CN112586096A - 印制线路基材用贴附膜 - Google Patents

印制线路基材用贴附膜 Download PDF

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Publication number
CN112586096A
CN112586096A CN201980057276.4A CN201980057276A CN112586096A CN 112586096 A CN112586096 A CN 112586096A CN 201980057276 A CN201980057276 A CN 201980057276A CN 112586096 A CN112586096 A CN 112586096A
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China
Prior art keywords
layer
circuit pattern
resin
film
adhesive
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Granted
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CN201980057276.4A
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CN112586096B (zh
Inventor
石冈宗悟
渡边正博
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Tuozda Wire Co ltd
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Tuozda Wire Co ltd
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    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
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    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
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Abstract

印制线路基材用贴附膜101包括电路图形遮盖层112、与电路图形遮盖层112层叠的胶粘剂层111。其中，电路图形的遮盖层112中与胶粘剂层111相反侧的面的Rku为2.5以上、3.0以下。

Description

印制线路基材用贴附膜
技术领域
本发明涉及印制线路基材用贴附膜及电磁波屏蔽膜。
背景技术
随着电子设备的复杂化，印制线路基材的电路图形也在复杂化。另外，电路图形的设计对电子设备的性能有很大影响，电路图形成为应得到保护的重要信息。因此，一直在进行以下研究：在印制线路基材的表面贴附覆盖膜等着色膜，使得无法直接用眼睛确认印制线路基材的电路图形（例如，参照专利文献1。）。
现有技术文献
专利文献
专利文献1：日本专利特开2014-185247号。
发明内容
发明要解决的技术问题
但是，印制线路基材的表面存在由电路图形引起的高低差。因此，即使把着色成了黑色的膜贴附到印制线路基材，有时也会由于光的反射等导致电路图形凸显在膜的表面，无法得到充分的遮盖性。因此，需要遮盖性有进一步提高的膜。
本发明的技术问题在于能实现电路图形的遮盖性高的贴附膜。
解决技术问题的技术手段
本发明的印制线路基材用贴附膜的第1形态包括电路图形遮盖层、与电路图形遮盖层层叠的胶粘剂层，其中，电路图形的遮盖层中与胶粘剂层相反侧的面的Rku为2.5以上、3.0以下。
在印制线路基材用贴附膜的第1形态中，能设计为，电路图形遮盖层中与胶粘剂层相反侧的面的截面高度为20%时的负载长度率（Rmr）为5.3%以上、8.5%以下。
本发明的印制线路基材用贴附膜的第2形态是一种印制线路基材用贴附膜，其包括电路图形遮盖层、与电路图形遮盖层层叠的胶粘剂层，其中，电路图形遮盖层中与胶粘剂层相反侧的面的Sku为1.8以上、4.0以下。
在印制线路基材用贴附膜的第2形态中，能设计为，电路图形遮盖层中与胶粘剂层相反侧的面的分离中心部与突出轮廓峰部的负载面积率为10%且分离中心部与突出轮廓谷部的负载面积率为80%时的中心部的实质体积（Vmc）为2.0mL/m2以上、3.0mL/m2以下。
本发明的电磁波屏蔽膜的一形态包括本发明的印制线路基材用贴附膜，且胶粘剂层为导电性胶粘剂层。
电磁波屏蔽膜的一形态可以在电路图形遮盖层与胶粘剂层之间还包括屏蔽层。
发明效果
通过本发明的印制线路基材贴附膜能提高电路图形的遮盖性。
附图说明
[图1]贴附有一实施方式涉及的印制线路基材用贴附膜的印制线路基材的截面图；
[图2]印制线路基材用贴附膜的变形例的截面图；
[图3]在实施例中使用的试验用基材的俯视图。
具体实施方式
本实施方式的印制线路基材贴附膜101（以下也简称贴附膜。）包括电路图形遮盖层112（以下也简称遮盖层。）、在遮盖层112的一侧的面形成的胶粘剂层111。
本实施方式的贴附膜101能如图1所示贴附到印制线路基材102。印制线路基材102例如含有基层121和设在基层121的表面的电路图形122。电路图形122例如被绝缘性的胶粘剂层123及绝缘膜124覆盖。
基层121由绝缘性的材料形成。绝缘性材料能使用绝缘性树脂组合物、陶瓷等。绝缘性树脂组合物例如能使用从下述中选择的至少1种：聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂以及聚苯硫醚类树脂。
电路图形122由导电性的材料形成。导电性的材料能使用金属箔、印刷·固化了导电性填料和树脂组合物的混合物而成的导电性材料，从成本的观点来看优选使用铜箔。
电路图形122的厚度无特别限定，优选1μm～100μm，更优选1～50μm。通过将电路图形的厚度设为1μm以上能降低印制线路基材102的制造成本。通过将厚度设为100μm以下能使得印制线路基材102薄型化。
胶粘剂层123由绝缘性的材料形成。绝缘性的材料优选绝缘性树脂组合物，例如能使用从下述中选择的至少1种：聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂以及聚苯硫醚类树脂。
胶粘剂层123的厚度无特别限定，优选1μm～50μm。
绝缘膜124由绝缘性的材料形成。绝缘性的材料优选绝缘性树脂组合物，例如能使用从下述中选择的至少1种：聚酰亚胺类树脂、聚酰胺酰亚胺类树脂、聚酰胺类树脂、聚醚酰亚胺类树脂、聚酯酰亚胺类树脂、聚醚腈类树脂、聚醚砜类树脂、聚苯硫醚类树脂、聚对苯二甲酸乙二醇酯类树脂、聚丙烯类树脂、交联聚乙烯类树脂、聚酯类树脂、聚苯并咪唑类树脂、聚酰亚胺类树脂、聚酰亚胺酰胺类树脂、聚醚酰亚胺类树脂以及聚苯硫醚类树脂。
绝缘膜124的厚度无特别限定，优选1μm～100μm，更优选10μm～25μm。通过将厚度设为1μm以上能降低印制线路基材的制造成本。通过将厚度设为100μm以下能使得印制线路基材薄型化。
若给遮盖层112着色使得贴附膜101不透明，就无法直接用眼睛确认电路图形122。例如，用全光线透过率优选20%以下、更优选10%以下、进一步优选5%以下的膜覆盖电路图形122的话，几乎无法直接用眼睛确认电路图形122。但是，由于电路图形122，遮盖层112的表面会形成凹凸。一般的电路图形122由铜线形成，其高度为几μm～十几μm。存在线的部分和不存在线的部分的高度之差由于胶粘剂层123等的填埋而变小，因此在遮盖层112的表面产生的凹凸的高度为几μm。但是，即使是如上所述微小的凹凸，在容易反射光的表面中也能用眼睛确认到凹凸的存在，无法遮盖电路图形122。
为了提高遮盖性，可以在遮盖层112的表面形成细微的凹凸，减少遮盖层112的光的反射。但是，本申请发明人发现，电路图形的遮盖性与作为一般的表面粗糙度的指标——依据日本工业规格（JIS）B0601：2001的算术平均粗糙度（Ra）及依据国际标准化机构（ISO）25178的三维算术平均高度（Sa）等不相关。另一方面，本申请发明人发现，在遮盖层112的表面，通过将依据JISB0601：2001的峰度（Rku）及依据ISO25178的陡峭度（Sku）设为一定范围内的数值，能够提高遮盖性。
具体地，遮盖层112中与胶粘剂层111相反侧的面（表面）的Rku为2.5以上、优选2.6以上、更优选2.7以上，3.0以下、优选2.9以下。另外，遮盖层112的表面的Sku为1.8以上、优选1.9以上、更优选2.1以上，4.0以下、优选3.0以下，更优选2.5以下。通过将Rku及Sku的至少一者设为上述值，能提高贴附膜101所带来的电路图形122的遮盖性。
另外，能将遮盖层112的表面的截面高度为20%时的相对负载长度率（Rmr）设为优选5.3%以上、更优选5.4%以上、进一步优选5.5%以上，优选8.5%以下、更优选8.0%以下、进一步优选7.8%以下、更进一步优选7.0%以下、进一步优选6.0%以下。除了Rku，还将Rmr设为上述值，由此能进一步提高遮盖性。
另外，能将遮盖层112的表面的分离中心部和突出轮廓峰部的负载面积率为10%且分离中心部和突出轮廓谷部的负载面积率为80%时的中心部的实质体积（Vmc）设为优选1.8mL/m2以上、更优选2.0mL/m2以上、进一步优选2.2mL/m2以上，优选3.0mL/m2以下。除了Sku，还将Vmc设为上述值，由此能进一步提高遮盖性。
并且，如实施例所示，Rku及Rmr能通过依据JISB0601：2001的方法来测定。如实施例所示，Sku及Vmc能通过依据ISO25178的方法来测定。
遮盖层112能由金属、热塑性树脂、热固性树脂或活性能量射线固化性树脂等形成。金属能使用镍、铜、银、锡、金、钯、铝、铬、钛及锌等中的任意一者，或包含二者以上在内的合金。热塑性树脂无特别限定，能使用苯乙烯类树脂、醋酸乙烯酯类树脂、聚酯类树脂、聚乙烯类树脂、聚丙烯类树脂、酰亚胺类树脂或丙烯酸类树脂等。热固性树脂无特别限定，能使用苯酚类树脂、环氧类树脂、末端有异氰酸酯基的聚氨酯类树脂、末端有异氰酸酯基的尿素类树脂、末端有异氰酸酯基的聚氨酯脲类树脂、三聚氰胺类树脂或醇酸类树脂等。另外，活性能量射线固化性树脂无特别限定，例如能使用分子中至少含有2个（甲基）丙烯酰氧基的聚合性化合物等。上述树脂可以单独使用，也可以组合使用2种以上。
将上述树脂涂抹到通过压纹加工等而具有凹凸形状的剥离性基板的表面并使其干燥，由此能形成具有一定的表面性状的遮盖层112。代替压纹加工，也能将在表面设置有表面具有凹凸的哑光层的膜用作剥离性基板。哑光层能通过在膜表面涂抹包含微粒子在内的树脂组合物或对在膜表面形成的树脂层的表面进行压纹加工来形成。
另外，除使用具有凹凸的剥离性基板外，也能通过向由上述树脂形成的树脂层的表面喷射干冰等方法、按压具有凹凸形状的模具的方法等，形成具有一定的表面性状的遮盖层112。
为调整遮盖层112的表面性状，也能添加微粒子。向遮盖层112添加的微粒子无特别限定，例如能使用树脂微粒子或无机微粒子。树脂微粒子能够是丙烯酸树脂微粒子、聚丙烯腈微粒子、聚氨酯微粒子、聚酰胺微粒子以及聚酰亚胺微粒子等。另外，无机微粒子能够是碳酸钙微粒子、硅酸钙微粒子、粘土、瓷土、滑石、二氧化硅微粒子、玻璃微粒子、硅藻土、云母粉、氧化铝微粒子、氧化镁微粒子、氧化锌微粒子、硫酸钡微粒子、硫酸铝微粒子、硫酸钙微粒子以及碳酸镁微粒子等。上述树脂微粒子及无机微粒子能单独使用，也能将复数个组合起来使用。
能设计为，遮盖层112的全光线透过率优选20%以下、更优选10%以下、进一步优选5%以下。通过将全光线透过率设定为20%以下，在将贴附膜101贴付于印制线路基材102时，难以直接用眼睛确认电路图形122。
从使得不易反射光的观点来看，优选遮盖层112含有黑色系着色剂。黑色系着色剂能够为黑色颜料或对复数种颜料进行减色混合而黑色化而成的混合颜料等。黑色颜料例如能够是碳黑、科琴黑（Ketjen Black）、碳纳米管（CNT）、苝黑、钛黑、铁黑以及苯胺黑等的其中一者或上述的组合。混合颜料例如能混合红色、绿色、蓝色、黄色、紫色、青色及品红等颜料来使用。从不易反射光的观点来看，黑色系着色剂的添加量优选相对于树脂100质量份为0.5质量%以上、更优选为1质量%以上。
根据需要，遮盖层112中可以含有固化促进剂、增黏剂、抗氧化剂、颜料、染料、可塑剂、紫外线吸收剂、消泡剂、整平剂、填充剂、阻燃剂、黏度改进剂以及防粘连剂等中的至少一者。
遮盖层112的厚度无特别限定，能根据需要恰当设定，从实现遮盖性、形成的容易程度及确保挠性的观点来看，能设为优选1μm以上、更优选4μm以上，并且优选20μm以下、更优选10μm以下、进一步优选5μm以下。
在本实施方式中，胶粘剂层111能由热塑性树脂、热固性树脂及活性能量射线固化性树脂等中的至少一者形成。
胶粘剂层111含有热塑性树脂时，热塑性树脂例如能使用苯乙烯类树脂、醋酸乙烯酯类树脂、聚酯类树脂、聚乙烯类树脂、聚丙烯类树脂、酰亚胺类树脂以及丙烯酸类树脂等。上述树脂可以单独使用1种，也可以组合使用2种以上。
胶粘剂层111含有热固性树脂时，热固性树脂例如能使用苯酚类树脂、环氧类树脂、聚氨酯类树脂、三聚氰胺类树脂、聚酰胺类树脂以及醇酸类树脂等。活性能量射线固化性树脂无特别限定，例如能使用分子中至少含有2个（甲基）丙烯酰氧基的聚合性化合物等。上述树脂可以单独使用1种，也可以组合使用2种以上。
热固性树脂例如包含含有反应性的第1官能团的第1树脂成分、与第1官能团反应的第2树脂成分。第1官能团例如能够是环氧基、酰胺基或羟基等。第2官能团根据第1官能团来选择即可，例如第1官能团为环氧基时，第2官能团能够是羟基、羧基、环氧基以及氨基等。具体地，例如第1树脂成分为环氧树脂时，能使用环氧基改性聚酯树脂、环氧基改性聚酰胺树脂、环氧基改性丙烯酸树脂、环氧基改性聚氨酯聚脲树脂、羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性丙烯酸树脂、羧基改性聚氨酯聚脲树脂以及氨基甲酸乙酯改性聚酯树脂等作为第2树脂成分。其中，优选羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性聚氨酯聚脲树脂以及氨基甲酸乙酯改性聚酯树脂。另外，第1树脂成分是羟基时，能使用环氧基改性聚酯树脂、环氧基改性聚酰胺树脂、环氧基改性丙烯酸树脂、环氧基改性聚氨酯聚脲树脂、羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性丙烯酸树脂、羧基改性聚氨酯聚脲树脂以及氨基甲酸乙酯改性聚酯树脂等作为第2树脂成分。其中，优选羧基改性聚酯树脂、羧基改性聚酰胺树脂、羧基改性聚氨酯聚脲树脂以及氨基甲酸乙酯改性聚酯树脂。
热固性树脂可以含有促进热固化反应的固化剂。热固性树脂含有第1官能团和第2官能团时，固化剂能够根据第1官能团及第2官能团的种类恰当选择。第1官能团是环氧基且第2官能团是羟基时，能使用咪唑类固化剂、苯酚类固化剂及阳离子类固化剂等。上述固化剂能单独使用1种，也能组合使用2种以上。此外,可以含有消泡剂、抗氧化剂、粘度调整剂、稀释剂、防沉剂、整平剂、偶联剂、着色剂及阻燃剂等作为非必须成分。
胶粘剂层111的厚度无特别限定,从确保接合性及挠性等的观点来看优选1μm～50μm。
胶粘剂层111也能够是在常温（例如20℃）的环境下具有黏着性，即具有粘着剂性的层。由于胶粘剂层111在常温的环境下具有黏着性，因此能在印制线路基材102的任意位置轻松贴附印制线路基材用贴附膜101。
也能向胶粘剂层111添加导电性填料，使胶粘剂层111成为具有导电性的导电性胶粘剂层。通过使胶粘剂层111为导电性，并使遮盖层112为绝缘保护层，从而能将贴附膜101作为电磁波屏蔽膜来使用。用贴附膜101作为电磁波屏蔽膜来使用时，将导电性的胶粘剂层111与设在印制线路基材102的接地图形连接即可。
导电性填料无特别限定，例如能使用金属填料、金属被覆树脂填料、碳系填料以及上述的混合物。金属填料能列举出铜粉、银粉、镍粉、银包铜粉、金包铜粉、银包镍粉以及金包镍粉等。上述金属粉能通过电解法、雾化法或还原法等制作。其中优选银粉、银包铜粉以及铜粉中的其中一者。
从填料彼此接触的观点来看,优选导电性填料的平均粒径为1μm以上、更优选3μm以上，优选50μm以下、更优选40μm以下。导电性填料的形状无特别限定,能够是球状、薄片状、树枝状或纤维状等。
导电性填料的含有量能根据用途恰当选择,全部固体成分中优选5质量%以上、更优选10质量%以上，优选95质量%以下、更优选90质量%以下。从嵌入性的观点来看，优选70质量%以下、更优选60质量%以下。另外，若要实现各向异性导电性，则优选40质量%以下、更优选35质量%以下。
如图2所示，把贴附膜101作为电磁波屏蔽膜时，也能在遮盖层112和胶粘剂层111之间设屏蔽层113。屏蔽层113能由金属箔、蒸镀膜及导电性填料等形成。
金属箔无特别限定，能够是镍、铜、银、锡、金、钯、铝、铬、钛及锌等中的其中一者或者包括二者以上在内的合金所形成的箔。
金属箔的厚度无特别限定，优选0.5μm以上、更优选1.0μm以上。金属箔的厚度为0.5μm以上的话，向屏蔽印制线路基材传递10MHz～100GHz的高频信号时，能抑制高频信号的衰减量。另外，优选金属箔的厚度为12μm以下、更优选10μm以下、进一步优选7μm以下。金属层的厚度在12μm以下的话，能确保良好的断裂伸长率。
蒸镀膜无特别限定，能蒸镀镍、铜、银、锡、金、钯、铝、铬、钛及锌等而形成。蒸镀能使用电镀法、无电解镀覆法、溅射法、电子束蒸镀法、真空蒸镀法、化学气相沉积（CVD）法或金属有机化学气相沉积（MOCVD）法等。
蒸镀膜的厚度无特别限定，优选0.05μm以上、更优选0.1μm以上。蒸镀膜的厚度为0.05μm以上的话，屏蔽印制线路基材中电磁波屏蔽膜屏蔽电磁波的特性优异。另外，优选蒸镀膜的厚度不足0.5μm、更优选不足0.3μm。蒸镀膜的厚度不足0.5μm时，电磁波屏蔽膜的柔韧性优异，能抑制屏蔽层因设置在印制线路基材的高低差而被破坏。
由导电性填料形成屏蔽层113时，能通过将配混了导电性填料的溶剂涂抹到遮盖层112的表面并使其干燥，由此形成屏蔽层113。导电性填料能使用金属填料、金属被覆树脂填料、碳系填料以及上述填料的混合物。金属填料能使用铜粉、银粉、镍粉、银包铜粉、金包铜粉、银包镍粉以及金包镍粉等。上述金属粉能通过电解法、雾化法、还原法制成。金属粉的形状能列举出球状、薄片状、纤维状、树枝状等。
在本实施方式中，屏蔽层113的厚度根据所要求的电磁屏蔽效果及耐反复弯曲・滑动性恰当选择即可。
优选贴附膜101的全光线透过率为20%以下、更优选10%以下、进一步优选5%以下。通过使全光线透过率为20%以下，能够在将贴附膜101贴附在印制线路基材102时，难以直接用眼睛确认电路图形122。为了使贴附膜101的全光线透过率为20%以下，只要向遮盖层112和/或胶粘剂层111添加着色剂、导电性填料等即可。另外，设有由金属箔等形成的屏蔽层113的话，能使得全光线透过率大致为0。此外，全光线透过率能依照JIS K 7136进行测定。
实施例
以下用实施例对贴附膜进一步详细说明。以下的实施例是示例，不对本发明进行限定。
＜剥离性基板的制作＞
向厚度为25μm的聚对苯二甲酸乙二醇酯膜（以下称PET膜）的表面喷射干冰微粒子形成凹凸后，设置由三聚氰胺类树脂形成的剥离层，得到了剥离性基板1。
调整含有二氧化硅粒子、三聚氰胺类树脂、甲苯的哑光层组合物,并使用线棒将其涂抹到厚度为25μm的聚对苯二甲酸乙二醇酯膜的表面，进行加热干燥得到了含有厚度为5μm的哑光层的剥离性基板2。通过改变二氧化硅粒子的粒径及添加量，同样得到了表面状态不同的剥离基板3～7。剥离性基板1～5的表面（形成遮盖层的面）的表面性状汇总在表1。
[表1]
Figure 847389DEST_PATH_IMAGE001
＜遮盖层的制作＞
向甲苯配混双酚A型环氧类树脂（三菱化学制、jER1256）100质量份、固化剂（三菱化学制、ST14）0.1质量份、作为黑色系着色剂的碳粒子（TOKAI CARBON制、TOKABLACK＃8300/F）15质量份并使得固体成分量为20质量%，制备了遮盖层组合物。用线棒将该组合物涂抹到剥离性基板的表面并进行加热干燥，在剥离性基板的表面制作了厚度为5μm的遮盖层。
＜胶粘剂层的制作＞
向甲苯添加双酚A型环氧类树脂（三菱化学制，jER1256）100质量份、固化剂（三菱化学制，ST14）0.1质量份并使得固体成分量为20质量%，进行搅拌混合，制备了胶粘剂层组合物。用线棒将得到的胶粘剂层组合物涂抹到对表面进行了离型处理的PET膜（以下称支撑膜），通过加热干燥在支撑膜表面形成了厚度为5μm的胶粘剂层。
＜贴附膜的制作＞
将在剥离性基板的表面形成的遮盖层与在支撑膜的表面形成的胶粘剂层贴合，用加热到100℃的一对金属辊，在5MPa的压力下进行加热加压,得到了贴附膜。得到的贴附膜的全光线透过率为5%以下。
＜评估用基材的制作＞
用压制机在温度：170℃，时间：3分钟，压力：2～3MPa的条件下接合得到的贴附膜和印制线路基材后，剥下剥离性基板制作出了评估用基材。
印制线路基材使用的是在由聚酰亚胺膜形成的基层121之上形成有如图3所示的电路图形122而成的印制线路基材。电路图形122由线宽为0.1mm、高度为12μm的铜箔形成。在基层121之上以覆盖电路图形122的方式设有厚度为25μm的胶粘剂层以及由厚度为12.5μm的聚酰亚胺膜所形成的覆盖膜（绝缘膜）。
＜表面状态的评估＞
用共聚焦显微镜（Lasertec公司制,OPTELICS HYBRID,物镜20倍）,依照JISB0601：2001测定了表面的任意5处。之后,用数据分析软件（LMeye7）进行倾斜补正，测定了Rku、Rmr以及Ra。另外，依照ISO25178测定了表面的任意5处。之后，用数据分析软件（LMeye7）进行表面的倾斜补正，测定了Sku、Vmr、Sa、Sv以及Sz。另外，S滤波器的截断波长为0.0025mm，L滤波器的截断波长为0.8mm。另外，各个数值是测定了5处的值的平均值。
＜遮盖性的评估＞
将评估用基材放置在平坦的桌面上，在屏蔽线路基材的表面的照度为500勒克斯的环境下，评估了在距评估用基材高度30cm、45度角度处能否从遮盖层侧用眼睛确认电路图形。无法用眼睛确认电路图形时为遮盖性良好（○），能用眼睛确认到电路图形时为遮盖性不良（×）。
（实施例1）
由用剥离性基板1形成的遮盖层制成贴附膜，得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为2.6，Sku为2.0。截面高度为20%时的Rmr为7.7%，分离中心部和突出轮廓峰部的负载面积率为10%且分离中心部和突出轮廓谷部的负载面积率为80%时的Vmc为2.8mL/m2。另外，Ra、Sa、Sv及Sz分别为1.8μm、2.3μm、-10.2μm及18.3μm。通过目视进行检验时，无法用眼睛确认电路图形，遮盖性十分良好。
（实施例2）
除使用了剥离性基板2外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为2.9，Sku为2.1。Rmr为5.6%，Vmc为2.9mL/m2。另外，Ra、Sa、Sv及Sz分别为1.8μm、2.5μm、-12.9μm及23.6μm。通过目视进行检验时，无法用眼睛确认电路图形，遮盖性十分良好。
（实施例3）
除使用了剥离性基板3外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为3.0，Sku为2.3。Rmr为5.8%，Vmc为2.5mL/m2。另外，Ra、Sa、Sv及Sz分别为1.0μm、2.0μm、-9.8μm及18.2μm。通过目视进行检验时，无法用眼睛确认电路图形，遮盖性十分良好。
（比较例1）
除使用了剥离性基板4外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为2.3，Sku为1.8。Rmr为8.8%，Vmc为3.5mL/m2。另外，Ra、Sa、Sv及Sz分别为2.0μm、2.7μm、-11.5μm及18.8μm。通过目视进行检验时，能用眼睛确认到电路图形，遮盖性不良。
（比较例2）
除使用了剥离性基板5外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为2.3，Sku为1.8。Rmr为10.1%，Vmc为3.5mL/m2。另外，Ra、Sa、Sv及Sz分别为1.7μm、2.7μm、-10.9μm及18.4μm。通过目视进行检验时，能用眼睛确认到电路图形，遮盖性不良。
（比较例3）
除使用了剥离性基板6外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为2.4，Sku为1.8。Rmr为9.5%，Vmc为3.2mL/m2。另外，Ra、Sa、Sv及Sz分别为1.9μm、2.6μm、-10.0μm及16.9μm。通过目视进行检验时，能用眼睛确认到电路图形，遮盖性不良。
（比较例4）
除使用了剥离性基板7外，其余与实施例1同样地得到了评估用基材。去掉剥离性基板后的评估用基材的遮盖层的表面的Rku为3.1，Sku为4.2。Rmr为5.1%，Vmc为1.7mL/m2。另外，Ra、Sa、Sv及Sz分别为0.7μm、1.5μm、-11.1μm及16.2μm。通过目视进行检验时，能用眼睛确认到电路图形，遮盖性不良。
各实施例及比较例的结果汇总如表2所示。
[表2]
Figure 299230DEST_PATH_IMAGE002
实用性
本发明的印制线路基材用贴附膜对于电路图形的遮盖性高，作为遮盖电路图形的贴附膜、电磁波屏蔽膜等是有用的。
附图标记
101贴附膜
102印制线路基材
111胶粘剂层
112遮盖层
113屏蔽层
121基层
122电路图形
123胶粘剂层
124绝缘膜

Claims (6)

1.一种印制线路基材用贴附膜，其特征在于，所述印制线路基材用贴附膜包括：
电路图形遮盖层、
与所述电路图形遮盖层层叠的胶粘剂层，其中，
所述电路图形遮盖层中与所述胶粘剂层相反侧的面的Rku为2.5以上、3.0以下。
2.根据权利要求1所述的印制线路基材用贴附膜，其特征在于：
所述电路图形遮盖层中与所述胶粘剂层相反侧的面的截面高度为20%时的Rmr为5.3%以上、8.5%以下。
3.一种印制线路基材用贴附膜，其特征在于，所述印制线路基材用贴附膜包括：
电路图形遮盖层、
与所述电路图形遮盖层层叠的胶粘剂层，其中，
所述电路图形遮盖层中与所述胶粘剂层相反侧的面的Sku为1.8以上、4.0以下。
4.根据权利要求3所述的印制线路基材用贴附膜，其特征在于：
所述电路图形遮盖层中与所述胶粘剂层相反侧的面的分离中心部和突出轮廓峰部的负载面积率为10%且分离中心部和突出轮廓谷部的负载面积率为80%时的Vmc为2.0mL/m2以上、3.0mL/m2以下。
5.一种电磁波屏蔽膜，其特征在于，所述电磁波屏蔽膜包括：
权利要求1至4的任意一项所述的印制线路基材用贴附膜；
其中，所述胶粘剂层为导电性胶粘剂层。
6.根据权利要求5所述的电磁波屏蔽膜，其特征在于：
在所述电路图形遮盖层与所述胶粘剂层之间还包括屏蔽层。
CN201980057276.4A 2018-07-06 2019-07-05 印制线路基材用贴附膜 Active CN112586096B (zh)

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