CN115449306A - Preparation method of anisotropic conductive adhesive film - Google Patents
Preparation method of anisotropic conductive adhesive film Download PDFInfo
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- CN115449306A CN115449306A CN202211151170.0A CN202211151170A CN115449306A CN 115449306 A CN115449306 A CN 115449306A CN 202211151170 A CN202211151170 A CN 202211151170A CN 115449306 A CN115449306 A CN 115449306A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
- C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C09J171/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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Abstract
The invention discloses a preparation method of an anisotropic conductive adhesive film, which comprises the following preparation steps: s1, preparing a photosensitive adhesive sheet; s2, preparing a photosensitive bonding layer with the linear arrangement of conductive particles; s3, preparing an insulating resin sheet; coating insulating resin liquid on the release processing surface of the release PET film to prepare an insulating resin sheet; s4, preparing an anisotropic conductive adhesive film 1) carrying out exposure treatment again on the photosensitive bonding layer; 2) And (3) laminating the insulating resin layer with another insulating resin layer to the insulating resin layer with the conductive particles prepared in the step (S4) and (1), and laminating to prepare the anisotropic conductive adhesive film. The invention has the following beneficial effects: the prepared conductive adhesive film can ensure that conductive particles are uniformly arranged in a linear mode in insulating resin, can correspond to the anisotropic conductive film with narrow-pitch connection, and can be industrially and stably produced.
Description
Technical Field
The invention relates to the technical field of conductive films, in particular to a preparation method of an anisotropic conductive adhesive film.
Background
An Anisotropic Conductive Film (ACF) is formed by dispersing conductive particles in an insulating resin. In a general anisotropic conductive film, an insulating resin composition containing conductive particles is applied to a base film to form a sheet.
In recent years, in small portable electronic devices such as smartphones, tablet PCs, and notebook computers, high-density mounting of electronic components has been performed with miniaturization and thinning, and in so-called FOB (Film on Board) connection in which a flexible substrate is connected to a main substrate or so-called FOF (Film on Film) connection in which flexible substrates are connected to each other, miniaturization of connection terminals and narrowing of the space between adjacent connection terminals have been performed. In the so-called COG (Chip on Glass) connection for connecting a control IC of a liquid crystal screen to an ITO wiring of a Glass substrate, terminals are increased in accordance with the higher definition of the screen, and the miniaturization of a connection terminal and the narrowing of the connection terminals adjacent to each other are also performed in accordance with the miniaturization of the control IC.
In order to achieve such miniaturization of connection terminals and narrowing of connection terminals in response to the demand for high-density mounting, in the conventional anisotropic conductive film, conductive particles are randomly dispersed in an insulating resin, and therefore, the conductive particles are connected between the fine terminals, and there is a possibility that a short circuit occurs between the terminals.
Here, a method of reducing the diameter of the conductive particles and forming an insulating film on the surface of the particles has also been proposed. The reduction in diameter of the conductive particles may reduce the particle capture rate of the miniaturized connection terminals, and the formation of an insulating film may not completely prevent short-circuiting between the terminals.
To solve such problems, an anisotropic conductive film has been proposed in which conductive particles are arranged at specific intervals by biaxial stretching of the film, and insulating particles are arranged between the conductive particles (japanese patent application laid-open No. 2010-9804 of patent document 1).
However, in the production process of the anisotropic conductive film of patent document 1, since an adhesive layer is formed on a biaxially stretchable film, conductive particles are spread over the adhesive layer in a multilayer, and excess conductive particles are scraped off with a doctor blade to be arranged in a single layer, the conductive particles may be damaged, and the process is difficult. In addition, when the conductive particles are arranged as a single layer, it is also difficult for the conductive particles to secure a uniform particle interval, so that it is difficult to stably produce an anisotropic conductive film that can cope with connection of a narrow pitch.
In summary, the present invention provides an anisotropic conductive film and a method for manufacturing the same, which can make conductive particles uniformly arranged in a linear manner in an insulating resin, can correspond to an anisotropic conductive film with narrow-pitch connection, and can be stably produced in an industrial manner.
Disclosure of Invention
The invention aims to provide a method for preparing an anisotropic conductive film, the conductive film prepared by the preparation method can ensure that conductive particles are uniformly arranged in a linear mode in insulating resin, can correspond to the anisotropic conductive film connected at a narrow interval, and can be industrially and stably produced.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a preparation method of anisotropic conductive adhesive film comprises the following preparation steps:
preparation of S1 photosensitive adhesive sheet 50
Coating a photosensitive coating liquid on the release processing surface of the release film 10, then attaching another release film 10, and curing to obtain a photosensitive adhesive sheet 50;
s2 preparation of photosensitive adhesive layer with linear arrangement of conductive particles
1) Exposure process
Covering the mask plate 70 on the release film layer 10 on one side of the photosensitive adhesive sheet 50, and after exposure treatment, removing the viscosity of the exposed area and peeling off the release film layer 10 on one side;
2) Arrangement of conductive particles
Dispersing the conductive particles 30 on the photosensitive adhesive layer having the adhesive part, and recovering the conductive particles not adhered to the adhesive layer to obtain a photosensitive adhesive layer in which the conductive particles are linearly arranged;
s3 preparation of insulating resin sheet 60
Coating an insulating resin liquid on the release processing surface of the release PET film 10 to prepare an insulating resin sheet 60;
s4 preparation of anisotropic conductive adhesive film
1) Re-exposure treatment of photosensitive adhesive layer
Covering the photosensitive adhesive layer with the linear arrangement of the conductive particles prepared in the step S2) on the insulating resin layer 61 on the insulating resin sheet 60, and performing exposure treatment from the direction of the photosensitive adhesive layer so that the adhesive layer with the conductive particles adhered thereon loses adhesiveness and the conductive particles fall off on the insulating resin layer 61;
2) Laminated insulating resin layer
Laminating the insulating resin layer with the conductive particles prepared in the step S4) with another insulating resin layer 61, and then pressing to prepare an anisotropic conductive adhesive film;
as a further improvement of this embodiment, the preparation of the photosensitive coating liquid comprises the steps of:
1) High molecular weight acrylic polymer solution
Adding 40-60 parts by weight of Butyl Acrylate (BA), 40-60 parts by weight of Methyl Acrylate (MA), 8-15 parts by weight of 2-hydroxyethyl methacrylate (HEMA), 30-40 parts by weight of toluene as a solvent and 60-80 parts by weight of ethyl acetate into a reaction device provided with a stirring paddle, a reflux condenser, a thermometer and a nitrogen inlet pipe, adding 0.1 part by weight of azobisisobutyronitrile as a reaction initiator, and carrying out polymerization reaction at 65 ℃ for 15 hours in a nitrogen gas flow to obtain a high molecular weight acrylic polymer solution;
2) Preparation of photosensitive coating liquid
An acrylic polymer-containing solution was obtained, and a 4-functional acrylic monomer, an isocyanate-based curing agent and a photoinitiator were further added to the polymer solution to prepare a coating liquid for a photosensitive adhesive layer.
As a further improvement of the scheme, in the preparation process of the photosensitive coating liquid: the 4-functional acrylic monomer is PE-4A, the hardener is L-75, and the photoinitiator is Irgacure 184.
As a further improvement of the scheme, the 4-functional acrylic monomer is PE-4A, the hardener is L-75, and the photoinitiator is Irgacure 184 in parts by weight: 70:2.5:2.0.
as a further improvement of the scheme, the insulating resin liquid comprises the following preparation steps: diluting and dissolving 30-50 parts by weight of imidazole latent cross-linking agent, 10-15 parts by weight of liquid epoxy resin, 30-40 parts by weight of phenoxy resin, 0.5 part by weight of silane coupling agent and 150 parts by weight of ethyl acetate solvent to obtain the required insulating resin solution.
As a further improvement of the scheme, the shading areas 71 and the non-shading areas 72 on the mask plate 70 are arranged at intervals, and the interval between the shading areas 71 is 10-15 μm, and the interval between the non-shading areas 72 is 10-15 μm.
As a further improvement of the scheme, the pitch of the light-shielding areas 71 is 12 μm, and the pitch of the non-light-shielding areas 72 is 13 μm.
As a further improvement of the scheme, the exposure conditions are as follows: the 3KW high-voltage mercury lamp is exposed for 20 seconds, and the distance between the high-voltage mercury lamp and the mask plate is 30cm.
As a further improvement of the scheme, the pressing conditions in the step S4) are as follows: pressing at 40 deg.C and 0.1 Mpa.
The anisotropic conductive adhesive film has the following beneficial effects:
1) In the manufacturing method of the present invention, the conductive particles are arranged in advance in correspondence, and by transferring them to the insulating resin layer, the conductive particles can be uniformly arranged on the insulating resin layer, and then another insulating resin layer is attached. At this time, the conductive particles are uniformly and linearly arranged in the anisotropic conductive film;
2) The anisotropic conductive film is free from the possibility of short circuit between terminals due to the remaining conductive particles. In addition, since the anisotropic conductive film has the conductive particles arranged in a linear manner, it is possible to achieve reliable conduction even in the electrode terminal having a narrow pitch.
3) In addition, according to another aspect of the present invention, in the anisotropic conductive film that supports a narrower pitch, since the position of the uniformly dispersed conductive particles can be reliably controlled, the conduction between the terminals having a narrower pitch can be reliably achieved. Further, according to another aspect of the present invention, it is possible to ensure good connectivity between the substrate of the connection structure and the electronic component, and to improve the long-term connection reliability.
Drawings
FIG. 1 is a schematic view showing the structure of a photosensitive adhesive sheet according to the present invention;
FIG. 2 is a schematic view showing the structure of an insulating resin sheet according to the present invention;
FIG. 3 is a schematic structural diagram of a mask according to the present invention;
FIG. 4 is a view showing a photosensitive adhesive sheet of the present invention after exposure treatment;
FIG. 5 shows a photosensitive adhesive sheet of the present invention after exposure;
FIG. 6 is a schematic view of the present invention showing conductive particles distributed on a photosensitive adhesive sheet after exposure treatment;
FIG. 7 is a schematic view of a photosensitive adhesive sheet with conductive particles adhered to unexposed areas according to the present invention;
FIG. 8 is a schematic view of the structure of the insulating resin sheet for transferring the conductive particles adhered to the exposed area of the insulating resin sheet to the insulating resin sheet according to the present invention;
FIG. 9 is a schematic view of a laminated structure of an insulating resin sheet with directionally distributed conductive particles adhered thereon and another insulating resin sheet according to the present invention;
FIG. 10 is a schematic view of the structure of the anisotropic conductive film of the present invention;
FIG. 11 is a schematic view of a structure in which conductive particles are dispersed on a photosensitive adhesive layer in example 2 of the present invention;
FIG. 12 is a schematic view showing the structure of an exposed photosensitive adhesive layer in example 2 of the present invention;
FIG. 13 is a schematic view of the structure of the conductive adhesive film in the comparative example of the present invention.
Detailed Description
In order to make the purpose, technical scheme and advantages of the invention more clear, the invention is further explained by combining the following embodiments 1-2:
■ Photosensitive adhesive and preparation of photosensitive adhesive sheet
Into a reaction apparatus equipped with a stirring blade, a reflux condenser, a thermometer and a nitrogen inlet tube were charged 45 parts by weight of Butyl Acrylate (BA), 45 parts by weight of Methyl Acrylate (MA), 10 parts by weight of 2-hydroxyethyl methacrylate (HEMA), 35 parts by weight of toluene as a solvent and 65 parts by weight of ethyl acetate, 0.1 part by weight of azobisisobutyronitrile as a reaction initiator was added, and polymerization was carried out at 65 ℃ for 15 hours in a nitrogen stream to obtainHigh molecular weight acrylic polymer solution。
Obtaining a mixture containingAcrylic polymer solution(the weight-average molecular weight Mw was 50 ten thousand as measured by GPC measurement), and the polymer solution was further added with a 4-functional acrylic monomer, an isocyanate-based curing agent (Corsai Co., ltd., type L-75) and a photoinitiator to prepare a copolymerCoating liquid for photosensitive adhesive layer。
In this case, the 4-functional acrylic monomer (PE-4A) was mixed in a proportion of 70 parts by weight, 2.5 parts by weight of the curing agent L-75 and 2.0 parts by weight of Irgacure 184 based on 100 parts by weight of the solid content (acrylic polymer) contained in the polymer solution to prepare a photosensitive adhesive.
Next, an adhesive layer-forming coating liquid was applied to a release-treated surface of a release PET film (MRF 38, manufactured by mitsubishi chemical polyester film corporation, japan) by a doctor blade so that the thickness after drying was 20 μm, and the other layer of the release PET film was further bonded thereto and cured at room temperature for 7 days to obtain a photosensitive adhesive sheet 50.
The photosensitive adhesive sheet obtained as described above is shown in FIG. 1
GPC measurement method
A measuring device: HLC-8120GPC (manufactured by Tosoh corporation, japan)
GPC column structure:
the following five columns (all made by Tosoh corporation)
(1) TSK-GEL HXL-H (guard column)
(2)TSK-GEL G7000HXL
(3)TSK-GEL GMHXL
(4)TSK-GEL GMHXL
(5)TSK-GEL G2500HXL
Sample concentration: diluted with tetrahydrofuran to 1.0mg/cm3
Mobile phase solvent: flow rate of tetrahydrofuran: 1.0cm3/min
Column temperature: at 40 deg.c.
■ Preparation of insulating resin liquid and preparation of insulating resin sheet
40 parts by weight of an imidazole latent crosslinking agent (product name: 3941HP; manufacturer: asahi Kasei elastomers), 14 parts by weight of a liquid epoxy resin (product name: jeR828; manufacturer: mitsubishi Chemical), 35 parts by weight of a phenoxy resin (product name: YP-50; manufacturer: NIPPON STEEL Chemical & Material CO., LTD.), 0.5 part by weight of a silane coupling agent (product name: KBM403; manufacturer: shin-Etsu Chemical Co., ltd.) and 150 parts by weight of an ethyl acetate solvent, and diluting and dissolving the components.
Next, an insulating resin liquid was applied to a release-treated surface of a release PET film (MRF 38, manufactured by mitsubishi chemical polyester film co., ltd., japan) with a doctor blade so that the thickness after drying was 8 μm, thereby producing an insulating resin sheet (60).
The insulating resin sheet obtained in the above-described step is shown in fig. 2.
The raw materials used are as follows:
BA: butyl acrylate supplier: toyo Synthesis Co Ltd
MA: methyl acrylate supplier: toyo Synthesis Co Ltd
HEMA: 2-hydroxyethyl methacrylate supplier: japanese catalyst Co Ltd
L-75 isocyanate crosslinker, supplier: cociscreating company Limited product
The crosslinking agent is trihydroxy methyl propane/hexamethylene diisocyanate trimer adduct
PE-4A: pentaerythritol tetraacrylate supplier: eiken chemical corporation
Irgacure 184: 1-hydroxycyclohexylphenone, supplier: basf Ltd
3941HP: imidazole latent cross-linkers, supplier: asahi Kasei Ematerials
jER828: liquid epoxy, supplier: mitsubishi chemical
YP-50: phenoxy resin, supplier: NIPPON STEEL Chemical & Material CO., LTD
KBM403: gamma-glycidoxypropyltrimethoxysilane, supplier: shin-Etsu chemical industry Co
■ Preparation of Anisotropic conductive film (example 1)
Step 1
Covering a mask plate shown in fig. 3 on a release film 10 on a photosensitive adhesive sheet 50, exposing a 3KW high-pressure mercury lamp for 20 seconds, setting a distance between the high-pressure mercury lamp and the mask plate to be 30cm, losing viscosity of an exposed area, and processing as shown in fig. 5;
peeling off the release PET film to obtain an intermediate product as shown in FIG. 4;
as shown in FIG. 6, conductive particles (product name: AUL704; water accumulation chemical Co., ltd.) having a particle size of 4 μm were scattered on the photosensitive adhesive layer having the adhesive portion, and the conductive particles not adhered to the adhesive layer were recovered to finally obtain conductive particles linearly arranged on the photosensitive adhesive layer as shown in FIG. 7.
Step 2
As shown in fig. 8, the line-type arrangement with the conductive particles is on the photosensitive adhesive layer covering the insulating resin layer;
the distance between the high-pressure mercury lamp and the mask plate is set to be 30cm when the 3KW high-pressure mercury lamp is exposed for 20 seconds from the direction of the photosensitive adhesive layer, at this time, the adhesive layer of the conductive particles of the adhesive loses viscosity, the conductive particles fall off on the insulating resin layer as shown in figure 9, then another insulating resin layer is used for bonding, and then the anisotropic conductive adhesive film as shown in figure 10 is obtained by pressing at the temperature of 40 ℃ and the pressure of 0.1 Mpa. The product shown in fig. 10 is the final product made by the present application.
■ Preparation of Anisotropic conductive film (example 2)
Step 1:
as shown in FIG. 11, conductive particles (product name: AUL704; water accumulation chemical Co., ltd.) having a particle size of 4 μm were scattered on the photosensitive adhesive layer;
as shown in fig. 12, covering a mask 70 shown in fig. 3 on a release film 10, and exposing for 20 seconds by using a 3KW high-pressure mercury lamp, wherein the distance between the high-pressure mercury lamp and the mask is 30cm, the exposed area fails in viscosity, so that the conductive particles fall off, and the unexposed area bonds the conductive particles;
as shown in FIG. 7, conductive particles were formed to be linearly arranged in the photosensitive adhesive layer.
As shown in fig. 10, an anisotropic conductive adhesive film was then prepared in the same manner as in the process 2 of example 1.
■ Production of Anisotropic conductive film (comparative example 1)
40 parts by weight of an imidazole-based crosslinking agent latent crosslinking agent (product name: 3941HP; manufacturer: asahi Kasei elastomers), 14 parts by weight of a liquid epoxy resin (product name: jeR828; manufacturer: mitsubishi Chemical), 35 parts by weight of a phenoxy resin (product name: YP-50; manufacturer: NIPPON STEEL Chemical & Material CO., LTD.), 0.5 part by weight of a silane coupling agent (product name: KBM403; manufacturer: shin-Etsu Chemical Co., ltd.) and 150 parts by weight of an ethyl acetate solvent, and after dissolving and diluting, 10 parts by weight of conductive particles having a particle diameter of 4 μm (product name: AUL; 704 hydropter Chemical Co., ltd.) were added
Next, an insulating resin coating solution containing conductive particles was applied to a release-treated surface of a release PET film (MRF 38, manufactured by mitsubishi chemical polyester film co., ltd.) with a doctor blade so that the thickness after drying was 16 μm, and then another layer of the release PET film was laminated to obtain an anisotropic conductive film shown in fig. 13.
■ Production of Anisotropic conductive film (comparative example 2)
The comparative example 1 was repeated except for 20 parts by weight of conductive particles having a particle size of 4 μm.
The evaluation method comprises the following steps:
■ The anisotropic conductive adhesive films of the examples and comparative examples were aligned with each other by a microscope, then bonded by pressing at 60 ℃ and 0.2MPa, and then the bumps on the IC chip and the conductive particles of the anisotropic conductive adhesive film were aligned with each other by an alignment mounting device by the same method, and then press-bonded (press-bonded conditions: 180 ℃, 70Mpa for 5 seconds, and polytetrafluoroethylene as a buffer material t =50 μm) to prepare samples for evaluation.
Initial conductivity test the on-resistance of the obtained connection structure was measured by a 4-terminal method (JIS K7194) using a digital multimeter (34401a, agilent TECHNOLOGIES).
IC chip
Bump (bump) gold plating, height: 12 μm, size: 12 μm 80 μm, inter-bump distance 13 μm, and terminal number 1300
Glass substrate
1737F manufactured by CORNING Corning Corp
The external form is 30mm multiplied by 50mm
Thickness of 0.5mm
Terminal ITO wiring
Number of conductive particles on terminal
The number of conductive particles on one terminal was observed from the glass substrate side with a microscope. Evaluation was carried out according to the following evaluation method.
Arbitrary 300 terminals were selected from the IC terminals to be pressure-bonded, and the number of conductive particles existing on the terminals was counted by a microscope and averaged.
More than 10A
More than 5 and less than 10B
More than 3 and less than 5 of C
D is less than 3
■ Evaluation of initial conduction characteristics
The evaluation samples were tested for conductive resistance and evaluated according to the following criteria
OK:2 omega or less
NG:2 omega or more
■ Short circuit rate
Using the following evaluation IC for short circuit rate, an evaluation connector was obtained under the same connection conditions as described above, the number of short circuits of the obtained evaluation connector was measured, and the ratio of the measured number of short circuits to the number of terminals of the evaluation IC was determined as the short circuit rate.
Short-circuit rate: number of short-circuit occurrences/number of IC terminals for evaluation
IC for evaluation of short-circuit rate (comb teeth TEG (test element group) in 7.5 μm space):
the external form is 15mm multiplied by 13mm
Thickness of 0.5mm
The size of the bumps is 25 μm × 140 μm, the distance between the bumps is 7.5 μm, and the height of the bumps is 15 μm.
Evaluation criterion of short-circuit rate
A: less than 50ppm
B:50ppm or more and less than 100ppm
C:100ppm or more and less than 200ppm
D: above 200 ppm.
The following test results for inventive examples 1,2 and comparative examples 1,2 are shown in Table 1.
TABLE 1
| Evaluation item | Example 1 | Example 2 | Comparative example 1 | Comparative example 2 |
| Number of conductive particles on terminal | 13 | 22 | 6 | 14 |
| Evaluation of initial on-state characteristics | OK | OK | NG | OK |
| Rate of short circuit | A | A | C | D |
From the test results of examples 1 and 2, and comparative examples 1 and 2, it can be seen that:
1) In the manufacturing method of the present invention, the conductive particles are arranged in advance in correspondence, and by transferring them to the insulating resin layer, the conductive particles can be uniformly arranged on the insulating resin layer, and then another insulating resin layer is attached. The conductive particles can be effectively and uniformly arranged in the anisotropic conductive film in a linear mode;
2) The anisotropic conductive films in examples 1 and 2 are free from the possibility of short circuit between terminals due to the remaining conductive particles. In addition, since the anisotropic conductive film has conductive particles arranged in a linear manner, reliable conduction can be achieved even in the electrode terminal with a narrow pitch.
3) In addition, according to another aspect of the present invention, in the anisotropic conductive film that supports a narrower pitch, since the position of the uniformly dispersed conductive particles can be reliably controlled, the conduction between the terminals having a narrower pitch can be reliably achieved. Further, according to another aspect of the present invention, it is possible to ensure good connectivity between the substrate of the connection structure and the electronic component, and to improve the connection reliability for a long period of time.
The above description is only for the preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent modifications made by the present invention are within the scope of the present invention.
Claims (9)
1. The preparation method of the anisotropic conductive adhesive film is characterized by comprising the following preparation steps of:
preparation of S1 photosensitive adhesive sheet (50)
Coating a photosensitive coating liquid on the release processing surface of the release film (10), then attaching another layer of release film (10), and curing to obtain a photosensitive adhesive sheet (50);
s2 preparation of photosensitive adhesive layer with linear arrangement of conductive particles
1) Exposure process
Covering a mask plate (70) on the release film layer (10) on one side of the photosensitive adhesive sheet (50), and stripping the release film layer (10) on one side after the exposed area loses viscosity after exposure treatment;
2) Arrangement of conductive particles
Dispersing conductive particles (30) on the photosensitive adhesive layer with the adhesive part, and recovering the conductive particles which are not adhered on the adhesive layer to obtain the photosensitive adhesive layer with the linear arrangement of the conductive particles;
s3 preparation of insulating resin sheet (60)
Coating insulating resin liquid on the release processing surface of the release PET film (10) to prepare an insulating resin sheet (60);
s4 preparation of anisotropic conductive adhesive film
1) Re-exposure treatment of photosensitive adhesive layer
Covering the photosensitive adhesive layer with the linear arrangement of the conductive particles prepared in the S2) on the insulating resin layer (61) on the insulating resin sheet (60), and performing exposure treatment from the direction of the photosensitive adhesive layer to ensure that the adhesive layer for adhering the conductive particles loses viscosity and the conductive particles fall off on the insulating resin layer (61);
2) Laminated insulating resin layer
And (2) laminating the insulating resin layer with the conductive particles prepared in the step (4) by using another insulating resin layer (61), and then pressing to prepare the anisotropic conductive adhesive film.
2. The method for preparing the anisotropic conductive film according to claim 1, wherein the preparing of the photosensitive coating liquid comprises the steps of:
1) High molecular weight acrylic polymer solution
Adding 40-60 parts by weight of Butyl Acrylate (BA), 40-60 parts by weight of Methyl Acrylate (MA), 8-15 parts by weight of 2-hydroxyethyl methacrylate (HEMA), 30-40 parts by weight of toluene as a solvent and 60-80 parts by weight of ethyl acetate into a reaction device provided with a stirring paddle, a reflux condenser, a thermometer and a nitrogen inlet pipe, adding 0.1 part by weight of azobisisobutyronitrile as a reaction initiator, and carrying out polymerization reaction at 65 ℃ for 15 hours in a nitrogen gas flow to obtain a high molecular weight acrylic polymer solution;
2) Preparation of photosensitive coating liquid
The acrylic polymer-containing solution was obtained, and a coating liquid for a photosensitive adhesive layer was prepared by further adding a 4-functional acrylic monomer, an isocyanate-based curing agent, and a photoinitiator to the polymer solution.
3. The method for preparing the anisotropic conductive film of claim 2, wherein during the preparation of the photosensitive coating liquid: the 4-functional acrylic monomer is PE-4A, the hardener is L-75, and the photoinitiator is Irgacure 184.
4. The method for preparing anisotropic conductive adhesive film according to claim 3, wherein the 4-functional acrylic monomer is PE-4A, the hardener is L-75, and the photoinitiator is Irgacure 184, in parts by weight: 70:2.5:2.0.
5. the method of claim 3 or 4, wherein the insulating resin solution comprises the following steps: diluting and dissolving 30-50 parts by weight of imidazole latent cross-linking agent, 10-15 parts by weight of liquid epoxy resin, 30-40 parts by weight of phenoxy resin, 0.5 part by weight of silane coupling agent and 150 parts by weight of ethyl acetate to obtain the required insulating resin liquid.
6. The method for preparing ACF as claimed in claim 3,
the light-shielding areas (71) and the non-light-shielding areas (72) on the mask (70) are arranged at intervals, the space between the light-shielding areas (71) is 10-15 mu m, and the space between the non-light-shielding areas (72) is 10-15 mu m.
7. The method for preparing an ACF film according to claim 6, wherein the pitch of the light-shielding regions (71) is 12 μm and the pitch of the non-light-shielding regions (72) is 13 μm.
8. The method for preparing the anisotropic conductive adhesive film according to claim 3, wherein the exposure conditions are as follows: the 3KW high-voltage mercury lamp is exposed for 20 seconds, and the distance between the high-voltage mercury lamp and the mask plate is 30cm.
9. The method for preparing the ACF film as claimed in claim 3, wherein the pressing conditions in S42) are as follows: pressing at 40 deg.C and 0.1 Mpa.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104109491A (en) * | 2013-04-16 | 2014-10-22 | 迪睿合电子材料有限公司 | Anisotropic conductive film, connecting method, and joined body |
| CN111057474A (en) * | 2019-12-24 | 2020-04-24 | 合肥乐凯科技产业有限公司 | Adhesive for UV (ultraviolet) anti-adhesive film and UV anti-adhesive film thereof |
| TWI746005B (en) * | 2020-06-11 | 2021-11-11 | 瑋鋒科技股份有限公司 | Manufacturing method of continuous anisotropic conductive adhesive |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104109491A (en) * | 2013-04-16 | 2014-10-22 | 迪睿合电子材料有限公司 | Anisotropic conductive film, connecting method, and joined body |
| CN111057474A (en) * | 2019-12-24 | 2020-04-24 | 合肥乐凯科技产业有限公司 | Adhesive for UV (ultraviolet) anti-adhesive film and UV anti-adhesive film thereof |
| TWI746005B (en) * | 2020-06-11 | 2021-11-11 | 瑋鋒科技股份有限公司 | Manufacturing method of continuous anisotropic conductive adhesive |
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