CN105407624A - Electromagnetic wave shielding film and method for manufacturing flexibility printing distribution board with the same - Google Patents
Electromagnetic wave shielding film and method for manufacturing flexibility printing distribution board with the same Download PDFInfo
- Publication number
- CN105407624A CN105407624A CN201510557139.0A CN201510557139A CN105407624A CN 105407624 A CN105407624 A CN 105407624A CN 201510557139 A CN201510557139 A CN 201510557139A CN 105407624 A CN105407624 A CN 105407624A
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- Prior art keywords
- film
- mold release
- electromagnetic shielding
- shielding film
- release film
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides an electromagnetic wave shielding film which can form concave-convex on a surface of a protection layer of the electromagnetic wave shielding film when a flexibility printing distribution board with an insulating film and the electromagnetic wave shielding film are hot pressed, and a demoulding film is easy to strip form the protection layer after the hot-pressing, and a method for manufacturing the flexibility printing distribution board with the electromagnetic wave shielding film. A first demoulding film (18) satisfying conditions (alpha) and (beta), an electrical conductive adhesive agent layer (16), and the electromagnetic wave shielding film of the projection layer (12) between the first demoulding film and the electrical conductive adhesive agent layer are used. In the condition (alpha), an arithmetic average roughness Ra of the surface at the protection layer (12) side of the first demoulding film, before the electromagnetic wave shielding film (10) is hot pressed, is more than 0.02 microns and less than 0.20 microns. In the condition (beta), the Ra of the surface at the protection layer (12) side of the first demoulding film (18)after the electromagnetic wave shielding film (10) is hot pressed by 30s at the temperature of 170 DEGC and the voltage of 15MPa is more than 0.30 microns and less than 0.80 microns.
Description
Technical field
The present invention relates to electromagnetic shielding film and be provided with the manufacture method of flexible printed wiring board of above-mentioned electromagnetic shielding film.
Background technology
In order to block the electromagnetic wave noise, the electromagnetic wave noise from outside that produce from flexible printed wiring board, electromagnetic shielding film (for example, referring to patent documentation 1) is set on the surface of flexible printed wiring board sometimes.
Fig. 7 is the cutaway view of an example of the manufacturing process of the flexible printed wiring board of the band electromagnetic shielding film illustrated in the past.
Flexible printed wiring board 101 with electromagnetic shielding film possesses: flexible printed wiring board 130, dielectric film 140 and the electromagnetic shielding film 110 after having peeled off mold release film 118.
Flexible printed wiring board 130 is provided with printed circuit 134 at the one side of basilar memebrane 132.
Dielectric film 140 is located at the surface being provided with the side of printed circuit 134 of flexible printed wiring board 130.
Electromagnetic shielding film 110 possesses: the mold release film 118 (carrier film) of the metal film layer 114 of the first surface of protective layer 112, protective mulch 112, the conductive adhesive oxidant layer 116 on the surface of covering metal film layer 114 and the second surface of protective mulch 112.
The conductive adhesive oxidant layer 116 of electromagnetic shielding film 110 is bonded in the surface of dielectric film 140 and solidifies.In addition, conductive adhesive oxidant layer 116 is electrically connected with printed circuit 134 by the through hole 142 being formed at dielectric film 140.
Flexible printed wiring board 101 with electromagnetic shielding film such as shown in Figure 7, manufactures via following operation.
I () arranges the operation of dielectric film 140 on the surface being provided with the side of printed circuit 134 of flexible printed wiring board 130, this dielectric film 140 is formed with through hole 142 in the position corresponding with the earth connection of printed circuit 134.
(ii) electromagnetic shielding film 110 is overlapped in the surface of dielectric film 140 in the mode that the conductive adhesive oxidant layer 116 of electromagnetic shielding film 110 contacts with the surface of dielectric film 140, and hot pressing is carried out to them, thus conductive adhesive oxidant layer 116 is bonded in the surface of dielectric film 140, and make the operation that conductive adhesive oxidant layer 116 is electrically connected with the earth connection of printed circuit 134 by through hole 142.
(iii) after hot pressing, the mold release film 118 completed as the effect of carrier film is peeled off from protective layer 112, removed, thus obtain the operation of the flexible printed wiring board 101 of band electromagnetic shielding film.
In the flexible printed wiring board 101 of band electromagnetic shielding film, from following point, sometimes seek be formed concavo-convex on the surface of protective layer 112 and make the surface of protective layer 112 be formed as coarse shape.
When the flexible printed wiring board 101 of band electromagnetic shielding film is installed on electronic equipment, the adhesiveness between the flexible printed wiring board 101 making this band electromagnetic shielding film and the stiffener on the surface being pasted on protective layer 112 improves.
The normal reflection light of the flexible printed wiring board 101 from band electromagnetic shielding film is suppressed at the periphery of optical pickocff (ccd image sensor, cmos image sensor etc. of camara module).
The scar etc. on the surface resulting from protective layer 112 is made to become not obvious.
So, by made by suitable bonding force mold release film 118 and protective layer 112 bonding for the purpose of, propose to use effects on surface to carry out the mold release film of blasting treatment, then form the method (patent documentation 2) of protective layer on the surface of mold release film.Adopt the method, due to when forming protective layer, mold release film concavo-convex to protective layer transfer, is therefore formed concavo-convex on the surface of protective layer.
But, when having carried out blasting treatment to the surface of mold release film, when causing the surface of mold release film to be cut in the collision because of the sand for blasting treatment, produce jagged on the surface of mold release film.Because the adhesiveness produced between the surface of jagged mold release film and protective layer is too high, be therefore difficult to mold release film to be peeled off from protective layer.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent No. 4201548 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2014-112576 publication.
Summary of the invention
The problem that invention will solve
The invention provides the manufacture method of the flexible printed wiring board of the band electromagnetic shielding film that can to form electromagnetic shielding film that is concavo-convex and that can easily mold release film be peeled off from protective layer after hot-pressing on the surface of the protective layer of electromagnetic shielding film when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film and use this electromagnetic shielding film.
For solving the means of problem
The present invention has following manner.
(1) a kind of electromagnetic shielding film, it possesses: mold release film, conductive adhesive oxidant layer and the protective layer be present between above-mentioned mold release film and above-mentioned conductive adhesive oxidant layer, and above-mentioned mold release film meets following condition (α) and condition (β): condition (α): the arithmetic average roughness Ra above-mentioned electromagnetic shielding film being carried out to the surface of the above-mentioned protective layer side of the above-mentioned mold release film before hot pressing is more than 0.02 μm less than 0.20 μm; Condition (β): the arithmetic average roughness Ra with temperature 170 DEG C, pressure 15MPa above-mentioned electromagnetic shielding film having been carried out to the surface of the above-mentioned protective layer side of the above-mentioned mold release film after the hot pressing of 30 seconds is more than 0.30 μm less than 0.80 μm.
(2) according to the electromagnetic shielding film of (1), above-mentioned mold release film has plural multiple bubble.
(3) according to the electromagnetic shielding film of (1) or (2), this electromagnetic shielding film also possesses the metal film layer be present between above-mentioned conductive adhesive and above-mentioned protective layer.
(4) according to the electromagnetic shielding film of any one in (1) ~ (3), above-mentioned mold release film has mold release film main body and is formed at the releasing agent layer on surface of above-mentioned protective layer side of above-mentioned mold release film main body.
(5) according to the electromagnetic shielding film of any one in (1) ~ (4), the ratio of the bubble in above-mentioned mold release film is 2 more than volume % 30 volume below the % in 100 volume % of above-mentioned mold release film.
(6) according to the electromagnetic shielding film of any one in (1) ~ (5), the average diameter of the bubble in above-mentioned mold release film is more than 0.1 μm less than 60 μm.
(7) a kind of manufacture method of the flexible printed wiring board with electromagnetic shielding film, there is in the manufacture method of the flexible printed wiring board of this band electromagnetic shielding film following operation (d) ~ (f): (d) arranges dielectric film on the surface being provided with the side of printed circuit of flexible printed wiring board, thus obtaining the flexible printed wiring board of tape insulation film, this flexible printed wiring board has above-mentioned printed circuit at least one mask of basilar memebrane; E () is after above-mentioned operation (d), the electromagnetic shielding film of any one in the flexible printed wiring board of above-mentioned tape insulation film and above-mentioned (1) ~ (6) is carried out overlapping with above-mentioned conductive adhesive layer with the mode that the surface of above-mentioned dielectric film contacts, and hot pressing is carried out to them, thus above-mentioned conductive adhesive oxidant layer is bonded in the surface of above-mentioned dielectric film; And (f) is after above-mentioned operation (e), peel off above-mentioned mold release film, obtain the flexible printed wiring board of band electromagnetic shielding film.
(8) according to the manufacture method of the flexible printed wiring board of the band electromagnetic shielding film of (7), the arithmetic average roughness Ra on the surface of the protective layer side of the above-mentioned mold release film that the arithmetic average roughness Ra on the surface of the protective layer side of the above-mentioned mold release film after above-mentioned operation (e) is more front than above-mentioned operation (e) is large.
(9) according to the manufacture method of the flexible printed wiring board of the band electromagnetic shielding film of (7) or (8), the arithmetic average roughness Ra on the surface of the above-mentioned protective layer after above-mentioned operation (f) is more than 0.30 μm less than 0.80 μm.
Invention effect
Adopt electromagnetic shielding film of the present invention; when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film; can be formed concavo-convex on the surface of the protective layer of electromagnetic shielding film, and after hot-pressing, can easily mold release film be peeled off from protective layer.
Adopt the manufacture method of the flexible printed wiring board of band electromagnetic shielding film of the present invention; when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film; can be formed concavo-convex on the surface of the protective layer of electromagnetic shielding film; and after hot-pressing, can easily mold release film be peeled off from protective layer.
Accompanying drawing explanation
Fig. 1 is the cutaway view of the example that electromagnetic shielding film of the present invention is shown.
Fig. 2 illustrates that the electromagnetic shielding film to Fig. 1 carries out the cutaway view of the electromagnetic shielding film after hot pressing.
Fig. 3 is the cutaway view of an example of the manufacturing process of the electromagnetic shielding film that Fig. 1 is shown.
Fig. 4 is the cutaway view of other examples that electromagnetic shielding film of the present invention is shown.
Fig. 5 is the cutaway view of an example of the flexible printed wiring board that band electromagnetic shielding film of the present invention is shown.
Fig. 6 is the cutaway view of an example of the manufacturing process of the flexible printed wiring board that band electromagnetic shielding film of the present invention is shown.
Fig. 7 is the cutaway view of an example of the manufacturing process of the flexible printed wiring board of the band electromagnetic shielding film illustrated in the past.
Embodiment
The definition of following term is applicable to whole specification and claims.
Arithmetic average roughness Ra is by using laser microscope to measure roughness curve to test film, and according to this roughness curve, based on the value that JISB0601:2001 (ISO4287:1997) tries to achieve.
The ratio of bubble is by with the section of microscopic examination mold release film, and the sectional area of the bubble in computed image is relative to the ratio of the area of image and the value of trying to achieve.
The average diameter of bubble is the value of being tried to achieve by following method, that is, with the direction of extrusion of microscopic examination mold release film or section vertical therewith, respectively sectional area is measured to 100 bubbles of random selecting, try to achieve the equivalent diameter of the equal circle of sectional area, these diameters are averaged.
The average grain diameter of electroconductive particle is the value of being tried to achieve by following method, namely, random selecting 30 electroconductive particles from the electron microscope image of electroconductive particle, minimum diameter and maximum gauge are measured to each electroconductive particle, using the particle diameter of the median between minimum diameter and maximum gauge as a particle, arithmetic average is carried out to the particle diameter of 30 electroconductive particles measured.
The specific area of electroconductive particle be make degassed after particle etc. to impregnated in liquid nitrogen and to measure the nitrogen quantity of absorption, thus according to the value that this value calculates.
The thickness of film (mold release film, dielectric film etc.), film (protective layer, conductive adhesive oxidant layer etc.), metal film layer etc. uses transmission electron microscope to observe the section of measuring object, measures the thickness of five positions and the obtained value that is averaged.
Storage modulus, as one of viscoelastic property, be calculate according to the stress giving measuring object and the strain detected, and use exports as the dynamic viscoelastic measurement mechanism of temperature or the function of time is measured.
Sheet resistance is following resistance, namely, be used in that gold evaporation on quartz glass is formed, two thin-film metal electrodes (length 10mm, width 5mm, interelectrode distance 10mm), place measured object on this electrode, press with the region of the load of 0.049N to the 10mm × 20mm of measured object above measured object, and with the interelectrode resistance measured by the measurement electric current of below 1mA.
< electromagnetic shielding film >
Fig. 1 is the cutaway view of the example that electromagnetic shielding film of the present invention is shown.
Electromagnetic shielding film 10 possesses: second mold release film 20 on the first mold release film 18 of the metal film layer 14 of the first surface of protective layer 12, protective mulch 12, the conductive adhesive oxidant layer 16 on the surface of covering metal film layer 14, the second surface of protective mulch 12 and the surface of covering conductive adhesive oxidant layer 16.
(protective layer)
Protective layer 12, as the substrate (basis) during formation metal film layer 14, for behind the surface of dielectric film electromagnetic shielding film 10 being pasted on the surface being located at flexible printed wiring board, protects metal film layer 14.
From the point of electrical insulating property, the sheet resistance of preferred protective layer 12 is 1 × 10
6more than Ω.From point in practical use, the sheet resistance of preferred protective layer 12 is 1 × 10
19below Ω.
As protective layer 12, there are comprise the coating of heat-curing resin and curing agent by coating and the film making it be solidified to form, coating comprise thermoplastic resin coating and formed film, make thermoplastic resin melting and layer etc. that the film that is shaped is formed.From the point of thermal endurance during soldering etc., preferred coated comprises the coating of heat-curing resin and curing agent and the film making it be solidified to form.
As heat-curing resin, there are amide resin, epoxy resin, phenolic resins, amino resins, alkyd resins, polyurethane resin, synthetic rubber, UV cured acrylate resin etc., from the point of excellent heat resistance, preferred amide resin, epoxy resin.
Storage modulus during 160 DEG C of protective layer 12 is preferably 5 × 10
6more than Pa 1 × 10
8below Pa, is more preferably 8 × 10
6more than Pa 2 × 10
7below Pa.Usually, because the solidfied material of heat-curing resin is comparatively hard, therefore, the film formed by it lacks flexibility, is particularly highly brittle when forming thickness compared with unfertile land, does not have the intensity that can exist as self-supported membrane.At the temperature of protective layer 12 preferably when stripping the first mold release film 18, (at the temperature of solidifying making conductive adhesive, being generally the temperature of more than 150 DEG C less than 200 DEG C) has enough intensity.If storage modulus when 160 of protective layer 12 DEG C is 5 × 10
6more than Pa, then protective layer 12 can not soften.If storage modulus when 160 of protective layer 12 DEG C is 1 × 10
8below Pa, then flexibility, intensity are abundant.Consequently, when stripping the first mold release film 18, protective layer 12 must make electromagnetic shielding film 10 be difficult to fracture.
In order to give the flexible printed wiring board design of band electromagnetic shielding film, also can carry out painted to protective layer 12.
Protective layer 12 also can be made up of the two or more layer that characteristic, the materials etc. such as storage modulus are different.
The thickness of protective layer 12 is preferably more than 1 μm less than 10 μm, is more preferably more than 1 μm less than 5 μm.If the thickness of protective layer 12 is more than 1 μm, then thermal endurance is good.If the thickness of protective layer 12 is less than 10 μm, then comparatively can form electromagnetic shielding film 10 by unfertile land.
(metal film layer)
Metal film layer 14 is the layers be made up of the film of metal.Because metal film layer 14 is formed as, along face Directional Extension, therefore having conductivity on direction, face, play function as electromagnetic wave shielding etc.
As metal film layer 14, there are the metallic film, metal forming etc. that are formed by physical vapor deposition (vacuum evaporation, sputter, ion beam evaporation, electron beam evaporation plating etc.), CVD, plating etc., from comparatively forming thickness by unfertile land, even and if thinner thickness, conductivity on direction, face is also excellent, and the point that can be formed simply with dry process sets out, be preferably based on the metallic film (vapor-deposited film) of physical vapor deposition.
As the material of the metallic film of formation metal film layer 14, there are aluminium, silver, copper, gold, conductive ceramic etc.From the point of conductivity, preferably copper, the point of stability chemically sets out, preferred conductive ceramic.
The thickness of metal film layer 14 is preferably more than 0.01 μm less than 1 μm, is more preferably more than 0.05 μm less than 1 μm.If the thickness of metal film layer 14 is more than 0.01 μm, then the conductivity on direction, face improves further.If the thickness of metal film layer 14 is more than 0.05 μm, then the occlusion effect of electromagnetic wave noise improves further.If the thickness of metal film layer 14 is less than 1 μm, then comparatively can form electromagnetic shielding film 10 by unfertile land.In addition, the productivity of electromagnetic shielding film 10, flexibility improve.
The sheet resistance of metal film layer 14 is preferably 0.001 more than Ω 1 below Ω, more preferably 0.001 more than Ω 0.1 below Ω.If the sheet resistance of metal film layer 14 is 0.001 more than Ω, then enough can form metal film layer 14 by unfertile land.If the sheet resistance of metal film layer 14 is 1 below Ω, then can give full play to function as electromagnetic wave shielding.
(conductive adhesive oxidant layer)
Conductive adhesive oxidant layer 16 has conductivity at least in a thickness direction, and has adhesiveness.
As conductive adhesive oxidant layer 16, there are and in a thickness direction there is conductivity and not there is the anisotropic conductive adhesive phase of conductivity on direction, face, there is the isotropic conductivity adhesive phase of conductivity on thickness direction and direction, face.As conductive adhesive oxidant layer 16, from comparatively forming conductive adhesive oxidant layer 16 by unfertile land, reduce the amount of electroconductive particle 22, its result can form electromagnetic shielding film 10 compared with unfertile land and the point improving the flexibility of electromagnetic shielding film 10 sets out, preferred anisotropic conductive adhesive phase.As conductive adhesive oxidant layer 16, from the point that can give full play to function as electromagnetic wave shielding, preferred isotropic conductivity adhesive phase.
As conductive adhesive oxidant layer 16, from the point that can play thermal endurance after hardening, the conductive adhesive oxidant layer of preferred Thermocurable.
The conductive adhesive oxidant layer 16 of Thermocurable comprises such as Thermocurable adhesive and electroconductive particle 22.Conductive adhesive oxidant layer 16 both can be uncured state, also can be the state that B-stage (B-Stage) is changed.
As Thermocurable adhesive, there are epoxy resin, phenolic resins, amino resins, alkyd resins, polyurethane resin, synthetic rubber and UV cured acrylate resin etc.From the point of excellent heat resistance, preferred epoxy.Epoxy resin also can comprise for giving flexible rubber constituent (carboxy-modified acrylonitrile-butadiene rubber etc.), paying stick etc.
Thermocurable adhesive, in order to improve the intensity of conductive adhesive oxidant layer 16, improves Blanking Properties, also can comprise celluosic resin, microfibre (microfibril, glass fibre etc.).
As electroconductive particle 22, there are graphite powder, fire carbon particle, the particle of metal (silver, platinum, gold, copper, nickel, palladium, aluminium, solder etc.), fire carbon particle etc. after plating.From the point of the mobility of conductive adhesive oxidant layer 16, preferably hardly spherical fire carbon particle.
When conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, the average grain diameter of electroconductive particle 22 is preferably more than 2 μm less than 26 μm, is more preferably more than 4 μm less than 16 μm.As long as the average grain diameter of electroconductive particle 22 is more than 2 μm, then by making the thick thickness guaranteeing conductive adhesive layer 16 of Thickness Ratio 2 μm of conductive adhesive, can obtain enough bonding strengths.If the average grain diameter of electroconductive particle 22 is less than 26 μm, then can guarantee the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16, can with in the through hole of conductive adhesive filling insulation film fully.
When conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, the average grain diameter of electroconductive particle 22 is preferably more than 0.1 μm less than 10 μm, is more preferably more than 0.2 μm less than 1 μm.If the average grain diameter of electroconductive particle 22 is more than 0.1 μm, then the contact of electroconductive particle 22 is counted increase, thus stably can improve the conduction on three-dimensional.If the average grain diameter of electroconductive particle 22 is less than 10 μm, then can guarantee the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16, can with in the through hole of conductive adhesive filling insulation film fully.
The specific area of electroconductive particle 22 is preferably 2m
2/ more than g 50m
2/ below g, is more preferably 2m
2/ more than g 20m
2/ below g.If the specific area of electroconductive particle 22 is 2m
2/ more than g, be then easy to obtain electroconductive particle 22.If the specific area of electroconductive particle 22 is 50m
2/ below g, then the oil absorption of electroconductive particle 22 can not become excessive, consequently, it is too high that the viscosity of conductive adhesive can not become, and screening characteristics improves further.In addition, the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16 can be guaranteed further.
When conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, the ratio of electroconductive particle 22 is preferably 1 more than volume % 30 volume below the % in 100 volume % of conductive adhesive oxidant layer 16, is more preferably 2 more than volume % 10 volume below %.If the ratio of electroconductive particle 22 is 1 more than volume %, then the conductivity of conductive adhesive oxidant layer 16 improves.If the ratio of electroconductive particle 22 is 30 below volume %, then the adhesiveness of conductive adhesive oxidant layer 16, mobility (tracing ability for the shape of the through hole of dielectric film) improve.In addition, the flexibility of electromagnetic shielding film 10 improves.
When conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, the ratio of electroconductive particle 22 is preferably 50 more than volume % 80 volume below the % in 100 volume % of conductive adhesive oxidant layer 16, is more preferably 60 more than volume % 70 volume below %.If the ratio of electroconductive particle 22 is 50 more than volume %, then the conductivity of conductive adhesive oxidant layer 16 improves.If the ratio of electroconductive particle 22 is 80 below volume %, then the adhesiveness of conductive adhesive oxidant layer 16, mobility (tracing ability for the shape of the through hole of dielectric film) improve.In addition, the flexibility of electromagnetic shielding film 10 improves.
When conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, the thickness of conductive adhesive oxidant layer 16 is preferably more than 3 μm less than 25 μm, is more preferably more than 5 μm less than 15 μm.If the thickness of conductive adhesive oxidant layer 16 is more than 3 μm, then can guarantee the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16, can with in the through hole of conductive adhesive filling insulation film fully.If the thickness of conductive adhesive oxidant layer 16 is less than 25 μm, then comparatively can form electromagnetic shielding film 10 by unfertile land.In addition, the flexibility of electromagnetic shielding film 10 improves.
When conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, the thickness of conductive adhesive oxidant layer 16 is preferably more than 5 μm less than 20 μm, is more preferably more than 7 μm less than 17 μm.If the thickness of conductive adhesive oxidant layer 16 is more than 5 μm, then the conductivity of conductive adhesive oxidant layer 16 improves, and can give full play to function as electromagnetic wave shielding.In addition, the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16 can be guaranteed, can with in the through hole of conductive adhesive filling insulation film fully, also folding resistance can be guaranteed, even if repeatedly bend, conductive adhesive oxidant layer 16 also can not rupture.If the thickness of conductive adhesive oxidant layer 16 is less than 20 μm, then comparatively can form electromagnetic shielding film 10 by unfertile land.In addition, the flexibility of electromagnetic shielding film 10 improves.
When conductive adhesive oxidant layer 16 is anisotropic conductive adhesive phase, the sheet resistance of conductive adhesive oxidant layer 16 is preferably 1 × 10
4more than Ω 1 × 10
16below Ω, is more preferably 1 × 10
6more than Ω 1 × 10
14below Ω.
If the sheet resistance of conductive adhesive oxidant layer 16 is 1 × 10
4more than Ω, then can suppress lower by the amount of electroconductive particle 22.If the sheet resistance of conductive adhesive oxidant layer 16 is 1 × 10
16below Ω, then in practical, do not have problems in anisotropy.
When conductive adhesive oxidant layer 16 is isotropic conductivity adhesive phase, the sheet resistance of conductive adhesive oxidant layer 16 is preferably 0.05 more than Ω 2.0 below Ω, is more preferably 0.1 more than Ω 1.0 below Ω.If the sheet resistance of conductive adhesive oxidant layer 16 is 0.05 more than Ω, then can suppress lower by the amount of electroconductive particle 22, the viscosity of conductive adhesive can not be too high, thus screening characteristics is improved further.In addition, the mobility (tracing ability for the shape of the through hole of dielectric film) of conductive adhesive oxidant layer 16 can be guaranteed further.If the sheet resistance of conductive adhesive oxidant layer 16 is 2.0 below Ω, then the whole mask of conductive adhesive oxidant layer 16 has uniform conductivity.
(the first mold release film)
First mold release film 18 as formed protective layer 12, metal film layer 14 time carrier film, for optimizing the operability of electromagnetic shielding film 10.After electromagnetic shielding film 10 being pasted on flexible printed wiring board etc., the first mold release film 18 is peeled off from protective layer 12.
First mold release film 18 meets following condition (α) and condition (β).
Condition (α): arithmetic average roughness Ra electromagnetic shielding film 10 being carried out to the surface of protective layer 12 side of the first mold release film 18 before hot pressing is more than 0.02 μm less than 0.20 μm.
Condition (β): with temperature: 170 DEG C, pressure: 15MPa hot pressing in 30 seconds is carried out to electromagnetic shielding film 10 after the arithmetic average roughness Ra on surface of protective layer 12 side of the first mold release film 18 be more than 0.30 μm less than 0.80 μm.
If the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 before hot pressing is more than 0.02 μm in the scope of less than 0.20 μm; suitably, the operability of electromagnetic shielding film 10 improves for the first mold release film 18 then before hot pressing and the adaptation between protective layer 12.
If the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 after hot pressing is more than 0.30 μm, then the concave-convex meeting following point is formed in the surface of protective layer 12.
When the flexible printed wiring board of band electromagnetic shielding film described later is installed on electronic equipment, make the flexible printed wiring board of this band electromagnetic shielding film and be pasted on protective layer 12 surface stiffener between adhesiveness improve.
The normal reflection of the light of the flexible printed wiring board from band electromagnetic shielding film is suppressed at the periphery of optical pickocff (ccd image sensor, cmos image sensor etc. of camara module).
The scar etc. on the surface resulting from protective layer 12 is made to become not obvious.
If the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 after hot pressing is less than 0.8 μm, then the adhesiveness between the first mold release film 18 and protective layer 12 can not be too high, is easy to the first mold release film 18 to peel off from protective layer 12.
As the first mold release film 18, preferably there is in the inside of mold release film main body 18a the mold release film of plural multiple bubble 24.When the first mold release film 18 has plural multiple bubble 24, by following mechanism, when hot pressing, be formed concavo-convex on the surface of protective layer 12 side of the first mold release film 18 and the surface of protective layer 12 side.In addition; be formed at the concavo-convex smooth of the surface of protective layer 12 side of the first mold release film 18 and the surface of protective layer 12 side; no matter whether the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 is higher than before hot pressing, can both easily the first mold release film 18 be peeled off from protective layer 12.
As shown in Figure 2, when carrying out hot pressing to electromagnetic shielding film 10, crush a part for the bubble 24 of the first mold release film 18, thus absorb the pressure of hot pressing.On the other hand, in the first mold release film 18, on thickness direction, part that bubble 24 does not almost crush, the pressure of hot pressing is not almost absorbed by the first mold release film 18.In the first mold release film 18, absorb the part of the pressure of hot pressing in the part by crushing bubble 24, the less thick of the first mold release film 18, and diminish to the pressure of the hot pressing of protective layer 12, metal film layer 14 and conductive adhesive oxidant layer 16 transmission.On the other hand, not crushed, the pressure almost unabsorbed part of hot pressing in the first mold release film 18 at bubble 24, the pressure of the hot pressing of transmitting to protective layer 12, metal film layer 14 and conductive adhesive oxidant layer 16 does not diminish.Therefore; at bubble 24 by the part crushed, the amount of the less thick of surface indentation first mold release film 18 of protective layer 12 side of the first mold release film 18, relatively; at bubble 24 not by the part crushed, the amount of the less thick of surface elevation first mold release film 18 of protective layer 12 side of the first mold release film 18.Consequently, be formed concavo-convex by hot pressing on the surface of protective layer 12 side of the first mold release film 18.In addition, because the change of this concavo-convex thickness by the first mold release film 18 based on hot pressing is formed, therefore this is concavo-convex is smooth, can not as formed with blasting treatment concavo-convex there is burr.Then; when being formed concavo-convex by hot pressing on the surface of protective layer 12 side of the first mold release film 18; protective layer 12, metal film layer 14 and conductive adhesive oxidant layer 16 are also out of shape in the concavo-convex mode of following the first mold release film 18 by the pressure of hot pressing, are formed smooth concavo-convex on the surface of protective layer 12.
As the film with plural multiple bubble 24; there are foam films, multiple aperture plasma membrane etc.; be adjusted to above-mentioned scope from the arithmetic average roughness Ra on surface of protective layer 12 side being easy to the first mold release film 18 after by hot pressing, be easy to storage modulus when 160 DEG C described later to be adjusted to aftermentioned scope and the point of (being easy to obtain) easy to manufacture, preferred foam films.Foam films both can be the monolayer constructions will be only made up of the foaming layer with plural multiple bubble, also can be the lit-par-lit structure with foaming layer and nonfoamed layer.
The ratio of the bubble 24 in the first mold release film 18 is preferably 2 more than volume % 30 volume below the % in 100 volume % of the first mold release film 18, is more preferably 5 more than volume % 25 volume below %, further preferred 10 more than volume % 20 volume below %.As long as the ratio of the bubble 24 in the first mold release film 18 is in above-mentioned scope, then the arithmetic average roughness Ra being easy to the surface of protective layer 12 side of the first mold release film 18 after by hot pressing is adjusted to above-mentioned scope.
The average diameter of bubble 24 is preferably more than 0.1 μm less than 60 μm, is more preferably more than 0.1 μm less than 50 μm, more preferably more than 0.2 μm less than 50 μm.As long as the average diameter of bubble 24 is in above-mentioned scope, then the arithmetic average roughness Ra being easy to the surface of protective layer 12 side of the first mold release film 18 after by hot pressing is adjusted to above-mentioned scope.
As the material of the first mold release film 18, there are PETG, PEN, polyethylene glycol isophthalate, polybutylene terephthalate (PBT), polyolefin, poly-acetate, Merlon, polyphenylene sulfide, polyamide, vinyl-vinyl acetate copolymer, polyvinyl chloride, Vingon, synthetic rubber, liquid crystal polymer etc., from the thermal endurance (dimensional stability) when manufacturing electromagnetic shielding film 10 and the point of cost, preferred polyethylene terephthalate.
Storage modulus during 160 DEG C of the first mold release film 18 is preferably 0.8 × 10
8more than Pa 4 × 10
8below Pa, is more preferably 0.8 × 10
8more than Pa 3 × 10
8below Pa.If storage modulus during 160 DEG C of the first mold release film 18 is 0.8 × 10
8more than Pa, then the operability of electromagnetic shielding film 10 improves.If storage modulus during 160 DEG C of the first mold release film 18 is 4 × 10
8below Pa, then the flexibility of the first mold release film 18 improves.
The thickness of the first mold release film 18 is preferably more than 5 μm less than 500 μm, is more preferably more than 10 μm less than 150 μm, more preferably more than 25 μm less than 100 μm.If the thickness of the first mold release film 18 is more than 5 μm, then the operability of electromagnetic shielding film 10 improves.In addition, first mold release film 18 plays one's part to the full as padded coaming, by the conductive adhesive oxidant layer 16 of electromagnetic shielding film 10 to be located at flexible printed wiring board surface dielectric film surperficial hot pressing and paste time, conductive adhesive oxidant layer 16 is easy to the concaveconvex shape on the surface of following dielectric film.If the thickness of the first mold release film 18 is less than 500 μm, then by the conductive adhesive oxidant layer 16 of electromagnetic shielding film 10 to the surperficial hot pressing of dielectric film time, heat is easy to transmit to conductive adhesive layer 16.
(releasing agent layer)
Implement the demoulding process based on release agent on the surface of protective layer 12 side of mold release film main body 18a, thus be formed with releasing agent layer 18b.By making the first mold release film 18, there is releasing agent layer 18b; in operation (f) described later; when the first mold release film 18 being peeled off from protective layer 12, be easy to stripping first mold release film 18, and protective layer 12, solidification after conductive adhesive oxidant layer 16 be difficult to fracture.
As release agent, use known release agent.
The thickness of releasing agent layer 18b is preferably more than 0.05 μm less than 2.0 μm, is more preferably more than 0.1 μm less than 1.5 μm.As long as the thickness of releasing agent layer 18b is in above-mentioned scope, then in operation (f) described later, the first mold release film 18 becomes and is more easy to peel off.
(the second mold release film)
Second mold release film 20 for the protection of conductive adhesive oxidant layer 16, and optimizes the operability of electromagnetic shielding film 10.Before electromagnetic shielding film 10 being pasted on flexible printed wiring board etc., the second mold release film 20 is peeled off from conductive adhesive oxidant layer 16.
As the material of the second mold release film 20, there are the material identical with the material of the first mold release film 18.The thickness of the second mold release film 20 is preferably more than 5 μm less than 500 μm, is more preferably more than 10 μm less than 150 μm, more preferably more than 25 μm less than 100 μm.
(thickness of electromagnetic shielding film)
The thickness (removing mold release film) of electromagnetic shielding film 10 is preferably more than 10 μm less than 45 μm, is more preferably more than 10 μm less than 30 μm.If the thickness of electromagnetic shielding film 10 (removing mold release film) is more than 10 μm, be then difficult to fracture when stripping the first mold release film 18.If the thickness of electromagnetic shielding film 10 (removing mold release film) is less than 45 μm, then can form the flexible printed wiring board of band electromagnetic shielding film compared with unfertile land.
(manufacture method of electromagnetic shielding film)
Electromagnetic shielding film of the present invention can be manufactured by the method such as with following operation (a) ~ (c).
A () forms the operation of protective layer at the one side of mold release film.
B () forms the operation of metal film layer on the surface of protective layer.
C () forms the operation of conductive adhesive oxidant layer on the surface of metal film layer.
Below, the method for the electromagnetic shielding film 10 shown in shop drawings 1 is described with reference to Fig. 3.
(operation (a))
As shown in Figure 3, protective layer 12 is formed on the surface of the releasing agent layer 18b of the first mold release film 18.
As the formation method of protective layer 12, there are coating comprise the coating of heat-curing resin and curing agent and the method making it solidify, coating comprise the coating of thermoplastic resin method, paste and make thermoplastic resin melting and the method etc. of film that is shaped.From the point of thermal endurance when carrying out soldering etc., preferred coated comprises the coating of heat-curing resin and curing agent and the method making it solidify.
The coating comprising heat-curing resin and curing agent also can comprise solvent, other compositions as required.
When being formed protective layer 12 by applying coatings, comparatively protective layer 12 can be formed by unfertile land.In addition, because the solidfied material of heat-curing resin is comparatively hard, therefore when forming protective layer 12 compared with unfertile land, intensity becomes insufficient.As mentioned above, by storage modulus when 160 of protective layer 12 DEG C is set to 5 × 10
6more than Pa 1 × 10
8the scope of below Pa, flexibility, balance between intensity and thermal endurance improve.
The control of the storage modulus of protective layer 12 selected the kind such as heat-curing resin, curing agent by the viewpoint from the obdurability brought by crosslink density and crosslinked configuration, formed, and the storage modulus adjusting the solidfied material of heat-curing resin is carried out.
In addition, the thermoplastic resins such as the condition of cure such as temperature, time when storage modulus can make heat-curing resin solidify by adjustment or interpolation thermoplastic elastomer (TPE) assign to adjust as the one-tenth without Thermocurable.
(operation (b))
As shown in Figure 3, metal film layer 14 is formed on the surface of protective layer 12.
As the formation method of metal film layer 14, there are and form the method for metallic film by physical vapor deposition, CVD, plating etc., paste the method etc. of metal forming.From the point of the metal film layer 14 of the excellent electric conductivity on forming surface direction, the method of metallic film is formed preferably by physical vapor deposition, CVD, plating etc., from the thickness that can form metal film layer 14 compared with unfertile land, even and if thinner thickness, also can the metal film layer 14 of excellent electric conductivity on forming surface direction, and the point that can form metal film layer 14 simply with dry process sets out, and is more preferably the method for physically based deformation evaporation.
(operation (c))
As shown in Figure 3, form conductive adhesive oxidant layer 16 on the surface of metal film layer 14, cover the surface of conductive adhesive oxidant layer 16 with the second mold release film 20.
As the formation method of conductive adhesive oxidant layer 16, there are: in the method for the surface application conductive adhesive constituent of metal film layer 14; After the surface of the second mold release film 20 forms conductive adhesive oxidant layer 16, by the first cascade body be made up of metal film layer 14, protective layer 12 and the first mold release film 18, the method for fitting in the mode that metal film layer 14 contacts with conductive adhesive oxidant layer 16 with the second duplexer be made up of conductive adhesive oxidant layer 16 and the second mold release film 20.
As conductive adhesive constituent, use the material comprising above-mentioned Thermocurable adhesive and electroconductive particle 22.
(action effect)
In electromagnetic shielding film 10 described above; because the first mold release film 18 meets above-mentioned condition (α) and condition (β); therefore, when carrying out hot pressing to the flexible printed wiring board of tape insulation film described later and electromagnetic shielding film 10, be formed concavo-convex on the surface of protective layer 12 side of the first mold release film 18.Then, formed concavo-convex in the concavo-convex mode on the surface of following protective layer 12 side of the first mold release film 18 on the surface of protective layer 12.In addition, because this concavo-convex distortion by the first mold release film 18 based on hot pressing is formed, be therefore smooth.Therefore, no matter whether the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 is higher than before hot pressing, can both easily the first mold release film 18 be peeled off from protective layer 12.
(other execution modes)
The protective layer that electromagnetic shielding film of the present invention possesses mold release film, conductive adhesive oxidant layer and is present between mold release film and conductive adhesive oxidant layer; mold release film meets above-mentioned condition (α) and condition (β), is not limited to the execution mode of Fig. 1.
Such as, when the viscosity on the surface of conductive adhesive oxidant layer 16 is less, also can omit the second mold release film 20.
First mold release film 18, when only just having enough release properties with mold release film main body 18a, also can not have releasing agent layer 18b.
When conductive adhesive oxidant layer 16 has enough conductivity on direction, face (such as, the situation of isotropic conductivity adhesive phase), as shown in Figure 4, also metal film layer can be omitted.
< is with the flexible printed wiring board > of electromagnetic shielding film
Fig. 5 illustrates the cutaway view of an example of the flexible printed wiring board of band electromagnetic shielding film of the present invention.
Flexible printed wiring board 1 with electromagnetic shielding film possesses flexible printed wiring board 30, dielectric film 40 and the electromagnetic shielding film 10 after having peeled off mold release film.
Flexible printed wiring board 30 is provided with printed circuit 34 at least one side of basilar memebrane 32.
Dielectric film 40 is located at the surface being provided with the side of printed circuit 34 of flexible printed wiring board 30.
The conductive adhesive oxidant layer 16 of electromagnetic shielding film 10 is bonded in the surface of dielectric film 40 and is cured.In addition, conductive adhesive oxidant layer 16 is electrically connected with printed circuit 34 by the through hole (omitting diagram) being formed at dielectric film 40.
Near the printed circuit 34 (signal circuit, earthed circuit, ground plane etc.) of certain part of removing through hole, the metal film layer 14 of electromagnetic shielding film 10 to be separated with this printed circuit 34 across dielectric film 40 and conductive adhesive oxidant layer 16 and opposed to configure.
Separating distance between the printed circuit 34 of certain part of removing through hole and metal film layer 14 is the summation of the thickness of dielectric film 40 and the thickness of conductive adhesive oxidant layer 16.Separating distance is preferably more than 30 μm less than 200 μm, is more preferably more than 60 μm less than 200 μm.If separating distance is less than 30 μm, then the resistance of signal circuit reduces, therefore in order to have the characteristic resistance of 100 Ω etc. and must reduce the live width of signal circuit, thus the deviation of live width becomes the deviation of characteristic resistance, and the reflection resonance noise based on the mismatch of impedance is easy to be attached to the signal of telecommunication.If separating distance is greater than 200 μm, then the flexible printed wiring board 1 with electromagnetic shielding film is thickening, flexible not enough.
(flexible printed wiring board)
The Copper Foil of copper-clad laminated board is processed as desired pattern by known etching method by flexible printed wiring board 30, thus as printed circuit 34 (power circuit, earthed circuit, ground plane etc.).
As copper-clad laminated board, there are: via the plate of adhesive phase (omitting diagram) at the one or two sides copper foil of basilar memebrane 32; And at the plate etc. of the surface of Copper Foil casting for the formation of the resin solution etc. of basilar memebrane 32.
As the material of adhesive phase, there are epoxy resin, polyester, polyimides, polyamidoimide, polyamide, phenolic resins, polyurethane, acrylic resin, melmac etc.The thickness of adhesive phase is preferably more than 0.5 μm less than 30 μm.
(basilar memebrane)
As basilar memebrane 32, preferably there is the film of thermal endurance, be more preferably polyimide film, liquid crystalline polymer film, further preferred polyimide film.
About the sheet resistance of basilar memebrane 32, from the point of electrical insulating property, be preferably 1 × 10
6more than Ω.About the sheet resistance of basilar memebrane 32, from point in practical use, be preferably 1 × 10
19below Ω.
The thickness of basilar memebrane 32 is preferably more than 5 μm less than 200 μm, from the point of bendability, is more preferably more than 6 μm less than 25 μm, more preferably more than 10 μm less than 25 μm.
(printed circuit)
As the Copper Foil forming printed circuit 34 (signal circuit, earthed circuit, ground plane etc.), there are rolled copper foil, electrolytic copper foil etc., from the point of bendability, preferred rolled copper foil.
The thickness of Copper Foil is preferably more than 1 μm less than 50 μm, is more preferably more than 18 μm less than 35 μm.
Because the end (terminal) on the length direction of printed circuit 34 is for solder connection, connector connection, element assembling etc., therefore do not covered by dielectric film 40, electromagnetic shielding film 10.
(dielectric film)
Dielectric film 40 is by the one side applying adhesive of base material film (omit diagram), adhesive sheet and form the film of adhesive phase (omitting diagram).
About the sheet resistance of base material film, from the point of electrical insulating property, be preferably 1 × 10
6more than Ω.About the sheet resistance of base material film, from point in practical use, be preferably 1 × 10
19below Ω.
As base material film, preferably there is the film of thermal endurance, be more preferably polyimide film, liquid crystalline polymer film, more preferably polyimide film.
The thickness of base material film is preferably more than 1 μm less than 100 μm, from the point of flexibility, is more preferably more than 3 μm less than 25 μm.
As the material of adhesive phase, there are epoxy resin, polyester, polyimides, polyamidoimide, polyamide, phenolic resins, polyurethane, acrylic resin, melmac, polystyrene and polyolefin etc.Epoxy resin also can comprise for giving flexible rubber constituent (carboxy-modified acrylonitrile-butadiene rubber etc.).
The thickness of adhesive phase is preferably more than 1 μm less than 100 μm, is more preferably more than 1.5 μm less than 60 μm.
The shape of the peristome of through hole there is no particular determination.As the shape of the peristome of through hole, such as, there are circle, ellipse, quadrangle etc.
< is with the manufacture method > of the flexible printed wiring board of electromagnetic shielding film
The manufacture method of the flexible printed wiring board of band electromagnetic shielding film of the present invention has following operation (d) ~ (f):
D () arranges dielectric film on the surface being provided with the side of printed circuit of flexible printed wiring board, thus obtain the operation of the flexible printed wiring board of tape insulation film, and this flexible printed wiring board has printed circuit at least one mask of basilar memebrane;
E () is after operation (d), the flexible printed wiring board of tape insulation film is carried out overlapping with conductive adhesive oxidant layer with the mode that the surface of dielectric film contacts with electromagnetic shielding film of the present invention, and hot pressing is carried out to them, thus conductive adhesive oxidant layer is bonded in the operation on the surface of dielectric film; And
F (), after operation (e), peels off mold release film, obtain the operation of the flexible printed wiring board of band electromagnetic shielding film.
Below, the method for the flexible printed wiring board of fabricated ribbon electromagnetic shielding film is described with reference to Fig. 6.
(operation (d))
As shown in Figure 6, flexible printed wiring board 30 overlaps the dielectric film 40 that the position corresponding with printed circuit 34 is formed with through hole 42, at the adhesive phase (omitting diagram) of the surface adhesive dielectric film 40 of flexible printed wiring board 30, and adhesive phase is solidified, thus obtain the flexible printed wiring board 2 of tape insulation film.Also can at the adhesive phase of the surperficial temporary adhesion dielectric film 40 of flexible printed wiring board 30, and in operation (e), adhesive phase be made really to solidify.
The bonding of adhesive phase and solidification are such as by carrying out based on the hot pressing of stamping machine (omitting diagram) etc.
(operation (e))
As shown in Figure 6, electromagnetic shielding film 10 on the flexible printed wiring board 2 of tape insulation film after overlapping stripping the second mold release film 20 also carries out hot pressing, thus obtain the precursor 3 of the flexible printed wiring board of band electromagnetic shielding film, the precursor 3 of the flexible printed wiring board of this band electromagnetic shielding film is at the conductive adhesive phase 16 of the surface adhesive of dielectric film 40, and conductive adhesive oxidant layer 16 is electrically connected with printed circuit 34 by through hole 42.
The bonding of conductive adhesive oxidant layer 16 and solidification are such as by carrying out based on the hot pressing of stamping machine (omitting diagram) etc.
The time of hot pressing is 20 seconds ~ 60 minutes, is more preferably 30 seconds ~ 30 minutes.If the time of hot pressing is more than 20 seconds, then conductive adhesive oxidant layer 16 is bonded in the surface of dielectric film 40.If the time of hot pressing is less than 60 minutes, then can the manufacturing time of flexible printed wiring board 1 of shortened belt electromagnetic shielding film.
The temperature (temperature of the pressing plate of stamping machine) of hot pressing is preferably more than 140 DEG C less than 190 DEG C, is more preferably more than 150 DEG C less than 175 DEG C.If the temperature of hot pressing is more than 140 DEG C, then conductive adhesive oxidant layer 16 is bonded in the surface of dielectric film 40.In addition, the time of hot pressing can be shortened.If the temperature of hot pressing is less than 190 DEG C, then can suppress the deterioration etc. of electromagnetic shielding film 10, flexible printed wiring board 30 etc.
The pressure of hot pressing is preferably more than 10MPa below 20MPa, is more preferably more than 10MPa below 16MPa.If the pressure of hot pressing is more than 10MPa, then conductive adhesive oxidant layer 16 is bonded in the surface of dielectric film 40.In addition, the time of hot pressing can be shortened.If the pressure of hot pressing is below 20MPa, then can suppress the breakage etc. of electromagnetic shielding film 10, flexible printed wiring board 30 etc.
Possessed the electromagnetic shielding film 10 of the first mold release film 18 meeting above-mentioned condition (α) and condition (β) owing to using, the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 therefore after operation (e) become than operation (e) before the arithmetic average roughness Ra on surface of protective layer 12 side of the first mold release film 18 large.
(operation (f))
As shown in Figure 6, peel off the first mold release film 18 from protective layer 12, thus obtain the flexible printed wiring board 1 of band electromagnetic shielding film.
The time of the hot pressing in operation (e), when being the short time of 20 seconds ~ 10 minutes, preferably carried out the real solidification of conductive adhesive oxidant layer 16 before or after stripping first mold release film 18.
The real solidification of conductive adhesive oxidant layer 16 such as uses the heaters such as baking box to carry out.
Heating time is 15 minutes ~ 120 minutes, is preferably 30 minutes ~ 60 minutes.If heating time is more than 15 minutes, then conductive adhesive oxidant layer 16 can be made to solidify fully.If heating time is less than 120 minutes, then can the manufacturing time of flexible printed wiring board 1 of shortened belt electromagnetic shielding film.
Heating-up temperature (ambient temperature in baking box) is preferably more than 120 DEG C less than 180 DEG C, is more preferably more than 120 DEG C less than 150 DEG C.If heating-up temperature is more than 120 DEG C, then heating time can be shortened.If heating-up temperature is less than 180 DEG C, then can suppress the deterioration etc. of electromagnetic shielding film 10, flexible printed wiring board 30 etc.
The point never using special device also can carry out heating sets out, and heating is preferably to carry out without the mode of pressurization.
The arithmetic average roughness Ra on the surface of the protective layer 12 after operation (f) is preferably more than 0.30 μm less than 0.80 μm, is more preferably more than 0.35 μm less than 0.60 μm.
If the arithmetic average roughness Ra on the surface of protective layer 12 is less than 0.8 μm, then the adhesiveness between the first mold release film 18 and protective layer 12 can not be too high, is easy to the first mold release film 18 to peel off from protective layer 12.
If the arithmetic average roughness Ra on the surface of protective layer 12 is more than 0.3 μm, then protective layer 12 meets following point.
When the flexible printed wiring board of band electromagnetic shielding film described later is installed on electronic equipment, make the flexible printed wiring board of this band electromagnetic shielding film and be pasted on protective layer 12 surface stiffener between adhesiveness improve.
The normal reflection of the light of the flexible printed wiring board from band electromagnetic shielding film is suppressed at the periphery of optical pickocff (ccd image sensor, cmos image sensor etc. of camara module).
The scar etc. on the surface resulting from protective layer 12 is made to become not obvious.
(action effect)
Owing to employing electromagnetic shielding film 10 in the manufacture method of the flexible printed wiring board 1 of band electromagnetic shielding film described above; therefore, when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film, can be formed concavo-convex on the surface of the protective layer of electromagnetic shielding film.In addition, after hot-pressing, can easily mold release film be peeled off from protective layer.
(other execution modes)
As long as the manufacture method of the flexible printed wiring board of band electromagnetic shielding film of the present invention has the method for above-mentioned operation (d) ~ (f), be not limited to the execution mode of illustrated example.
Such as, flexible printed wiring board also can have ground plane in side overleaf.In addition, flexible printed wiring board also can have printed circuit on two sides, and is pasted with dielectric film and electromagnetic shielding film on two sides.
Embodiment
Below, embodiment is shown.In addition, the present invention is not limited to embodiment.
(storage modulus)
Storage modulus uses dynamic viscoelastic measurement mechanism (RheometricScientific Inc., RSAII) to measure.
(ratio of bubble)
The ratio of the bubble in foam films is tried to achieve by following method, namely, laser microscope (OLYMPUS Inc. is measured with 3D, LEXTOLS4000) section of foam films be amplified to 100 times, object lens and observe, the sectional area of the bubble in computed image is relative to the ratio of the area of image.
(average diameter of bubble)
The average diameter of bubble is tried to achieve by following method, that is, in the same manner as described above the section of foam films amplified and observe, respectively sectional area being measured to 100 bubbles of random selecting, try to achieve the equivalent diameter of the equal circle of sectional area, these diameters are averaged.
(arithmetic average roughness Ra)
The arithmetic average roughness Ra on the surface of the protective layer 12 after the arithmetic average roughness Ra on the surface of the protective layer side of the first mold release film after the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before hot pressing, operation (e) and operation (f) uses 3D to measure laser microscope (OLYMPUS Inc., LEXTOLS4000) to carry out measuring.
The hot pressing of electromagnetic shielding film uses hot-press arrangement (VIGOR Inc., 50ton-press, VFPC-05R), the temperature at pressing plate: 170 DEG C, pressure: 15MPa, the time: the condition of 30 seconds is got off and is implemented.
(peel strength)
Peel strength when peeling off the first mold release film from protective layer is divided to measure the test film of 20mm width with peel angle 180 °, peeling rate 300mm/ and is obtained.
(embodiment 1)
As the first mold release film 18, the foaming polyethylene terephthalate film (East paj Inc., Crisper, the thickness: storage modulus when 50 μm, 160 DEG C: 3.5 × 10 that with non-silicone release agent, one side have been carried out to demoulding process gained are prepared
8the ratio of Pa, bubble: the average diameter of 20 volume %, bubble: 52 μm, arithmetic average roughness Ra:0.118 μm of surface, the thickness of releasing agent layer 18b of releasing agent layer 18b: 0.12 μm).The arithmetic average roughness Ra on the surface of the releasing agent layer 18b of the first mold release film 18 before hot pressing is shown in Table 1.
Operation (a):
At the surface application of the releasing agent layer 18b of the first mold release film 18 by solvent solubility amide resin (T & K Dong Hua Inc.; TPAE-617C) and curing agent (toluene di-isocyanate(TDI)) be dissolved in N; the coating of dinethylformamide; with 150 DEG C of heating 0.4 hour, amide resin is solidified, form protective layer 12 (thickness: storage modulus when 5 μm, 160 DEG C: 8 × 10
6pa, sheet resistance: 8 × 10
12Ω).
Operation (b):
On the surface of protective layer 12 with e-beam evaporation physically copper steam-plating, form the vapor-deposited film (metal film layer 14) of thickness 0.07 μm, sheet resistance 0.3 Ω.
Operation (c):
Die coater (diecoater) coating electrically conductive adhesive composition is used on the surface of metal film layer 14, and make solvent evaporates, then carry out B-stage, thus form the conductive adhesive oxidant layer 16 (thickness: 10 μm, silver-platedly fire carbon particle: 5 volume %, sheet resistance: 5 × 10 of anisotropic conductive
8Ω), this conductive adhesive compositions is epoxy resin (the DIC Inc. by making as potential curable epoxy resin, EXA-4816) with curing agent (supplier aginomoto Fine-TechnoCo.Inc system, PN-23) mixture and as electroconductive particle 22, to firing carbon particle (AirWaterBellpearl Inc., CR1-2000, average grain diameter: 9 μm, specific area: 5m
2/ g, real density: 1.5g/cm
3) electroconductive particle of implementing 1 μm of thick silver-plated gained dissolves in the solvent (methylethylketone) or dispersion and obtaining.Using as the second mold release film 20, non-foamed polyethylene terephthalate film (the Lintec Inc. that non-silicone release agent carried out to one side demoulding process gained, T157, thickness: 50 μm) be located at the surface of conductive adhesive oxidant layer 16 and obtain electromagnetic shielding film 10.
Operation (d):
In the polyimide film (sheet resistance: 1 × 10 of thickness 25 μm
17the mode that Ω) surface of (base material film) becomes 25 μm with dry film thickness applies the insulating properties adhesive composition be made up of acrylonitrile butadiene rubber modified epoxy resin, thus obtains dielectric film 40 (thickness: 50 μm).
Prepare the polyimide film (sheet resistance: 1 × 10 thickness 12 μm
17Ω) surface of (basilar memebrane 32) is formed with the flexible printed wiring board 30 of printed circuit 34.
Paste dielectric film 40 by hot pressing at flexible printed wiring board 30, thus obtain the flexible printed wiring board 2 of tape insulation film.
Operation (e):
Electromagnetic shielding film 10 after flexible printed wiring board 30 overlap has peeled off the second mold release film 20, and use hot-press arrangement (VIGOR Inc., VFPC-05R), with temperature: 170 DEG C, pressure: 15MPa hot pressing 30 seconds, in the surface adhesive conductive adhesive oxidant layer 16 of dielectric film 40, thus obtain the precursor 3 of the flexible printed wiring board of band electromagnetic shielding film.
Operation (f):
Cut test film from the precursor 3 of the flexible printed wiring board of band electromagnetic shielding film, for test film, peel off the first mold release film 18 from protective layer 12, measure peel strength when peeling off the first mold release film 18 from protective layer 12.
For the precursor 3 of the flexible printed wiring board of remaining band electromagnetic shielding film, peel off the first mold release film 18 from protective layer 12.Illustrate in Table 1 the conductive adhesive oxidant layer 16 after protective layer 12 and solidification with or without fracture and peel off, the arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 after operation (e).
(nanmu originally changes into Inc. to use pyrostal, HT210), with temperature: 170 DEG C are heated 30 minutes to the precursor 3 of the flexible printed wiring board of the band electromagnetic shielding film after having peeled off the first mold release film 18, thus conductive adhesive oxidant layer 16 is really solidified, make the flexible printed wiring board 1 of band electromagnetic shielding film.The arithmetic average roughness Ra on the surface of the protective layer 12 after operation (f) is shown in Table 1.
(embodiment 2)
Except the thickness of protective layer 12 is set to 10 μm; omit metal film layer; conductive adhesive layer 16 is changed to beyond isotropic conductivity adhesive layer (thickness: 12 μm, sheet resistance: 0.3 Ω); identical with embodiment 1, make the flexible printed wiring board 1 of band electromagnetic shielding film.Illustrate in Table 1 the conductive adhesive oxidant layer 16 after peel strength when peeling off the first mold release film 18 from protective layer 12, protective layer 12 and solidification with or without fracture and peel off, the arithmetic average roughness Ra on surface of protective layer 12 side, the arithmetic average roughness Ra on the surface of protective layer 12 of the first mold release film 18 after operation (e).
(embodiment 3)
As the first mold release film 18, use and carry out the foaming polyethylene terephthalate film of one side demoulding process gained with non-silicone release agent (Inc., Crisper, thickness spin in Japan: storage modulus when 38 μm, 160 DEG C: 3.7 × 10
8the ratio of Pa, bubble: the average diameter of 18 volume %, bubble: 50 μm, arithmetic average roughness Ra:0.123 μm of surface, the thickness of releasing agent layer 18b of releasing agent layer 18b: 0.11 μm), change except metal film layer 14, the conductive adhesive layer 16 of anisotropic conductive and the second mold release film 20 except as shown in table 1, identical with embodiment 1, obtain the flexible printed wiring board 1 of band electromagnetic shielding film.
The arithmetic average roughness Ra on the surface of protective layer 12 side of the first mold release film 18 after the arithmetic average roughness Ra on the surface of the releasing agent layer 18b of the first mold release film 18 before hot pressing, operation (e) is shown in Table 1, conductive adhesive oxidant layer 16 after peel strength when peeling off the first mold release film 18 from protective layer 12, protective layer 12 and solidification is with or without fracture and peel off, the arithmetic average roughness Ra on the surface of protective layer 12.
(embodiment 4)
Except the thickness of protective layer 12 is set to 10 μm; omit metal film layer; conductive adhesive layer 16 is changed to beyond isotropic conductivity adhesive layer (thickness: 17 μm, sheet resistance: 0.2 Ω); identical with embodiment 3, make the flexible printed wiring board 1 of band electromagnetic shielding film.Illustrate in Table 1 the conductive adhesive oxidant layer 16 after peel strength when peeling off the first mold release film 18 from protective layer 12, protective layer 12 and solidification with or without fracture and peel off, the arithmetic average roughness Ra on surface of protective layer 12 side, the arithmetic average roughness Ra on the surface of protective layer 12 of the first mold release film 18 after operation (e).
(comparative example 1)
Except employing as the first mold release film the non-foamed polyethylene terephthalate film (Lintec Inc., T157, the thickness: storage modulus when 50 μm, 160 DEG C: 6 × 10 that carry out one side demoulding process gained with non-silicone release agent
8the arithmetic average roughness Ra:0.074 μm on the surface of Pa, releasing agent layer) beyond, identical with embodiment 1, obtain the flexible printed wiring board of band electromagnetic shielding film.
The arithmetic average roughness Ra on the surface of the protective layer side of the first mold release film after the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before hot pressing, operation (e) is shown in Table 1, conductive adhesive oxidant layer after peel strength when peeling off the first mold release film from protective layer, protective layer and solidification is with or without fracture and peel off, the arithmetic average roughness Ra on the surface of protective layer.
(comparative example 2)
Except the non-foamed polyethylene terephthalate film (Lintec Inc., T157, the thickness: storage modulus when 50 μm, 160 DEG C: 6 × 10 that employ carrying out one side demoulding process gained with non-silicone release agent as the first mold release film
8carry out the film (the arithmetic average roughness Ra:0.529 μm on the surface of releasing agent layer) of blasting treatment gained on the surface of the side of the demoulding process of carrying out Pa), and beyond the conductive adhesive layer 16 changing isotropic conductivity in the manner as shown in table 1, identical with embodiment 4, obtain the flexible printed wiring board of band electromagnetic shielding film.
The arithmetic average roughness Ra on the surface of the protective layer side of the first mold release film after the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before hot pressing, operation (e) is shown in Table 1, conductive adhesive oxidant layer after peel strength when peeling off the first mold release film from protective layer, protective layer and solidification is with or without fracture and peel off, the arithmetic average roughness Ra on the surface of protective layer.
[table 1]
In embodiment 1 ~ 4; because the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before carrying out hot pressing to electromagnetic shielding film and after hot pressing meets above-mentioned condition (α) and condition (β); therefore when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film; can be formed concavo-convex on the surface of the protective layer of electromagnetic shielding film; and after hot-pressing, can easily the first mold release film be peeled off from protective layer.
On the other hand; in comparative example 1; because the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film after carrying out hot pressing to electromagnetic shielding film does not meet above-mentioned condition (β); therefore, when carrying out hot pressing to the flexible printed wiring board of tape insulation film and electromagnetic shielding film, cannot be formed concavo-convex on the surface of the protective layer of electromagnetic shielding film.
In comparative example 2; owing to having carried out blasting treatment to the surface of the first mold release film in advance; and the arithmetic average roughness Ra on the surface of the releasing agent layer of the first mold release film before carrying out hot pressing to electromagnetic shielding film does not meet above-mentioned condition (α); therefore after hot-pressing, cannot easily the first mold release film be peeled off from protective layer.
Utilizability in industry
Electromagnetic shielding film of the present invention is as smart mobile phone, mobile phone, optical module, digital camera, game machine, and in the flexible printed wiring board of the electronic equipment such as notebook, medical apparatus, electromagnetic wave shielding component is useful.
Reference numeral
1, the flexible printed wiring board of electromagnetic shielding film is with
2, the flexible printed wiring board of tape insulation film
3, the precursor of the flexible printed wiring board of electromagnetic shielding film is with
10, electromagnetic shielding film 12, protective layer
14, metal film layer 16, conductive adhesive oxidant layer
18, the first mold release film 18a, mold release film main body
18b, releasing agent layer 20, second mold release film
22, electroconductive particle 24, bubble
30, flexible printed wiring board 32, basilar memebrane
34, printed circuit 40, dielectric film
42, the flexible printed wiring board of through hole 101, band electromagnetic shielding film
110, electromagnetic shielding film 112, protective layer
114, metal film layer 116, conductive adhesive oxidant layer
118, mold release film 130, flexible printed wiring board
132, basilar memebrane 134, printed circuit
140, dielectric film 142, through hole.
Claims (9)
1. an electromagnetic shielding film, comprising:
Mold release film;
Conductive adhesive oxidant layer; And
Protective layer, it is present between described mold release film and described conductive adhesive oxidant layer,
Described mold release film meets following condition (α) and condition (β):
Condition (α): the arithmetic average roughness Ra on the surface of the described protective layer side of the described mold release film before carrying out hot pressing to described electromagnetic shielding film is more than 0.02 μm less than 0.20 μm,
Condition (β): be more than 0.30 μm less than 0.80 μm with temperature 170 DEG C, the arithmetic average roughness Ra of pressure 15MPa to the surface of the described protective layer side of the described mold release film of described electromagnetic shielding film hot pressing after 30 seconds.
2. electromagnetic shielding film according to claim 1, wherein, described mold release film has plural multiple bubble.
3. electromagnetic shielding film according to claim 1 and 2, also comprises the metal film layer be present between described conductive adhesive oxidant layer and described protective layer.
4. electromagnetic shielding film according to any one of claim 1 to 3, wherein, described mold release film has mold release film main body and is formed at the releasing agent layer on surface of described protective layer side of described mold release film main body.
5. electromagnetic shielding film according to any one of claim 1 to 4, wherein, the ratio of the bubble in described mold release film is 2 more than volume % 30 volume below the % in 100 volume % of described mold release film.
6. electromagnetic shielding film according to any one of claim 1 to 5, wherein, the average diameter of the bubble in described mold release film is more than 0.1 μm less than 60 μm.
7. a manufacture method for the flexible printed wiring board with electromagnetic shielding film, wherein, described manufacture method has following operation (d) to (f):
D () has the surface being provided with the side of described printed circuit of the flexible printed wiring board of printed circuit to arrange dielectric film at least one mask at basilar memebrane, thus obtain the flexible printed wiring board of tape insulation film,
E () is after described operation (d), the mode that electromagnetic shielding film according to any one of the flexible printed wiring board of described tape insulation film and claim 1 to 6 is contacted with the surface of described dielectric film with described conductive adhesive oxidant layer is carried out overlap, and hot pressing is carried out to them, thus described conductive adhesive oxidant layer is bonded in the surface of described dielectric film, and
F (), after described operation (e), peels off described mold release film, obtain the flexible printed wiring board of band electromagnetic shielding film.
8. the manufacture method of the flexible printed wiring board of band electromagnetic shielding film according to claim 7; wherein, the arithmetic average roughness Ra on the surface of the protective layer side of the described mold release film that the arithmetic average roughness Ra on the surface of the protective layer side of the described mold release film after described operation (e) is more front than described operation (e) is large.
9. the manufacture method of the flexible printed wiring board of the band electromagnetic shielding film according to claim 7 or 8, wherein, the arithmetic average roughness Ra on the surface of the described protective layer after described operation (f) is more than 0.30 μm less than 0.80 μm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014180305A JP6184025B2 (en) | 2014-09-04 | 2014-09-04 | Electromagnetic wave shielding film and method for producing flexible printed wiring board with electromagnetic wave shielding film |
| JP2014-180305 | 2014-09-04 |
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| Publication Number | Publication Date |
|---|---|
| CN105407624A true CN105407624A (en) | 2016-03-16 |
| CN105407624B CN105407624B (en) | 2018-05-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510557139.0A Active CN105407624B (en) | 2014-09-04 | 2015-09-02 | The manufacture method of electromagnetic shielding film and flexible printed wiring board with it |
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| JP (1) | JP6184025B2 (en) |
| CN (1) | CN105407624B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555010A (en) * | 2014-10-28 | 2016-05-04 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and methods for manufacturing the same |
| CN109153239A (en) * | 2016-05-20 | 2019-01-04 | 日立化成株式会社 | Mold release film |
| CN113853839A (en) * | 2019-05-29 | 2021-12-28 | 拓自达电线株式会社 | Electromagnetic wave shielding film and shielded printed wiring board |
| TWI802757B (en) * | 2018-10-03 | 2023-05-21 | 日商東洋油墨Ｓｃ控股股份有限公司 | Electromagnetic wave shield sheet and electronic component mounting board |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6709669B2 (en) * | 2016-04-20 | 2020-06-17 | 信越ポリマー株式会社 | Electromagnetic wave shield film and printed wiring board with electromagnetic wave shield film |
| JP2018010889A (en) * | 2016-07-11 | 2018-01-18 | 藤森工業株式会社 | Electromagnetic wave shield material |
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| CN111993731B (en) * | 2019-05-27 | 2023-11-14 | 宁波长阳科技股份有限公司 | Foaming release film and preparation method thereof |
| CN115500067B (en) * | 2022-09-02 | 2023-08-29 | 苏州申赛新材料有限公司 | Electromagnetic shielding composite material with low-reflection magneto-electric dual-functional gradient structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095566A (en) * | 2002-07-08 | 2004-03-25 | Tatsuta Electric Wire & Cable Co Ltd | Shield film, shielded flexible printed wiring board, and their manufacturing methods |
| JP2009277980A (en) * | 2008-05-16 | 2009-11-26 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding adhesive film and method of manufacturing the same |
| CN103002725A (en) * | 2011-09-16 | 2013-03-27 | 藤森工业株式会社 | Electromagnetic wave shielding material for FPC |
| CN103140126A (en) * | 2011-11-24 | 2013-06-05 | 大自达电线股份有限公司 | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| CN103857268A (en) * | 2012-11-28 | 2014-06-11 | 大自达电线股份有限公司 | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4540150B2 (en) * | 1998-09-30 | 2010-09-08 | 日東電工株式会社 | Thermally peelable adhesive sheet |
| JP5493523B2 (en) * | 2009-07-10 | 2014-05-14 | 東洋紡株式会社 | Laminated film for releasing adhesive sheet |
-
2014
- 2014-09-04 JP JP2014180305A patent/JP6184025B2/en active Active
-
2015
- 2015-09-02 CN CN201510557139.0A patent/CN105407624B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004095566A (en) * | 2002-07-08 | 2004-03-25 | Tatsuta Electric Wire & Cable Co Ltd | Shield film, shielded flexible printed wiring board, and their manufacturing methods |
| JP2009277980A (en) * | 2008-05-16 | 2009-11-26 | Toyo Ink Mfg Co Ltd | Electromagnetic wave shielding adhesive film and method of manufacturing the same |
| CN103002725A (en) * | 2011-09-16 | 2013-03-27 | 藤森工业株式会社 | Electromagnetic wave shielding material for FPC |
| CN103140126A (en) * | 2011-11-24 | 2013-06-05 | 大自达电线股份有限公司 | Shield film, shielded printed wiring board, and method for manufacturing shield film |
| CN103857268A (en) * | 2012-11-28 | 2014-06-11 | 大自达电线股份有限公司 | Shield film, shield printed wiring board and method of manufacturing shield printed wiring board |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105555010A (en) * | 2014-10-28 | 2016-05-04 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printed wiring board and methods for manufacturing the same |
| CN105555010B (en) * | 2014-10-28 | 2019-10-22 | 信越聚合物株式会社 | Electromagnetic shielding film, flexible printing wiring board and their manufacturing method |
| CN110662347A (en) * | 2014-10-28 | 2020-01-07 | 信越聚合物株式会社 | Electromagnetic wave shielding film, flexible printed wiring board, and method for producing same |
| CN109153239A (en) * | 2016-05-20 | 2019-01-04 | 日立化成株式会社 | Mold release film |
| CN109153239B (en) * | 2016-05-20 | 2021-05-04 | 昭和电工材料株式会社 | Mold release film |
| TWI802757B (en) * | 2018-10-03 | 2023-05-21 | 日商東洋油墨Ｓｃ控股股份有限公司 | Electromagnetic wave shield sheet and electronic component mounting board |
| CN113853839A (en) * | 2019-05-29 | 2021-12-28 | 拓自达电线株式会社 | Electromagnetic wave shielding film and shielded printed wiring board |
| CN113853839B (en) * | 2019-05-29 | 2022-09-30 | 拓自达电线株式会社 | Electromagnetic wave shielding film and shielding printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105407624B (en) | 2018-05-01 |
| JP2016054259A (en) | 2016-04-14 |
| JP6184025B2 (en) | 2017-08-23 |
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