CN208242098U - The printed circuit board of electromagnetic shielding film and charged magnetic shielding film - Google Patents
The printed circuit board of electromagnetic shielding film and charged magnetic shielding film Download PDFInfo
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- CN208242098U CN208242098U CN201820224612.2U CN201820224612U CN208242098U CN 208242098 U CN208242098 U CN 208242098U CN 201820224612 U CN201820224612 U CN 201820224612U CN 208242098 U CN208242098 U CN 208242098U
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- shielding film
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Abstract
The utility model, which provides, can be easy and carry out with low cost the identification of the front and back of removing of the first mold release film, can prevent the electromagnetic shielding film for forgetting removing of the first mold release film when the manufacture of flexible printed circuit board and the printed circuit board of charged magnetic shielding film.The electromagnetic shielding film (1) of the utility model has insulating resin layer (10), the conductive layer (20) adjacent with insulating resin layer (10) and first mold release film (30) adjacent with the opposite side relative to conductive layer (20) of insulating resin layer (10)；First mold release film (30) has the adhesive phase (34) to connect with insulating resin layer (10)；Adhesive phase (34) includes adhesive (34a) and colorant (34c).
Description
Technical field
The utility model relates to electromagnetic shielding film and it is provided with the printed circuit board of electromagnetic shielding film.
Background technique
It is shielded for the electromagnetic wave noise that will be generated by flexible printed circuit board or from external electromagnetic wave noise, sometimes
Insulating resin layer and the conductive layer that metal film layer and conductive adhesive layer is made of adjacent with insulating resin layer will be included
Electromagnetic shielding film inside is set to the surface of flexible printed circuit board across insulating film (cover film) (referring for example to patent text
It offers 1).
Electromagnetic shielding film for example, by the carrier film i.e. one side of the first mold release film be coated with comprising heat-curing resin,
The coating liquid of curing agent and solvent makes it dry and forms insulating resin layer, and conductive layer is arranged on the surface of insulating resin layer
And it manufactures.
First mold release film is bonded on the surface of the insulating film on the surface for being set to flexible printed circuit board according to electric conductivity
After the mode that oxidant layer connects with insulating film attaches electromagnetic shielding film, removed from insulating resin layer.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2016-086120 bulletin
Utility model content
Utility model project to be solved
As described above, in the manufacture of flexible printed circuit board, the first mold release film is removed from insulating resin layer.In order to anti-
Only the first mold release film when the manufacture of flexible printed circuit board is forgotten to remove, such as the first mold release film is made and is insulated sometimes
The different color of resin layer.In the past, the first de- of raw material was being constituted using polyethylene terephthalate etc. as main
When the manufacture of mould film, always using by containing pigments or dyes, the first mold release film is coloured, is made different from insulating resin layer
Color technology.
However, needing for example in the case wheres containing pigment etc. in the manufacture of the first mold release film relative to poly- terephthaldehyde
Sour glycol ester etc. constitutes raw material and is kneaded pigments or dyes and manufactures the first mold release film.As a result, with the first mold release film
Situation without containing pigment etc. is compared, process and increased costs when the manufacture of the first mold release film, electromagnetic shielding film and flexibility
The process and cost of printed circuit board also increase.In addition, previous, as the film for not limiting purposes, manufacture have it is transparent (not by
Coloring) films such as polyethylene terephthalate, but the film can not be also used for the purpose of the first mold release film.It is therefore desirable to
The technology for containing pigments or dyes in the manufacture of the first mold release film, which is compared, can be easy and carry out the first demoulding with low cost
The technology of the identification of the front and back of the removing of film.
The utility model provides the identification that can be easy and carry out with low cost the front and back of removing of the first mold release film, energy
Enough prevent the electromagnetic shielding film for forgetting removing of the first mold release film when the manufacture of flexible printed circuit board and with electromagnetic wave screen
Cover the printed circuit board of film.
A technical solution to solve project
The utility model has mode below.
<1>a kind of electromagnetic shielding film, with insulating resin layer, with above-mentioned insulating resin layer abut conductive layer and with it is upper
State the first adjacent mold release film of the opposite side relative to above-mentioned conductive layer of insulating resin layer, above-mentioned first mold release film have with it is upper
The adhesive phase that insulating resin layer connects is stated, above-mentioned adhesive phase includes adhesive and colorant.
<2>according to the electromagnetic shielding film of above-mentioned<1>, wherein the content of above-mentioned colorant is relative to above-mentioned adhesive phase
Total quality mass percent be 10% or more and 40% or less.
<3>according to the electromagnetic shielding film of above-mentioned<1>or<2>, wherein above-mentioned colorant is selected from by titanium oxide, sulfuric acid
It is at least one kind of in the group of barium and zinc oxide composition.
<4>according to the electromagnetic shielding film of any one of above-mentioned<1>~<3>, wherein above-mentioned colorant is that average grain diameter is
0.01 μm or more and 1 μm of particle below.
<5>according to the electromagnetic shielding film of any one of<1>~<4>, wherein above-mentioned first mold release film is based on JIS K
The total light transmittance that 7361:1997 is determined is 30% or more and 70% or less.
<6>according to the electromagnetic shielding film of any one of<1>~<5>, wherein above-mentioned first mold release film is based on JIS K
The mist degree that 7136:2000 is determined is 80% or more and 99.5% or less.
<7>according to the electromagnetic shielding film of any one of<1>~<6>, wherein above-mentioned adhesive phase with a thickness of 1 μm with
It is upper and 15 μm or less.
<8>according to the electromagnetic shielding film of any one of above-mentioned<1>~<7>, wherein above-mentioned electromagnetic shielding film also has
The opposite side relative to above-mentioned insulating resin layer of second mold release film, above-mentioned second mold release film and above-mentioned conductive layer is adjacent.
<9>a kind of printed circuit board of charged magnetic shielding film has and at least one side of substrate is provided with printed circuit
Printed circuit board；With the insulating film of the surface contiguous of that side for being provided with above-mentioned printed circuit of above-mentioned printed circuit board；With
Adjacent and above-mentioned conductive layer passes through the through hole being formed on above-mentioned insulating film and above-mentioned print to above-mentioned conductive layer with above-mentioned insulating film
The electromagnetic shielding film of any one of above-mentioned<1>~<8>of brush circuit electrical connection.
Utility model effect
Before the electromagnetic shielding film of the utility model can be easy and carry out the removing of the first mold release film with low cost
Identification afterwards can prevent the first mold release film when the manufacture of flexible printed circuit board from forgetting to remove.Furthermore it is possible to detect viscous
The removing of mixture layer remains.
The printed circuit board of the charged magnetic shielding film of the utility model can be easy and be manufactured with low cost.
Detailed description of the invention
Fig. 1 is the sectional view for indicating an embodiment of electromagnetic shielding film of the utility model.
Fig. 2 is the sectional view for indicating the other embodiments of electromagnetic shielding film of the utility model.
Fig. 3 is the sectional view for indicating the other embodiments of electromagnetic shielding film of the utility model.
Fig. 4 is the sectional view for indicating the manufacturing process of electromagnetic shielding film of Fig. 1.
Fig. 5 is the sectional view of an embodiment of the printed circuit board for the charged magnetic shielding film for indicating the utility model.
Fig. 6 is printed circuit board the cutting the state of the first demoulding film stripping indicated from the charged magnetic shielding film of Fig. 5
Face figure.
Fig. 7 is the sectional view for indicating the manufacturing process of the printed circuit board of charged magnetic shielding film of Fig. 5 and Fig. 6.
Specific embodiment
The definition of term below is suitable for present specification and claims.
So-called " isotropic conductivity adhesive layer " refers to conductive conduction on thickness direction and face direction
Property adhesive layer.
So-called " anisotropic conductive adhesive layer " refers to conductive in a thickness direction and in the surface direction not
Conductive conductive adhesive layer.
So-called " conductive adhesive layer for not having electric conductivity in the surface direction " refers to that sheet resistance is 1 × 104Ω with
On conductive adhesive layer.
The average grain diameter of particle is that 30 particles are randomly chosen from the MIcrosope image of particle, for each particle,
Most path and maximum diameter are measured, using the median of most path and maximum diameter as the partial size of a particle, by 30 particles of measurement
Partial size take value obtained from arithmetic average.The measuring method of the average grain diameter of the particle is measuring the aftermentioned grain as colorant
Son, use whens also may include other particles in addition to above-mentioned colorant and electroconductive particle in adhesive phase etc..Film
The thickness of (mold release film, insulating film etc.), film (insulating resin layer, conductive adhesive layer etc.), metal film layer etc. be using
The section of microscope Observe and measure object, value obtained from measuring the thickness at 5 and being averaged.
Storage elasticity moduli is calculated by the stress and the strain of detection for giving measure object, used as temperature or time
The measurement of dynamic viscoelasticity device of function output, it is measured as one of viscoelastic property.
Sheet resistance is used in 2 thin-film metal electrodes (the length 10mm, width that gold is deposited on quartz glass and is formed
Degree is 5mm, interelectrode distance 10mm), determinand is placed on this electrode, is pressed from determinand with the load of 0.049N
The region of 10mm × 20mm of determinand is pressed, with the interelectrode resistance of 1mA measurement amperometric determination below.
For convenience of description, the size ratio in FIG. 1 to FIG. 7 is from actual size than different.
<electromagnetic shielding film>
Fig. 1 is the sectional view for indicating the first embodiment of electromagnetic shielding film of the utility model, and Fig. 2 is to indicate this
The sectional view of the second embodiment of the electromagnetic shielding film of utility model, Fig. 3 are the electromagnetic wave shieldings for indicating the utility model
The sectional view of the third embodiment of film.
The electromagnetic shielding film 1 of first embodiment, second embodiment and third embodiment has insulating resin layer
10；The adjacent conductive layer 20 with insulating resin layer 10；With the opposite side adjoining relative to conductive layer 20 of insulating resin layer 10
First mold release film 30；The second adjacent mold release film 40 with the opposite side relative to insulating resin layer 10 of conductive layer 20.
The electromagnetic shielding film 1 of first embodiment is that conductive layer 20 has the metallic film adjacent with insulating resin layer 10
The example of layer 22 and the anisotropic conductive adhesive layer 24 adjacent with the second mold release film 40.
The electromagnetic shielding film 1 of second embodiment is that conductive layer 20 has the metallic film adjacent with insulating resin layer 10
The example of layer 22 and the isotropic conductivity adhesive layer 26 adjacent with the second mold release film 40.
The electromagnetic shielding film 1 of third embodiment is conductive layer 20 only comprising isotropic conductivity adhesive layer 26
Example.
(insulating resin layer)
Insulating resin layer 10 becomes the basis (substrate) when forming metal film layer 22.In addition, insulating resin layer 10 is being incited somebody to action
Electromagnetic shielding film 1 is pasted in the surface of the insulating film on the surface that flexible printed circuit board is arranged in, and by the first mold release film 30
After removing, become the protective layer of metal film layer 22.
As insulating resin layer 10, the coating that coating includes heat-curing resin and curing agent can be enumerated, keeps it partly solid
The film changed or be solidified to form；The film for being coated with the coating comprising thermoplastic resin and being formed；Comprising that will include thermoplastic resin
The layer etc. of film obtained from the composition melt-shaping of rouge.Heat resistance aspect whens solder etc., preferably painting cloth bag
Coating containing heat-curing resin and curing agent, the film for making its semi-solid preparation or being solidified to form.
As heat-curing resin, amide resin, epoxy resin, phenolic resin, amino resins, alkyd tree can be enumerated
Rouge, polyurethane resin, synthetic rubber, UV light-curable acrylate resin etc..
As heat-curing resin, from excellent heat resistance aspect, preferred amide resin, epoxy resin.
As curing agent, well known curing agent corresponding with the type of heat-curing resin can be enumerated.
Insulating resin layer 10 is in order to by the printed circuit of printed circuit board is hidden or printing to charged magnetic shielding film
Circuit board assigns design, also may include any one of colorant (pigment, dyestuff etc.) and filler or both.
It is excellent from weatherability, heat resistance, concealed aspect as any one of colorant and filler or both
Select pigment or filler, from the concealment of printed circuit, design aspect, more preferable black pigment or black pigment with
The combination of other pigment or filler.
Insulating resin layer 10 also may include fire retardant.
Insulating resin layer 10 in the range of not damaging the effect of the utility model, also can according to need comprising other at
Point.
Storage elasticity moduli at 180 DEG C of insulating resin layer 10 is preferably 5 × 106Pa or more and 5 × 109Pa hereinafter,
More preferably 1 × 107Pa or more and 1 × 109Pa or less.If the storage elasticity moduli at 180 DEG C of insulating resin layer 10 is upper
The lower limit value of range or more is stated, then insulating resin layer 10 becomes to can reduce insulating resin when hot pressing with the hardness of appropriateness
The pressure loss in layer 10.As a result, conductive adhesive layer and the printed circuit of printed circuit board are sufficiently be bonded, electric conductivity
Adhesive layer is more reliably electrically connected by the through hole of insulating film with the printed circuit of printed circuit board.If insulating resin layer
Storage elasticity moduli at 180 DEG C of 10 is the upper limit value of above range hereinafter, then flexibility becomes better for electromagnetic shielding film 1.
As a result, electromagnetic shielding film 1 becomes easy in the through hole for sinking to insulating film, conductive adhesive layer passes through insulating film
Through hole and be more reliably electrically connected with the printed circuit of printed circuit board.
The sheet resistance of insulating resin layer 10 is from electrical insulating property aspect, preferably 1 × 106Ω or more.Insulation tree
The sheet resistance of rouge layer 10 is from aspect in practical use, preferably 1 × 1019Ω or less.
The thickness of insulating resin layer 10 is preferably 0.1 μm or more and 30 μm hereinafter, more preferably 0.5 μm or more and 20 μm
Below.If more than the lower limit value with a thickness of above range of insulating resin layer 10, insulating resin layer 10 can be played fully
Function as protective layer.If insulating resin layer 10 the upper limit value with a thickness of above range hereinafter, if can make electromagnetism wave screen
It is thin to cover film 1.
(conductive layer)
As conductive layer 20, conductive layer (I) or conductive layer (II) can be enumerated, conductive layer (I) has and insulating resin layer
10 adjacent metal film layers 22 and become viscous with the electric conductivity on the most surface layer of 10 opposite side of insulating resin layer in conductive layer 20
It connects oxidant layer (anisotropic conductive adhesive layer 24 or isotropic conductivity adhesive layer 26), conductive layer (II) is only comprising each
To same sex conductive adhesive layer 26.As conductive layer 20, from can be used as electromagnetic wave shielding give full play to function in terms of
It sets out, preferably conductive layer (I).
(metal film layer)
Metal film layer 22 is the layer for wrapping metalliferous film.Metal film layer 22 is due to according to the side extended along the plane direction
Formula is formed, thus it is conductive in the surface direction, it is functioned as electromagnetic wave shielding etc..
As metal film layer 22, can enumerate through physical vapor deposition (vacuum evaporation, sputtering, ion beam vapor deposition, electron beam
Vapor deposition etc.) or the CVD evaporation film formed, the plating film, the metal foil that are formed by plating etc..From the excellent electric conductivity in face direction
Aspect is set out, preferably evaporation film, plating film, from thickness can be made thin and even if thickness thin and face direction electric conductivity it is excellent,
It is set out by the aspect that dry process can be simply forming, more preferable evaporation film further preferably utilizes the steaming of physical vapor deposition
Plated film.
As the metal for constituting metal film layer 22, aluminium, silver, copper, gold, conductive ceramic etc. can be enumerated.From conductivity
Aspect set out, preferred copper chemically sets out in terms of stability, preferably conductive ceramic.
The sheet resistance of metal film layer 22 is preferably 0.001 Ω or more and 1 Ω hereinafter, more preferably 0.001 Ω or more
And 0.5 Ω or less.If the sheet resistance of metal film layer 22 is the lower limit value of above range or more, metal film layer can be made
22 is sufficiently thin.If metal film layer 22 sheet resistance be above range upper limit value hereinafter, if can be used as electromagnetic wave shielding
Layer gives full play to function.
The thickness of metal film layer 22 is preferably 0.01 μm or more and 1 μm hereinafter, more preferably 0.05 μm or more and 1 μm
Below.If metal film layer 22 with a thickness of 0.01 μm or more, the electric conductivity in face direction further becomes good.If metal foil
Film layer 22 with a thickness of 0.05 μm or more, then the shield effectiveness of electromagnetic wave noise further becomes good.If metal film layer 22
The upper limit value with a thickness of above range hereinafter, then electromagnetic shielding film 1 can be made thin.In addition, the production of electromagnetic shielding film 1
Rate, flexibility becomes better.
(conductive adhesive layer)
Conductive adhesive layer is at least conductive in a thickness direction and has cementability.
As conductive adhesive layer, it can enumerate conductive in a thickness direction and not have in the surface direction
The anisotropic conductive adhesive layer 24 of electric conductivity or conductive isotropism on thickness direction and face direction are led
Electrical adhesive layer 26.As the conductive adhesive layer in conductive layer (I), from conductive adhesive layer can be made thin, conductive
The quantitative change of property particle is few, as a result, electromagnetic shielding film 1 can be made thin, the aspect that flexibility becomes better of electromagnetic shielding film 1
It sets out, preferably anisotropic conductive adhesive layer 24.As the conductive adhesive layer in conductive layer (I), from being capable of conduct
Electromagnetic wave shielding sets out in terms of giving full play to function, preferably isotropic conductivity adhesive layer 26.
As conductive adhesive layer, from can play heat resistance aspect after hardening, preferred Thermocurable
Conductive adhesive layer.The conductive adhesive layer of Thermocurable can be uncured state, or by the shape of B-staged
State.
The anisotropic conductive adhesive layer 24 of Thermocurable is including, for example, Thermocurable bonding agent 24a and electric conductivity
Particle 24b.
The isotropic conductivity adhesive layer 26 of Thermocurable is including, for example, Thermocurable bonding agent 26a and electric conductivity
Particle 26b.
As Thermocurable bonding agent, the bonding comprising heat-curing resin and curing agent with cementability can be enumerated
Agent.
As heat-curing resin, epoxy resin, phenolic resin, amino resins, alkyd resin, polyurethane tree can be enumerated
Rouge, synthetic rubber, UV light-curable acrylate resin etc..As heat-curing resin, from excellent heat resistance aspect,
Preferred epoxy.
As curing agent, well known curing agent corresponding with the type of heat-curing resin can be enumerated.
When heat-curing resin is epoxy resin, Thermocurable bonding agent also be may include for assigning flexible rubber
Ingredient (carboxy-modified nitrile rubber, acrylic rubber etc.), bonding imparting agent etc..
Thermocurable bonding agent also can according to need comprising fire retardant.
Thermocurable bonding agent also may include to improve the intensity of conductive adhesive layer, improve Blanking Properties
Celluosic resin, microfibril (glass fibre etc.).
Thermocurable bonding agent also can according to need in the range of not damaging the effect of the utility model comprising other
Ingredient.
As electroconductive particle, the particle, graphite of metal (silver, platinum, gold, copper, nickel, palladium, aluminium, solder etc.) can be enumerated
Powder, firing carbon particle, the firing carbon particle being plated etc..As electroconductive particle, become to have from conductive adhesive layer suitable
It sets out in terms of the pressure loss in the hardness of degree, conductive adhesive layer when can reduce hot pressing, preferably metallic, more
It is preferred that copper particle.
The average grain diameter of electroconductive particle 24b in anisotropic conductive adhesive layer 24 is preferably 2 μm or more and 26
μm hereinafter, more preferably 4 μm or more and 16 μm or less.If the average grain diameter of electroconductive particle 24b is the lower limit value of above range
More than, then it can ensure the thickness of anisotropic conductive adhesive layer 24, sufficient adhesive strength can be obtained.If electric conductivity
The average grain diameter of particle 24b is the upper limit value of above range hereinafter, can then ensure anisotropic conductive adhesive layer 24
Mobility (to the tracing ability of the shape of the through hole of insulating film) can will be filled in the through hole of insulating film with conductive adhesive
Divide landfill.
The average grain diameter of electroconductive particle 26b in isotropic conductivity adhesive layer 26 be preferably 0.1 μm or more and
10 μm hereinafter, more preferably 0.2 μm or more and 1 μm or less.If the average grain diameter of electroconductive particle 26b is under above range
More than limit value, then the contact of electroconductive particle 26b, which is counted, increases, and can steadily improve the conduction in 3 dimension directions.If electric conductivity
The average grain diameter of particle 26b is the upper limit value of above range hereinafter, can then ensure isotropic conductivity adhesive layer 26
Mobility (to the tracing ability of the shape of the through hole of insulating film), can by the through hole of insulating film with conductive adhesive
Sufficiently landfill.
The ratio of electroconductive particle 24b in anisotropic conductive adhesive layer 24 is preferably that anisotropic conductive is viscous
The 1 volume % or more in 100 volume % of oxidant layer 24 is met and 30 volume % hereinafter, more preferably 2 volume % or more and 10 bodies
Product % or less.If the ratio of electroconductive particle 24b is the lower limit value of above range or more, anisotropic conductive adhesive layer
24 electric conductivity becomes good.If electroconductive particle 24b ratio be above range upper limit value hereinafter, if anisotropic conductive
The cementability of property adhesive layer 24, mobility (to the tracing ability of the shape of the through hole of insulating film) become good.In addition, electric
Flexibility becomes better for magnetic wave screened film 1.
The ratio of electroconductive particle 26b in isotropic conductivity adhesive layer 26 is preferably that isotropic conductivity is viscous
The 50 volume % or more in 100 volume % of oxidant layer 26 are met and 80 volume % hereinafter, more preferably 60 volume % or more and 70 bodies
Product % or less.If the ratio of electroconductive particle 26b is the lower limit value of above range or more, isotropic conductivity adhesive layer
26 electric conductivity becomes good.If electroconductive particle 26b ratio be above range upper limit value hereinafter, if isotropism it is conductive
The cementability of property adhesive layer 26, mobility (to the tracing ability of the shape of the through hole of insulating film) become good.In addition, electric
Flexibility becomes better for magnetic wave screened film 1.
Storage elasticity moduli at 180 DEG C of conductive adhesive layer is preferably 1 × 103Pa or more and 5 × 107Pa with
Under, more preferably 5 × 103Pa or more and 1 × 107Pa or less.If the storage elasticity moduli at 180 DEG C of conductive adhesive layer
More than the lower limit value of above range, then conductive adhesive layer further becomes to can reduce hot pressing with the hardness of appropriateness
When conductive adhesive layer in the pressure loss.As a result, the printed circuit of conductive adhesive layer and printed circuit board
Sufficiently bonding, conductive adhesive layer are more reliably electrically connected by the through hole of insulating film and the printed circuit of printed circuit board
It connects.If the storage elasticity moduli at 180 DEG C of conductive adhesive layer be above range upper limit value hereinafter, if electromagnetic wave shielding
Flexibility becomes better for film 1.As a result, electromagnetic shielding film 1 becomes easy in the through hole for sinking to insulating film, electric conductivity bonding
Oxidant layer is more reliably electrically connected by the through hole of insulating film with the printed circuit of printed circuit board.
The sheet resistance of anisotropic conductive adhesive layer 24 is preferably 1 × 104Ω or more and 1 × 1016Ω hereinafter,
More preferably 1 × 106Ω or more and 1 × 1014Ω or less.If the sheet resistance of anisotropic conductive adhesive layer 24 is above-mentioned
More than the lower limit value of range, then the content of electroconductive particle 24b is suppressed lower.If anisotropic conductive adhesive layer 24
Sheet resistance be the upper limit value of above range hereinafter, then there is no problem in practical, in terms of anisotropy.
The sheet resistance of isotropic conductivity adhesive layer 26 is preferably 0.05 Ω or more and 2.0 Ω hereinafter, more preferably
For 0.1 Ω or more and 1.0 Ω or less.If the sheet resistance of isotropic conductivity adhesive layer 26 is the lower limit value of above range
More than, then the content of electroconductive particle 26b is suppressed lower, and the viscosity of conductive adhesive will not become excessively high, coating
Further become good.Furthermore it is possible to further ensure that the mobility of isotropic conductivity adhesive layer 26 (to insulating film
The tracing ability of the shape of through hole).If the sheet resistance of isotropic conductivity adhesive layer 26 is the upper limit value of above range
Hereinafter, then having the layer of uniform electric conductivity as the whole face of isotropic conductivity adhesive layer 26.
The thickness of anisotropic conductive adhesive layer 24 is preferably 3 μm or more and 25 μm hereinafter, more preferably 5 μm or more
And 15 μm or less.If more than the lower limit value with a thickness of above range of anisotropic conductive adhesive layer 24, can ensure
The mobility (to the tracing ability of the shape of the through hole of insulating film) of anisotropic conductive adhesive layer 24, can be by insulating film
Through hole in sufficiently filled with conductive adhesive.If anisotropic conductive adhesive layer 24 with a thickness of above range
Upper limit value is hereinafter, then can make electromagnetic shielding film 1 thin.In addition, flexibility becomes better for electromagnetic shielding film 1.
The thickness of isotropic conductivity adhesive layer 26 is preferably 5 μm or more and 20 μm hereinafter, more preferably 7 μm or more
And 17 μm or less.If it is more than the lower limit value with a thickness of above range of isotropic conductivity adhesive layer 26, isotropism
The electric conductivity of conductive adhesive layer 26 becomes well, can give full play to function as electromagnetic wave shielding.Furthermore it is possible to really
The mobility (to the tracing ability of the shape of the through hole of insulating film) for protecting isotropic conductivity adhesive layer 26, can will insulate
It is sufficiently filled in the through hole of film with conductive adhesive, folding resistance can also ensure that, even if alternating bending, isotropism is conductive
Property adhesive layer 26 will not be broken.If the upper limit value with a thickness of above range of isotropic conductivity adhesive layer 26 with
Under, then electromagnetic shielding film 1 can be made thin.In addition, flexibility becomes better for electromagnetic shielding film 1.
(the first mold release film)
First mold release film 30 is to make electromagnetic shielding film 1 as the film of the carrier film of insulating resin layer 10 or conductive layer 20
Treatability become good.First mold release film 30 is set after electromagnetic shielding film 1 to be attached to printed circuit board etc. above from insulation
Rouge layer 10 is removed.
First mold release film 30 has demoulding membrane body 32 and is set to the table of 10 side of insulating resin layer of demoulding membrane body 32
The adhesive phase 34 in face.
As the resin material of demoulding membrane body 32, polyethylene terephthalate can be enumerated (hereinafter, also referred to as
PET.), it is polyethylene naphthalate, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-
Acetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene-vinyl acetate copolymer, polyvinyl chloride, Vingon, conjunction
At rubber, liquid crystal polymer etc..As resin material, heat resistance (dimensional stability) when from manufacture electromagnetic shielding film 1 and
It sets out in terms of price, preferably PET.
Demoulding membrane body 32 also may include any one of colorant (pigment, dyestuff etc.) and filler or both.
As any one of colorant and filler or both, from can clearly be distinguished with insulating resin layer 10, in heat
Be easily noted that after pressure the first mold release film 30 forget removing aspect set out, preferably with 10 different colours of insulating resin layer
The combination of toner and filler, more preferable white pigment, filler or white pigment and other pigment or filler.
As described later, in the present embodiment, due to the colorant adhesive phase by including in adhesive phase 34
34 fully show the color different from insulating resin layer 10 (such as white etc.), so demoulding membrane body 32 can not also wrap
It is transparent containing colorant and filler.If demoulding membrane body 32 does not include colorant and filler, it is de- that first can be manufactured inexpensively
Mould film 30.
The storage elasticity moduli demoulded at 180 DEG C of membrane body 32 is preferably 8 × 107Pa or more and 5 × 109Pa, it is more excellent
It is selected as 1 × 108Pa or more and 8 × 108Pa.If demoulding the storage elasticity moduli at 180 DEG C of membrane body 32 is under above range
More than limit value, then the first mold release film 30 becomes the hardness with appropriateness, the pressure in the first mold release film 30 when can reduce hot pressing
Power loss.If the upper limit value that the storage elasticity moduli at demoulding 180 DEG C of membrane body 32 is above range hereinafter, if it is first de-
The flexibility of mould film 30 becomes good.
The thickness for demoulding membrane body 32 is preferably 3 μm or more and 75 μm hereinafter, more preferably 12 μm or more and 50 μm or less.
If more than the lower limit value with a thickness of above range for demoulding membrane body 32 treatability of electromagnetic shielding film 1 becomes good.If
The upper limit value with a thickness of above range of membrane body 32 is demoulded hereinafter, then in the surface Pyroelectric Media magnetic wave screened film 1 of insulating film
Heat is easy conduction to conductive adhesive layer when conductive adhesive layer.
Adhesive phase 34 includes adhesive 34a and colorant 34c.
Adhesive phase 34 is for example in the bonding that the surface coating of demoulding membrane body 32 includes adhesive 34a and colorant 34c
Agent composition and formed.There is adhesive phase 34 by the first mold release film 30, by the second mold release film 40 from conductive adhesive
When being attached at printed circuit board etc. above by hot pressing when layer removing or by electromagnetic shielding film 1, the first mold release film 30 can be inhibited
It is removed from insulating resin layer 10, the first mold release film 30 can give full play to the effect as protective film.
The first mold release film 30 will not be from insulating resin layer 10 easily before hot pressing to the imparting of adhesive phase 34 by adhesive 34a
The adhesiveness of the appropriateness of removing and the degree that the first mold release film 30 can be removed from insulating resin layer 10 after hot-pressing.
As adhesive 34a, acrylic adhesive, polyurethane series adhesive, elastomeric adhesive etc. can be enumerated.
The glass transition temperature of adhesive 34a is preferably -100~60 DEG C, more preferably -60~40 DEG C.
Colorant 34c is the substance coloured on adhesive phase 34.The type for the colorant 34c for including in particle layer 34
It can be a kind, be also possible to two or more.
So-called colorant 34c refers to can colour relative to adhesive phase 34, pass through the absorption of visible light or release
Give the additive of color.As such additive, such as pigment, the especially effect from the coloring of unit content can be used
Fruit sets out, it is preferable to use pigment, dyestuff etc., particularly preferred pigment.As the pigment that can be used for colorant 34c, preferably for example wrap
Containing selected from one or more of the group being made of titanium oxide, barium sulfate and zinc oxide.Wherein, colorant 34c more preferably includes oxygen
Change titanium.By using the pigment of titanium oxide in colorant 34c, tinting strength, tinting power (hidden power) is high, can relative to adhesive phase 34
Assign the white easily identified by visual observation.As a result, the shape after the state and removing of not removing the first mold release film 30
The difference visually of state becomes to be particularly easy to.
Colorant 34c be particle when, average grain diameter be preferably 0.01 μm or more and 1 μm hereinafter, more preferably 0.1 μm with
It is upper and 0.5 μm hereinafter, further preferably 0.1 μm more than or lower than 0.5 μm.In the case where colorant 34c is particle, pass through
Its average grain diameter is 0.01 μm or more, and adhesive phase 34 is sufficiently colored.As a result, the first mold release film 30 is not removed
State and removing after the difference visually of state can become abundant.It is 1 μm hereinafter, colorant by average grain diameter
34c does not hinder the adhesiveness of adhesive 34a, and adhesive phase 34 has the adhesiveness of appropriateness.In addition, colorant 34c contains by that
When the particle of more than two kinds that this different material is formed, for the particle of various species, it is preferably to be above-mentioned average grain diameter.
The additive amount of colorant 34c is preferably 10% or more relative to the mass percent of the total quality of adhesive phase 34
And 40% hereinafter, more preferably 20% or more and 30% or less.If the additive amount of colorant 34c be above range lower limit value with
On, then adhesive phase 34 is coloured denselyer.As a result, the shape after the state and removing of not removing the first mold release film 30
The difference visually of state becomes easier to.If colorant 34c additive amount be above range upper limit value hereinafter, if colour
Agent 34c does not hinder the adhesiveness of adhesive 34a, and adhesive phase 34 has the adhesiveness of appropriateness.
In addition, recessed in order to be assigned to adjacent insulating resin layer 10 and bumps are arranged on the surface of adhesive phase 34
Convex, adhesive phase 34 also may include the particle (not shown) in addition to above-mentioned colorant.As in addition to above-mentioned colorant
Particle can be enumerated such as inorganic particulate, polymer particle.As inorganic particulate, silicon dioxide granule, carbonic acid can be enumerated
Calcium particle, aluminium oxide particles etc..As polymer particle, acrylic particles, melamine particle etc. can be enumerated.As except upper
State the particle other than colorant, from be easy with adhesive 34a it is fused, generate uniform concave-convex aspects, be preferably selected from by
It is at least one kind of in the group of silicon dioxide granule and acrylic particles composition.Particle usually in addition to above-mentioned colorant is preferably flat
Equal partial size is greater than colorant.The average grain diameter of particle in addition to above-mentioned colorant for example be preferably 0.5 μm or more and 15 μm with
Under, more preferably 1 μm or more and 13 μm hereinafter, further preferably 2 μm or more and 10 μm or less.If due to removing above-mentioned coloring
The average grain diameter of particle other than agent is the lower limit value of above range or more, then is easy to be set as journey identical as the film thickness of adhesive
Degree, so the bumps of particle can be prevented to be embedded in adhesive phase 34, can assign bumps to adjacent insulating resin layer 10.
If particle average grain diameter be above range upper limit value hereinafter, if particle will not be detached from from adhesive phase 34.Except above-mentioned coloring
Particle other than agent can be used alone, and also may be two kinds or more.In addition, the particle in addition to above-mentioned colorant is excellent
It is selected as colorless or clear.
In addition, it is concave-convex by being arranged on the surface of insulating resin layer 10, it can reduce the reflection of the light in above-mentioned surface, mention
Visibility of the height in above-mentioned surface lettering.
The thickness of adhesive phase 34 is preferably 1 μm or more and 15 μm hereinafter, more preferably 3 μm or more and 10 μm or less.If
Adhesive phase 34 with a thickness of in above range, then becoming to be particularly easy to remove the first mold release film 30.The thickness of adhesive phase 34
Degree is preferably thinner than demoulding the thickness of membrane body 32.
The total light transmittance that the first mold release film 30 with adhesive phase 34 is measured based on JIS K 7361:1997
It (T.T) is preferably 30% or more and 70% or less.Above-mentioned total light transmittance be more preferably 35% or more and 60% hereinafter,
Particularly preferably 35% or more and 50% or less.By make total light transmittance 30% or more and 70% hereinafter, by sufficiently
Color, there is the first mold release film 30 of adhesive phase 34 to become easy for identification by visual observation.
The mist degree (HAZE) that the first mold release film 30 with adhesive phase 34 is measured based on JIS K 7136:2000 is excellent
It is selected as 80% or more and 99.5% or less.Above-mentioned mist degree is more preferably 90% or more and 99.5% hereinafter, particularly preferably
95% or more and 99.5% or less.By making mist degree 80% or more and 99.5% hereinafter, being sufficiently colored as in addition to transparent
Color, by visual observation identification have adhesive phase 34 the first mold release film 30 become easy.
The thickness of first mold release film 30 is preferably 25 μm or more and 125 μm hereinafter, more preferably 38 μm or more and 100 μm
Below.If more than the lower limit value with a thickness of above range of first mold release film 30 treatability of electromagnetic shielding film 1 becomes good
It is good.If the first mold release film 30 the upper limit value with a thickness of above range hereinafter, if insulating film surface Pyroelectric Media magnetic wave shield
Heat is easy conduction to conductive adhesive layer when the conductive adhesive layer of film 1.
(the second mold release film)
Second mold release film 40 is to protect the film of conductive adhesive layer, and the treatability of electromagnetic shielding film 1 is made to become good.
Second mold release film 40 is removed before electromagnetic shielding film 1 to be attached to printed circuit board etc. above from conductive adhesive layer.
Second mold release film 40 has such as demoulding membrane body 42 and is set to the conductive adhesive layer of demoulding membrane body 42
The releasing agent layer 44 on the surface of side.
As the resin material of demoulding membrane body 42, material same as the resin material for demoulding membrane body 32 can be enumerated
Material.
Demoulding membrane body 42 also may include colorant, filler etc..
Demoulding membrane body 42 thickness be preferably 5 μm or more and 500 μm hereinafter, more preferably 10 μm or more and 150 μm with
Under, further preferably 25 μm or more and 100 μm or less.
Releasing agent layer 44 is will to demould the surface of membrane body 42 so that release agent is handled and is formed.Pass through the second mold release film 40
With releasing agent layer 44, when removing the second mold release film 40 from conductive adhesive layer, it is easy to remove the second mold release film 40,
Conductive adhesive layer becomes not easy to break.
As release agent, as long as using well known release agent.
The thickness of releasing agent layer 44 be preferably 0.05 μm or more and 30 μm hereinafter, more preferably 0.1 μm or more and 20 μm with
Under.If releasing agent layer 44 with a thickness of in above range, the removing of the second mold release film 40 is further become easy.
(thickness of electromagnetic shielding film)
The thickness (in addition to mold release film) of electromagnetic shielding film 1 is preferably 5 μm or more and 50 μm hereinafter, more preferably 8 μm
Above and 30 μm or less.If the thickness (in addition to mold release film) of electromagnetic shielding film 1 is the lower limit value of above range or more,
It is not easy to break when by the removing of the first mold release film 30.If the thickness (in addition to mold release film) of electromagnetic shielding film 1 is above range
Upper limit value is hereinafter, then can make the printed circuit board of charged magnetic shielding film thin.
(manufacturing method of electromagnetic shielding film)
The electromagnetic shielding film of the utility model can be for example, by with following process (a)~(c) methods (α)
To manufacture.
Process (a): in the process that the one side of the first mold release film forms insulating resin layer.
Process (b): after process (a), in the process that the surface of insulating resin layer forms conductive layer.
Process (c): after process (b), in the process that the surface of conductive layer attaches the second mold release film.
In addition, the electromagnetic shielding film of the utility model can for example, by with following processes (a '), (b ' 1),
The method (β) of (b ' 2), (c ') manufactures.
Process (a '): in the process that the one side of the first mold release film forms insulating resin layer.
Process (b ' 1): by forming metal film layer on the surface of insulating resin layer, successively had the first demoulding
The process of the first layer stack of film, insulating resin layer and metal film layer.
Process (b ' 2): conductive adhesive layer is formed by the one side in the second mold release film, it is de- successively to be had second
The process of mould film and the second laminated body of conductive adhesive layer.
Process (c '): contact first layer stack according to metal film layer with conductive adhesive layer with the second laminated body
The process that mode is bonded.
Hereinafter, the method for manufacturing electromagnetic shielding film 1 shown in Fig. 1 by method (α), carries out referring to Fig. 4
Explanation.
Process (a):
As shown in Figure 4, insulating resin layer 10 is formed on the surface of the adhesive phase 34 of the first mold release film 30.
First mold release film 30 includes adhesive 34a and colorant 34c for example, by the surface coating in demoulding membrane body 32
Adhesive composition and form adhesive phase 34 to manufacture.
As the forming method of insulating resin layer 10, heat resistance aspect whens solder of reflux type etc.,
It is preferred that coating is formed comprising the insulating resin layer of heat-curing resin and curing agent uses coating, make its semi-solid preparation or cured side
Method.
Insulating resin layer formation also can according to need with coating comprising solvent, colorant, filler, fire retardant or other
Ingredient.
Process (b):
As shown in Figure 4, metal film layer 22 (process (b1)) is formed on the surface of insulating resin layer 10, in gold
The surface for belonging to film layer 22 forms anisotropic conductive adhesive layer 24 (process (b2)).
As the forming method of metal film layer 22, can enumerate by physical vapor deposition, CVD formed evaporation film method,
The method of plating film, the method for attaching metal foil etc. are formed by plating.From the gold for the excellent electric conductivity for being capable of forming face direction
The aspect for belonging to film layer 22 is set out, and is preferably formed the method for evaporation film by physical vapor deposition, CVD or is formed plating by plating
The method of film, it is excellent from the electric conductivity that the thickness of metal film layer 22 can be made thin and be capable of forming thickness is thin face direction
Different metal film layer 22 is set out by the aspect that dry process can be simply forming metal film layer 22, is more preferably passed through
The method that physical vapor deposition, CVD form evaporation film, the method that evaporation film is further preferably formed by physical vapor deposition.
As the forming method of anisotropic conductive adhesive layer 24, can enumerate on the surface of metal film layer 22
The method for being coated with Thermocurable conductive adhesive composition.
As Thermocurable conductive adhesive composition, using including Thermocurable bonding agent 24a and electroconductive particle
The composition of 24b.
Process (c):
As shown in Figure 4, the second mold release film 40 is attached on the surface of anisotropic conductive adhesive layer 24, obtained
To electromagnetic shielding film 1.
(function and effect)
In electromagnetic shielding film 1 described above, since the first mold release film 30 has and the adjoining of insulating resin layer 10
Adhesive phase 34, and adhesive phase 34 includes adhesive 34a and colorant 34c, so adhesive phase 34 is coloured.Therefore, from
It, can be by the shape of adhesive phase 34 and the adjoining of insulating resin layer 10 when the surface side of first mold release film 30 sees electromagnetic shielding film 1
State and the state for having removed adhesive phase 34 are distinguished by the color of adhesive phase 34.As a result, it is possible to prevent flexible print
The first mold release film 30 when the manufacture of printed circuit board is forgotten to remove.The manufacture of adhesive phase 34 comprising colorant 34c can be with
It inexpensively and is easy to carry out, due to not needing to be dispersed with pigment etc. in the first demoulding membrane body 32, so being capable of cheap and appearance
It changes places and manufactures electromagnetic shielding film 1.In addition, preferably adhesive phase 34 is also shelled together when removing the first mold release film 30
From, but in the present embodiment, it is coloured by adhesive phase 34, is able to detect the adhesive phase 34 on insulating resin layer 10
Removing residual.That is, can prevent the removing of adhesive phase 34 from remaining, the surface of the ontology of electromagnetic shielding film 1 can be prevented
Pollution.
(other embodiments)
As long as the electromagnetic shielding film of the utility model have insulating resin layer, the conductive layer adjacent with insulating resin layer and
The first adjacent mold release film with the opposite side relative to conductive layer of insulating resin layer；First mold release film has and insulating resin layer
The adhesive phase to connect；Adhesive phase includes adhesive and colorant, is not limited to the embodiment of illustrated example.
For example, second mold release film also can have bonding in the case where the viscosity on the surface of conductive adhesive layer is few
Oxidant layer replaces releasing agent layer.Or the second mold release film can also be omitted.
In the case where demoulding the high mold release of membrane body, the second mold release film is also possible to not have releasing agent layer, only wrap
The film of the membrane body containing demoulding.
Insulating resin layer may be 2 layers or more.
<printed circuit board of charged magnetic shielding film>
Fig. 5 is the sectional view of an embodiment of the printed circuit board for the charged magnetic shielding film for indicating the utility model.
It is real that the flexible printed circuit board 2 of charged magnetic shielding film has flexible printed circuit board 50, insulating film 60 and first
Apply the electromagnetic shielding film 1 of mode.
Flexible printed circuit board 50 is provided with the flexible print circuit of printed circuit 54 for at least one side in basilar memebrane 52
Plate.
Insulating film 60 is set to the surface for being provided with 54 side of printed circuit of flexible printed circuit board 50.
The anisotropic conductive adhesive layer 24 of electromagnetic shielding film 1 is Nian Jie with the surface of insulating film 60 and is cured.
In addition, anisotropic conductive adhesive layer 24 passes through the through hole (illustration omitted) and printed circuit that are formed on insulating film 60
54 electrical connections.
In the flexible printed circuit board 2 of charged magnetic shielding film, the second mold release film 40 is bonded from anisotropic conductive
Oxidant layer 24 is removed.
When the first mold release film 30 becomes not needing in the flexible printed circuit board 2 of charged magnetic shielding film, such as institute in Fig. 6
As showing, the first mold release film 30 is removed from insulating resin layer 10.After the removing of the first mold release film 30, colorant can be passed through
The removing of adhesive phase 34 in surface of the presence or absence of the 34c to confirm insulating resin layer 10 it is remaining whether there is or not.
Near the printed circuit 54 (signal circuit, earthed circuit, ground plane etc.) in addition to the part for having through hole,
The metal film layer 22 of electromagnetic shielding film 1 is opposite via insulating film 60 and the interval of anisotropic conductive adhesive layer 24 to match
It sets.
The spacing distance of printed circuit 54 and metal film layer 22 in addition to the part for having through hole and insulating film 60
The summation of the thickness of thickness and anisotropic conductive adhesive layer 24 is roughly equal.Spacing distance be preferably 30 μm or more and
200 μm hereinafter, more preferably 60 μm or more and 200 μm or less.Since if spacing distance is less than 30 μm, the impedance of signal circuit
It is lower, so in order to have the characteristic impedances such as 100 Ω, it is necessary to reduce the line width of signal circuit, the unevenness of line width is hindered as characteristic
Anti- unevenness becomes easy enhancing electric signal by the detuning caused reflection resonance noise of impedance.If spacing distance is greater than 200 μ
M, then the flexible printed circuit board 2 of charged magnetic shielding film thickens, flexible insufficient.
(flexible printed circuit board)
Flexible printed circuit board 50 is that the copper foil of copper-clad laminated board is processed into desired figure by well known etching method
Case and the flexible printed circuit board that printed circuit (power circuit, earthed circuit, ground plane etc.) is made.
As copper-clad laminated board, the one or both sides in basilar memebrane 52 can be enumerated via adhesive layer (illustration omitted)
It is pasted with the copper-clad laminated board of copper foil；It is cast on the surface of copper foil obtained from resin solution to form basilar memebrane 52 etc. and covers copper
Plywood etc..
As the material of adhesive layer, epoxy resin, polyester, polyimides, polyamidoimide, polyamides can be enumerated
Amine, phenolic resin, polyurethane resin, acrylic resin, melamine resin etc..
The thickness of adhesive layer is preferably 0.5 μm or more and 30 μm or less.
(basilar memebrane)
As basilar memebrane 52, preferably with heat resistance film, more preferable polyimide film, liquid crystalline polymer film, further
It is preferred that polyimide film.
The sheet resistance of basilar memebrane 52 is from electrical insulating property aspect, preferably 1 × 106Ω or more.Basilar memebrane 52
Sheet resistance is from aspect in practical use, preferably 1 × 1019Ω or less.
The thickness of basilar memebrane 52 is preferably 5 μm or more and 200 μm hereinafter, from bendability aspect, and more preferably 6 μm
Above and 25 μm hereinafter, more preferably 10 μm or more and 25 μm or less.
(printed circuit)
As the copper foil for constituting printed circuit 54 (signal circuit, earthed circuit, ground plane etc.), rolling copper can be enumerated
Foil, electrolytic copper foil etc., from bendability aspect, preferably rolled copper foil.
The thickness of copper foil is preferably 1 μm or more and 50 μm hereinafter, more preferably 18 μm or more and 35 μm or less.
The end (terminal) of the length direction of printed circuit 54 does not have for solder connection, connector connection, component mounting etc.
Have and is covered by insulating film 60 or electromagnetic shielding film 1.
(insulating film)
Insulating film 60 (cover film) is in coating of the one side by bonding agent of insulation membrane body (illustration omitted), bonding agent
Attaching of sheet material etc. and the film for being formed with adhesive layer (illustration omitted).
The sheet resistance of insulation membrane body is from electrical insulating property aspect, preferably 1 × 106Ω or more.Insulating film sheet
The sheet resistance of body is from aspect in practical use, preferably 1 × 1019Ω or less.
As insulation membrane body, preferably with the film of heat resistance, more preferable polyimide film, liquid crystalline polymer film, into one
Walk preferred polyimide film.
Insulation membrane body thickness be preferably 1 μm or more and 100 μm hereinafter, from pliability aspect, more preferably 3
μm or more and 25 μm or less.
As the material of adhesive layer, epoxy resin, polyester, polyimides, polyamidoimide, polyamides can be enumerated
Amine, phenolic resin, polyurethane resin, acrylic resin, melamine resin, polystyrene, polyolefin etc..Epoxy resin can also
Comprising for assigning flexible rubber constituent (carboxy-modified nitrile rubber etc.).
The thickness of adhesive layer is preferably 1 μm or more and 100 μm hereinafter, more preferably 1.5 μm or more and 60 μm or less.
The shape of the opening portion of through hole is not particularly limited.The shape of opening portion as through hole 62 can enumerate
Such as circle, ellipse, quadrangle etc..
(manufacturing method of the printed circuit board of charged magnetic shielding film)
The printed circuit board of the charged magnetic shielding film of the utility model can for example, by with following processes (d)~
(g) method manufactures.
Process (d): on the surface for being provided with printed circuit side of printed circuit board, it is arranged in position corresponding with printed circuit
The insulating film for being formed with through hole is set, the process for obtaining the printed circuit board with insulating film.
Process (e): after process (d), by by the printed circuit board with insulating film and the sheet for having removed the second mold release film
The electromagnetic shielding film of utility model be overlapped in such a way that conductive adhesive layer is contacted with the surface of insulating film and by they
Hot pressing is bonded conductive adhesive layer on the surface of insulating film, and conductive adhesive layer is passed through through hole and printed circuit
Electrical connection, the process for obtaining the printed circuit board of charged magnetic shielding film.
Process (f): after process (e), when the first mold release film becomes not needing by the process of the first demoulding film stripping.
Process (g): make anisotropic conductive between process (e) and process (f) or after process (f) as needed
The process of adhesive layer formal solidification.
Hereinafter, being illustrated for the method for the flexible printed circuit board for manufacturing charged magnetic shielding film referring to Fig. 7.
(process (d))
As shown in Figure 7, by flexible printed circuit board 50, overlapping position corresponding with printed circuit 54
The insulating film 60 for being formed with through hole 62 is set, the adhesive layer of bonding insulating film 60 (saves on the surface of flexible printed circuit board 50
Sketch map shows), solidify adhesive layer, obtains the flexible printed circuit board 3 with insulating film.It can also be in flexible printed circuit board 50
Surface temporary bond insulating film 60 adhesive layer, adhesive layer formal solidification is made by process (g).
The bonding of adhesive layer and solidifies by, for example, the hot pressing of press machine (illustration omitted) etc. and carry out.
(process (e))
As shown in Figure 7, the second demoulding has been removed by being overlapped on the flexible printed circuit board 3 with insulating film
The electromagnetic shielding film 1 of film 40 simultaneously carries out hot pressing, and the surface for obtaining anisotropic conductive adhesive layer 24 and insulating film 60 is viscous
It connects and anisotropic conductive adhesive layer 24 passes through the charged magnetic shielding film that through hole 62 is electrically connected with printed circuit 54
Flexible printed circuit board 2.
The bonding of anisotropic conductive adhesive layer 24 and solidify by, for example, press machine (illustration omitted) etc.
Hot pressing and carry out.
The time of hot pressing is 20 seconds or more and 60 minutes hereinafter, further preferably 30 seconds or more and 30 minutes or less.If
The time of hot pressing is the lower limit value of above range or more, then the surface of anisotropic conductive adhesive layer 24 and insulating film 60 is viscous
It connects.In addition, insulating resin layer 10 cures sufficiently, insulating resin layer 10 and the peeling force in the interface of the first mold release film 30 are abundant
Ground decline.If the upper limit value that the time of hot pressing is above range hereinafter, if can shorten the flexible printing of charged magnetic shielding film
The manufacturing time of circuit board 2.
The temperature (temperature of the hot plate of press machine) of hot pressing is preferably 140 DEG C or more and 190 DEG C hereinafter, more preferably 150
DEG C or more and 175 DEG C or less.If the temperature of hot pressing is the lower limit value of above range or more, anisotropic conductive adhesive layer
24 is Nian Jie with the surface of insulating film 60.Furthermore it is possible to shorten the time of hot pressing.In addition, insulating resin layer 10 cures sufficiently, absolutely
Edge resin layer 10 fully declines with the peeling force in the interface of the first mold release film 30.If the temperature of hot pressing is the upper of above range
Limit value is hereinafter, be then able to suppress the deterioration etc. of electromagnetic shielding film 1, flexible printed circuit board 50 etc..
The pressure of hot pressing is preferably 0.5MPa or more and 20MPa hereinafter, more preferably 1MPa or more and 16MPa or less.If
The pressure of hot pressing is the lower limit value of above range or more, then the surface of anisotropic conductive adhesive layer 24 and insulating film 60 is viscous
It connects.Furthermore it is possible to shorten the time of hot pressing.If hot pressing pressure be above range upper limit value hereinafter, if be able to suppress electromagnetism
The breakage etc. of wave screened film 1, flexible printed circuit board 50 etc..
(process (f))
As shown in Figure 7, when the first mold release film becomes not needing, there will be bonding from insulating resin layer 10
First mold release film 30 of oxidant layer 34 is removed.At this point, being coloured since adhesive phase 34 passes through colorant 34c, so can prevent
First mold release film 30 is forgotten to remove.In addition, having on insulating resin layer 10 after the operation for removing the first mold release film 30
In the remaining situation of the removing of adhesive phase 34, it may also detect that it and remove.
(process (g))
When the time of hot pressing in process (e) is 20 seconds or more and 10 minute short time below, preferably in process (e) and
The formal solidification of anisotropic conductive adhesive layer 24 is carried out between process (f) or in process (f) afterwards.
The formal solidification of anisotropic conductive adhesive layer 24 is carried out using the heating device such as baking oven.
Heating time is 15 minutes or more and 120 minutes hereinafter, preferably 30 points or more and 60 minutes or less.If when heating
Between for above range lower limit value more than, then anisotropic conductive adhesive layer 24 can be cured sufficiently.If when heating
Between for above range upper limit value hereinafter, can then shorten the manufacturing time of the flexible printed circuit board 2 of charged magnetic shielding film.
Heating temperature (atmosphere temperature in baking oven) be preferably 120 DEG C or more and 180 DEG C hereinafter, it is preferred that 120 DEG C or more and
150 DEG C or less.If heating temperature is the lower limit value of above range or more, heating time can be shortened.If heating temperature is upper
The upper limit value of range is stated hereinafter, being then able to suppress the deterioration etc. of electromagnetic shielding film 1, flexible printed circuit board 50 etc..
Heating is preferably carried out lower without pressurization from that can also not use special device aspect.
(function and effect)
In the flexible printed circuit board 2 of charged magnetic shielding film described above, due to using electromagnetic shielding film 1,
So the available flexible printed circuit board of charged magnetic shielding film for can be cheap and being easily manufactured.Due to adhesive phase 34
It is coloured by colorant 34c, so can prevent first mold release film 30 with adhesive phase 34 from forgetting to remove.In addition,
After the operation for removing the first mold release film 30, the case where the removing for having adhesive phase 34 on insulating resin layer 10 remains
Under, it is readily detected it and removes.
(other embodiments)
In addition, as long as the printed circuit board of the charged magnetic shielding film of the utility model has printed circuit board and print
The insulating film and conductive layer of the surface contiguous for being provided with printed circuit side of printed circuit board are adjacent with insulating film and conductive layer passes through
The printed circuit board of the electromagnetic shielding film of the utility model that the through hole being formed on insulating film is electrically connected with printed circuit
, it is not limited to the embodiment of illustrated example.
For example, flexible printed circuit board is also possible to the printed circuit board that overleaf side has ground plane.In addition, flexible print
Printed circuit board is also possible to be pasted with the printed circuit of insulating film and electromagnetic shielding film with printed circuit, on two sides on two sides
Plate.
Also the rigid printed circuit substrate of not flexibility can be used to replace flexible printed circuit board.
Also the electromagnetic shielding film 1 of second embodiment, electromagnetic shielding film 1 of third embodiment etc. can be used
Instead of the electromagnetic shielding film 1 of first embodiment.
[embodiment]
Hereinafter, showing embodiment.In addition, the utility model is not limited to embodiment.
(total light transmittance)
The T.T (total light transmittance, (%)) of first mold release film is measured based on JIS K 7361:1997.
(mist degree)
The HAZE (mist degree, (%)) of first mold release film is measured based on JIS K 7136:2000.
(Examples 1 to 3)
By acrylic adhesive (comprehensive to grind chemical society's system, SK Dyne (registered trademark) 1499M) and as colorant
The toluene dispersion liquid (CIK Nanotek Co., Ltd. H65, average grain diameter be 0.3 μm) of titanium oxide according to titanium oxide relative to
The mass percent of the total quality of the solid component of adhesive composition cooperates as 10% mode, prepares adhesive combination
Object.
Adhesive phase is formed using applicator coating adhesive composition on the surface of transparent PET film (thickness: 50 μm)
(thickness: 3,6 or 10 μm), obtains the first mold release film.The value of the T.T and HAZE of first mold release film of the embodiment 1 are shown in
In table 1.
As the second mold release film, prepare the PET film that one side has carried out demoulding processing by non-organic silicon systems release agent
(Lintec Corporation system, T157, the thickness for demoulding membrane body: 50 μm, the thickness of releasing agent layer: 0.1 μm).
As insulating resin layer formation coating, prepare bisphenol A type epoxy resin (society of Mitsubishi Chemical system, jER (registration
Trade mark) 828) 100 mass parts, 20 mass parts of curing agent (Showa electrician society system, Sho-amine X (registered trademark)), 2-
2 mass parts of ethyl -4-methylimidazole, 2 mass parts of carbon black are dissolved in 200 mass parts of solvent (methyl ethyl ketone) and obtain
The coating arrived.
As Thermocurable conductive adhesive composition, preparation makes Thermocurable bonding agent (by epoxy resin (DIC society
System, EXA-4816) 100 mass parts and curing agent (Ajinomoto Fine-Techno Co., Inc. system, PN-23) 20 matter
The potential curable epoxy resin that mixes of amount part) and electroconductive particle (copper particle that average grain diameter is 7.5 μm) 40 matter
Amount part is dissolved or dispersed in composition obtained from 200 mass parts of solvent (methyl ethyl ketone).
Process (a):
It is coated with insulating resin layer formation coating on the surface of the adhesive phase of the first mold release film, 2 points are heated at 60 DEG C
Clock, makes that coating is dry, semi-solid preparation, formed insulating resin layer (thickness: the storage elasticity moduli at 10 μm, 180 DEG C: 1.8 ×
107Pa)。
Process (b1):
On the surface of insulating resin layer 10, the physical vapor deposition of copper is set to form metal film layer by e-beam evaporation
(evaporation film, thickness: 0.07 μm, sheet resistance: 0.3 Ω).
Process (b2):
By being coated with Thermocurable conductive adhesive composition using die coating machine on the surface of metal film layer, make solvent
It volatilizees and carries out B-staged, form anisotropic conductive adhesive layer (thickness: 7 μm, copper particle: 4.5 volume %, at 180 DEG C
Storage elasticity moduli: 1 × 104Pa)。
Process (c):
The second mold release film is attached on the surface of anisotropic conductive adhesive layer, obtains electricity as illustrated in figure 1
Magnetic wave screened film.
Process (d):
In the polyimide film (sheet resistance: 1 × 10 with a thickness of 25 μm17Ω) surface of (insulation membrane body) is according to drying
Film thickness is coated with the insulating properties adhesive composite comprising nitrile rubber modified epoxy as 25 μm of mode, forms bonding agent
Layer, obtains insulating film (thickness: 50 μm).Through hole (aperture: 150 μ is formed in position corresponding with the ground connection of printed circuit 54
m)。
Prepare in the polyimide film (sheet resistance: 1 × 10 with a thickness of 12 μm17Ω) surface of (basilar memebrane) is formed with print
The flexible printed circuit board of brush circuit.
Insulating film is attached by hot pressing on flexible printed circuit board, obtains the flexible printed circuit board with insulating film.
Process (e):
On the flexible printed circuit board with insulating film, the electromagnetic shielding film after the second mold release film has been removed in overlapping, is made
With hot-press arrangement (former production society of the institute system, G-12 of folding), in temperature of heat plate: 170 DEG C, pressure: carrying out hot pressing in 120 seconds under 2MPa,
In the surface temporary bond anisotropic conductive adhesive layer of insulating film, the flexible print circuit of charged magnetic shielding film is obtained
Plate.
Process (f), (g):
By by the flexible printed circuit board of charged magnetic shielding film using pyrostal (this chemical conversion of nanmu society system,
HT210) in temperature: carrying out heating for 1 hour at 160 DEG C, make anisotropic conductive adhesive layer formal solidification.
Film stripping is demoulded from insulating resin layer by first.
(embodiment 4~6)
According to entirety of the titanium oxide relative to the solid component of adhesive composition in the adhesive phase of the first mold release film
The mass percent of quality cooperates as 20% mode, in addition to this, operates in the same way with Examples 1 to 3 and obtains first
Mold release film.The T.T and HAZE that measure to the first mold release film of the embodiment 2 are shown in Table 1.
(embodiment 7~9)
According to entirety of the titanium oxide relative to the solid component of adhesive composition in the adhesive phase of the first mold release film
The mass percent of quality cooperates as 30% mode, in addition to this, operates in the same way with Examples 1 to 3 and obtains first
Mold release film.The T.T and HAZE that measure to the first mold release film of the embodiment 2 are shown in Table 1.
(embodiment 10~12)
According to entirety of the titanium oxide relative to the solid component of adhesive composition in the adhesive phase of the first mold release film
The mass percent of quality cooperates as 40% mode, in addition to this, operates in the same way with Examples 1 to 3 and obtains first
Mold release film.The T.T and HAZE that measure to the first mold release film of the embodiment 2 are shown in Table 1.
(comparative example)
Other than not adding colorant within the adhesive layer, operates similarly with example 1 and obtain the first mold release film.
The T.T and HAZE that measure to the first mold release film of the comparative example are shown in Table 1.
[table 1]
As shown in table 1 as, used contain in adhesive phase of the Titanium particles as the first mold release film
The embodiment 1~12 of toner is compared with the comparative example for not using colorant, and T.T is low and in the range of 30~70%, HAZE
It is high and in the range of being 80~99.5%, fully it is colored as the degree that can be identified by visual observation.
In addition, the flexible printed circuit board manufactured using the electromagnetic shielding film of embodiment 1~12 is from insulating resin layer
When by the first demoulding film stripping, the removing of the first mold release film with adhesive phase can be easily confirmed by visual observation.
By these following purports as the result is shown: the electromagnetic shielding film of the utility model can be easy and with low cost system
It makes, is easy to carry out the identification of the front and back of the removing of the first mold release film；It can prevent first when the manufacture of flexible printed circuit board
Mold release film is forgotten to remove, and is furthermore possible to the removing residual of detection adhesive phase；Use the band electromagnetic wave of its utility model
The printed circuit board of screened film is able to detect the removing of the first mold release film and adhesive phase, can be easy and with low cost system
It makes.
Industrial availability
The electromagnetic shielding film of the utility model is as smart phone, mobile phone, optical module, digital camera, game machine, notes
Electromagnetic wave shielding in the flexible printed circuit board of the electronic equipments such as this computer, medical apparatus is useful with component.
Symbol description
1 electromagnetic shielding film,
The flexible printed circuit board of 2 charged magnetic shielding films,
3 flexible printed circuit boards with insulating film,
10 insulating resin layers,
20 conductive layers,
22 metal film layers,
24 anisotropic conductive adhesive layers,
24a Thermocurable bonding agent,
24b electroconductive particle,
26 isotropic conductivity adhesive layers,
26a Thermocurable bonding agent,
26b electroconductive particle,
30 first mold release films,
32 demoulding membrane bodies,
34 adhesive phases,
34a adhesive,
34c colorant,
40 second mold release films,
42 demoulding membrane bodies,
44 releasing agent layers,
50 flexible printed circuit boards,
52 basilar memebranes,
54 printed circuits,
60 insulating films,
62 through holes.
Claims (9)
1. a kind of electromagnetic shielding film, comprising:
Insulating resin layer；
Conductive layer, it is adjacent with the insulating resin layer；With
First mold release film, it is adjacent with the opposite side relative to the conductive layer of the insulating resin layer,
First mold release film has the adhesive phase to connect with the insulating resin layer,
Described adhesive layer includes adhesive and colorant.
2. electromagnetic shielding film according to claim 1, wherein the content of the colorant is relative to described adhesive layer
Total quality mass percent be 10% or more and 40% or less.
3. electromagnetic shielding film according to claim 1 or 2, wherein the colorant includes selected from by titanium oxide, sulfuric acid
At least one or more in the group of barium and zinc oxide composition.
4. electromagnetic shielding film according to claim 1 or 2, wherein the colorant be average grain diameter be 0.01 μm with
Upper and 1 μm of particle below.
5. electromagnetic shielding film according to claim 1 or 2, wherein first mold release film is based on JIS K 7361:
1997 total light transmittances determined are 30% or more and 70% or less.
6. electromagnetic shielding film according to claim 1 or 2, wherein first mold release film is based on JIS K 7136:
2000 mist degrees determined are 80% or more and 99.5% or less.
7. electromagnetic shielding film according to claim 1 or 2, wherein described adhesive layer with a thickness of 1 μm or more and 15
μm or less.
8. electromagnetic shielding film according to claim 1 or 2, wherein the electromagnetic shielding film also has the second demoulding
The opposite side relative to the insulating resin layer of film, second mold release film and the conductive layer is adjacent.
9. a kind of printed circuit board of charged magnetic shielding film, comprising:
Printed circuit board is provided with printed circuit in at least one side of substrate；
Insulating film, the surface contiguous with that side for being provided with the printed circuit of the printed circuit board；With
Electromagnetic shielding film according to any one of claims 1 to 8, the conductive layer and the insulating film are adjacent, and institute
Conductive layer is stated to be electrically connected and the through hole being formed on the insulating film with the printed circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017063657A JP2018166181A (en) | 2017-03-28 | 2017-03-28 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
| JP2017-063657 | 2017-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208242098U true CN208242098U (en) | 2018-12-14 |
Family
ID=63922672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820224612.2U Active CN208242098U (en) | 2017-03-28 | 2018-02-08 | The printed circuit board of electromagnetic shielding film and charged magnetic shielding film |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2018166181A (en) |
| CN (1) | CN208242098U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6511550B1 (en) * | 2018-01-30 | 2019-05-15 | タツタ電線株式会社 | Electromagnetic shielding film |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000269632A (en) * | 1999-03-17 | 2000-09-29 | Tatsuta Electric Wire & Cable Co Ltd | Shield flexible printed wiring board, manufacture thereof and reinforcing shield film therefor |
| JP5296335B2 (en) * | 2007-06-18 | 2013-09-25 | スリーエム イノベイティブ プロパティズ カンパニー | Colored acrylic adhesive and marking film |
| JP2011057839A (en) * | 2009-09-09 | 2011-03-24 | Lintec Corp | Adhesive sheet |
| JP2012204445A (en) * | 2011-03-24 | 2012-10-22 | Dainippon Printing Co Ltd | Front filter for display, and image display device using the same |
| JP2015193688A (en) * | 2014-03-31 | 2015-11-05 | 日東電工株式会社 | Agent treatment protection sheet |
| JP6613516B2 (en) * | 2014-07-07 | 2019-12-04 | リンテック株式会社 | Surface protection film |
| JP6381117B2 (en) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film |
| JP6699548B2 (en) * | 2015-02-20 | 2020-05-27 | 東洋紡株式会社 | Uneven transfer film |
-
2017
- 2017-03-28 JP JP2017063657A patent/JP2018166181A/en active Pending
-
2018
- 2018-02-08 CN CN201820224612.2U patent/CN208242098U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018166181A (en) | 2018-10-25 |
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