CN105407624B - The manufacture method of electromagnetic shielding film and flexible printed wiring board with it - Google Patents
The manufacture method of electromagnetic shielding film and flexible printed wiring board with it Download PDFInfo
- Publication number
- CN105407624B CN105407624B CN201510557139.0A CN201510557139A CN105407624B CN 105407624 B CN105407624 B CN 105407624B CN 201510557139 A CN201510557139 A CN 201510557139A CN 105407624 B CN105407624 B CN 105407624B
- Authority
- CN
- China
- Prior art keywords
- film
- mold release
- electromagnetic shielding
- protective layer
- shielding film
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 28
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- 239000000853 adhesive Substances 0.000 claims abstract description 149
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- 238000007731 hot pressing Methods 0.000 claims abstract description 80
- 238000009413 insulation Methods 0.000 claims abstract description 18
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- 238000004364 calculation method Methods 0.000 claims description 3
- 239000010408 film Substances 0.000 description 484
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical class CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- 229920001410 Microfiber Polymers 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
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- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
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- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
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- QQVIHTHCMHWDBS-UHFFFAOYSA-L isophthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC(C([O-])=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-L 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- 238000002844 melting Methods 0.000 description 1
- 239000003658 microfiber Substances 0.000 description 1
- 210000001724 microfibril Anatomy 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- KJFMBFZCATUALV-UHFFFAOYSA-N phenolphthalein Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C(=O)O1 KJFMBFZCATUALV-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The manufacture method that electromagnetic shielding film that is concavo-convex and easily can peeling off mold release film from protective layer after hot-pressing and the flexible printed wiring board equipped with the electromagnetic shielding film can be formed on the surface of the protective layer of electromagnetic shielding film in flexible printed wiring board and electromagnetic shielding film the progress hot pressing to tape insulation film is provided.Use the electromagnetic shielding film (10) for possessing the condition of satisfaction (α), first mold release film (18) of (β), conductive adhesive oxidant layer (16) and the protective layer (12) being present between them.Condition (α)：The arithmetic average roughness Ra that the surface of protective layer (12) side of the first mold release film (18) before hot pressing is carried out to electromagnetic shielding film (10) is less than more than 0.02 μm 0.20 μm.Condition (β)：With temperature：170 DEG C, pressure：The Ra that 15MPa has carried out electromagnetic shielding film (10) on the surface of protective layer (12) side of the first mold release film (18) after hot pressing in 30 seconds is less than more than 0.30 μm 0.80 μm.
Description
Technical field
The present invention relates to electromagnetic shielding film and the flexible printed wiring board equipped with above-mentioned electromagnetic shielding film manufacture
Method.
Background technology
In order to block the electromagnetic wave noise produced from flexible printed wiring board, the electromagnetic wave noise from outside, exist sometimes
The surface of flexible printed wiring board sets electromagnetic shielding film (for example, referring to patent document 1).
Fig. 7 is cuing open for an example of the manufacturing process for showing the conventional flexible printed wiring board with electromagnetic shielding film
View.
Flexible printed wiring board 101 with electromagnetic shielding film possesses：Flexible printed wiring board 130, dielectric film 140, with
And the electromagnetic shielding film 110 after mold release film 118 is peeled off.
Flexible printed wiring board 130 is equipped with printed circuit 134 in the single side of basilar memebrane 132.
Dielectric film 140 is arranged on the surface of the side equipped with printed circuit 134 of flexible printed wiring board 130.
Electromagnetic shielding film 110 possesses：Protective layer 112, protective mulch 112 first surface metal film layer 114,
The demoulding of the conductive adhesive oxidant layer 116 on the surface of covering metal film layer 114 and the second surface of protective mulch 112
Film 118 (carrier film).
The conductive adhesive oxidant layer 116 of electromagnetic shielding film 110 is bonded in surface and the curing of dielectric film 140.In addition,
Conductive adhesive oxidant layer 116 is electrically connected by being formed at the through hole 142 of dielectric film 140 with printed circuit 134.
Flexible printed wiring board 101 with electromagnetic shielding film is for example as shown in fig. 7, manufactured via following processes
's.
(i) work of dielectric film 140 is set on the surface of the side equipped with printed circuit 134 of flexible printed wiring board 130
Sequence, the dielectric film 140 with the corresponding position of the ground wire of printed circuit 134 formed with through hole 142.
(ii) by electromagnetic shielding film 110 with the conductive adhesive oxidant layer 116 of electromagnetic shielding film 110 and dielectric film 140
The mode that is in contact of surface be overlapped in the surface of dielectric film 140, and hot pressing is carried out to them, so that by conductive adhesive oxidant layer
116 are bonded in the surface of dielectric film 140, and make conductive adhesive oxidant layer 116 by through hole 142 and with printed circuit 134
Ground wire be electrically connected process.
(iii) after hot pressing, the mold release film 118 of the effect completed as carrier film is peeled off from protective layer 112, is removed,
So as to the process for obtaining the flexible printed wiring board 101 with electromagnetic shielding film.
In the flexible printed wiring board 101 with electromagnetic shielding film, from following points, seek sometimes in protective layer
112 surface makes the surface of protective layer 112 be formed as coarse shape formed with concavo-convex.
When the flexible printed wiring board 101 with electromagnetic shielding film is installed on electronic equipment, make the band electromagnetic wave
The flexible printed wiring board 101 of screened film and be pasted on protective layer 112 surface reinforcing plate between adhesiveness improve.
Suppress on the periphery of optical sensor (ccd image sensor of camara module, cmos image sensor etc.)
Normal reflection light from the flexible printed wiring board 101 with electromagnetic shielding film.
Making to result from the scar on the surface of protective layer 112 etc. becomes unobvious.
Then, for the purpose of making mold release film 118 and protective layer 112 bonding by appropriate bonding force, use pair is proposed
Surface has carried out the mold release film of blasting treatment, and the method (patent document 2) of protective layer is then formed on the surface of mold release film.Using
This method, due to when forming protective layer, the bumps of mold release film are to protective layer transfer, therefore on the surface of protective layer formed with recessed
It is convex.
But in the case where having carried out blasting treatment to the surface of mold release film, in touching because of the sand for blasting treatment
When hitting and causing the surface of mold release film to be cut, produced on the surface of mold release film jagged.Due to producing jagged mold release film
Surface and protective layer between adhesiveness it is excessive, therefore, it is difficult to by mold release film from protective layer peel off.
Prior art literature
Patent document
Patent document 1：No. 4201548 publications of Japanese Patent Publication No.
Patent document 2：Japanese Unexamined Patent Publication 2014-112576 publications.
The content of the invention
The subject that the invention solves
The present invention is provided when carrying out hot pressing to the flexible printed wiring board and electromagnetic shielding film of tape insulation film can be
The surface of the protective layer of electromagnetic shielding film forms concavo-convex and easily can peel off mold release film from protective layer after hot-pressing
Electromagnetic shielding film and using the electromagnetic shielding film the flexible printed wiring board with electromagnetic shielding film manufacturer
Method.
Means for solving the problems
The present invention has following manner.
(1) a kind of electromagnetic shielding film, it possesses：Mold release film, conductive adhesive oxidant layer and it is present in above-mentioned mold release film
With the protective layer between above-mentioned conductive adhesive oxidant layer, above-mentioned mold release film meets following conditions (α) and condition (β)：Condition
(α)：The arithmetic average that the surface of the above-mentioned protective layer side of the above-mentioned mold release film before hot pressing is carried out to above-mentioned electromagnetic shielding film is thick
Rugosity Ra is less than more than 0.02 μm 0.20 μm；Condition (β)：With 170 DEG C of temperature, pressure 15MPa to above-mentioned electromagnetic shielding film
The arithmetic average roughness Ra for having carried out the surface of the above-mentioned protective layer side of the above-mentioned mold release film after the hot pressing of 30 seconds is 0.30 μm
Below 0.80 μm of the above.
(2) more than two multiple bubbles are had according to the electromagnetic shielding film of (1), above-mentioned mold release film.
(3) according to the electromagnetic shielding film of (1) or (2), which, which is also equipped with being present in above-mentioned electric conductivity, glues
Metal film layer between mixture and above-mentioned protective layer.
(4) according to the electromagnetic shielding film of any one of (1)~(3), above-mentioned mold release film have mold release film main body and
It is formed at the releasing agent layer on the surface of the above-mentioned protective layer side of above-mentioned mold release film main body.
(5) according to the electromagnetic shielding film of any one of (1)~(4), the ratio of the bubble in above-mentioned mold release film is upper
State below the 30 volume % of more than 2 volume % in 100 volume % of mold release film.
(6) according to the electromagnetic shielding film of any one of (1)~(5), the average diameter of the bubble in above-mentioned mold release film
For less than more than 0.1 μm 60 μm.
(7) a kind of manufacture method of the flexible printed wiring board with electromagnetic shielding film, at this with electromagnetic shielding film
There are following process (d)~(f) in the manufacture method of flexible printed wiring board：(d) it is equipped with printing in flexible printed wiring board
The surface of the side of circuit sets dielectric film, so that the flexible printed wiring board of tape insulation film is obtained, the flexible printed wiring board
There is above-mentioned printed circuit at least one side of basilar memebrane；(e) after above-mentioned operation (d), by the flexibility of above-mentioned tape insulation film
The electromagnetic shielding film of any one of printing distributing board and above-mentioned (1)~(6) with above-mentioned conductive adhesive layer with it is above-mentioned absolutely
The mode that the surface of velum is in contact carry out it is overlapping, and to they carry out hot pressing so that by above-mentioned conductive adhesive oxidant layer bond
In the surface of above-mentioned dielectric film；And (f) peels off above-mentioned mold release film after above-mentioned operation (e), band electromagnetic shielding film is obtained
Flexible printed wiring board.
(8) according to the manufacture method of the flexible printed wiring board with electromagnetic shielding film of (7), after above-mentioned operation (e)
Protections of the arithmetic average roughness Ra on the surface of the protective layer side of above-mentioned mold release film than the above-mentioned mold release film before above-mentioned operation (e)
The arithmetic average roughness Ra on the surface of layer side is big.
(9) according to the manufacture method of the flexible printed wiring board with electromagnetic shielding film of (7) or (8), above-mentioned operation (f)
The arithmetic average roughness Ra on the surface of above-mentioned protective layer afterwards is less than more than 0.30 μm 0.80 μm.
Invention effect
Electromagnetic shielding film using the present invention, to the flexible printed wiring board of tape insulation film and electromagnetic shielding film into
During row hot pressing, bumps can be formed on the surface of the protective layer of electromagnetic shielding film, and after hot-pressing, will easily can taken off
Mould film is peeled off from protective layer.
The manufacture method of flexible printed wiring board using the present invention with electromagnetic shielding film, is scratched to tape insulation film
Property printing distributing board and electromagnetic shielding film carry out hot pressing when, can be formed on the surface of the protective layer of electromagnetic shielding film recessed
It is convex, and after hot-pressing, easily can peel off mold release film from protective layer.
Brief description of the drawings
Fig. 1 is the sectional view for an example for showing the electromagnetic shielding film of the present invention.
Fig. 2 is the sectional view for showing to carry out the electromagnetic shielding film of Fig. 1 the electromagnetic shielding film after hot pressing.
Fig. 3 is the sectional view of an example of the manufacturing process for the electromagnetic shielding film for showing Fig. 1.
Fig. 4 is the sectional view for the other examples for showing the electromagnetic shielding film of the present invention.
Fig. 5 is the sectional view for an example for showing the flexible printed wiring board with electromagnetic shielding film of the present invention.
Fig. 6 is an example of the manufacturing process for showing the flexible printed wiring board with electromagnetic shielding film of the present invention
Sectional view.
Fig. 7 is cuing open for an example of the manufacturing process for showing the conventional flexible printed wiring board with electromagnetic shielding film
View.
Embodiment
The definition of following term is suitable for whole this specification and claims.
Arithmetic average roughness Ra is by measuring roughness curve using laser microscope to test film, and according to this
Roughness curve, based on JIS B 0601：2001(ISO 4287：1997) value tried to achieve.
The ratio of bubble is opposite by with the section of micro- sem observation mold release film, calculating the sectional area of the bubble in image
In the value that the ratio of the area of image is tried to achieve.
The average diameter of bubble is the value to try to achieve by following methods, i.e. with the extruding side of micro- sem observation mold release film
To or with this vertical section, sectional area is measured to 100 bubbles randomly selected respectively, tries to achieve working as the equal circle of sectional area
Diameter is measured, these diameters are averaged.
The average grain diameter of electroconductive particle is the value to try to achieve by following methods, i.e. from the electronic display of electroconductive particle
30 electroconductive particles are randomly selected in micro mirror image, minimum diameter and maximum gauge are measured to each electroconductive particle, will most
Particle diameter of the median as a particle between minor diameter and maximum gauge, carries out the particle diameter of 30 electroconductive particles of measurement
Arithmetic average.
The specific surface area of electroconductive particle is particle after degassing etc. is impregnated in liquid nitrogen and is measured the nitrogen quantity of absorption,
So as to the value calculated according to the value.
The thickness of film (mold release film, dielectric film etc.), film (protective layer, conductive adhesive oxidant layer etc.), metal film layer etc.
It is the section that object is observed and measured using transmission electron microscope, the thickness and being averaged for measuring five positions is obtained
Value.
Storage modulus as one of viscoelastic property, is counted according to the stress and the strain detected of giving measurement object
Calculate, and measured using dynamic viscoelastic measuring device of the output for temperature or the function of time.
Sheet resistance is following resistance, i.e. is formed, two thin-film metal electrodes using the gold evaporation on quartz glass
(length 10mm, width 5mm, interelectrode distance 10mm), places measured object on this electrode, above measured object with
The load of 0.049N presses the region of 10mm × 20mm of measured object, and with measured by the measurement electric current of below 1mA
Interelectrode resistance.
＜ electromagnetic shielding films ＞
Fig. 1 is the sectional view for an example for showing the electromagnetic shielding film of the present invention.
Electromagnetic shielding film 10 possesses：Protective layer 12, protective mulch 12 first surface metal film layer 14, covering
The conductive adhesive oxidant layer 16 on the surface of metal film layer 14, the first mold release film 18 of the second surface of protective mulch 12, with
And second mold release film 20 on the surface of covering conductive adhesive oxidant layer 16.
(protective layer)
Protective layer 12 is as the substrate (basis) when forming metal film layer 14, for being pasted by electromagnetic shielding film 10
In behind the surface of the dielectric film on the surface of flexible printed wiring board, metal film layer 14 is protected.
From the point of electrical insulating property, the preferably sheet resistance of protective layer 12 is 1 × 106More than Ω.From point in practical use
Set out, preferably the sheet resistance of protective layer 12 is 1 × 1019Below Ω.
As protective layer 12, there are by applying the coating comprising heat-curing resin and curing agent and it is cured and shape
Into film, coating comprising thermoplastic resin coating and formed film, make thermoplastic resin melt and shape film form
Layer etc..From the point of heat resistance during soldering etc., coating of the preferred coated comprising heat-curing resin and curing agent simultaneously makes
Its film being solidified to form.
As heat-curing resin, there are amide resin, epoxy resin, phenolic resin, amino resins, alkyd resin,
Polyurethane resin, synthetic rubber, UV cured acrylate resins etc., from the point of excellent heat resistance, preferred amide resin, ring
Oxygen tree fat.
Storage modulus at 160 DEG C of protective layer 12 is preferably 5 × 106More than Pa 1 × 108Below Pa, is more preferably 8
×106More than Pa 2 × 107Below Pa.It is harder generally, due to the solidfied material of heat-curing resin, therefore, the film formed by it
Lack flexibility, it is particularly highly brittle in the case where relatively thinly forming thickness, without can be used as existing for self-supported membrane
Intensity.Protective layer 12 (in the case where making the cured temperature of conductive adhesive, leads to preferably at the temperature at which the first mold release film 18 is peeled off
It is often less than more than 150 DEG C 200 DEG C of temperature) there is enough intensity.If storage modulus at 160 DEG C of protective layer 12 is
5×106More than Pa, then protective layer 12 will not soften.If storage modulus at 160 DEG C of protective layer 12 is 1 × 108Below Pa,
Then flexibility, intensity are abundant.As a result, when peeling off the first mold release film 18, protective layer 12 necessarily makes electromagnetic shielding film 10
It is difficult to be broken.
In order to assign the flexible printed wiring board design with electromagnetic shielding film, protective layer 12 can also be carried out
Color.
Protective layer 12 can also be made of the different two or more layers such as the characteristics such as storage modulus, material.
The thickness of protective layer 12 is preferably less than more than 1 μm 10 μm, is more preferably less than more than 1 μm 5 μm.If protection
The thickness of layer 12 is more than 1 μm, then heat resistance is good.If the thickness of protective layer 12 is less than 10 μm, being capable of relatively thin landform
Into electromagnetic shielding film 10.
(metal film layer)
Metal film layer 14 is the layer being made of the film of metal.Since metal film layer 14 is formed as expanding along the plane direction
Exhibition, thus it is conductive in the surface direction, played function as electromagnetic wave shielding etc..
As metal film layer 14, there are by physical vapor deposition (vacuum evaporation, sputter, ion beam evaporation, electron beam steaming
Plating etc.), CVD, the metallic film of the formation such as plating, metal foil etc., from can relatively thinly form thickness, and even if thickness compared with
Thin, the electric conductivity on the direction of face is also excellent, and the point that can be simply formed with dry process sets out, and is preferably based on physical vapor deposition
Metallic film (evaporation film).
As the material for the metallic film for forming metal film layer 14, aluminium, silver, copper, gold, conductive ceramic etc. there are.
From the point of electrical conductivity, preferably copper, the point of stability chemically sets out, preferably conductive ceramic.
The thickness of metal film layer 14 is preferably less than more than 0.01 μm 1 μm, be more preferably more than 0.05 μm 1 μm with
Under.If the thickness of metal film layer 14 is more than 0.01 μm, the electric conductivity on the direction of face further improves.If metal foil
The thickness of film layer 14 is more than 0.05 μm, then the occlusion effect of electromagnetic wave noise further improves.If metal film layer 14
Thickness is less than 1 μm, then can relatively thinly form electromagnetic shielding film 10.In addition, the productivity of electromagnetic shielding film 10, flexibility
Improve.
The sheet resistance of metal film layer 14 is preferably 0.001 more than Ω, 1 below Ω, more preferably 0.001 Ω with
Upper 0.1 below Ω.If the sheet resistance of metal film layer 14 is 0.001 more than Ω, metal foil can be thinly formed enough
Film layer 14.If the sheet resistance of metal film layer 14 is 1 below Ω, work(can be given full play to as electromagnetic wave shielding
Energy.
(conductive adhesive oxidant layer)
Conductive adhesive oxidant layer 16 is at least conductive in a thickness direction, and has adhesiveness.
As conductive adhesive oxidant layer 16, there are conductive in a thickness direction and in the surface direction without leading
Electrical anisotropic conductive adhesive phase, isotropic conductivity conductive on thickness direction and face direction
Adhesive phase.As conductive adhesive oxidant layer 16, from can relatively thinly form conductive adhesive oxidant layer 16, electroconductive particle is reduced
22 amount, its result can relatively thinly form electromagnetic shielding film 10 and improve the flexible point of electromagnetic shielding film 10 and set out,
It is preferred that anisotropic conductive adhesive phase.As conductive adhesive oxidant layer 16, fully sent out from electromagnetic wave shielding can be used as
The point for waving function sets out, preferably isotropic conductivity adhesive phase.
As conductive adhesive oxidant layer 16, from the point that can play heat resistance after hardening, preferred Thermocurable
Conductive adhesive oxidant layer.
The conductive adhesive oxidant layer 16 of Thermocurable includes such as Thermocurable adhesive and electroconductive particle 22.Electric conductivity
Adhesive phase 16 is either the state that uncured state or B-stage (B-Stage) are changed.
As Thermocurable adhesive, epoxy resin, phenolic resin, amino resins, alkyd resin, polyurethane tree there are
Fat, synthetic rubber and UV cured acrylate resins etc..From the point of excellent heat resistance, preferred epoxy.Asphalt mixtures modified by epoxy resin
Fat can also include the rubber constituent (carboxy-modified nitrile rubber etc.) for being used to assign flexibility, pay stick etc..
Thermocurable adhesive improves Blanking Properties, can also include to improve the intensity of conductive adhesive oxidant layer 16
Celluosic resin, microfibre (microfibril, glass fibre etc.).
As electroconductive particle 22, there are graphite powder, fire carbon particle, metal (silver, platinum, gold, copper, nickel, palladium, aluminium,
Solder etc.) particle, the firing carbon particle etc. after plating.It is preferably hard from the point of the mobility of conductive adhesive oxidant layer 16
Hard spherical firing carbon particle.
In the case where conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, electroconductive particle 22 is averaged
Particle diameter is preferably less than more than 2 μm 26 μm, is more preferably less than more than 4 μm 16 μm.As long as the average grain of electroconductive particle 22
Footpath is more than 2 μm, then can ensure the thickness of conductive adhesive layer 16 by making 2 μ m-thick of thickness ratio of conductive adhesive,
Enough bonding strengths can be obtained.If the average grain diameter of electroconductive particle 22 is less than 26 μm, electric conductivity is able to ensure that
The mobility (for the tracing ability of the shape of the through hole of dielectric film) of adhesive phase 16, can be with conductive adhesive fully
In the through hole of filling insulation film.
In the case where conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, electroconductive particle 22 is averaged
Particle diameter is preferably less than more than 0.1 μm 10 μm, is more preferably less than more than 0.2 μm 1 μm.If electroconductive particle 22 is averaged
Particle diameter is more than 0.1 μm, then the contact points increase of electroconductive particle 22, so as to stably improve leading on three-dimensional
The general character.If the average grain diameter of electroconductive particle 22 is less than 10 μm, the mobility of conductive adhesive oxidant layer 16 is able to ensure that
(for the tracing ability of the shape of the through hole of dielectric film), can be fully filled the through hole of dielectric film with conductive adhesive
It is interior.
The specific surface area of electroconductive particle 22 is preferably 2m2/ more than g 50m2/ below g, is more preferably 2m2/ more than g
20m2/ below g.If the specific surface area of electroconductive particle 22 is 2m2/ more than g, then be easily obtained electroconductive particle 22.Such as Tab phenolphthaleinum
The specific surface area of conductive particles 22 is 50m2/ below g, then the oil absorption of electroconductive particle 22 will not become excessive, as a result,
The viscosity of conductive adhesive will not become excessive, and screening characteristics further improves.Furthermore it is possible to further ensure that conductive adhesive
The mobility of oxidant layer 16 (for the tracing ability of the shape of the through hole of dielectric film).
In the case where conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, the ratio of electroconductive particle 22
Below 30 volume % of more than 1 volume % in preferably 100 volume % of conductive adhesive oxidant layer 16, are more preferably 2 bodies
Product below 10 volume % of more than %.If the ratio of electroconductive particle 22 is more than 1 volume %, conductive adhesive oxidant layer 16
Electric conductivity improves.If the ratio of electroconductive particle 22 is below 30 volume %, adhesiveness, the stream of conductive adhesive oxidant layer 16
Dynamic property improves (for the tracing ability of the shape of the through hole of dielectric film).In addition, the flexibility of electromagnetic shielding film 10 improves.
In the case where conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, the ratio of electroconductive particle 22
Below 80 volume % of more than 50 volume % in preferably 100 volume % of conductive adhesive oxidant layer 16, are more preferably 60 bodies
Product below 70 volume % of more than %.If the ratio of electroconductive particle 22 is more than 50 volume %, conductive adhesive oxidant layer 16
Electric conductivity improve.If the ratio of electroconductive particle 22 is below 80 volume %, the adhesiveness of conductive adhesive oxidant layer 16,
Mobility improves (for the tracing ability of the shape of the through hole of dielectric film).In addition, the flexibility of electromagnetic shielding film 10 improves.
In the case where conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, conductive adhesive oxidant layer 16
Thickness is preferably less than more than 3 μm 25 μm, is more preferably less than more than 5 μm 15 μm.If the thickness of conductive adhesive oxidant layer 16
Spend and for more than 3 μm, be then able to ensure that the mobility of conductive adhesive oxidant layer 16 (is followed for the shape of the through hole of dielectric film
Property), it can be fully filled with conductive adhesive in the through hole of dielectric film.If the thickness of conductive adhesive oxidant layer 16 is
Less than 25 μm, then it can relatively thinly form electromagnetic shielding film 10.In addition, the flexibility of electromagnetic shielding film 10 improves.
In the case where conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, conductive adhesive oxidant layer 16
Thickness is preferably less than more than 5 μm 20 μm, is more preferably less than more than 7 μm 17 μm.If the thickness of conductive adhesive oxidant layer 16
Spend for more than 5 μm, then the electric conductivity of conductive adhesive oxidant layer 16 improves, and can give full play to function as electromagnetic wave shielding.
Furthermore it is possible to ensure the mobility (for the tracing ability of the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16, can
It is fully filled with conductive adhesive in the through hole of dielectric film, can also ensure that folding resistance, even if bending repeatedly, electric conductivity
Adhesive phase 16 will not be broken.If the thickness of conductive adhesive oxidant layer 16 is less than 20 μm, electricity can be relatively thinly formed
Magnetic wave screened film 10.In addition, the flexibility of electromagnetic shielding film 10 improves.
In the case where conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, conductive adhesive oxidant layer 16
Sheet resistance is preferably 1 × 104More than Ω 1 × 1016Below Ω, is more preferably 1 × 106More than Ω 1 × 1014Below Ω.
If the sheet resistance of conductive adhesive oxidant layer 16 is 1 × 104More than Ω, then being capable of containing electroconductive particle 22
The amount of having suppresses relatively low.If the sheet resistance of conductive adhesive oxidant layer 16 is 1 × 1016Below Ω, then in practical, it is each to
There is no problem for different in nature aspect.
In the case where conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, conductive adhesive oxidant layer 16
Sheet resistance is preferably 0.05 more than Ω, 2.0 below Ω, is more preferably 0.1 more than Ω, 1.0 below Ω.If conductive adhesive
The sheet resistance of oxidant layer 16 is 0.05 more than Ω, then can suppress relatively low by the amount of electroconductive particle 22, electric conductivity is glued
The viscosity of mixture will not be excessive, so that screening characteristics further improves.Furthermore it is possible to further ensure that conductive adhesive oxidant layer 16
Mobility (for the tracing ability of the shape of the through hole of dielectric film).If the sheet resistance of conductive adhesive oxidant layer 16 is
2.0 below Ω, then the whole face of conductive adhesive oxidant layer 16 there is uniform electric conductivity.
(the first mold release film)
First mold release film 18 is as carrier film when forming protective layer 12, metal film layer 14, for optimizing electromagnetism wave screen
Cover the operability of film 10.After electromagnetic shielding film 10 is pasted on flexible printed wiring board etc., by the first mold release film 18 from guarantor
Sheath 12 is peeled off.
First mold release film 18 meets following conditions (α) and condition (β).
Condition (α)：The surface of 12 side of protective layer of the first mold release film 18 before hot pressing is carried out to electromagnetic shielding film 10
Arithmetic average roughness Ra is less than more than 0.02 μm 0.20 μm.
Condition (β)：With temperature：170 DEG C, pressure：15MPa is de- to first after the progress hot pressing in 30 seconds of electromagnetic shielding film 10
The arithmetic average roughness Ra on the surface of 12 side of protective layer of mould film 18 is less than more than 0.30 μm 0.80 μm.
If the arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 before hot pressing is at 0.02 μm
In scope below 0.20 μm of the above, then the adaptation between the first mold release film 18 before hot pressing and protective layer 12 is appropriate, electromagnetism
The operability of ripple screened film 10 improves.
If the arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 after hot pressing is 0.30 μm
More than, then meet that the bumps of following points are formed at the surface of protective layer 12.
When the flexible printed wiring board described later with electromagnetic shielding film is installed on electronic equipment, make the band electromagnetism
The flexible printed wiring board of ripple screened film and be pasted on protective layer 12 surface reinforcing plate between adhesiveness improve.
Suppress on the periphery of optical sensor (ccd image sensor of camara module, cmos image sensor etc.)
The normal reflection of light from the flexible printed wiring board with electromagnetic shielding film.
Making to result from the scar on the surface of protective layer 12 etc. becomes unobvious.
If the arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 after hot pressing for 0.8 μm with
Under, then the adhesiveness between the first mold release film 18 and protective layer 12 will not be excessive, is easy to the first mold release film 18 from protective layer 12
Peel off.
As the first mold release film 18, preferably there are more than two multiple bubbles 24 in the inside of mold release film main body 18a
Mold release film.In the case where the first mold release film 18 has more than two multiple bubbles 24, by following mechanisms, in hot pressing,
On the surface of 12 side of surface and protective layer of 12 side of protective layer of the first mold release film 18 formed with bumps.In addition, it is formed at
The surface of 12 side of surface and protective layer of 12 side of protective layer of one mold release film 18 it is concavo-convex smooth, no matter the first mold release film 18
12 side of protective layer surface arithmetic average roughness Ra whether be higher than hot pressing before, can be easily by the first mold release film 18
Peeled off from protective layer 12.
As shown in Fig. 2, when carrying out hot pressing to electromagnetic shielding film 10, one of the bubble 24 of the first mold release film 18 is crushed
Point, so as to absorb the pressure of hot pressing.On the other hand, in the first mold release film 18, on thickness direction, bubble 24 almost
The part not crushed, the pressure of hot pressing are not almost absorbed by the first mold release film 18.In the first mold release film 18, by crushing gas
Bubble 24 a part and absorb the part of the pressure of hot pressing, the thickness of the first mold release film 18 diminishes, and to protective layer 12, gold
The pressure for belonging to the hot pressing that film layer 14 and conductive adhesive oxidant layer 16 are transmitted diminishes.On the other hand, be not crushed in bubble 24,
The pressure of the hot pressing almost unabsorbed part in the first mold release film 18, to protective layer 12, metal film layer 14 and conduction
Property the pressure of hot pressing transmitted of adhesive phase 16 do not diminish.Therefore, in the part that bubble 24 is crushed, the guarantor of the first mold release film 18
The amount that the thickness of the first mold release film of surface indentation 18 of 12 side of sheath diminishes, relatively, in the part that bubble 24 is not crushed,
The amount that the thickness of the first mold release film of surface elevation 18 of 12 side of protective layer of one mold release film 18 diminishes.As a result, pass through hot pressing
On the surface of 12 side of protective layer of the first mold release film 18 formed with bumps.Further, since the bumps are by based on hot pressing
The change of the thickness of one mold release film 18 and formed, therefore the bumps be it is smooth, will not be as the bumps formed with blasting treatment
There is burr like that.Then, by hot pressing on the surface of 12 side of protective layer of the first mold release film 18 formed with bumps when, protection
Layer 12, metal film layer 14 and conductive adhesive oxidant layer 16 are by the pressure of hot pressing also to follow the bumps of the first mold release film 18
Mode deform, on the surface of protective layer 12 formed with smooth bumps.
As the film with more than two multiple bubbles 24, foam films, multiple aperture plasma membrane etc. are there are, from being easy to hot pressing
The arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 afterwards is adjusted to above range, be easy to will be aftermentioned
160 DEG C when storage modulus be adjusted to aftermentioned scope and the point of (being easily obtained) easy to manufacture sets out, preferred foam films.Hair
Vacuolar membrane is either the monolayer constructions that are only made of the foaming layer with more than two multiple bubbles or with foaming
The lit-par-lit structure of layer and nonfoamed layer.
The ratio of bubble 24 in first mold release film 18 is preferably 2 volume % in 100 volume % of the first mold release film 18
Below 30 volume % of the above, more preferably below 25 volume % of more than 5 volume %, 20 bodies of further preferred more than 10 volume %
Product below %.As long as the ratio of the bubble 24 in the first mold release film 18 is within the above range, then it is easy to take off first after hot pressing
The arithmetic average roughness Ra on the surface of 12 side of protective layer of mould film 18 is adjusted to above range.
The average diameter of bubble 24 is preferably less than more than 0.1 μm 60 μm, is more preferably less than more than 0.1 μm 50 μm,
More preferably less than more than 0.2 μm 50 μm.As long as the average diameter of bubble 24 is within the above range, then it is easy to after hot pressing
The arithmetic average roughness Ra on surface of 12 side of protective layer of the first mold release film 18 be adjusted to above range.
As the material of the first mold release film 18, there are polyethylene terephthalate, polyethylene naphthalate,
Polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-vinegar acid esters, makrolon, polyphenylene sulfide,
Polyamide, vinyl-vinyl acetate copolymer, polyvinyl chloride, Vingon, synthetic rubber, liquid crystal polymer etc., from manufacture
The point of heat resistance (dimensional stability) and cost during electromagnetic shielding film 10 sets out, preferably polyethylene terephthalate.
Storage modulus at 160 DEG C of the first mold release film 18 is preferably 0.8 × 108More than Pa 4 × 108Below Pa, it is more excellent
Elect 0.8 × 10 as8More than Pa 3 × 108Below Pa.If storage modulus at 160 DEG C of the first mold release film 18 is 0.8 × 108Pa
More than, then the operability of electromagnetic shielding film 10 improves.If storage modulus at 160 DEG C of the first mold release film 18 for 4 ×
108Below Pa, then the flexibility of the first mold release film 18 improve.
The thickness of first mold release film 18 is preferably less than more than 5 μm 500 μm, is more preferably less than more than 10 μm 150 μm,
More preferably less than more than 25 μm 100 μm.If the thickness of the first mold release film 18 is more than 5 μm, electromagnetic shielding film
10 operability improves.In addition, the first mold release film 18 plays one's part to the full as padded coaming, by electromagnetic shielding film 10
Surface hot pressing of the conductive adhesive oxidant layer 16 to the dielectric film arranged on the surface of flexible printed wiring board and when pasting, electric conductivity is glued
Mixture layer 16 is easy to follow the concaveconvex shape on the surface of dielectric film.If the thickness of the first mold release film 18 is less than 500 μm,
During by surface hot pressing of the conductive adhesive oxidant layer 16 of electromagnetic shielding film 10 to dielectric film, heat is easy to conductive adhesive
Layer 16 transmits.
(releasing agent layer)
The demoulding processing based on releasing agent is implemented with the surface of 12 side of protective layer of mold release film main body 18a, so as to be formed
There is releasing agent layer 18b.By making the first mold release film 18 that there is releasing agent layer 18b, in process (f) described later, taken off by first
Mould film 18 from protective layer 12 peel off when, be easily peeled off the first mold release film 18, and protective layer 12, cure after conductive adhesive oxidant layer
16 are difficult to be broken.
As releasing agent, known releasing agent is used.
The thickness of releasing agent layer 18b is preferably less than more than 0.05 μm 2.0 μm, be more preferably more than 0.1 μm 1.5 μm with
Under.As long as the thickness of releasing agent layer 18b is within the above range, then in process (f) described later, the first mold release film 18 becomes more
It is easily peeled off.
(the second mold release film)
Second mold release film 20 is used to protect conductive adhesive oxidant layer 16, and optimizes the operability of electromagnetic shielding film 10.
Before electromagnetic shielding film 10 is pasted on flexible printed wiring board etc., the second mold release film 20 is shelled from conductive adhesive oxidant layer 16
From.
As the material of the second mold release film 20, the material with the material identical of the first mold release film 18 there are.Second demoulding
The thickness of film 20 is preferably less than more than 5 μm 500 μm, is more preferably less than more than 10 μm 150 μm, more preferably 25 μm
Below 100 μm of the above.
(thickness of electromagnetic shielding film)
The thickness (removing mold release film) of electromagnetic shielding film 10 is preferably less than more than 10 μm 45 μm, is more preferably 10 μm
Below 30 μm of the above.If the thickness (removing mold release film) of electromagnetic shielding film 10 is more than 10 μm, first demoulding is being peeled off
It is difficult to be broken during film 18.If the thickness (removing mold release film) of electromagnetic shielding film 10 is less than 45 μm, being capable of relatively thin landform
Into the flexible printed wiring board with electromagnetic shielding film.
(manufacture method of electromagnetic shielding film)
The electromagnetic shielding film of the present invention can be manufactured for example, by the method with following process (a)~(c).
(a) process for forming protective layer in the single side of mold release film.
(b) process for forming metal film layer on the surface of protective layer.
(c) process for forming conductive adhesive oxidant layer on the surface of metal film layer.
Hereinafter, the method for the electromagnetic shielding film 10 shown in manufacture Fig. 1 is illustrated with reference to Fig. 3.
(process (a))
As shown in figure 3, form protective layer 12 on the surface of the releasing agent layer 18b of the first mold release film 18.
As the forming method of protective layer 12, it there are coating of the coating comprising heat-curing resin and curing agent and make it
The method of the coating of cured method, coating comprising thermoplastic resin, the side for pasting the film for melting thermoplastic resin and shaping
Method etc..From the point of heat resistance when be brazed etc., preferred coated include the coating of heat-curing resin and curing agent and
Make its cured method.
Coating comprising heat-curing resin and curing agent can also include solvent, other compositions as needed.
In the case where forming protective layer 12 by applying coating, protective layer 12 can be relatively thinly formed.Further, since
The solidfied material of heat-curing resin is harder, therefore in the case where relatively thinly forming protective layer 12, intensity becomes inadequate.As above
Described, storage modulus during by by 160 DEG C of protective layer 12 is set to 5 × 106More than Pa 1 × 108The scope of below Pa, it is soft
Balance between property, intensity and heat resistance improves.
The control of the storage modulus of protective layer 12 is by from the obdurability brought by crosslink density and crosslinked configuration
Viewpoint, which is set out, selects the species such as heat-curing resin, curing agent, composition, and adjusts the energy storage mould of the solidfied material of heat-curing resin
Measure to carry out.
In addition, storage modulus can by adjusting conditions of cure such as temperature when making heat-curing resin solidification, times or
The thermoplastic resins such as addition thermoplastic elastomer (TPE) are adjusted as the component without Thermocurable.
(process (b))
As shown in figure 3, form metal film layer 14 on the surface of protective layer 12.
As the forming method of metal film layer 14, it there are and metallic film is formed by physical vapor deposition, CVD, plating etc.
Method, paste the method etc. of metal foil.The point of the metal film layer 14 of excellent electric conductivity from forming face direction, it is excellent
The method that physical vapor deposition, CVD, plating etc. form metallic film was gated, from the thickness that can relatively thinly form metal film layer 14
Degree, and even if thinner thickness, the metal film layer 14 of excellent electric conductivity that also can be on forming face direction, and can be with dry method
The point that technique simply forms metal film layer 14 sets out, more preferably the method based on physical vapor deposition.
(process (c))
As shown in figure 3, forming conductive adhesive oxidant layer 16 on the surface of metal film layer 14, covered with the second mold release film 20
The surface of conductive adhesive oxidant layer 16.
As the forming method of conductive adhesive oxidant layer 16, there are：Electric conductivity is applied on the surface of metal film layer 14
The method of adhesive compositions；, will be by metal film layer after forming conductive adhesive oxidant layer 16 on the surface of the second mold release film 20
14th, the first layer stack and demoulded by conductive adhesive oxidant layer 16 and second that 12 and first mold release film 18 of protective layer is formed
The method that the second layered product that film 20 is formed is bonded in a manner of metal film layer 14 is in contact with conductive adhesive oxidant layer 16.
As conductive adhesive constituent, the material for including above-mentioned Thermocurable adhesive and electroconductive particle 22 is used
Material.
(action effect)
In electromagnetic shielding film 10 described above, since the first mold release film 18 meets above-mentioned condition (α) and condition
(β), therefore when the flexible printed wiring board to tape insulation film described later carries out hot pressing with electromagnetic shielding film 10, it is de- first
The surface of 12 side of protective layer of mould film 18 is formed with bumps.Then, to follow the surface of 12 side of protective layer of the first mold release film 18
Concavo-convex mode form bumps on the surface of protective layer 12.Further, since the bumps are by first demoulding based on hot pressing
The deformation of film 18 and formed, therefore be smooth.Therefore, no matter the arithmetic on the surface of 12 side of protective layer of the first mold release film 18
Before whether average roughness Ra is higher than hot pressing, easily the first mold release film 18 can be peeled off from protective layer 12.
(other embodiment)
The electromagnetic shielding film of the present invention possesses mold release film, conductive adhesive oxidant layer and is present in mold release film and conduction
Protective layer between property adhesive phase, mold release film meet above-mentioned condition (α) and condition (β), are not limited to the reality of Fig. 1
Apply mode.
For example, the surface of conductive adhesive oxidant layer 16 it is sticky it is less in the case of, the second mold release film can also be omitted
20。
First mold release film 18 can not also have in the case where only just having enough release properties with mold release film main body 18a
There is releasing agent layer 18b.
In the case where conductive adhesive oxidant layer 16 has enough electric conductivity in the surface direction (for example, isotropism is led
The situation of conductive adhesive layer), as shown in figure 4, metal film layer can also be omitted.
Flexible printed wiring board ＞s of the ＜ with electromagnetic shielding film
Fig. 5 shows the sectional view of an example of the flexible printed wiring board with electromagnetic shielding film of the present invention.
Flexible printed wiring board 1 with electromagnetic shielding film possesses flexible printed wiring board 30, dielectric film 40 and peels off
Electromagnetic shielding film 10 after mold release film.
Flexible printed wiring board 30 is equipped with printed circuit 34 at least one side of basilar memebrane 32.
Dielectric film 40 is arranged on the surface of the side equipped with printed circuit 34 of flexible printed wiring board 30.
The conductive adhesive oxidant layer 16 of electromagnetic shielding film 10 is bonded in the surface of dielectric film 40 and is cured.This
Outside, conductive adhesive oxidant layer 16 is electrically connected by being formed at the through hole (illustration omitted) of dielectric film 40 with printed circuit 34.
Near some portion of printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) for removing through hole, electricity
The metal film layer 14 of magnetic wave screened film 10 is separated across dielectric film 40 and conductive adhesive oxidant layer 16 with the printed circuit 34
And it is opposed to configure.
The separating distance removed between some portion of printed circuit 34 and metal film layer 14 of through hole is dielectric film 40
Thickness and conductive adhesive oxidant layer 16 thickness summation.Separating distance is preferably less than more than 30 μm 200 μm, more preferably
For less than more than 60 μm 200 μm.If separating distance is less than 30 μm, the resistance of signal circuit reduces, therefore in order to 100 Ω
Deng characteristic resistance and the line width of signal circuit must be reduced so that the deviation of line width become characteristic resistance deviation, based on resistance
The reflection resonance noise of anti-mismatch is easily attached to electric signal.If separating distance is more than 200 μm, with electromagnetic shielding film
Flexible printed wiring board 1 is thickening, flexible deficiency.
(flexible printed wiring board)
The copper foil of copper-clad laminated board is processed as desired pattern by flexible printed wiring board 30 by known etching method,
So as to as printed circuit 34 (power circuit, earthed circuit, ground plane etc.).
As copper-clad laminated board, there are：Glued via adhesive phase (illustration omitted) in the one or two sides of basilar memebrane 32
The plate that copper-surfaced paper tinsel forms；And plate formed such as resin solution for being used to form basilar memebrane 32 in the casting of the surface of copper foil etc..
As the material of adhesive phase, there are epoxy resin, polyester, polyimides, polyamidoimide, polyamide,
Phenolic resin, polyurethane, acrylic resin, melmac etc..The thickness of adhesive phase be preferably more than 0.5 μm 30 μm with
Under.
(basilar memebrane)
As basilar memebrane 32, the preferably film with heat resistance, more preferred polyimide film, liquid crystalline polymer film, into one
Walk preferred polyimide film.
It is preferably 1 × 10 from the point of electrical insulating property on the sheet resistance of basilar memebrane 326More than Ω.On substrate
The sheet resistance of film 32, is preferably 1 × 10 from point in practical use19Below Ω.
The thickness of basilar memebrane 32 is preferably less than more than 5 μm 200 μm, from the point of bendability, be more preferably 6 μm with
Upper less than 25 μm, more preferably less than more than 10 μm 25 μm.
(printed circuit)
As form printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) copper foil, there are rolled copper foil,
Electrolytic copper foil etc., from the point of bendability, preferably rolled copper foil.
The thickness of copper foil is preferably less than more than 1 μm 50 μm, is more preferably less than more than 18 μm 35 μm.
Since the end (terminal) on the length direction of printed circuit 34 is used for solder connection, connector connection, element dress
With etc., therefore do not covered by dielectric film 40, electromagnetic shielding film 10.
(dielectric film)
Dielectric film 40 is viscous to be formed by applying adhesive, adhesive piece in the single side of base material film (illustration omitted)
The film of mixture layer (illustration omitted).
It is preferably 1 × 10 from the point of electrical insulating property on the sheet resistance of base material film6More than Ω.On base material film
Sheet resistance, be preferably 1 × 10 from point in practical use19Below Ω.
It is more preferably polyimide film, liquid crystalline polymer film, into one as base material film, the preferably film with heat resistance
Step is preferably polyimide film.
The thickness of base material film is preferably less than more than 1 μm 100 μm, is more preferably more than 3 μm 25 from flexible point
Below μm.
As the material of adhesive phase, there are epoxy resin, polyester, polyimides, polyamidoimide, polyamide,
Phenolic resin, polyurethane, acrylic resin, melmac, polystyrene and polyolefin etc..Epoxy resin can also wrap
Containing the rubber constituent (carboxy-modified nitrile rubber etc.) for assigning flexibility.
The thickness of adhesive phase is preferably less than more than 1 μm 100 μm, is more preferably less than more than 1.5 μm 60 μm.
The shape of the opening portion of through hole is simultaneously not particularly limited.As the shape of the opening portion of through hole, for example, there are
Circle, ellipse, quadrangle etc..
The manufacture method ＞ of flexible printed wiring boards of the ＜ with electromagnetic shielding film
The manufacture method of the flexible printed wiring board with electromagnetic shielding film of the present invention has following process (d)~(f)：
(d) dielectric film is set on the surface of the side equipped with printed circuit of flexible printed wiring board, so as to obtain band absolutely
The process of the flexible printed wiring board of velum, the flexible printed wiring board have printed circuit at least one side of basilar memebrane；
(e) after process (d), by the electromagnetic shielding film of the flexible printed wiring board of tape insulation film and the present invention to lead
Conductive adhesive layer carries out overlapping with the mode that the surface of dielectric film is in contact, and hot pressing is carried out to them, so that by electric conductivity
The process that adhesive phase is bonded in the surface of dielectric film；And
(f) after process (e), mold release film, the process for obtaining the flexible printed wiring board with electromagnetic shielding film are peeled off.
Hereinafter, the method for illustrating to manufacture the flexible printed wiring board with electromagnetic shielding film with reference to Fig. 6.
(process (d))
As shown in fig. 6, overlapped on flexible printed wiring board 30 with 34 corresponding position of printed circuit formed with passing through
The dielectric film 40 of through hole 42, in the adhesive phase (illustration omitted) of the surface bonding dielectric film 40 of flexible printed wiring board 30, and
Cure adhesive phase, so as to obtain the flexible printed wiring board 2 of tape insulation film.Can also be in the table of flexible printed wiring board 30
The adhesive phase of face temporary adhesion dielectric film 40, and adhesive phase is really cured in process (e).
The bonding of adhesive phase and curing is carried out such as by the hot pressing based on press machine (illustration omitted).
(process (e))
As shown in fig. 6, the overlapping electromagnetic wave peeled off after the second mold release film 20 on the flexible printed wiring board 2 of tape insulation film
Screened film 10 simultaneously carries out hot pressing, so that the precursor 3 of the flexible printed wiring board with electromagnetic shielding film is obtained, the band electromagnetic wave screen
Cover surface bonding conductive adhesive phase 16 of the precursor 3 in dielectric film 40 of the flexible printed wiring board of film, and electric conductivity
Adhesive phase 16 is electrically connected by through hole 42 with printed circuit 34.
The bonding of conductive adhesive oxidant layer 16 and cure such as by the hot pressing based on press machine (illustration omitted) come
Carry out.
The time of hot pressing is 20 seconds~60 minutes, is more preferably 30 seconds~30 minutes.If the time of hot pressing is 20 seconds
More than, then conductive adhesive oxidant layer 16 is bonded in the surface of dielectric film 40.If the time of hot pressing is less than 60 minutes, can
The manufacturing time of the flexible printed wiring board 1 of shortened belt electromagnetic shielding film.
The temperature (temperature of the pressing plate of press machine) of hot pressing is preferably less than more than 140 DEG C 190 DEG C, is more preferably 150
Less than 175 DEG C more than DEG C.If the temperature of hot pressing is more than 140 DEG C, conductive adhesive oxidant layer 16 is bonded in dielectric film 40
Surface.Furthermore it is possible to shorten the time of hot pressing.If the temperature of hot pressing is less than 190 DEG C, electromagnetic shielding film can be suppressed
10th, deterioration of flexible printed wiring board 30 etc. etc..
The pressure of hot pressing is preferably more than 10MPa below 20MPa, is more preferably more than 10MPa below 16MPa.If
The pressure of hot pressing is more than 10MPa, then conductive adhesive oxidant layer 16 is bonded in the surface of dielectric film 40.Furthermore it is possible to shorten heat
The time of pressure.If the pressure of hot pressing is below 20MPa, electromagnetic shielding film 10, flexible printed wiring board 30 can be suppressed
Deng breakage etc..
Due to the use of the electromagnetic shielding film for possessing the first mold release film 18 for meeting above-mentioned condition (α) and condition (β)
10, therefore the arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 after process (e) becomes to compare work
The arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 before sequence (e) is big.
(process (f))
As shown in fig. 6, the first mold release film 18 is peeled off from protective layer 12, so as to obtain the flexible printing with electromagnetic shielding film
Distributing board 1.
In the case that the time of hot pressing in process (e) is the short time of 20 seconds~10 minutes, preferably first is being peeled off
The real curing of conductive adhesive oxidant layer 16 is carried out before or after mold release film 18.
The real of conductive adhesive oxidant layer 16 cures the heating unit such as using oven to carry out.
Heating time is 15 minutes~120 minutes, is preferably 30 minutes~60 minutes.If heating time for 15 minutes with
On, then it can cure sufficiently conductive adhesive oxidant layer 16.If heating time is less than 120 minutes, being capable of shortened belt
The manufacturing time of the flexible printed wiring board 1 of electromagnetic shielding film.
Heating-up temperature (environment temperature in oven) is preferably less than more than 120 DEG C 180 DEG C, be more preferably 120 DEG C with
Upper less than 150 DEG C.If heating-up temperature is more than 120 DEG C, heating time can be shortened.If heating-up temperature for 180 DEG C with
Under, then it can suppress deterioration of electromagnetic shielding film 10, flexible printed wiring board 30 etc. etc..
From the point that can also be heated without using special device, heating is preferably carried out in a manner of no pressurization.
The arithmetic average roughness Ra on the surface of the protective layer 12 after process (f) be preferably more than 0.30 μm 0.80 μm with
Under, it is more preferably less than more than 0.35 μm 0.60 μm.
If the arithmetic average roughness Ra on the surface of protective layer 12 is less than 0.8 μm, the first mold release film 18 and protection
Adhesiveness between layer 12 will not be excessive, is easy to peel off the first mold release film 18 from protective layer 12.
If the arithmetic average roughness Ra on the surface of protective layer 12 is more than 0.3 μm, protective layer 12 meets following points.
When the flexible printed wiring board described later with electromagnetic shielding film is installed on electronic equipment, make the band electromagnetism
The flexible printed wiring board of ripple screened film and be pasted on protective layer 12 surface reinforcing plate between adhesiveness improve.
Suppress on the periphery of optical sensor (ccd image sensor of camara module, cmos image sensor etc.)
The normal reflection of light from the flexible printed wiring board with electromagnetic shielding film.
Making to result from the scar on the surface of protective layer 12 etc. becomes unobvious.
(action effect)
Due to having used electromagnetism in the manufacture method of the flexible printed wiring board 1 described above with electromagnetic shielding film
Ripple screened film 10, therefore when flexible printed wiring board and electromagnetic shielding film to tape insulation film carry out hot pressing, can be in electricity
The surface of the protective layer of magnetic wave screened film forms bumps.In addition, after hot-pressing, easily mold release film can be shelled from protective layer
From.
(other embodiment)
As long as the manufacture method of the flexible printed wiring board with electromagnetic shielding film of the present invention is with above-mentioned process
(d) method of~(f), is not limited to the embodiment of illustrated example.
For example, flexible printed wiring board overleaf can also have ground plane in side.In addition, flexible printed wiring board can also
There is printed circuit on two sides, and dielectric film and electromagnetic shielding film are pasted with two sides.
Embodiment
Hereinafter, embodiment is shown.In addition, the present invention is not limited to embodiment.
(storage modulus)
Storage modulus is come using dynamic viscoelastic measuring device (Rheometric Scientific company systems, RSAII)
Measurement.
(ratio of bubble)
The ratio of bubble in foam films is tried to achieve by following methods, i.e. measures laser microscope with 3D
The section of foam films is amplified to 100 times of object lens and is observed by (OLYMPUS company systems, LEXT OLS4000), calculates image
In bubble sectional area relative to the area of image ratio.
(average diameter of bubble)
The average diameter of bubble is tried to achieve by following methods, i.e. in the same manner as described above puts the section of foam films
Greatly and observed, sectional area is measured to 100 bubbles randomly selected respectively, the equivalent for trying to achieve the equal circle of sectional area is straight
Footpath, is averaged these diameters.
(arithmetic average roughness Ra)
First after the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before hot pressing, process (e)
The arithmetic on the surface of the protective layer 12 after the arithmetic average roughness Ra and process (f) on the surface of the protective layer side of mold release film
Average roughness Ra is come what is measured using 3D measurement laser microscopes (OLYMPUS company systems, LEXT OLS4000).
The hot pressing of electromagnetic shielding film is to use hot-press arrangement (VIGOR company systems, 50ton-press, VFPC-05R),
The temperature of pressing plate：170 DEG C, pressure：15MPa, time：Implement under conditions of 30 seconds.
(peel strength)
Peel strength when peeling off the first mold release film from protective layer is with 180 ° of peel angle, 300mm/ points pairs of peeling rate
The test film of 20mm width is measured and obtained.
(embodiment 1)
As the first mold release film 18, prepare to have carried out single side with non-silicone releasing agent the foaming of demoulding processing gained
Polyethylene terephthalate film (East pajs company system, Crisper, thickness：Storage modulus at 50 μm, 160 DEG C：3.5×
108The ratio of Pa, bubble：20 volume %, the average diameter of bubble：52 μm, the arithmetic mean roughness on the surface of releasing agent layer 18b
Spend Ra：0.118 μm, the thickness of releasing agent layer 18b：0.12μm).The demoulding of the first mold release film 18 before hot pressing is shown in table 1
The arithmetic average roughness Ra on the surface of oxidant layer 18b.
Process (a)：
Applied on the surface of the releasing agent layer 18b of the first mold release film 18 by solvent solubility amide resin (T＆K Dong Hua companies
System, TPAE-617C) and curing agent (toluene di-isocyanate(TDI)) be dissolved in the coating that n,N-Dimethylformamide forms, with 150
DEG C heating 0.4 it is small when and cure amide resin, formed 12 (thickness of protective layer：Storage modulus at 5 μm, 160 DEG C：8×
106Pa, sheet resistance：8×1012Ω)。
Process (b)：
On the surface of protective layer 12 with e-beam evaporation physically copper steam-plating, 0.07 μm of thickness, sheet resistance 0.3 are formed
The evaporation film (metal film layer 14) of Ω.
Process (c)：
Conductive adhesive compositions are applied using die coater (die coater) on the surface of metal film layer 14,
And solvent is volatilized, B-stage is then carried out, so as to form the 16 (thickness of conductive adhesive oxidant layer of anisotropic conductive：10
μm, silver-plated firing carbon particle：5 volume %, sheet resistance：5×108Ω), which is by making to be used as
The epoxy resin (DIC company systems, EXA-4816) of potential curable epoxy resin and curing agent (supplier aginomoto Fine-
Techno Co.Inc systems, PN-23) mixture and as electroconductive particle 22, to fire carbon particle (Air Water
Bellpearl company systems, CR1-2000, average grain diameter：9 μm, specific surface area：5m2/ g, real density：1.5g/cm3) implement 1 μ m-thick
The dissolving or scattered and acquisition in solvent (methyl ethyl ketone) of the electroconductive particle of silver-plated gained.Using as the second mold release film 20,
Non-foamed polyethylene terephthalate film (the Lintec companies of single side demoulding processing gained are carried out to non-silicone releasing agent
System, T157, thickness：50 μm) it is arranged on the surface of conductive adhesive oxidant layer 16 and obtains electromagnetic shielding film 10.
Process (d)：
In 25 μm of polyimide film (sheet resistance of thickness：1×1017Ω) surface of (base material film) is become with dry film thickness
25 μm of mode applies the insulating properties adhesive composition being made of acrylonitrile butadiene rubber modified epoxy resin, so as to obtain dielectric film 40
(thickness：50μm).
Prepare the polyimide film (sheet resistance in 12 μm of thickness：1×1017Ω) surface of (basilar memebrane 32) is formed with print
The flexible printed wiring board 30 of brush circuit 34.
Dielectric film 40 is pasted in flexible printed wiring board 30 by hot pressing, so as to obtain the flexible printing distribution of tape insulation film
Plate 2.
Process (e)：
Flexible printed wiring board 30 is overlapping peeled off the second mold release film 20 after electromagnetic shielding film 10, and use hot pressing
Device (VIGOR company systems, VFPC-05R), with temperature：170 DEG C, pressure：15MPa hot pressing 30 seconds, glues on the surface of dielectric film 40
Conductive adhesive oxidant layer 16 is closed, so as to obtain the precursor 3 of the flexible printed wiring board with electromagnetic shielding film.
Process (f)：
Test film is cut from the precursor 3 of the flexible printed wiring board with electromagnetic shielding film, for test film, from protective layer
12 peel off the first mold release films 18, measure from protective layer 12 peel off the first mold release film 18 when peel strength.
For the precursor 3 of the remaining flexible printed wiring board with electromagnetic shielding film, it is de- to peel off first from protective layer 12
Mould film 18.Conductive adhesive oxidant layer 16 after protective layer 12 is shown in table 1 and cures whether there is fracture and stripping, process
(e) the arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 after.
Using pyrostal (nanmu this chemical conversion company system, HT210), with temperature：170 DEG C to having peeled off the first mold release film 18
The precursor 3 of the flexible printed wiring board with electromagnetic shielding film afterwards heats 30 minutes, so that conductive adhesive oxidant layer 16 is true
It is positive to cure, the flexible printed wiring board 1 with electromagnetic shielding film is made.The table of the protective layer after process (f) 12 is shown in table 1
The arithmetic average roughness Ra in face.
(embodiment 2)
Except the thickness of protective layer 12 is set to 10 μm, metal film layer is omitted, conductive adhesive layer 16 is changed to respectively
To same sex conductive adhesive layer (thickness：12 μm, sheet resistance：0.3 Ω) beyond, it is same as Example 1, band electromagnetic wave screen is made
Cover the flexible printed wiring board 1 of film.Be shown in table 1 from protective layer 12 peel off the first mold release film 18 when peel strength, protection
Layer 12 and the conductive adhesive oxidant layer 16 after curing whether there is the guarantor of the first mold release film 18 after fracture and stripping, process (e)
The arithmetic average roughness Ra on the surface of 12 side of sheath, the arithmetic average roughness Ra on the surface of protective layer 12.
(embodiment 3)
As the first mold release film 18, the foaming for carrying out single side demoulding processing gained with non-silicone releasing agent is used to gather to benzene
(company system, Crisper, thickness spin to dioctyl phthalate second diester film in Japan：Storage modulus at 38 μm, 160 DEG C：3.7×108Pa, gas
The ratio of bubble：18 volume %, the average diameter of bubble：50 μm, the arithmetic average roughness Ra on the surface of releasing agent layer 18b：
0.123 μm, the thickness of releasing agent layer 18b：0.11 μm), except changing metal film layer 14 as shown in table 1, anisotropy is led
It is same as Example 1 beyond electrical 16 and second mold release film 20 of conductive adhesive layer, obtain scratching with electromagnetic shielding film
Property printing distributing board 1.
Be shown in table 1 the surface of the releasing agent layer 18b of the first mold release film 18 before hot pressing arithmetic average roughness Ra,
The arithmetic average roughness Ra on the surface of 12 side of protective layer of the first mold release film 18 after process (e), from protective layer 12 peel off the
Peel strength, protective layer 12 during one mold release film 18 and the conductive adhesive oxidant layer 16 after curing whether there is fracture and stripping,
The arithmetic average roughness Ra on the surface of protective layer 12.
(embodiment 4)
Except the thickness of protective layer 12 is set to 10 μm, metal film layer is omitted, conductive adhesive layer 16 is changed to respectively
To same sex conductive adhesive layer (thickness：17 μm, sheet resistance：0.2 Ω) beyond, it is same as Example 3, band electromagnetic wave screen is made
Cover the flexible printed wiring board 1 of film.Be shown in table 1 from protective layer 12 peel off the first mold release film 18 when peel strength, protection
Layer 12 and the conductive adhesive oxidant layer 16 after curing whether there is the guarantor of the first mold release film 18 after fracture and stripping, process (e)
The arithmetic average roughness Ra on the surface of 12 side of sheath, the arithmetic average roughness Ra on the surface of protective layer 12.
(comparative example 1)
The non-hair of single side demoulding processing gained is carried out with non-silicone releasing agent except having been used as the first mold release film
Steep polyethylene terephthalate film (Lintec company systems, T157, thickness：Storage modulus at 50 μm, 160 DEG C：6×
108Pa, releasing agent layer surface arithmetic average roughness Ra：0.074 μm) beyond, it is same as Example 1, obtain band electromagnetism
The flexible printed wiring board of ripple screened film.
Arithmetic average roughness Ra, the process on the surface of the releasing agent layer of the first mold release film before hot pressing is shown in table 1
(e) the arithmetic average roughness Ra on the surface of the protective layer side of the first mold release film after, from protective layer peel off the first mold release film when
Peel strength, protective layer and the conductive adhesive oxidant layer after curing whether there is fracture and stripping, protective layer surface calculation
Art average roughness Ra.
(comparative example 2)
Except having been used as the first mold release film to carrying out the non-of single side demoulding processing gained with non-silicone releasing agent
Foam polyethylene terephthalate film (Lintec company systems, T157, thickness：Storage modulus at 50 μm, 160 DEG C：6×
108Pa the film that the surface of the side of progress) demoulding processing carries out obtained by blasting treatment (put down by the arithmetic on the surface of releasing agent layer
Equal roughness Ra：0.529 μm), and change in the manner as shown in table 1 beyond the conductive adhesive layer 16 of isotropic conductivity,
It is same as Example 4, obtain the flexible printed wiring board with electromagnetic shielding film.
Arithmetic average roughness Ra, the process on the surface of the releasing agent layer of the first mold release film before hot pressing is shown in table 1
(e) the arithmetic average roughness Ra on the surface of the protective layer side of the first mold release film after, from protective layer peel off the first mold release film when
Peel strength, protective layer and the conductive adhesive oxidant layer after curing whether there is fracture and stripping, protective layer surface calculation
Art average roughness Ra.
[table 1]
In embodiment 1~4, due to the de- of the first mold release film before electromagnetic shielding film progress hot pressing and after hot pressing
The arithmetic average roughness Ra on the surface of mould oxidant layer meets above-mentioned condition (α) and condition (β), therefore to tape insulation film
When flexible printed wiring board and electromagnetic shielding film carry out hot pressing, it can be formed on the surface of the protective layer of electromagnetic shielding film recessed
It is convex, and after hot-pressing, easily can peel off the first mold release film from protective layer.
On the other hand, in comparative example 1, due to carrying out the releasing agent of the first mold release film after hot pressing to electromagnetic shielding film
The arithmetic average roughness Ra on the surface of layer is unsatisfactory for above-mentioned condition (β), therefore in the flexible printing distribution to tape insulation film
When plate and electromagnetic shielding film carry out hot pressing, bumps can not be formed on the surface of the protective layer of electromagnetic shielding film.
In comparative example 2, due to having carried out blasting treatment to the surface of the first mold release film in advance, and to electromagnetic wave shielding
The arithmetic average roughness Ra that film carries out the surface of the releasing agent layer of the first mold release film before hot pressing is unsatisfactory for above-mentioned condition
(α), therefore after hot-pressing, easily can not peel off the first mold release film from protective layer.
Industrial applicability
The electromagnetic shielding film of the present invention is as smart mobile phone, mobile phone, optical module, digital camera, game machine, pen
In the flexible printed wiring boards of electronic equipment such as note sheet, medical apparatus, electromagnetic wave shielding is useful with component.
Reference numeral
1st, the flexible printed wiring board with electromagnetic shielding film
2nd, the flexible printed wiring board of tape insulation film
3rd, the precursor of the flexible printed wiring board with electromagnetic shielding film
10th, electromagnetic shielding film 12, protective layer
14th, metal film layer 16, conductive adhesive oxidant layer
18th, the first mold release film 18a, mold release film main body
18b, releasing agent layer 20, the second mold release film
22nd, electroconductive particle 24, bubble
30th, flexible printed wiring board 32, basilar memebrane
34th, printed circuit 40, dielectric film
42nd, through hole 101, the flexible printed wiring board with electromagnetic shielding film
110th, electromagnetic shielding film 112, protective layer
114th, metal film layer 116, conductive adhesive oxidant layer
118th, mold release film 130, flexible printed wiring board
132nd, basilar memebrane 134, printed circuit
140th, dielectric film 142, through hole.
Claims (9)
1. a kind of electromagnetic shielding film, including：
Mold release film；
Conductive adhesive oxidant layer；And
Protective layer, it is present between the mold release film and the conductive adhesive oxidant layer,
The mold release film meets following condition (α) and condition (β)：
Condition (α)：The calculation on the surface of the protective layer side of the mold release film before hot pressing is carried out to the electromagnetic shielding film
Art average roughness Ra is less than more than 0.02 μm 0.20 μm,
Condition (β)：With 170 DEG C of temperature, pressure 15MPa to the institute of the mold release film after the electromagnetic shielding film hot pressing 30 seconds
The arithmetic average roughness Ra for stating the surface of protective layer side is less than more than 0.30 μm 0.80 μm.
2. electromagnetic shielding film according to claim 1, wherein, the mold release film has more than two multiple bubbles.
3. electromagnetic shielding film according to claim 1 or 2, further include and be present in the conductive adhesive oxidant layer and described
Metal film layer between protective layer.
4. electromagnetic shielding film according to claim 1 or 2, wherein, the mold release film has mold release film main body and shape
The releasing agent layer on the surface of the protective layer side of mold release film main body described in Cheng Yu.
5. electromagnetic shielding film according to claim 1 or 2, wherein, the ratio of the bubble in the mold release film is described
Below 30 volume % of more than 2 volume % in 100 volume % of mold release film.
6. electromagnetic shielding film according to claim 1 or 2, wherein, the average diameter of the bubble in the mold release film is
Less than more than 0.1 μm 60 μm.
7. a kind of manufacture method of the flexible printed wiring board with electromagnetic shielding film, wherein, the manufacture method has following
Process (d) to (f)：
(d) it is provided with the printed circuit at least one side flexible printed wiring board with printed circuit in basilar memebrane
The surface of side sets dielectric film, so that the flexible printed wiring board of tape insulation film is obtained,
(e) after the process (d), by any one of the flexible printed wiring board of the tape insulation film and claim 1 to 6
The electromagnetic shielding film carried out in a manner of the surface that the conductive adhesive oxidant layer is contacted with the dielectric film it is overlapping, and
Hot pressing is carried out to them, so that the conductive adhesive oxidant layer is bonded in the surface of the dielectric film, and
(f) after the process (e), the mold release film is peeled off, obtains the flexible printed wiring board with electromagnetic shielding film.
8. the manufacture method of the flexible printed wiring board according to claim 7 with electromagnetic shielding film, wherein, the work
The arithmetic average roughness Ra on the surface of the protective layer side of the mold release film after sequence (e) is than described de- before the process (e)
The arithmetic average roughness Ra on the surface of the protective layer side of mould film is big.
9. the manufacture method of the flexible printed wiring board with electromagnetic shielding film according to claim 7 or 8, wherein, institute
The arithmetic average roughness Ra for stating the surface of the protective layer after process (f) is less than more than 0.30 μm 0.80 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014180305A JP6184025B2 (en) | 2014-09-04 | 2014-09-04 | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film |
| JP2014-180305 | 2014-09-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105407624A CN105407624A (en) | 2016-03-16 |
| CN105407624B true CN105407624B (en) | 2018-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510557139.0A Active CN105407624B (en) | 2014-09-04 | 2015-09-02 | The manufacture method of electromagnetic shielding film and flexible printed wiring board with it |
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| Country | Link |
|---|---|
| JP (1) | JP6184025B2 (en) |
| CN (1) | CN105407624B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6467701B2 (en) * | 2014-10-28 | 2019-02-13 | 信越ポリマー株式会社 | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof |
| JP6709669B2 (en) * | 2016-04-20 | 2020-06-17 | 信越ポリマー株式会社 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
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| JP2004095566A (en) * | 2002-07-08 | 2004-03-25 | Tatsuta Electric Wire & Cable Co Ltd | Shield film, shielded flexible printed wiring board, and their manufacturing methods |
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| JP4540150B2 (en) * | 1998-09-30 | 2010-09-08 | 日東電工株式会社 | Thermally peelable adhesive sheet |
| JP5493523B2 (en) * | 2009-07-10 | 2014-05-14 | 東洋紡株式会社 | Laminated film for releasing adhesive sheet |
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| JP2004095566A (en) * | 2002-07-08 | 2004-03-25 | Tatsuta Electric Wire & Cable Co Ltd | Shield film, shielded flexible printed wiring board, and their manufacturing methods |
| JP2009277980A (en) * | 2008-05-16 | 2009-11-26 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding adhesive film and method of manufacturing the same |
| CN103002725A (en) * | 2011-09-16 | 2013-03-27 | 藤森工业株式会社 | Electromagnetic wave shielding material for FPC |
| CN103140126A (en) * | 2011-11-24 | 2013-06-05 | 大自达电线股份有限公司 | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| CN103857268A (en) * | 2012-11-28 | 2014-06-11 | 大自达电线股份有限公司 | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105407624A (en) | 2016-03-16 |
| JP6184025B2 (en) | 2017-08-23 |
| JP2016054259A (en) | 2016-04-14 |
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