[ Fig. 2] Fig. 2 is a schematic cross-sectional view showing another embodiment of the shape transfer film of the present disclosure.
It is a cross-sectional schematic diagram which shows one Embodiment of the affixed film for printed wiring boards using the shape transfer film shown in FIG.

[Shape Transfer Film]

A shape transfer film according to an embodiment of the present disclosure has an uneven shape on at least one surface, and is used to impart (transfer) a shape derived from the uneven shape to a transfer object. In particular, the shape transfer film provides a shape derived from the concave-convex shape to the outermost layer (for example, a circuit pattern hiding layer described later) in a film for affixing to a printed wiring board (a affixed film for a printed wiring board) ( It is preferable that it is for transcription).

In the said uneven shape which the said shape transfer film has, it is preferable that the developed area ratio Sdr of an interface is 1500 to 7000 %, More preferably, it is 2000 to 6500 %, More preferably, it is 2500 to 6000 %. The developed area ratio Sdr of the interface is compliant with ISO25178, and is an index indicating how much the developed area (surface area) of the positive region increases with respect to the area of the positive region. The Sdr of a perfectly flat surface is 0%. When the developed area ratio Sdr of the interface is 1500% or more, sufficient hiding properties can be imparted to the transfer object to which the shape derived from the concave-convex shape is imparted. If the developed area ratio Sdr of the interface is 7000% or less, it becomes easy to intentionally peel the shape transfer film from the transfer object.

The said uneven shape WHEREIN: It is preferable that the level difference Sk of a core part is 2.0-7.0 micrometers, More preferably, it is 2.3-6.0 micrometers, More preferably, it is 2.5-5.0 micrometers. The level difference Sk of the core part conforms to ISO25178, and is a value obtained by subtracting the minimum height from the maximum height of the core part in the concave-convex shape. The core portion is a region sandwiched between the height of 0% and 100% of the load area ratio of an equivalent straight line. When the level difference Sk of the said core part is 2.0 micrometers or more, the height difference of a core part is large, and sufficient hiding property can be provided to the transfer object to which the shape derived from the said uneven|corrugated shape was provided. When the level difference Sk of the core portion is 7.0 µm or less, it becomes easy to intentionally peel the shape transfer film from the transfer object.

The said uneven shape WHEREIN: It is preferable that arithmetic mean height Sa is 1.0-2.0 micrometers, More preferably, it is 1.0-1.8 micrometers, More preferably, it is 1.0-1.6 micrometers. The said arithmetic mean height Sa is based on ISO25178, and shows the average of the absolute value of the height difference of each point with respect to the average surface of the surface. When the said arithmetic mean height Sa is 1.0 micrometer or more, further sufficient hiding property can be provided to the transfer object to which the shape derived from the said uneven|corrugated shape was provided. If the arithmetic mean height Sa is 2.0 µm or less, it becomes even easier to intentionally peel the shape transfer film from the transfer object.

The said uneven shape WHEREIN: It is preferable that root mean square height Sq is 1.0-2.8 micrometers, More preferably, it is 1.1-2.5 micrometers, More preferably, it is 1.3-2.0 micrometers. The said root mean square height Sq is based on ISO25178, and is a parameter corresponding to the standard deviation of the distance from an average plane. If the said root mean square height Sq is 1.0 micrometer or more, further sufficient hiding property can be provided to the transcription|transfer target to which the shape derived from the said uneven|corrugated shape was provided. If the said root mean square height Sq is 2.8 micrometers or less, there are few unevenness|variation in height in an uneven|corrugated shape, and it becomes further easier to intentionally peel a shape transfer film from a transfer object.

The said uneven shape WHEREIN: It is preferable that root mean square inclination Sdq is 7-15, More preferably, it is 8-14, More preferably, it is 9-13.5. The said root mean square inclination Sdq conforms to ISO25178, and is a parameter computed by the root mean square of inclinations at all points in a positive area|region. The Sdq of a perfectly flat surface is zero. If the said root mean square inclination Sdq is 7 or more, further sufficient hiding property can be provided to the transcription|transfer target to which the shape derived from the said uneven|corrugated shape was provided. When the root mean square inclination Sdq is 15 or less, there is little unevenness in height in the concavo-convex shape, and it becomes much easier to intentionally peel the shape transfer film from the transfer object.

In the concave-convex shape, the ratio [Sdr/Sdq] of the developed area ratio Sdr [%] of the interface to the root mean square inclination Sdq is preferably 200 to 500, more preferably 250 to 480, still more preferably 300 -450. If the ratio is 200 or more, it is estimated that the surface area becomes large (that is, the unevenness becomes severe), and sufficient hiding properties can be imparted by the transfer object to which the shape derived from the uneven shape is imparted. When the ratio is 500 or less, the inclination of the unevenness is suppressed and the surface area (that is, the degree of undulation of the unevenness) is also suppressed within a certain range, thereby making it easier to intentionally peel the shape transfer film from the transfer object.

It is preferable that the 60 degree glossiness in the said uneven|corrugated shape is 4.0 or more, More preferably, it is 4.5 or more, More preferably, it is 5.0 or more. When the 60° glossiness is 4.0 or more, it is presumed that the concave-convex shape becomes a shape more suitable for intentional peeling, and it becomes much easier to intentionally peel the shape transfer film from the transfer object. It is preferable that 60 degree glossiness in the said uneven|corrugated shape is 20 or less, More preferably, it is 15 or less, More preferably, it is 10 or less. When the 60° glossiness is 20 or less, it is estimated that the uneven shape becomes a shape more suitable for intentional peeling, and further sufficient hiding properties can be provided to the transfer object. The said 60 degree glossiness can be measured by the method based on JIS Z8741.

It is preferable that 85 degree glossiness in the said uneven|corrugated shape is 2.5-15.0, More preferably, it is 3.0-13.0. If the 85° glossiness is 2.5 or more, it becomes even easier to intentionally peel the shape transfer film from the transfer object. When the 85° glossiness is 15.0 or less, it is possible to provide a further sufficient hiding property to the transfer object. The said 85 degree glossiness can be measured by the method based on JIS Z8741.

As an embodiment of the shape transfer film, for example, a shape transfer film comprising a base layer and a resin layer formed on at least one surface of the base layer, wherein the surface on the resin layer side has the concave-convex shape. . Moreover, as another embodiment of the said shape transfer film, the shape transfer film in which the surface of a base material layer has the said uneven|corrugated shape is mentioned. As a shape transfer film which concerns on the said other embodiment, the shape transfer film which provided the uneven|corrugated shape by the method of pressurizing the casting_mold|template which has an uneven|corrugated shape to the base material layer is mentioned.

In the shape transfer film, the concave-convex shape can be formed by a known or customary method so as to have the various characteristics described above. As a method for forming the concave-convex shape, the flat surface is physically roughened by, for example, a method of sand matting the flat surface, a method of spraying dry ice or the like on the flat surface, a method of pressing a mold having an uneven shape, etc. The method of cotton-izing, the method of mix|blending a filler and making it protrude outward from the flat surface of a shape transfer film, etc. are mentioned. These methods may use only 1 type, and may use them in combination of 2 or more type.

As an embodiment of the shape transfer film in which a concave-convex shape is formed by blending a filler, for example, the shape transfer film shown in Figs. 1 and 2 is exemplified. The shape transfer film 1 shown in Fig. 1 includes a base layer 2 and a resin layer 3 formed on one side of the base layer 2, and the surface on the resin layer 3 side has the above-mentioned concave-convex shape. . The resin layer 3 contains the filler 4, and the filler 4 protrudes outward from the flat surface 3a of the resin layer 3 which is a film flat surface, thereby forming the above-mentioned uneven shape.

The base layer may include, for example, a plastic base material (especially a plastic film), paper, cloth, a porous material such as a nonwoven fabric, a net, a foam sheet, a metal foil, and the like. A single layer may be sufficient as the said base material layer, and the laminated body of the same type or different types of base materials may be sufficient as it. In addition, the surface of the said base material layer may be suitably given well-known and usual surface treatment, such as a physical treatment, such as corona discharge treatment and plasma treatment, and chemical treatment, such as an undercoating treatment, for example.

Examples of the resin constituting the plastic substrate include low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymerized polypropylene, block copolymerized polypropylene, homopolypropylene, polybutene, and polymethyl. Pentene, ethylene-vinyl acetate copolymer (EVA), ionomer, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer polyolefin resins, such as; Polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonate; polyimide; polyether ether ketone; polyetherimido; polyamides such as aramid and wholly aromatic polyamide; polyphenyl sulfide; fluororesin; polyvinyl chloride; polyvinylidene chloride; cellulose resin; A silicone resin etc. are mentioned. As for the said resin, only 1 type may be used and 2 or more types may be used for it.

It does not specifically limit as resin which forms the said resin layer, Curable resins, such as a thermoplastic resin, a thermosetting resin, and active energy ray-curable resin, etc. are mentioned. In addition, in this specification, "curable resin" is a concept including both the resin which can harden|cure and form resin (curable resin), and the resin formed by hardening|curing curable resin. Among them, the resin is preferably a curable resin from the viewpoint of excellent releasability to the circuit pattern hiding layer described later after curing, and the curing degree hardly varies when the affixed film for a printed wiring board is thermocompression-bonded to a printed wiring board. In this case, it is particularly preferable that it is an active energy ray-curable resin. As for the said resin, only 1 type may be used and 2 or more types may be used for it.

Examples of the thermoplastic resin include polystyrene-based resin, vinyl acetate-based resin, polyester-based resin, polyolefin-based resin (eg, polyethylene-based resin, polypropylene-based resin composition, etc.), polyimide-based resin, acrylic resin, and the like. can be heard

As said thermosetting resin, a phenol type resin, an epoxy resin, a urethane type resin, a melamine type resin, an alkyd type resin, a silicone resin etc. are mentioned, for example.

Examples of the epoxy resin include bisphenol epoxy resin, spirocyclic epoxy resin, naphthalene epoxy resin, biphenyl epoxy resin, terpene epoxy resin, glycidyl ether epoxy resin, glycidyl ether epoxy resin, and glycidyl ether epoxy resin. Cydylamine-type epoxy-type resin, a novolak-type epoxy-type resin, etc. are mentioned.

As said bisphenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, tetrabromobisphenol A type epoxy resin, etc. are mentioned, for example. Examples of the glycidyl ether type epoxy resin include tris(glycidyloxyphenyl)methane and tetrakis(glycidyloxyphenyl)ethane. As said glycidylamine type epoxy resin, tetraglycidyl diamino diphenylmethane etc. are mentioned, for example. Examples of the novolak type epoxy resin include cresol novolak type epoxy resins, phenol novolak type epoxy resins, α-naphthol novolak type epoxy resins, and brominated phenol novolak type epoxy resins. have.

Examples of the active energy ray-curable resin include polymerizable resins having at least two radical reactive groups (eg, (meth)acryloyl groups) in the molecule. Examples of the active energy rays include electron beams, ultraviolet rays, α-rays, β-rays, γ-rays, and X-rays.

Examples of the filler include organic particles and inorganic particles. As said organic particle|grains, acrylic resins, such as polymethyl methacrylate, polyacrylonitrile resin, a polyurethane resin, polyamide, a polyimide, etc. are mentioned, for example. Examples of the inorganic particles include calcium carbonate, calcium silicate, clay, kaolin, talc, silica, glass, diatomaceous earth, mica powder, alumina, magnesium oxide, zinc oxide, barium sulfate, aluminum sulfate, calcium sulfate, magnesium carbonate, etc. can be heard As for the said particle|grain, only 1 type may be used and 2 or more types may be used for it.

Although the median diameter (D50) of the said filler is not specifically limited, It is preferable that it is 0.5-20 micrometers, More preferably, it is 1-10 micrometers. When D50 is within the above range, the concave-convex shape can be easily formed. Said D50 shall mean the particle diameter in 50% of the integrated value in the particle size distribution calculated|required by the laser diffraction/scattering method.

Although content of the said filler in the said resin layer is not specifically limited, 20-70 mass parts is preferable with respect to 100 mass parts of resin which forms the said resin layer, More preferably, it is 30-60 mass parts. When the content is within the above range, the concave-convex shape can be easily formed.

Although the thickness (thickness between the flat surfaces of both surfaces) of the said resin layer is not specifically limited, It is preferable that it is 0.5-9 micrometers, More preferably, it is 1-7 micrometers. When the thickness is within the above range, the shape of the pillar protruding from the flat surface can be within an appropriate range according to the relationship with D50 of the pillar, and the concave-convex shape can be easily formed.

The shape transfer film 1 shown in FIG. 1 can be produced by forming the resin layer 3 on the base material layer 2 so as to have the concave-convex shape by a known or conventional method. Specifically, for example, on one surface of the base layer, a composition comprising a resin or a compound and a filler for forming the resin layer, and if necessary, a composition containing a solvent is cast and coated, followed by solvent removal or curing treatment. It can be manufactured by performing and solidifying.

As for the shape transfer film 1 shown in FIG. 2, the surface of the base material layer 2 has the said uneven|corrugated shape. The base material layer 2 contains the filler 4, and the said uneven|corrugated shape is formed by the filler 4 protruding outward from the flat surface 2a of the base material layer 2 which is a film flat surface.

A release treatment layer may be formed on the surface of the base material layer having an uneven shape. As said release-treated layer, the layer formed by surface-treating with peeling agents, such as a silicone type, a long-chain alkyl type, a fluorine type, and molybdenum sulfide, is mentioned. And when it has a mold release process layer, the thickness and shape of a mold release process layer are suitably set so that the uneven|corrugated shape of the surface of a base material layer may not lose|disappear, ie, so that a shape transfer film may have the said uneven|corrugated shape.

As a base material layer in the case of having the said release process layer, what was illustrated and demonstrated as a base material layer which has the above-mentioned resin layer is mentioned. As a base material layer in the case of not having the said release process layer, the low-adhesive base material which consists of a fluoropolymer, the low-adhesive base material which consists of a nonpolar polymer, etc. are mentioned. Examples of the fluorine-based polymer in the low-adhesion substrate made of the fluoropolymer include polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer. Copolymer, a chlorofluoroethylene-vinylidene fluoride copolymer, etc. are mentioned. Moreover, as said nonpolar polymer, an olefin resin (for example, polyethylene, polypropylene, etc.) etc. are mentioned, for example. The surface of the said base material layer may be suitably given well-known and usual surface treatment, such as physical treatment, such as corona discharge treatment and plasma treatment, and chemical treatment, such as an undercoating treatment, for example.

As said filler, what was illustrated and demonstrated as what is contained in the above-mentioned resin layer is mentioned.

Although the median diameter (D50) of the said filler is not specifically limited, It is preferable that it is 0.5-20 micrometers, More preferably, it is 1-10 micrometers. When D50 is within the above range, the concave-convex shape can be easily formed. Said D50 shall mean the particle diameter in 50% of the integrated value in the particle size distribution calculated|required by the laser diffraction/scattering method.

Although the content rate of the said filler in the said base material layer is not specifically limited, With respect to 100 volume% of the total amount of the said base material layer, 10-70 volume% is preferable, More preferably, 20-60 volume%, More preferably, it is 30 -50% by volume. When the content is within the above range, the concave-convex shape can be easily formed.

The shape transfer film 1 shown in FIG. 2 can be produced by molding the base material layer 2 by a known or conventional method so that at least one surface has the above-mentioned concavo-convex shape. Specifically, for example, it can manufacture by kneading the said filler in the resin composition which forms a base material layer, and shaping|molding. Then, you may apply|coat and solidify a mold release agent as needed, and may form a mold release process layer.

The layer (resin layer or base material layer) having the said uneven|corrugated shape may contain other components other than each component mentioned above within the range which does not impair the effect of this invention. As said other component, a colorant, an antistatic agent, a stabilizer, antioxidant, a ultraviolet absorber, an optical brightening agent etc. are mentioned, for example. As for the said other component, only 1 type may be used and 2 or more types may be used for it.

Although the thickness of the said shape transfer film is not specifically limited, For example, it is 10-200 micrometers, Preferably it is 15-150 micrometers. When the thickness is 10 µm or more, the protection performance of the transfer object is more excellent. If the said thickness is 200 micrometers or less, it will peel more easily at the time of use.

According to the shape transfer film, by having the above-described specific concave-convex shape on the surface, it is possible to impart a shape derived from the concave-convex shape to the transfer object to impart sufficient hiding properties to the transfer object, and to intentionally remove it from the transfer object. When peeling, it can peel easily. In addition, it is difficult to peel off the shape transfer film during transportation or the like except when intentionally peeling the shape transfer film with the circuit pattern hiding layer.

[Attached film for printed wiring board]

The affixed film for printed wiring boards according to an embodiment of the present disclosure includes the shape transfer film and a circuit pattern hiding layer directly laminated with the shape transfer film. The shape derived from the said uneven|corrugated shape is provided (transferred) to the surface of the circuit pattern hiding layer laminated|stacked directly on the surface which has the said uneven|corrugated shape of the said shape transfer film (transfer). Thereby, when the shape transfer film is intentionally peeled, it can peel easily from the said circuit pattern hiding layer, and the said circuit pattern hiding layer after peeling has sufficient hiding property.

As for the said affixing film for printed wiring boards, it is preferable that the said circuit pattern hiding layer, and the said shape transfer film are laminated|stacked in this order. The said affixing film for printed wiring boards may be equipped with layers other than the said adhesive bond layer, the said circuit pattern hiding layer, and the said shape transfer film.

One Embodiment of the said affixing film for printed wiring boards is demonstrated below. It is a cross-sectional schematic diagram which shows one Embodiment of the said affixed film for printed wiring boards.

The affixing film 5 for printed wiring boards shown in FIG. 3 is equipped with the adhesive bond layer 7, the circuit pattern hiding layer 6, and the shape transfer film 1 shown in FIG. More specifically, as for the affixing film 5 for printed wiring boards, the circuit pattern hiding layer 6 which is a protective layer for protecting the adhesive bond layer 7 is laminated|stacked directly on one side of the adhesive bond layer 7 . And in the case where the affixed film 5 for printed wiring boards uses a conductive adhesive layer as the adhesive bond layer 7, a conductive adhesive layer functions as an electromagnetic wave shielding layer, and exhibits electromagnetic wave shielding performance. In this case, the affixed film 5 for printed wiring boards can be used as an electromagnetic wave shielding film. In addition, when the adhesive bond layer 7 does not have shielding performance, or when higher shielding performance is requested|required, you may provide separately other electromagnetic wave shielding layers, such as a metal layer, between a circuit pattern hiding layer and an adhesive bond layer. In this case, the circuit pattern hiding layer is indirectly laminated on the adhesive layer.

On the surface of the circuit pattern hiding layer 6 opposite to the adhesive layer 7 , the shape transfer film 1 is laminated so that the circuit pattern hiding layer 6 and the resin layer 3 come into contact with each other. Since the surface of the circuit pattern hiding layer 6 is directly laminated on the surface having the concave-convex shape of the shape transfer film 1, a shape derived from the concavo-convex shape is imparted (transferred).

(Circuit Pattern Concealment Layer)

The said circuit pattern hiding layer is a layer for making it difficult to visually recognize and concealing the circuit pattern in a printed wiring board in the state which pasted the affixing film for printed wiring boards to a printed wiring board, and may be responsible for design. . When the adhesive bond layer of the said affixing film for printed wiring boards is affixed on a printed wiring board, it is located in the side which will be located on the opposite side to the said printed wiring board of the said adhesive bond layer. The said affixing film for printed wiring boards WHEREIN: Any of a single|mono layer and multiple layers (laminated body of several circuit pattern hiding layers) may be sufficient as the said circuit pattern hiding layer. And, when another electromagnetic wave shielding layer is separately provided between the circuit pattern hiding layer and the adhesive layer, the circuit pattern hiding layer can protect the other electromagnetic wave shielding layer and the adhesive layer.

The said circuit pattern hiding layer may also contain a metal and resin as a binder component. Examples of the resin include those exemplified and described as the resin contained in the above-mentioned resin layer. Examples of the metal include nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, and an alloy containing at least one of these. As for the said binder component, only 1 type may be used and 2 or more types may be used for it.

As said binder component, resin is especially preferable. The resin is preferably a curable resin from the viewpoint of adjusting the ease of peeling by varying the adhesiveness to the shape transfer film before and after curing, and is cured at the same time when the affixed film for a printed wiring board is thermocompression bonded to the printed wiring board. It is especially preferable that it is a thermosetting resin from a viewpoint which can reduce the adhesiveness to a shape transfer film easily.

Although the content rate of the said binder component in the said circuit pattern hiding layer is not specifically limited, 10-70 mass % is preferable with respect to 100 mass % of the total amount of the said circuit pattern hiding layer, More preferably, 20-60 mass % , More preferably, it is 30-50 mass %.

It is preferable that the said circuit pattern hiding layer contains a black type coloring agent from a viewpoint that it can be made into the thing excellent in hiding property. As the black colorant, a black pigment, a mixed pigment obtained by subtractive mixing of a plurality of pigments, and the like can be used. Examples of the black pigment include carbon black, Ketjen black, perylene black, titanium black, iron black, and aniline black. From a viewpoint of the dispersibility to a circuit pattern hiding layer, it is preferable that the average primary particle diameter is 20 nm or more, and, as for the particle diameter of a black pigment, it is more preferable that it is 100 nm or less. The average primary particle diameter of a black pigment can be calculated|required from the average value of about 20 primary particles which can be observed from the image magnified by about 50,000 times - 1 million times with a transmission electron microscope (TEM). As said mixed pigment, pigments, such as red, green, blue, yellow, purple, cyan, and magenta, can be mixed and used, for example. Content of the black type coloring agent in the said circuit pattern hiding layer is 0.5-50 mass % with respect to 100 mass % of the total amount of the said circuit pattern hiding layer, Preferably it is 1-40 mass %.

The said circuit pattern hiding layer may contain components other than each component mentioned above within the range which does not impair the effect of this invention. Examples of the other components include an antifoaming agent, a viscosity modifier, an antioxidant, a diluent, an anti-settling agent, a filler, a colorant, a leveling agent, a coupling agent, an ultraviolet absorber, a tackifier resin, a curing accelerator, a plasticizer, a flame retardant, a blocking agent An inhibitor, a hardening|curing agent, etc. are mentioned. As for the said other component, only 1 type may be used and 2 or more types may be used for it.

It is preferable that the 60 degree glossiness of the surface to which the said shape transfer film of the said circuit pattern hiding layer was pasted together is 0.3-5.0, More preferably, it is 0.4-3.0, More preferably, it is 0.5-2.0. When the 60° glossiness is 0.3 or more, it becomes much easier to intentionally peel the shape transfer film. Concealment property becomes it higher that the said 60 degree glossiness is 5.0 or less. The said 60 degree glossiness can be measured by the method based on JISZ8741. And the said 60 degree glossiness is measured in the state which peeled the said shape transfer film from the said affixed film for printed wiring boards.

It is preferable that the 85 degree glossiness of the surface to which the said shape transfer film of the said circuit pattern concealment layer was stuck is 15 or less, More preferably, it is less than 15. Concealment property becomes higher that the said 85 degree glossiness is 15 or less. The said 85 degree glossiness can be measured by the method based on JIS Z8741. And the said 85 degree glossiness is measured in the state which peeled the said shape transfer film from the said affixed film for printed wiring boards.

It is preferable that the said circuit pattern hiding layer has a total light transmittance of 20 % or less, More preferably, it is 10 % or less, More preferably, it is 5 % or less. When the affixed film for printed wiring boards is stuck as the said total light transmittance is 20 % or less on a printed wiring board, a circuit pattern is more difficult to visually recognize.

The thickness of the said circuit pattern hiding layer is not specifically limited, It can set suitably as needed. The thickness of the circuit pattern hiding layer is preferably 1 µm or more, more preferably 4 µm or more, from the viewpoints of realization of concealability, easiness of formation, and securing of flexibility. Moreover, as for the thickness of the said circuit pattern hiding layer, 20 micrometers or less are preferable, More preferably, it is 10 micrometers or less, More preferably, it is 5 micrometers or less.

(Adhesive layer)

The said adhesive bond layer has adhesiveness for adhere|attaching the said affixing film for printed wiring boards to a printed wiring board. The adhesive layer may be either a single layer or a multilayer.

It is preferable that the said adhesive bond layer contains the binder component which comprises the resin region in an adhesive bond layer. Examples of the binder component include those exemplified and described as the resin contained in the above-mentioned resin layer. As for the said binder component, only 1 type may be used and 2 or more types may be used for it.

When the binder component contains a thermosetting resin, a curing agent for accelerating the thermosetting reaction may be included as a component constituting the binder component. The said hardening|curing agent can be suitably selected according to the kind of the said thermosetting resin. Only 1 type may be used for the said hardening|curing agent, and 2 or more types may be used for it.

A conductive adhesive layer may be sufficient as the said adhesive bond layer. In the case of a conductive adhesive layer, it becomes possible for the said adhesive bond layer to exhibit electromagnetic wave shielding property. When the said adhesive bond layer is a conductive adhesive layer, it is preferable to contain electroconductive particle further.

As said electroconductive particle, a metal particle, a metal-coated resin particle, a metal fiber, a carbon filler etc. are mentioned, for example. The said electroconductive particle may use only 1 type and may use 2 or more types.

As a metal which comprises the said metal particle, the metal which comprises the coating part of the said metal-coated resin particle, and the said metal fiber, gold, silver, copper, nickel, zinc, etc. are mentioned, for example. As for the said metal, only 1 type may be used and 2 or more types may be used for it.

Specific examples of the metal particles include copper particles, silver particles, nickel particles, silver-coated copper particles, gold-coated copper particles, silver-coated nickel particles, gold-coated nickel particles, and silver-coated alloy particles. Examples of the silver-coated alloy particles include silver-coated copper alloy particles in which alloy particles containing copper (eg, copper alloy particles made of an alloy of copper, nickel, and zinc) are coated with silver. . The metal particles can be produced by an electrolysis method, an atomization method, a reduction method, or the like.

As said metal particle, silver particle, silver-coated copper particle, and silver-coated copper alloy particle|grains are especially preferable. Silver-coated copper particles and silver-coated copper alloy particles are particularly preferable from the viewpoint of being excellent in conductivity, suppressing oxidation and aggregation of metal particles, and lowering the cost of metal particles.

As a shape of the said electroconductive particle, spherical shape, flake shape (scale shape), dendritic shape, fibrous shape, an irregular shape (polyhedron), etc. are mentioned.

It is preferable that the median diameter (D50) of the said electroconductive particle is 1-50 micrometers, More preferably, it is 3-40 micrometers. If the said median diameter is 1 micrometer or more, the dispersibility of electroconductive particle is favorable, aggregation can be suppressed and it is hard to be oxidized. If the said average particle diameter is 50 micrometers or less, electroconductivity will become favorable. Said D50 shall mean the particle diameter in 50% of the integrated value in the particle size distribution calculated|required by the laser diffraction/scattering method.

The said conductive adhesive layer can be made into the layer which has isotropic electroconductivity or anisotropic electroconductivity as needed.

When the adhesive layer is a conductive adhesive layer, the content of the binder component in the adhesive layer is not particularly limited, but is preferably 5 to 60% by mass, more preferably 10 to 100% by mass of the total amount of the adhesive layer. -50 mass %, more preferably 20-40 mass %. Electromagnetic wave shielding performance becomes favorable as the said content rate is 5 mass % or more. The adhesiveness to a printed wiring board is more excellent that the said content rate is 60 mass % or less.

When the said adhesive bond layer is a conductive adhesive layer, Although the content rate of the electroconductive particle in the said adhesive bond layer is not specifically limited, 2-95 mass % is preferable with respect to 100 mass % of the total amount of an adhesive bond layer, More preferably, 5 -80 mass %, More preferably, it is 10-70 mass %. When the said content rate is 2 mass % or more, electroconductivity will become more favorable. A binder component can be fully contained as the said content rate is 95 mass % or less, and the adhesiveness with respect to a printed wiring board becomes more favorable.

The said adhesive bond layer may contain other components other than each said component within the range which does not impair the effect of this invention. As said other component, the component contained in a well-known thru|or a common adhesive bond layer is mentioned. Examples of the other components include antifoaming agents, viscosity modifiers, antioxidants, diluents, anti-settling agents, fillers, colorants, leveling agents, coupling agents, ultraviolet absorbers, tackifying resins, curing accelerators, plasticizers, flame retardants, antiblocking agents, etc. can be heard As for the said other component, only 1 type may be used and 2 or more types may be used for it.

It is preferable that the thickness of the said adhesive bond layer is 3-20 micrometers, More preferably, it is 5-15 micrometers. If the said thickness is 3 micrometers or more, a printed wiring board and adhesiveness will become more favorable.

The said affixing film for printed wiring boards may have other layers other than the said shape transfer film, the said circuit pattern hiding layer, and the said adhesive bond layer. As said other layer, other electromagnetic wave shielding layers other than the said conductive adhesive layer, such as a metal layer formed between the said circuit pattern hiding layer and the said adhesive bond layer, are mentioned. Moreover, when it has the said other electromagnetic wave shielding layer, as said other layer, the anchor coat layer formed between the said circuit pattern hiding layer and the said other electromagnetic wave shielding layer is mentioned.

Examples of the metal constituting the metal layer include gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, or an alloy thereof. As said metal layer, it is preferable that it is a metal plate or metal foil. That is, as said metal layer, a copper plate (copper foil) and a silver plate (silver foil) are preferable.

Examples of the material for forming the anchor coat layer include a urethane-based resin, an acrylic resin, a core-shell type composite resin having an urethane-based resin as a shell and an acrylic-based resin as a core, an epoxy-based resin, a polyimide-based resin, a polyamide-based resin, and a melamine-based resin. , phenol-based resins, urea-formaldehyde-based resins, blocked isocyanates obtained by reacting polyisocyanate with a blocking agent such as phenol, polyvinyl alcohol, polyvinylpyrrolidone, and the like. As for the said material, only 1 type may be used and 2 or more types may be used for it.

It is preferable that the peeling force (1st peeling force) of the shape transfer film with respect to the circuit pattern hiding layer in the said affixed film for printed wiring boards is 0.1N or more, More preferably, it is 0.2N or more, More preferably, In most cases, it is 0.3N or more. When the 1st peeling force is 0.1 N or more, it is hard to peel during transportation etc., and unintentional peeling can be suppressed. In addition, the 1st peeling force can be measured by the method described in an Example.

The peeling force (2nd peeling force) of the shape transfer film with respect to the circuit pattern hiding layer in the state after bonding the adhesive bond layer surface of the said affixing film for printed wiring boards to a printed wiring board, and performing adhesion|attachment by heat and pressure is 3.0N It is preferable that it is less than, More preferably, it is 2.0 N or less, More preferably, it is 1.5 or less. When the second peeling force is 3.0 N or less, the shape transfer film can be easily peeled when the shape transfer film is intentionally peeled during use. In addition, the second peeling force can be measured by the method described in Examples.

As for ratio [2nd peeling force / 1st peeling force] of the 2nd peeling force with respect to 1st peeling force, 0.5-1.5 are preferable, More preferably, it is 0.6-1.3, More preferably, it is 0.7-1.2. Unintended peeling can be suppressed more as the said ratio is in the said range, and when peeling intentionally at the time of use, it can peel more easily.

It is especially preferable that the said affixing film for printed wiring boards is a flexible printed wiring board (FPC) use. The said affixed film for printed wiring boards can be used suitably as a affixed film for flexible printed wiring boards.

(Manufacturing method of the affixed film for printed wiring boards)

The manufacturing method of the said affixed film for printed wiring boards is demonstrated. In preparation of the affixing film 5 for printed wiring boards shown in FIG. 3, first, the adhesive bond layer 7 and the circuit pattern hiding layer 6 are produced separately. Then, the adhesive layer 7 and the circuit pattern hiding layer 6 which were produced separately are laminated|attached (lamination method).

The adhesive layer 7 may be formed by, for example, applying (coating) an adhesive composition for forming the adhesive layer 7 on a temporary substrate or substrate such as a separate film, and removing the solvent and/or partially curing it if necessary. can

The said adhesive composition contains a solvent (solvent) in addition to each component contained in the adhesive bond layer mentioned above, for example. As a solvent, toluene, acetone, methyl ethyl ketone, methanol, ethanol, a propanol, dimethylformamide etc. are mentioned, for example. The solid content concentration of the adhesive composition is appropriately set according to the thickness of the adhesive layer to be formed.

A well-known coating method may be used for application|coating of the said adhesive composition. For example, a coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a lip coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, a direct coater, and a slot die coater may be used.

On the other hand, when a resin is used as a binder component for the circuit pattern hiding layer 6, for example, a resin composition for forming the circuit pattern hiding layer 6 is applied to the surface on which the concave-convex shape of the shape transfer film is formed. It can be formed by applying (coating) and, if necessary, desolving and/or partially curing it to solidify. Thereby, the shape derived from the uneven|corrugated shape surface of the shape transfer film 1 can be provided to the circuit pattern hiding layer 6 surface.

The said resin composition contains a solvent (solvent) in addition to each component contained in the circuit pattern hiding layer mentioned above, for example. As a solvent, what was illustrated as a solvent which the adhesive composition mentioned above can contain is mentioned. Solid content concentration of the said resin composition is suitably set according to the thickness etc. of the circuit pattern hiding layer to form.

A well-known coating method may be used for application|coating of the said resin composition. For example, what was illustrated as a coater used for application|coating of the adhesive composition mentioned above is mentioned.

Next, the exposed surface of the respectively produced adhesive bond layer 7 and the exposed surface of the circuit pattern hiding layer 6 are pasted together, and the affixing film 5 for printed wiring boards is produced.

As an aspect other than the said lamination method, you may manufacture the said affixing film for printed wiring boards by the method of laminating|stacking each layer one by one (direct coating method). For example, as for the affixed film 5 for printed wiring boards shown in FIG. 3, on the surface of the adhesive bond layer 7, the resin composition for circuit pattern hiding layer 6 formation is apply|coated (coated), and solvent is removed as needed. and/or solidified by partial curing to form the circuit pattern hiding layer 6 . And in this case, by laminating the concave-convex shape surface of the shape transfer film 1 to the layer of the resin composition before completely solidifying, and then completely solidifying it, the surface of the circuit pattern hiding layer 6 formed in the concave-convex shape derived shape can be given. Alternatively, first, the circuit pattern hiding layer 6 is formed on the concave-convex shape surface of the shape transfer film 1, and the adhesive composition for forming the adhesive layer 7 is applied to the surface of the circuit pattern hiding layer 6 (coating). , may be prepared by removing the solvent and/or partially curing the adhesive layer 7 if necessary.

<Example>

Hereinafter, the present invention will be described in more detail based on Examples, but the present invention is not limited only to these Examples.

<Example 1>

(Production of shape transfer film)

A resin composition consisting of 30 parts by mass of silica particles (D50: 6.5 μm), 100 parts by mass of a melamine-based resin, and toluene is prepared, and the resin composition is applied on the surface of a polyethylene terephthalate film having a thickness of 25 μm using a wire bar, and The solvent was removed by heating, and a shape transfer film having a resin layer having a thickness of 5 µm on the surface of the substrate layer was produced.

(production of pasting film)

100 parts by mass of bisphenol A epoxy resin (trade name "jER1256", manufactured by Mitsubishi Chemical Co., Ltd.) and a curing agent (trade name "ST14", manufactured by Mitsubishi Chemical Corporation) 0.1 to toluene so that the solid content is 20 mass% 15 mass parts of carbon particles (trade name "Toka Black #8300/F", manufactured by Tokai Carbon Corporation) were mix|blended as mass parts and a black type coloring agent, and the resin composition was prepared. The resin composition was applied to the surface of the resin layer of the shape transfer film using a wire bar, and solidified by heating to form a circuit pattern hiding layer having a thickness of 5 µm on the surface of the shape transfer film.

Next, 100 parts by mass of a bisphenol A epoxy resin (trade name "jER1256", manufactured by Mitsubishi Chemical Corporation), a curing agent (trade name "ST14", manufactured by Mitsubishi Chemical Corporation) in toluene so that the solid content is 20 mass% ) was mix|blended by 0.1 mass part, it stirred and mixed, and the adhesive bond layer composition was prepared. The adhesive layer composition was applied to a PET film (hereinafter, referred to as a support film) having a surface subjected to a release treatment using a wire bar, and solidified by heating to form an adhesive layer having a thickness of 5 μm on the surface of the support film.

Next, the circuit pattern hiding layer formed on the surface of the shape transfer film and the adhesive layer formed on the surface of the support film are pasted together, using a pair of metal rolls heated to 100° C. got a film. The total light transmittance of the obtained affixed film was 5 % or less.

(Preparation of substrate for evaluation)

The affixed film obtained above was laminated on a printed wiring board, and then vacuumed for 60 seconds under the conditions of temperature: 170 ° C. and pressure: 2 MPa using a press machine, then heated and pressed for 180 seconds to adhere, and the substrate for evaluation made And as the said printed wiring board, the thing in which the circuit pattern was formed on the base layer which consists of a polyimide film was used. The circuit pattern was formed of a copper foil having a line width of 0.1 mm and a height of 12 µm. On the said base layer, the 25-micrometer-thick adhesive bond layer and the cover-lay (insulating film) which consist of a 12.5 micrometer-thick polyimide film were provided so that the circuit pattern might be covered.

<Example 2>

Except having formed the 7-micrometer-thick resin layer in the base material layer surface, it carried out similarly to Example 1, and produced the shape transfer film, the affixing film, and the board|substrate for evaluation.

<Example 3>

A shape transfer film, a affixed film, and a substrate for evaluation were produced in the same manner as in Example 1 except that the silica particle having a D50 of 4.5 µm was used.

<Example 4>

A shape transfer film, an affixed film, and a substrate for evaluation were produced in the same manner as in Example 1 except that the silica particle having a D50 of 3.8 µm was used.

<Comparative Example 1>

A shape transfer film, a affixed film, and a substrate for evaluation were produced in the same manner as in Example 1 except that the silica particle having a D50 of 9 µm was used.

<Comparative Example 2>

A shape transfer film, a affixed film, and a substrate for evaluation were produced in the same manner as in Example 1 except that the silica particle having a D50 of 10 µm was used.

<Comparative Example 3>

A shape transfer film, an adhesive film, and a substrate for evaluation were prepared in the same manner as in Example 1 except that a silica particle having a D50 of 3.5 µm was used and a resin layer having a thickness of 3 µm was formed on the surface of the substrate layer. .

<Comparative Example 4>

A shape transfer film, a affixed film, and a substrate for evaluation were produced in the same manner as in Comparative Example 3 except that a resin layer having a thickness of 4 µm was formed on the surface of the substrate layer.

<Comparative Example 5>

A film having an uneven shape of the performance shown in Table 1 was used as the shape transfer film. And except having used the said shape transfer film, it carried out similarly to Example 1, and produced the affixed film and the board|substrate for evaluation.

<Comparative Example 6>

A film having an uneven shape having the performance shown in Table 1, obtained by kneading a filler into a polyethylene terephthalate resin and molding it was used as the shape transfer film. And except having used the said shape transfer film, it carried out similarly to Example 1, and produced the affixed film and the board|substrate for evaluation.

<Comparative Example 7>

A film having an uneven shape having the performance shown in Table 1, obtained by kneading a filler into a polyethylene terephthalate resin and molding it was used as the shape transfer film. And except having used the said shape transfer film, it carried out similarly to Example 1, and produced the affixed film and the board|substrate for evaluation.

<Comparative Example 8>

A film having an uneven shape having the performance shown in Table 1 obtained by sand matting the surface of the polyethylene terephthalate film was used as the shape transfer film. And except having used the said shape transfer film, it carried out similarly to Example 1, and produced the affixed film and the board|substrate for evaluation.

(evaluation)

Each shape transfer film obtained in the Example and the comparative example, the affixed film, and the board|substrate for evaluation were evaluated as follows. The evaluation result was described in the table.

(1) Surface shape

Using a confocal microscope (trade name "OPTELICS HYBRID", manufactured by Lasertec, Inc., objective lens 100x), based on ISO25178, the surface of the resin layer of the shape transfer film is formed in 5 arbitrary places for the uneven shape of the surface, the development of the interface The area ratio Sdr, the level difference Sk of the core part, the arithmetic mean height Sa, the root mean square height Sq, and the arithmetic mean of the root mean square inclination Sdq were measured. In addition, the cutoff wavelength of the S filter was set to 0.0025 mm, and the cutoff wavelength of the L filter was set to 0.8 mm.

(2) Glossiness

Using Gardner Micro-Gloss (mobile phone type gloss meter, manufactured by BYK), 60° glossiness and 85° glossiness in the concave-convex shape formed on the surface of the resin layer of the shape transfer film, and circuit pattern on the evaluation substrate The 60° glossiness and 85° glossiness in the region to which the concave-convex shape of the surface of the hiding layer was transferred were measured. And the measurement of the glossiness of the circuit pattern hiding layer surface was performed with respect to the surface after peeling a shape transfer film from the said board|substrate for evaluation.

(3) Peeling force before heating and pressurization (first peeling force)

The peeling force at the time of peeling a shape transfer film from the affixing film (state before heat-pressing) produced in the said Example and the comparative example was measured as 1st peeling force. Specifically, the affixed film is fixed to a polyimide film having a thickness of 100 µm, and using a strength tester (trade name "PFT50S", manufactured by Falmac Co., Ltd.), a sample width of 10 mm, a peeling angle of 170°, a peeling rate of 1000 The peeling force (1st peeling force) at the time of peeling a shape transfer film from an affixed film under conditions of mm/min was evaluated.

(4) Peeling force after heating and pressing (second peeling force)

In preparation of the said board|substrate for evaluation, the peeling force at the time of peeling a shape transfer film from the state after heat-pressing was measured as 2nd peeling force. Specifically, using a strength tester (trade name "PFT50S", manufactured by Falmac Co., Ltd.), the shape transfer film from the substrate for evaluation under the conditions of a sample width of 10 mm, a peeling angle of 170°, and a peeling rate of 1000 mm/min. The peeling force (2nd peeling force) at the time of peeling was evaluated.

(5) Concealment

The evaluation substrate is placed on a flat table surface, the shape transfer film is peeled off, the surface roughness of the shielding wiring board is 500 lux, the height from the evaluation substrate is 30 cm, and at an angle of 45°, It was evaluated whether the circuit pattern could be visually recognized from the circuit pattern hiding layer side. The case where a circuit pattern could not be visually recognized was made into good|favorableness ((circle)), and the concealability evaluated the case where a circuit pattern could be visually recognized as poor (x).

[Table 1]

In the shape transfer film of the embodiment, the circuit pattern hiding layer formed using the shape transfer film has excellent hiding properties, the peeling force (second peeling force) after heating and pressing is as low as 2.0 N or less, and peeling from the circuit pattern hiding layer The castle was excellent. Moreover, it is shown that the peeling force (1st peeling force) before heat-pressing is 0.1 N or more, and it is hard to peel in the situation where a shape transfer film is not intended. On the other hand, when the developed area ratio Sdr of the interface of the shape transfer film surface or the level difference Sk of the core part is large (Comparative Examples 1 and 2), the second peeling force exceeds 2.0 N, and the peelability to the circuit pattern hiding layer is was behind Moreover, when the developed area ratio Sdr of the interface of the shape transfer film surface or the level difference Sk of the core portion was small (Comparative Examples 3 to 8), the hiding property of the circuit pattern hiding layer was inferior. Moreover, in the comparative example 8, the 2nd peeling force exceeded 2.0N, and it was also inferior to the peelability from a circuit pattern hiding layer.

1: shape transfer film
2: base layer
3: resin layer
4: filler
5: Sticking film for printed wiring boards
6: circuit pattern hiding layer
7: adhesive layer
2a, 3a: shape transfer film flat surface

Claims (12)

A shape transfer film comprising, on at least one surface, an uneven shape having an interface development area ratio Sdr of 1500 to 7000%, and transferring a shape derived from the uneven shape onto a transfer object. According to claim 1,
The shape transfer film, wherein the level difference Sk of the core portion in the concave-convex shape is 2.0 to 7.0 µm. (according to claim 1 or 2,)
A shape transfer film comprising, on at least one surface, an uneven shape having a level difference Sk of a core portion of 2.0 to 7.0 µm, and for transferring a shape derived from the uneven shape to a transfer object. 4. The method according to any one of claims 1 to 3,
The shape transfer film, wherein the arithmetic mean height Sa in the concave-convex shape is 1.0 to 2.0 µm. 5. The method according to any one of claims 1 to 4,
The shape transfer film, wherein the root mean square height Sq in the concave-convex shape is 1.0 to 2.8 µm. 6. The method according to any one of claims 1 to 5,
The shape transfer film whose root mean square inclination Sdq in the said uneven|corrugated shape is 7-15. 7. The method according to any one of claims 1 to 6,
The shape transfer film, wherein the ratio [Sdr/Sdq] of the developed area ratio Sdr of the interface to the root mean square inclination Sdq in the concave-convex shape is 200 to 500. 8. The method according to any one of claims 1 to 7,
A base layer and a resin layer formed on one side of the base layer,
The shape transfer film in which the said resin layer side surface has the said uneven|corrugated shape. 9. The method according to any one of claims 1 to 8,
The shape transfer film includes a filler, and the concave-convex shape is formed by the filler protruding outward from a flat surface of the film. A affixing film for printed wiring boards comprising the shape transfer film according to any one of claims 1 to 9, and a circuit pattern hiding layer directly laminated with the shape transfer film. 11. The method of claim 10,
The adhesive film for printed wiring boards in which the adhesive bond layer, the said circuit pattern hiding layer, and the said shape transfer film are laminated|stacked in this order. 12. The method of claim 11,
The affixed film for printed wiring boards whose 85 degree glossiness of the surface of the said shape transfer film side of the said circuit pattern hiding layer is 15 or less.

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