CN104109491A - Anisotropic conductive film, connecting method, and joined body - Google Patents
Anisotropic conductive film, connecting method, and joined body Download PDFInfo
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- CN104109491A CN104109491A CN201410151549.0A CN201410151549A CN104109491A CN 104109491 A CN104109491 A CN 104109491A CN 201410151549 A CN201410151549 A CN 201410151549A CN 104109491 A CN104109491 A CN 104109491A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/025—Electric or magnetic properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- Non-Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract
An anisotropic conductive film allowing anisotropic conductive connection between terminals of a first circuit part and terminals of a second circuit part comprises a first layer containing film forming resin and a second layer containing film forming resin. At least one of the first layer and the second layer contains conductive particles. One of the first layer and the second layer contains leuco dye and the other contains a hue change agent which interacts with the leuco dye to make the hue of the anisotropic conductive film change.
Description
Technical field
The present invention relates to anisotropic conductive film, method of attachment and conjugant.
Background technology
At present, as the means that electronic component is connected with substrate, use the heat-curing resin that is dispersed with electroconductive particle is coated to banded connecting material on stripping film (anisotropic conductive film (ACF for example; Anisotropic Conductive Film)).
This anisotropic conductive film is for example for take situation that the terminal of flexible printed board (FPC) or IC (Integrated Circuit) chip is connected with the electrode being formed on the glass substrate of LCD (Liquid Crystal Display) panel as main, situation about being electrically connected to when various terminals are bonded to each other.
At present, use the confirmation of the connection state of anisotropic conductive film to use the device analysis mensuration degree of cure of infrared measure, differential scanning calorimetric measurement etc. to carry out by employing.Therefore, the confirmation of connection state exists needs a large amount of labours and the problem of time.
Heat while therefore, attempting confirming to connect by the variation of form and aspect and the state of pressure.
The insulativity binder resin sheet (for example, with reference to the flat 5-224227 communique of Japanese Patent Publication) of the insulativity capsule that for example, has proposed to comprise developer and contained conducting material and leuco dye.
In addition, a kind of anisotropic conductive tackiness agent has for example been proposed, by being formed with the second circuit parts that are formed with second circuit electrode on the first circuit block of the first circuit electrode and the interarea of second substrate on the interarea of first substrate, make above-mentioned the first circuit electrode and above-mentioned second circuit electrode pair pressurize and heat under the state of configuration, for above-mentioned the first circuit electrode and above-mentioned second circuit electrode are electrically connected to, wherein, the anisotropic conductive tackiness agent that this anisotropic conductive tackiness agent is the radical-curable of the free radical reaction foxy by containing composition (for example, with reference to Japanese Patent Publication 2009-88465 communique).
But, in the technology of these propositions, while becoming state more than prescribed value due to a side of heat and pressure, form and aspect can change, so even if existing the opposing party of heat and pressure not meet form and aspect in the situation of prescribed value also can change, thereby can not fully confirm the problem of connection state.In addition, also there is the situation that can change because of the temperature form and aspect in preserving.
Therefore, present situation is to seek to provide a kind of can be confirmed the anisotropic conductive film of good connection state and bad connection state and excellent storage stability and be used the method for attachment of this anisotropic conductive film and use the conjugant of above-mentioned anisotropic conductive film by the variation of form and aspect.
Summary of the invention
Invent problem to be solved
Problem of the present invention is to solve existing described problems, realizes following object.That is, the object of this invention is to provide and can confirm the anisotropic conductive film of good connection state and bad connection state and excellent storage stability and use the method for attachment of this anisotropic conductive film and use the conjugant of above-mentioned anisotropic conductive film by the variation of form and aspect.
For solving the means of problem
As follows for solving the means of described problem.That is,
< 1 > anisotropic conductive film, is connected the terminal of the first circuit block and the terminal anisotropic conductive of second circuit parts, it is characterized in that,
Have and contain the second layer that film forms the first layer of resin and contains film formation resin,
At least arbitrary layer in described the first layer and the described second layer contains electroconductive particle,
One deck in described the first layer and the described second layer contains leuco dye, another layer contain by with the interact foxy agent of the foxy that makes described anisotropic conductive film of described leuco dye.
< 2 > are according to the anisotropic conductive film described in above-mentioned < 1 >, and foxy agent is developer.
Anisotropic conductive film described in above-mentioned < 1 > of < 3 > root, in the first layer and the second layer, the one deck that contains leuco dye is alkalescence, another layer that contains foxy agent is for acid, and described foxy agent is acid foxy agent.
< 4 > are according to the anisotropic conductive film described in above-mentioned < 1 >, in the first layer and the second layer, the one deck that contains leuco dye is for acid, another layer that contains foxy agent is alkalescence, and described foxy agent is alkaline foxy agent.
< 5 > are according to the anisotropic conductive film described in any one in above-mentioned < 1 >～< 4 >, a side in the first layer and the second layer be contain electroconductive particle and film form resin containing electroconductive particle layer, the opposing party is contained the insulativity bonding coat that film forms resin.
< 6 > are according to the anisotropic conductive film described in any one in above-mentioned < 1 >～< 5 >, the first layer contains curable resin and solidifying agent, and the second layer contains curable resin and solidifying agent.
< 7 > are according to the anisotropic conductive film described in above-mentioned < 6 >, and the curable resin in the first layer is free-radical polymerised compound, and solidifying agent is organo-peroxide,
Curable resin in the second layer is free-radical polymerised compound, and solidifying agent is organo-peroxide.
< 8 > method of attachment, is connected the terminal of the first circuit block and the terminal anisotropic conductive of second circuit parts, it is characterized in that, comprises:
On the terminal of described the first circuit block, configure the first arrangement step of the anisotropic conductive film described in any one in above-mentioned < 1 >～< 7 >;
The mode of joining with terminal and the described anisotropic conductive film of described second circuit parts in described anisotropic conductive film configures the second arrangement step of described second circuit parts;
The heating extrusion process that utilizes heating extruder member that described second circuit parts are heated and pushed.
< 9 > conjugant, is characterized in that having:
With the first circuit block of terminal, with the second circuit parts of terminal, be situated between and be located between described the first circuit block and described second circuit parts and the cured article of the anisotropic conductive film that the terminal of the terminal of described the first circuit block and described second circuit parts is electrically connected to
Described anisotropic conductive film is the anisotropic conductive film described in any one in above-mentioned < 1 >～< 7 >.
Invention effect
According to the present invention, can solve existing described problems, realize described object, can provide and can confirm the anisotropic conductive film of good connection state and bad connection state and excellent storage stability and use the method for attachment of this anisotropic conductive film and use the conjugant of above-mentioned anisotropic conductive film by the variation of form and aspect.
Accompanying drawing explanation
Fig. 1 is the explanatory view that shows the measuring method of the conducting resistance in embodiment.
Embodiment
(anisotropic conductive film)
Anisotropic conductive film of the present invention at least has the first layer and the second layer, further has as required other layer.
Above-mentioned anisotropic conductive film is the anisotropic conductive film that the terminal of the first circuit block and the terminal anisotropic conductive of second circuit parts are connected.
< the first layer, second layer >
Above-mentioned the first layer at least contains film and forms resin, further contains as required other composition.
The above-mentioned second layer at least contains film and forms resin, further contains as required other composition.
At least arbitrary layer in above-mentioned the first layer and the above-mentioned second layer contains electroconductive particle.
One deck in above-mentioned the first layer and the above-mentioned second layer contains leuco dye, and another layer contains foxy agent.
A side in preferred above-mentioned the first layer and the above-mentioned second layer be contain above-mentioned electroconductive particle and above-mentioned film form resin containing electroconductive particle layer, the opposing party is contained the insulativity bonding coat that above-mentioned film forms resin.
Above-mentioned the first layer preferably further contains curable resin and solidifying agent.
The above-mentioned second layer preferably further contains curable resin and solidifying agent.
Above-mentioned curable resin in above-mentioned the first layer is preferably free-radical polymerised compound.
Above-mentioned solidifying agent in above-mentioned the first layer is preferably organo-peroxide.
Above-mentioned curable resin in the above-mentioned second layer is preferably free-radical polymerised compound.
Above-mentioned solidifying agent in the above-mentioned second layer is preferably organo-peroxide.
Mode for above-mentioned the first layer and the above-mentioned second layer illustrates an example.
< < first method > >
First method is the mode that above-mentioned foxy agent is developer.
In above-mentioned first method, the above-mentioned one deck that contains above-mentioned leuco dye can be also neutrality for alkalescence, but is preferably weakly alkaline.Above-mentioned another layer that contains above-mentioned developer can, for alkalescence can be also neutrality, can also be acidity, but be preferably alkalescence, neutrality.
In above-mentioned first method, before connection, above-mentioned leuco dye does not develop the color, and therefore, above-mentioned anisotropic conductive film is the color that procrypsis or other material bring.When using this anisotropic conductive film to carry out the connection of above-mentioned the first circuit block and above-mentioned second circuit parts with suitable condition, the above-mentioned developer of above-mentioned another layer melts because of heat, and above-mentioned another layer becomes acidity.And, by utilization, pressurize above-mentioned another layer and above-mentioned one deck are mixed, thus above-mentioned leuco dye colour developing.
< < second method > >
Second method is that above-mentioned one deck of containing above-mentioned leuco dye is alkalescence, and above-mentioned another layer that contains above-mentioned foxy agent is for acid, and above-mentioned foxy agent is the mode of acid foxy agent.The acidity of above-mentioned another layer is to result from the acidity of above-mentioned foxy agent.
In above-mentioned second method, before connection, above-mentioned leuco dye does not develop the color, and therefore, above-mentioned anisotropic conductive film is the color that procrypsis or other material bring.When using this anisotropic conductive film to carry out the connection of above-mentioned the first circuit block and above-mentioned second circuit parts with suitable condition, by utilizing heat and pressurization to be acid above-mentioned another layer and above-mentioned one deck and to mix resulting from above-mentioned foxy agent, above-mentioned leuco dye develops the color thus.
< < Third Way > >
Third Way be above-mentioned one deck of containing above-mentioned leuco dye for acid, above-mentioned another layer that contains above-mentioned foxy agent is alkalescence, and above-mentioned foxy agent is the mode of alkaline foxy agent.The alkalescence of above-mentioned another layer is to result from the alkalescence of above-mentioned foxy agent.
In above-mentioned Third Way, before connection, above-mentioned leuco dye colour developing, therefore, above-mentioned anisotropic conductive film is the color that above-mentioned leuco dye brings.When using this anisotropic conductive film to carry out the connection of above-mentioned the first circuit block and above-mentioned second circuit parts with suitable condition, by utilize heat and pressurization by result from above-mentioned foxy agent be alkalescence above-mentioned another layer and above-mentioned one deck mix, above-mentioned leuco dye colour killing thus.
At this, acidity refers to that pH is lower than 6.5, and neutrality refers to that pH is 6.5～7.5, and alkalescence refers to that pH surpasses 7.5.Weakly alkaline refers to that pH surpasses below 7.5 and 9.0.
The pH of each layer for example extracts at 100 ℃ by pure water, and extractum can pass through digital pH meter (such as Heng Chuan Electric Co., Ltd system etc.) and measure.
Mean thickness as above-mentioned the first layer and the above-mentioned second layer, is not particularly limited, can be according to the suitable selection of object, but be preferably respectively 1 μ m～30 μ m, more preferably 3 μ m～20 μ m, are particularly preferably 5 μ m～10 μ m.
Below, the details of above-mentioned various materials are described.
-leuco dye-
Above-mentioned leuco dye is the compound that shows supplied for electronic, is the dyestuff former of himself procrypsis or light color.As above-mentioned leuco dye, be not particularly limited, can be according to the suitable selection of object, but be preferably the procrypsis compounds such as triphenyl methane phthalide-type, triallyl methane class, Material of Fluoran, phenothiazines, sulfo-Material of Fluoran, cluck ton class, indoles phthaloyl class, spiro-pyrans class, pyridine phthaleins, chromene pyrazoles, methine class, rhodamine anilino lactams, rhodamine lactams, quinazoline ditosylate salt, diaza cluck ton class, dilactone class, more preferably the leuco dye of Material of Fluoran, phthalide-type.
As above-mentioned leuco dye, particularly, for example, can enumerate 2-anilino-3-methyl-6-diethylamino fluorane, 2-anilino-3-methyl-6-(di-n-butyl is amino) fluorane, 2-anilino-3-methyl-6-(N-n-propyl-N-methylamino) fluorane, 2-anilino-3-methyl-6-(the different n-propyl-N-of N-methylamino) fluorane, 2-anilino-3-methyl-6-(N-isobutyl--N-methylamino) fluorane, 2-anilino-3-methyl-6-(N-n-pentyl-N-methylamino) fluorane, 2-anilino-3-methyl-6-(N-sec-butyl-N-ethylamino) fluorane, 2-anilino-3-methyl-6-(N-n-pentyl-N-ethylamino) fluorane, 2-anilino-3-methyl-6-(N-isopentyl-N-ethylamino) fluorane, 2-anilino-3-methyl-6-(the different n-propyl of N-n-propyl-N-is amino) fluorane, 2-anilino-3-methyl-6-(N-cyclohexyl-N-methylamino) fluorane, 2-anilino-3-methyl-6-(N-ethyl-N-para-totuidine base) fluorane, 2-anilino-3-methyl-6-(N-methyl-N-para-totuidine base) fluorane, 3-diethylamino-7,8-benzo fluorane, 1,3-dimethyl-6-diethylamino fluorane, the amino fluorane of 1,3-dimethyl-6-di-n-butyl, 3-diethylamino-7-methyl fluoran, 3-diethylamino-7-chlorine fluorane, 3-diethylamino-6-methyl-7-chlorine fluorane, 10-diethylamino-2-ethyl benzo ［ Isosorbide-5-Nitrae ］ thiazine is ［ 3,2-b ］ fluorane also, two (1-normal-butyl-2 methyl indole-3-yl) phthalides of 3,3-, two (4-diethylamino-2-ethoxyl phenenyl)-4-azepine phthalides of 3,3-, 3-［ two (1-Ethyl-2-Methyl-3-indyl) vinyl of 2,2-］-3-(4-diethylamino phenyl) phthalide, 3-［ two (the 4-diethylamino phenyl) ethylidene-2-yls of 1,1-］-6-dimethylamino phthalide etc.
Content as the above-mentioned leuco dye in the above-mentioned one deck that contains above-mentioned leuco dye, be not particularly limited, can be according to the suitable selection of object, but with respect to above-mentioned one deck 100 mass parts, be preferably 1 mass parts～15 mass parts, more preferably 2 mass parts～10 mass parts.
-foxy agent-
As above-mentioned foxy agent, so long as by with the interact foxy agent of the foxy that makes above-mentioned anisotropic conductive film of above-mentioned leuco dye, be just not particularly limited, can be according to the suitable selection of object.The variation of the form and aspect of the above-mentioned anisotropic conductive film that above-mentioned foxy agent causes produces when above-mentioned the first circuit block is connected with the anisotropic conductive of above-mentioned second circuit parts.
As above-mentioned interaction, such as enumerating mode (above-mentioned first method) that above-mentioned leuco dye and above-mentioned foxy agent contact with each other with molecule and react, make the mode (above-mentioned second method) of above-mentioned leuco dye oxidation, alkalescence by above-mentioned foxy agent make the mode (above-mentioned Third Way) etc. of above-mentioned leuco dye reduction by the acidity of above-mentioned foxy agent.
The variation of above-mentioned form and aspect can be from coloured to other coloured variation, can be also from procrypsis to coloured variation, can also be the variation from coloured to procrypsis.
Above-mentioned foxy agent is developer in above-mentioned first method, is acid foxy agent in above-mentioned second method, is alkaline foxy agent in above-mentioned Third Way.
--developer--
As above-mentioned developer, so long as react when heating with respect to above-mentioned leuco dye, make the various electronics acceptability materials of its colour developing, be just not particularly limited, can, according to the suitable selection of object, can enumerate organic acidity compound etc.As above-mentioned organic acidity compound, such as enumerating phenolic compound etc.
As described phenolic compound, for example, can enumerate bisphenol S, dihydroxyphenyl propane (4,4 '-isopropylidene biphenol), tetrabromo-bisphenol (4.4 '-isopropylidene two (2,6-dibromophenol)), 1,1 '-isopropylidene two (2-chlorophenol), 4,4 '-isopropylidene two (2,6-chlorophenesic acid), 4,4 '-isopropylidene two (2-methylphenol), 4,4 '-isopropylidene two (2,6-xylenol), 4,4 '-isopropylidene two (2-TBP), 4,4 '-sec.-butylidene biphenol, 4,4 '-cyclohexylidene bis-phenol, 4,4 '-cyclohexylidene two (2-methylphenol), 4-TBP, 4-phenylphenol, 4-hydroxyl-4 '-methoxyl group sulfobenzide, 4-hydroxyl-4 '-ethoxy diphenyl base sulfone, 4-hydroxyl-4 '-isopropoxy sulfobenzide, 4-hydroxyl-4 '-propoxy-sulfobenzide, 4-hydroxyl-4 '-butoxy sulfobenzide, 4-hydroxyl-4 '-isopropoxy sulfobenzide, 4-hydroxyl-4 '-sec-butoxy sulfobenzide, 4-hydroxyl-4 '-tert.-butoxy sulfobenzide, 4-hydroxyl-4 '-benzyloxy sulfobenzide, 4-hydroxyl-4 '-phenoxy group sulfobenzide, 4-hydroxyl-4 '-(a methyl benzyloxy) sulfobenzide, 4-hydroxyl-4 '-(to methyl benzyloxy) sulfobenzide, 4-hydroxyl-4 '-(adjacent methyl benzyloxy) sulfobenzide, 4-hydroxyl-4 '-(to chlorine benzyloxy) sulfobenzide, 4-hydroxyl-4 '-allyloxy sulfobenzide, 2,2 '-bis-(4-(4-hydroxy phenyl alkylsulfonyl) phenoxy group) Anaesthetie Ether etc.Wherein, owing to producing good color reaction under the Heating temperature when above-mentioned the first circuit block is connected with the anisotropic conductive of above-mentioned second circuit parts; so be preferably 4-hydroxyl-4 '-isopropoxy sulfobenzide (such as D-8 of Tso Tat Co., Ltd., Japan's system etc.), 2,2 '-bis-(4-(4-hydroxy phenyl alkylsulfonyl) phenoxy group) Anaesthetie Ether (such as D-90 of Tso Tat Co., Ltd., Japan's system etc.).
Content as the above-mentioned developer in above-mentioned another layer that contains above-mentioned developer, be not particularly limited, can be according to the suitable selection of object, but with respect to above-mentioned another layer 100 mass parts, be preferably 1 mass parts～15 mass parts, more preferably 2 mass parts～10 mass parts.
--acid foxy agent--
The foxy agent of above-mentioned acidity is so long as by making above-mentioned another layer for acid, makes above-mentioned leuco dye colour developing thus when above-mentioned one deck and above-mentioned another layer mix, and is just not particularly limited, can be according to the suitable selection of object, such as enumerating phosphoric acid ester etc.As above-mentioned phosphoric acid ester, such as enumerating p thiodipropionic acid ester, phosphoric acid methacrylic ester etc.Above-mentioned phosphoric acid ester is as long as show that acidity also can modification, as the phosphoric acid ester of above-mentioned modification, such as enumerating oxyethane modified phosphate dimethacrylate (such as the PM-21 of Nippon Kayaku K. K's system etc.).
Content as the foxy agent of the above-mentioned acidity in above-mentioned another layer of the foxy agent that contains above-mentioned acidity, as long as can make above-mentioned another layer is desirable acidity, just be not particularly limited, can be according to the suitable selection of object, but with respect to above-mentioned another layer 100 mass parts, be preferably 0.1 mass parts～10 mass parts, more preferably 0.5 mass parts～5 mass parts.
--foxy agent of alkalescence--
The foxy agent of above-mentioned alkalescence is so long as be alkalescence by making above-mentioned another layer, and when above-mentioned one deck and above-mentioned another layer mix, make the above-mentioned leuco dye colour killing of colour developing, just be not particularly limited, can be according to the suitable selection of object, such as enumerating amine compound etc.As above-mentioned amine compound, so long as there is amino compound, be just not particularly limited, can, according to the suitable selection of object, such as enumerating, there is amino silane coupling agent etc.
Content as the foxy agent of the above-mentioned alkalescence in above-mentioned another layer of the foxy agent that contains above-mentioned alkalescence, as long as can make above-mentioned another layer is desirable alkalescence, just be not particularly limited, can be according to the suitable selection of object, but with respect to above-mentioned another layer 100 mass parts, be preferably 0.1 mass parts～10 mass parts, more preferably 0.5 mass parts～5 mass parts.
-film formation resin-
As above-mentioned film, form resin, be not particularly limited, can be according to the suitable selection of object, such as enumerating phenoxy resin, unsaturated polyester resin, saturated polyester resin resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, polyolefin resin etc.Above-mentioned film forms resin and can be used, or two or more may be used separately.Wherein, from masking, processibility, connection reliability this point, be preferably phenoxy resin.
As above-mentioned phenoxy resin, such as enumerating by dihydroxyphenyl propane and the synthetic resin of Epicholorohydrin etc.
Above-mentioned phenoxy resin can be used suitable synthetic phenoxy resin, also can use commercially available product.
The content that forms resin as the above-mentioned film in above-mentioned the first layer and the above-mentioned second layer, is not particularly limited, can be according to the suitable selection of object, but be preferably respectively 20 quality %～70 quality %, and 30 quality %～60 quality % more preferably.
-curable resin-
As above-mentioned curable resin, be not particularly limited, can be according to the suitable selection of object, such as enumerating epoxy resin, free-radical polymerised compound etc.
--epoxy resin--
As above-mentioned epoxy resin, be not particularly limited, can be according to the suitable selection of object, such as enumerating bisphenol A type epoxy resin, bisphenol f type epoxy resin, phenolic resin varnish type epoxy resin, their modified epoxy, alicyclic epoxy resin etc.They can be used, or two or more may be used separately.
--free-radical polymerised compound--
As above-mentioned free-radical polymerised compound, be not particularly limited, can be according to the suitable selection of object, for example can enumerate methyl acrylate, ethyl propenoate, isopropyl acrylate, isobutyl acrylate, acrylic acid epoxy ester, glycol diacrylate, diethylene glycol diacrylate, Viscoat 295, dihydroxymethyl tristane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxyl-1, 3-bis-acryloxy propane, 2, two ［ 4-(acryloyl-oxy ylmethoxy) phenyl ］ propane of 2-, 2, two ［ 4-(acryloyl-oxy base oxethyl) phenyl ］ propane of 2-, vinylformic acid two cyclopentenes esters, vinylformic acid tricyclodecenyl esters, three (acryloxy ethyl) isocyanuric acid ester, ammonia ester acrylate etc.They can be used, or two or more may be used separately.
In addition, can enumerate and change aforesaid propylene acid esters into methacrylic ester, they can be used, or two or more may be used separately.
Content as the above-mentioned curable resin in above-mentioned the first layer and the above-mentioned second layer, is not particularly limited, can be according to the suitable selection of object, but be preferably respectively 20 quality %～70 quality %, and 30 quality %～60 quality % more preferably.
-solidifying agent-
As above-mentioned solidifying agent, be not particularly limited, can be according to the suitable selection of object, such as enumerating imidazoles, organo-peroxide, anionic species solidifying agent, cationic solidifying agent etc.
As above-mentioned imidazoles, such as enumerating 2-ethyl 4-methylimidazole etc.
As above-mentioned organo-peroxide, such as enumerating lauroyl peroxide, butylperoxide, dilauroyl peroxide, dibutyl superoxide, peroxy dicarbonate, benzoyl peroxide etc.
As above-mentioned anionic species solidifying agent, such as enumerating organic amine etc.
As above-mentioned cationic solidifying agent, for example can enumerate sulfonium salt,
salt, aluminum chelating agent etc.
Content as the above-mentioned solidifying agent in above-mentioned the first layer and the above-mentioned second layer, is not particularly limited, can be according to the suitable selection of object, but be preferably respectively 1 quality %～10 quality %, and 2 quality %～8 quality % more preferably.
Combination as above-mentioned curable resin and above-mentioned solidifying agent, be not particularly limited, can be according to the suitable selection of object, but be preferably the combination of the combination of above-mentioned epoxy resin and above-mentioned cationic solidifying agent, above-mentioned free-radical polymerised compound and above-mentioned organo-peroxide.
-electroconductive particle-
As above-mentioned electroconductive particle, be not particularly limited, can be according to the suitable selection of object, such as enumerating metallics, coating metal resin particle etc.
As above-mentioned metallics, be not particularly limited, can be according to the suitable selection of object, such as enumerating nickel, cobalt, silver, copper, gold, palladium, tin etc.They can be used, or two or more may be used separately.
Wherein more preferably nickel, silver, copper.Their metallics, for the object that prevents surface oxidation, also can impose gold, palladium to its surface.Further also can use the particle that imposes insulating coating on surface with metal protuberance or organism.
As above-mentioned coating metal resin particle, so long as the surface of resin particle with coating metal particle, just be not particularly limited, can be according to the suitable selection of object, such as can enumerate resin particle at least any coating metal in nickel, silver, tin, copper, gold and palladium for surface particle etc.Further, also can use the particle that imposes insulating coating on surface with metal protuberance or organism.In the situation that considering low-resistance connection, the surface of preferred resin particle with silver-colored coating particle.
Coating method as the above-mentioned resin particle of metal pair, is not particularly limited, can be according to the suitable selection of object, such as enumerating electroless plating method, sputtering method etc.
Material as above-mentioned resin particle, be not particularly limited, can be according to the suitable selection of object, such as enumerating styrene diethylene benzene copoly mer, benzoguanamine resin, cross-linked polystyrene resin, acrylic resin, vinylbenzene-silicon-dioxide compound resin etc.
Above-mentioned electroconductive particle is when anisotropic conductive connects, as long as have electroconductibility.For example, even impose the particle of insulating coating on the surface of metallics, as long as above-mentioned metallics is exposed in above-mentioned particle distortion when anisotropic conductive connects, just can be used as above-mentioned electroconductive particle.
Median size as above-mentioned electroconductive particle, is not particularly limited, can be according to the suitable selection of object, but be preferably 1 μ m～50 μ m, more preferably 2 μ m～25 μ m, are particularly preferably 2 μ m～10 μ m.
The mean value that above-mentioned median size is particle diameter that any 10 electroconductive particles are recorded.
Above-mentioned particle diameter for example can be observed to measure by scanning electron microscope.
As the above-mentioned content containing the above-mentioned electroconductive particle in electroconductive particle layer, be not particularly limited, can be according to the suitable selection of object, but be preferably 0.5 quality %～10 quality %, 1 quality %～4 quality % more preferably.
-the first circuit block, second circuit parts-
As above-mentioned the first circuit block and above-mentioned second circuit parts, so long as there is terminal and use the circuit block that becomes the object that anisotropic conductive connects of above-mentioned anisotropic conductive film, just be not particularly limited, can be according to the suitable selection of object, can enumerate the glass substrate with terminal, the plastic base with terminal, IC (Integrated Circuit), TAB (Tape Automated Bonding) band, Flex-on-Glass (flexible board encapsulation on glass, FOG), Chip-on-Glass (glass top chip encapsulation, COG), Chip-on-Flex (Chip Packaging on flexible board, COF), Flex-on-Board (flexible board encapsulation on plate, FOB), Flex-on-Flex (flexible board encapsulation on flexible board, FOF), liquid crystal panel etc.
As the above-mentioned glass substrate with terminal, such as enumerating ITO (Indium Tin Oxide) glass substrate, IZO (Indium Zinc Oxide) glass substrate, other glass pattern substrate etc.Among them, preferred ito glass substrate, IZO glass substrate.
As above-mentioned material, the structure with the plastic base of terminal, be not particularly limited, can be according to the suitable selection of object, such as can enumerate have terminal rigid substrates, there is the flexible base, board of terminal etc.
As above-mentioned IC, such as the liquid crystal panel control IC chip etc. that can enumerate in flat-panel monitor (FPD).
Shape, size as above-mentioned the first circuit block and above-mentioned second circuit parts, be not particularly limited, can be according to the suitable selection of object.
Above-mentioned the first circuit block and above-mentioned second circuit parts can be identical circuit blocks, can be also different circuit blocks.
Mean thickness as above-mentioned anisotropic conductive film, is not particularly limited, can be according to the suitable selection of object, but be preferably 2 μ m～60 μ m, more preferably 5 μ m～30 μ m, are particularly preferably 10 μ m～20 μ m.
(method of attachment)
Method of attachment of the present invention at least comprises the first arrangement step, the second arrangement step, heating extrusion process, further comprises as required other operation.
Above-mentioned method of attachment is the method that the terminal of the first circuit block is connected with the terminal anisotropic conductive of second circuit parts.
As above-mentioned the first circuit block and above-mentioned second circuit parts, be not particularly limited, can be according to the suitable selection of object, for example can enumerate respectively illustrated above-mentioned the first circuit block and above-mentioned second circuit parts in the explanation of above-mentioned anisotropic conductive film of the present invention.
< the first arrangement step >
As above-mentioned the first arrangement step, so long as configure the operation of above-mentioned anisotropic conductive film of the present invention on the terminal of above-mentioned the first circuit block, be just not particularly limited, can be according to the suitable selection of object.
In the situation that above-mentioned anisotropic conductive film has containing electroconductive particle layer and insulativity bonding coat, conventionally with the terminal of above-mentioned the first circuit block and the mode of joining containing electroconductive particle layer of above-mentioned anisotropic conductive film, carry out above-mentioned the first arrangement step.
< the second arrangement step >
As above-mentioned the second arrangement step, so long as the mode of joining with terminal and the above-mentioned anisotropic conductive film of above-mentioned second circuit parts in above-mentioned anisotropic conductive film configures the operation of above-mentioned second circuit parts, just be not particularly limited, can be according to the suitable selection of object.
In the situation that above-mentioned anisotropic conductive film has containing electroconductive particle layer and insulativity bonding coat, the mode of conventionally joining with the terminal of above-mentioned second circuit parts and the insulativity bonding coat of above-mentioned anisotropic conductive film is carried out above-mentioned the second arrangement step.
< heating extrusion process >
As above-mentioned heating extrusion process, so long as utilize, heat the operation that extruder member heats and pushes above-mentioned second circuit parts, be just not particularly limited, can be according to the suitable selection of object.
As above-mentioned heating extruder member, such as enumerating extruder member having heating arrangements etc.As the extruder member with above-mentioned heating arrangements, such as enumerating hot-pressing tool etc.
Temperature as above-mentioned heating, is not particularly limited, can be according to the suitable selection of object, but be preferably 120 ℃～200 ℃.
Pressure as above-mentioned extruding, is not particularly limited, can be according to the suitable selection of object, but be preferably 0.5MPa～100MPa.
Time as above-mentioned heating and extruding, is not particularly limited, can be according to the suitable selection of object, but be preferably 0.5 second～10 seconds.
(conjugant)
Conjugant of the present invention at least has the cured article of the first circuit block, second circuit parts, anisotropic conductive film, further has as required other parts.
As above-mentioned the first circuit block and above-mentioned second circuit parts, be not particularly limited, can be according to the suitable selection of object, for example can enumerate respectively illustrated above-mentioned the first circuit block and above-mentioned second circuit parts in the explanation of above-mentioned anisotropic conductive film of the present invention.
Above-mentioned anisotropic conductive film is above-mentioned anisotropic conductive film of the present invention.
The cured article of above-mentioned anisotropic conductive film is situated between and is located between above-mentioned the first circuit block and above-mentioned second circuit parts, and the terminal of the terminal of above-mentioned the first circuit block and above-mentioned second circuit parts is electrically connected to.
Above-mentioned conjugant for example can be manufactured by above-mentioned method of attachment of the present invention.
[embodiment]
Below, embodiments of the invention are described, but the present invention is not subject to any restriction of these embodiment.
Embodiment 1
The making of < anisotropic conductive film (2 layers of structure) >
-making of insulativity bonding coat-
By phenoxy resin (trade(brand)name: PKHC, Tomoe Engineering Co., Ltd.'s system) 47 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 44 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts and developer (trade(brand)name: D-8, Tso Tat Co., Ltd., Japan's system, 130 ℃ of melting points) 6 mass parts homogeneous mixing.Mixed title complex be take to the PET (polyethylene terephthalate) that mode that dried mean thickness is 8 μ m coats silicone-treated with excellent painting machine upper, at 70 ℃ dry 5 minutes, make insulativity bonding coat.
-containing the making of electroconductive particle layer-
By phenoxy resin (trade(brand)name: PKHJ, Tomoe Engineering Co., Ltd.'s system) 45 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 46 mass parts, electroconductive particle (trade(brand)name: AUL704, Sekisui Chemical Co., Ltd's system, median size 4 μ m) 2 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts, silane coupling agent (trade(brand)name: KBE-903, Shin-Etsu Chemial Co., Ltd's system) 1 mass parts, phosphoric acid ester (trade(brand)name: PM-21, Nippon Kayaku K. K's system) 1 mass parts and red leuco dye (trade(brand)name: RED-40, Yamamoto Chemicals Co., Ltd's system) 6 mass parts homogeneous mix.Mixed weakly alkaline title complex be take to the mode that dried mean thickness is 8 μ m to be coated on the PET (polyethylene terephthalate) of silicone-treated with excellent painting machine, at 70 ℃ dry 5 minutes, make weakly alkaline (pH8.3) containing electroconductive particle layer.
In addition, silane coupling agent is carry out pH adjustment and improve the closing force of glass is used.Phosphoric acid ester is carry out pH adjustment and improve the binding property of metal is used.
By insulativity bonding coat obtained above with containing electroconductive particle layer, use roll-type laminating machine to carry out lamination at 45 ℃ of roll temperatures, obtain anisotropic conductive film.
The color of the anisotropic conductive film of making is because the color of electroconductive particle is faint yellow.
The manufacture > of < conjugant
By following method, manufacture conjugant.
As second circuit parts, COF for in-service evaluation (Chip Packaging on flexible board) (デ Network セリアル ズ Co., Ltd. evaluation base material, 50 μ mP (spacing), Cu8 μ mt (thickness)-plating Sn, PI (polyimide) 38 μ mt (thickness)-S ' perflex base materials).
As the first circuit block, use ITO coated glass (デ Network セリアル ズ Co., Ltd. evaluation base material, complete surperficial ITO coating, thickness of glass 0.7mm).
On above-mentioned the first circuit block, in above-mentioned mode of joining containing electroconductive particle layer and above-mentioned the first circuit block, configure the above-mentioned anisotropic conductive film that is cut into width 1.5mm.During configuration, with 80 ℃, 1MPa, within 1 second, attach.Then, in this anisotropic conductive film, not configure above-mentioned second circuit parts from the outstanding mode of above-mentioned anisotropic conductive film.Then, via cushioning material (special teflon (registered trademark), thickness 0.15mm), utilize heating tool (width 1.5mm) with the condition of contact shown in table 1 and table 2, above-mentioned second circuit parts are heated and pushed, obtain conjugant.
< evaluates >
The conjugant of made is carried out to following evaluation.Table 1 and table 2 represent result.
In addition, by using its situation (unaged) of making conjugant and evaluate 40 ℃ of 2 days (aging) rear its situations of making conjugant of using of preserving after having made anisotropic conductive film at once.
The variation > > of < < form and aspect
Use colour-difference meter (NF333, Japanese electricity Se Industrial Co., Ltd system) to confirm the variation of the form and aspect of the anisotropic conductive film before and after heating and extruding.After being represented to connect by Δ E with respect to the aberration before connecting.
< < conducting resistance > >
By following method, measure the conduction resistance value (Ω) at the initial stage of conjugant.
Particularly, by the method that the manufacture with above-mentioned conjugant is identical, make test body as shown in Figure 1, and use digital multimeter (model: digital multimeter 7555, Yokogawa Electric Corporation's system) to measure the resistance value while flowing through 1mA electric current with 4 terminal methods.30 passages are measured to resistance value, and take maximum resistance value as measured value.In Fig. 1, symbol 1 represents glass baseplate, and symbol 2 represents ACF, and symbol 3 represents the pattern of COF, and symbol 4 represents ITO distribution, and symbol A represents to measure site.
< < connection state > >
According to the conducting state of the solid state of anisotropic conductive film and conjugant, with following metewand, evaluate connection state.
(metewand)
Good: uncured and poor flow does not all occur.
Bad: at least any appearance in uncured and poor flow.
In addition, " uncured " refers to before and after crimping and anisotropic conductive film carried out to FT-IR mensuration, the state of the minimizing value less than 80% of vinyl (residual more than 20% state of vinyl)." poor flow " is that conducting resistance is state more than 3.0 Ω.
Embodiment 2
The making of < anisotropic conductive film (2 layers of structure) >
-making of insulativity bonding coat-
By phenoxy resin (trade(brand)name: PKHC, Tomoe Engineering Co., Ltd.'s system) 47 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 38 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts and phosphoric acid ester (trade(brand)name: PM-21, Nippon Kayaku K. K's system) 2 mass parts homogeneous mix.The title complex of mixed acidity be take to the mode that dried mean thickness is 8 μ m to be coated on the PET (polyethylene terephthalate) of silicone-treated with excellent painting machine, at 70 ℃, be dried 5 minutes, make the insulativity bonding coat of acid (pH5.4).
In addition, phosphoric acid ester is used for making pH be acid.
By in insulativity bonding coat obtained above and embodiment 1, obtain containing electroconductive particle layer, use roll-type laminating machine to carry out lamination at 45 ℃ of roll temperatures, obtain anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
The anisotropic conductive film that use obtains, makes conjugant similarly to Example 1, evaluates.Table 1 and table 2 represent result.
Embodiment 3
The making of < anisotropic conductive film (2 layers of structure) >
-making of insulativity bonding coat-
By phenoxy resin (trade(brand)name: PKHC, Tomoe Engineering Co., Ltd.'s system) 47 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 38 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts and silane coupling agent (trade(brand)name: KBE-903, Shin-Etsu Chemial Co., Ltd's system) 2 mass parts homogeneous mix.The title complex of mixed alkalescence be take to the mode that dried mean thickness is 8 μ m to be coated on the PET (polyethylene terephthalate) of silicone-treated with excellent painting machine, at 70 ℃, be dried 5 minutes, make the insulativity bonding coat of alkalescence (pH9.2).
-containing the making of electroconductive particle layer-
By phenoxy resin (trade(brand)name: PKHJ, Tomoe Engineering Co., Ltd.'s system) 45 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 46 mass parts, electroconductive particle (trade(brand)name: AUL704, Sekisui Chemical Co., Ltd's system, median size 4 μ m) 2 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts, silane coupling agent (trade(brand)name: KBE-503, Shin-Etsu Chemial Co., Ltd's system) 1 mass parts, phosphoric acid ester (trade(brand)name: PM-21, Nippon Kayaku K. K's system) 2 mass parts and red leuco dye (trade(brand)name: RED-40, Yamamoto Chemicals Co., Ltd's system) 6 mass parts homogeneous mix.The title complex of mixed acidity be take to the mode that dried mean thickness is 8 μ m to be coated on the PET (polyethylene terephthalate) of silicone-treated with excellent painting machine, at 70 ℃ dry 5 minutes, make acid (pH5.2) containing electroconductive particle layer.Color containing electroconductive particle layer is the redness that leuco dye causes.
By insulativity bonding coat obtained above with containing electroconductive particle layer, use roll-type laminating machine to carry out lamination at 45 ℃ of roll temperatures, obtain anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of leuco dye is red.
The anisotropic conductive film that use obtains, makes conjugant similarly to Example 1, evaluates.Table 1 and table 2 represent result.
Embodiment 4
The making > of < anisotropic conductive film
Except the red leuco dye containing electroconductive particle layer in embodiment 1 in addition, is made to anisotropic conductive film similarly to Example 1 instead of leuco dye (PSD-HR, Tso Tat Co., Ltd., Japan's system).
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 5
The making > of < anisotropic conductive film
Except the developer of insulativity bonding coat in embodiment 1 in addition, is made to anisotropic conductive film similarly to Example 1 instead of developer (TG-SH, Nippon Kayaku K. K's system).
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 6
The making > of < anisotropic conductive film
Except the amount of the red leuco dye when making containing electroconductive particle layer in embodiment 1 changes to 10 mass parts from 6 mass parts, make similarly to Example 1 anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 7
The making > of < anisotropic conductive film
Except the amount of the red leuco dye when making containing electroconductive particle layer in embodiment 1 changes to 2 mass parts from 6 mass parts, make similarly to Example 1 anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 8
The making > of < anisotropic conductive film
Except the amount of the developer when making insulativity bonding coat in embodiment 1 changes to 10 mass parts from 6 mass parts, make similarly to Example 1 anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 9
The making > of < anisotropic conductive film
Except the amount of the developer when making insulativity bonding coat in embodiment 1 changes to 2 mass parts from 6 mass parts, make similarly to Example 1 anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Embodiment 10
The making > of < anisotropic conductive film
Except the electroconductive particle when making containing electroconductive particle layer in embodiment 1 in addition, is made anisotropic conductive film similarly to Example 1 instead of electroconductive particle (AUL705, Sekisui Fine Chemical Co., Ltd.'s system).
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Comparative example 1
The making of < anisotropic conductive film (1 layer of structure): triphenylmethane pigment >
By phenoxy resin (trade(brand)name: PKHC, Tomoe Engineering Co., Ltd.'s system) 42 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 40 mass parts, electroconductive particle (trade(brand)name: AUL704, Sekisui Chemical Co., Ltd's system, median size 4 μ m) 2 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts, silane coupling agent (trade(brand)name: KBE-903, Shin-Etsu Chemial Co., Ltd's system) 1 mass parts, phosphoric acid ester (trade(brand)name: PM-21, Nippon Kayaku K. K's system) 1 mass parts and triphenylmethane pigment (trade(brand)name: C.I. solvent red 18, Baotugu Chemical Industrial Co., Ltd's system) 3 mass parts homogeneous mix.Mixed title complex be take to the PET (polyethylene terephthalate) that mode that dried mean thickness is 8 μ m coats silicone-treated with excellent painting machine upper, at 70 ℃ dry 5 minutes, make anisotropic conductive film.
The color of the anisotropic conductive film of made is because the color of pigment is red.
Carry out evaluation similarly to Example 1.Table 1 and table 2 represent result.
Comparative example 2
The making of < bonding film (1 layer of structure): imidazoles tackiness agent >
By phenoxy resin (trade(brand)name: YP-50, Nippon Steel Chemical Co., Ltd's system) 30 mass parts, liquid epoxy resin (trade(brand)name: 4032D, Dainippon Ink Chemicals's system) 20 mass parts, tackify acrylic resin (trade(brand)name: SG-P3, Nagase Industrial Co., Ltd.'s system) microcapsule-type curing agent of 20 mass parts and imidazole modified epoxy (trade(brand)name: ノ バ キ ュ ア 3941HP, Asahi Kasei Corporation's system) homogeneous mixes.Mixed title complex be take to the PET (polyethylene terephthalate) that mode that dried mean thickness is 8 μ m coats silicone-treated with excellent painting machine upper, at 70 ℃ 5 minutes, make bonding film.
The color of the bonding film of made is filbert.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Comparative example 3
The making of < anisotropic conductive film (1 layer of structure): leuco dye >
By phenoxy resin (trade(brand)name: PKHC, Tomoe Engineering Co., Ltd.'s system) 42 mass parts, ammonia ester acrylate (trade(brand)name: EB-600, Daicel Co., Ltd. system) 40 mass parts, electroconductive particle (trade(brand)name: AUL704, Sekisui Chemical Co., Ltd's system, median size 4 μ m) 2 mass parts, organo-peroxide (trade(brand)name: パ ー ヘ キ サ C, Japan Oil Co's system) 3 mass parts, silane coupling agent (trade(brand)name: KBE-903, Shin-Etsu Chemial Co., Ltd's system) 1 mass parts, phosphoric acid ester (trade(brand)name: PM-21, Nippon Kayaku K. K's system) 1 mass parts, red leuco dye (trade(brand)name: RED-40, Yamamoto Chemicals Co., Ltd's system) 6 mass parts and developer (trade(brand)name: D-90, Tso Tat Co., Ltd., Japan's system, 130 ℃ of melting points) 6 mass parts homogeneous mix.Mixed weakly alkaline title complex be take to the mode that dried mean thickness is 8 μ m to be coated on the PET (polyethylene terephthalate) of silicone-treated with excellent painting machine, at 70 ℃, be dried 5 minutes, make the anisotropic conductive film of weakly alkaline (pH8.2).
The color of the anisotropic conductive film of made is because the color of electroconductive particle is faint yellow.
Carry out the evaluation identical with embodiment 1.Table 1 and table 2 represent result.
Table 1
Table 2
In embodiment 1,4～10, under the connection state state of bad (low temperature connects the uncured or low pressure causing and connects the poor flow causing), the color before and after connecting is unchanged (still for resulting from the faint yellow of electroconductive particle) almost.On the other hand, under the state of good connection, the colour-change before and after connecting (changing to resulting from the redness of leuco dye from faint yellow).Thus, can confirm that connection state is good or bad by the colour-change of anisotropic conductive film.
In embodiment 2, in the situation that the low temperature of 150 ℃ connection, connection state bad (uncured), but before and after connecting, color changes (from resulting from the faint yellow to incarnadine variation of electroconductive particle) a little.But the variation of this color is less than the variation of the color before and after connection under the state of good connection (changing to resulting from the redness of leuco dye from faint yellow).Therefore, although compare embodiment 1,4～10, some is poor, can confirm that connection state is good or bad by the colour-change of anisotropic conductive film.
In embodiment 3, in the situation that the low temperature of 150 ℃ connects, connection state is bad (uncured), but color changes (from resulting from the redness of leuco dye to resulting from the faint yellow variation of electroconductive particle) a little before and after connecting.But it is that colour-change before and after the connection under good state is little that connection state is compared in the variation of this color.Therefore, although compare embodiment 1,4～10, some is poor, can confirm that connection state is good or bad by the colour-change of anisotropic conductive film.
In addition, in embodiment 1～10, at 40 ℃, preserve after 2 days, the color of anisotropic conductive film does not change yet, and storage stability is good.In addition, even if use the anisotropic conductive film after preserving, make conjugant, also be the connection state equal with the situation of using the anisotropic conductive film making conjugant before preserving, and can confirm good connection state and bad connection state by the variation of form and aspect.
In comparative example 1, in the situation that the low pressure of 1MPa connects, connection state is bad (poor flow), but is connecting front and back colour-change (from redness to faint yellow variation).This variation and connection state are that the variation (from redness to faint yellow variation) of the color before and after connecting under good state is identical, are difficult to confirm that by the colour-change of anisotropic conductive film connection state is good or bad.
In addition, if preserved at 40 ℃ 2 days, the color of anisotropic conductive film is changed to incarnadine from redness.Therefore,, in the situation that use the anisotropic conductive film after preserving to make the situation of conjugant and use the anisotropic conductive film before preserving to make conjugant, the variation of the color before and after connecting produces difference.
In comparative example 2, in the situation that the low pressure of 1MPa connects, connection state is bad (poor flow), but is connecting front and back colour-change (changing to persimmon from brown).This variation and connection state are that the variation (changing to persimmon from brown) of the color before and after connecting under good state is identical, are difficult to confirm that by the colour-change of anisotropic conductive film connection state is good or bad.
In addition, if preserved at 40 ℃ 2 days, the color of anisotropic conductive film is from the filbert brown that is changed to.Therefore,, in the situation that use the anisotropic conductive film after preserving to make the situation of conjugant and use the anisotropic conductive film before preserving to make conjugant, the colour-change before and after connecting produces difference.
In comparative example 3, in the situation that the low pressure of 1MPa connects (connecting temperature is 210 ℃), connection state is bad (poor flow), but is connecting front and back colour-change (changing to redness from faint yellow).This variation and connection state are that the variation (changing to redness from faint yellow) of the color before and after connecting under good state is identical, are difficult to confirm that by the colour-change of anisotropic conductive film connection state is good or bad.
Utilizability in industry
Anisotropic conductive film of the present invention can be confirmed good connection state and bad connection state by the variation of form and aspect, and excellent storage stability, therefore, goes for the connection of circuit block.
Nomenclature
1 glass baseplate
2 ACF
The pattern of 3 COF
4 ITO distributions
A measures site
Claims (9)
1. an anisotropic conductive film, is connected the terminal of the first circuit block and the terminal anisotropic conductive of second circuit parts, it is characterized in that,
Have and contain the second layer that film forms the first layer of resin and contains film formation resin,
At least arbitrary layer in described the first layer and the described second layer contains electroconductive particle,
One deck in described the first layer and the described second layer contains leuco dye, another layer contain by with the interact foxy agent of the foxy that makes described anisotropic conductive film of described leuco dye.
2. anisotropic conductive film according to claim 1, foxy agent is developer.
3. anisotropic conductive film according to claim 1, in the first layer and the second layer, the one deck that contains leuco dye is alkalescence, and another layer that contains foxy agent is for acid, and described foxy agent is acid foxy agent.
4. anisotropic conductive film according to claim 1, in the first layer and the second layer, the one deck that contains leuco dye is for acid, and another layer that contains foxy agent is alkalescence, and described foxy agent is alkaline foxy agent.
5. anisotropic conductive film according to claim 1, the side in the first layer and the second layer be contain electroconductive particle and film form resin containing electroconductive particle layer, the opposing party is contained the insulativity bonding coat that film forms resin.
6. anisotropic conductive film according to claim 1, the first layer contains curable resin and solidifying agent, and the second layer contains curable resin and solidifying agent.
7. anisotropic conductive film according to claim 6, the curable resin in the first layer is free-radical polymerised compound, solidifying agent is organo-peroxide,
Curable resin in the second layer is free-radical polymerised compound, and solidifying agent is organo-peroxide.
8. a method of attachment, is connected the terminal of the first circuit block and the terminal anisotropic conductive of second circuit parts, it is characterized in that, comprises:
The first arrangement step of the anisotropic conductive film configure claim 1～7 on the terminal of described the first circuit block in described in any one;
The mode of joining with terminal and the described anisotropic conductive film of described second circuit parts in described anisotropic conductive film configures the second arrangement step of described second circuit parts;
The heating extrusion process that utilizes heating extruder member that described second circuit parts are heated and pushed.
9. a conjugant, is characterized in that, has:
With the first circuit block of terminal, with the second circuit parts of terminal, be situated between and be located between described the first circuit block and described second circuit parts and the cured article of the anisotropic conductive film that the terminal of the terminal of described the first circuit block and described second circuit parts is electrically connected to
Described anisotropic conductive film is the anisotropic conductive film described in any one in claim 1～7.
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| WO2017201892A1 (en) * | 2016-05-27 | 2017-11-30 | 深圳市华星光电技术有限公司 | Display, and multi-section circuit board and manufacturing method therefor |
| CN110358484A (en) * | 2019-07-23 | 2019-10-22 | 深圳市华星光电技术有限公司 | Conducting resinl and preparation method thereof |
| CN110970153A (en) * | 2019-11-29 | 2020-04-07 | 维沃移动通信有限公司 | Conductive film and electronic device |
| CN115449306A (en) * | 2022-09-21 | 2022-12-09 | 安佐化学有限公司 | Preparation method of anisotropic conductive adhesive film |
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| KR20220001527A (en) | 2020-06-29 | 2022-01-06 | 삼성디스플레이 주식회사 | Adhesive member and display device including the same |
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| JPH05224227A (en) * | 1992-02-13 | 1993-09-03 | Ricoh Co Ltd | Anisotropic conductive film |
| JP2009088465A (en) * | 2007-09-14 | 2009-04-23 | Hitachi Chem Co Ltd | Anisotropically conductive adhesive, anisotropically conductive film, and method of manufacturing circuit connecting structure |
| EP2343785A2 (en) * | 2010-01-08 | 2011-07-13 | Ricoh Company, Ltd. | Surface-emitting laser element, surface-emitting laser array, optical scanner device, and image forming apparatus |
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| JPH10268772A (en) * | 1997-03-26 | 1998-10-09 | Mitsubishi Paper Mills Ltd | Sheet and adhesive label for prevention against forgery |
| JP5823117B2 (en) * | 2010-11-16 | 2015-11-25 | デクセリアルズ株式会社 | Anisotropic conductive film, bonded body, and manufacturing method of bonded body |
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2013
- 2013-04-16 JP JP2013085583A patent/JP5975930B2/en not_active Expired - Fee Related
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2014
- 2014-04-15 KR KR1020140044836A patent/KR20140124333A/en not_active Application Discontinuation
- 2014-04-16 CN CN201410151549.0A patent/CN104109491A/en active Pending
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| CN1035901A (en) * | 1987-12-29 | 1989-09-27 | 纳舒厄公司 | But the coating material of hot print and system method thereof |
| JPH05224227A (en) * | 1992-02-13 | 1993-09-03 | Ricoh Co Ltd | Anisotropic conductive film |
| JP2009088465A (en) * | 2007-09-14 | 2009-04-23 | Hitachi Chem Co Ltd | Anisotropically conductive adhesive, anisotropically conductive film, and method of manufacturing circuit connecting structure |
| EP2343785A2 (en) * | 2010-01-08 | 2011-07-13 | Ricoh Company, Ltd. | Surface-emitting laser element, surface-emitting laser array, optical scanner device, and image forming apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017201892A1 (en) * | 2016-05-27 | 2017-11-30 | 深圳市华星光电技术有限公司 | Display, and multi-section circuit board and manufacturing method therefor |
| CN110358484A (en) * | 2019-07-23 | 2019-10-22 | 深圳市华星光电技术有限公司 | Conducting resinl and preparation method thereof |
| CN110970153A (en) * | 2019-11-29 | 2020-04-07 | 维沃移动通信有限公司 | Conductive film and electronic device |
| CN110970153B (en) * | 2019-11-29 | 2021-06-04 | 维沃移动通信有限公司 | Conductive film and electronic device |
| CN115449306A (en) * | 2022-09-21 | 2022-12-09 | 安佐化学有限公司 | Preparation method of anisotropic conductive adhesive film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014207203A (en) | 2014-10-30 |
| KR20140124333A (en) | 2014-10-24 |
| JP5975930B2 (en) | 2016-08-23 |
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