TWI780343B - 印刷配線基板用貼黏膜及電磁波屏蔽膜 - Google Patents
印刷配線基板用貼黏膜及電磁波屏蔽膜 Download PDFInfo
- Publication number
- TWI780343B TWI780343B TW108123825A TW108123825A TWI780343B TW I780343 B TWI780343 B TW I780343B TW 108123825 A TW108123825 A TW 108123825A TW 108123825 A TW108123825 A TW 108123825A TW I780343 B TWI780343 B TW I780343B
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- resin
- circuit pattern
- film
- printed wiring
- Prior art date
Links
- 239000002313 adhesive film Substances 0.000 title claims abstract description 34
- 239000010410 layer Substances 0.000 claims abstract description 85
- 239000012790 adhesive layer Substances 0.000 claims abstract description 50
- 238000000926 separation method Methods 0.000 claims 2
- 229920005989 resin Polymers 0.000 description 92
- 239000011347 resin Substances 0.000 description 92
- 239000010408 film Substances 0.000 description 35
- 239000000758 substrate Substances 0.000 description 31
- 238000011156 evaluation Methods 0.000 description 20
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 239000010419 fine particle Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 15
- 229920001225 polyester resin Polymers 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 239000004645 polyester resin Substances 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 125000000524 functional group Chemical group 0.000 description 12
- -1 polyethylene terephthalate Polymers 0.000 description 12
- 239000011231 conductive filler Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000000945 filler Substances 0.000 description 10
- 229920006122 polyamide resin Polymers 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 9
- 229920001187 thermosetting polymer Polymers 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- 229920000178 Acrylic resin Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 7
- 239000000049 pigment Substances 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 239000004697 Polyetherimide Substances 0.000 description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 description 6
- 229920002396 Polyurea Polymers 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 239000011810 insulating material Substances 0.000 description 6
- 239000011859 microparticle Substances 0.000 description 6
- 229920001601 polyetherimide Polymers 0.000 description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000003086 colorant Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229920000570 polyether Polymers 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- 229920000877 Melamine resin Polymers 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 239000004962 Polyamide-imide Substances 0.000 description 3
- 239000004693 Polybenzimidazole Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000004703 cross-linked polyethylene Substances 0.000 description 3
- 229920003020 cross-linked polyethylene Polymers 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 210000004400 mucous membrane Anatomy 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 150000002825 nitriles Chemical class 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229920003055 poly(ester-imide) Polymers 0.000 description 3
- 229920002312 polyamide-imide Polymers 0.000 description 3
- 229920002480 polybenzimidazole Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 229910052718 tin Inorganic materials 0.000 description 3
- 239000011135 tin Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 101000661807 Homo sapiens Suppressor of tumorigenicity 14 protein Proteins 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 235000011089 carbon dioxide Nutrition 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920005678 polyethylene based resin Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000006722 reduction reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004034 viscosity adjusting agent Substances 0.000 description 2
- FWLHAQYOFMQTHQ-UHFFFAOYSA-N 2-N-[8-[[8-(4-aminoanilino)-10-phenylphenazin-10-ium-2-yl]amino]-10-phenylphenazin-10-ium-2-yl]-8-N,10-diphenylphenazin-10-ium-2,8-diamine hydroxy-oxido-dioxochromium Chemical compound O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.O[Cr]([O-])(=O)=O.Nc1ccc(Nc2ccc3nc4ccc(Nc5ccc6nc7ccc(Nc8ccc9nc%10ccc(Nc%11ccccc%11)cc%10[n+](-c%10ccccc%10)c9c8)cc7[n+](-c7ccccc7)c6c5)cc4[n+](-c4ccccc4)c3c2)cc1 FWLHAQYOFMQTHQ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- DIZPMCHEQGEION-UHFFFAOYSA-H aluminium sulfate (anhydrous) Chemical compound [Al+3].[Al+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O DIZPMCHEQGEION-UHFFFAOYSA-H 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 210000004379 membrane Anatomy 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920005673 polypropylene based resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/22—Layered products comprising a layer of synthetic resin characterised by the use of special additives using plasticisers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/302—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising aromatic vinyl (co)polymers, e.g. styrenic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
- B32B2264/025—Acrylic resin particles, e.g. polymethyl methacrylate or ethylene-acrylate copolymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
- B32B2264/0264—Polyamide particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/02—Synthetic macromolecular particles
- B32B2264/0214—Particles made of materials belonging to B32B27/00
- B32B2264/0292—Polyurethane particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/101—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/12—Mixture of at least two particles made of different materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/212—Electromagnetic interference shielding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/40—Properties of the layers or laminate having particular optical properties
- B32B2307/41—Opaque
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0215—Metallic fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Security & Cryptography (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Abstract
印刷配線基板用貼黏膜101係具備電路圖案隱蔽層112、及與電路圖案隱蔽層112積層之接著劑層111。電路圖案隱蔽層112中，與接著劑層111相反側之面的Rku為2.5以上3.0以下。
Description
本發明係關於印刷配線基板用貼黏膜及電磁波屏蔽膜。
隨著電子機器複雜化，印刷配線基板之電路圖案亦複雜化。又，電路圖案設計會對電子機器性能造成很大的影響，電路圖案為需保護之重要資訊。因此檢討在印刷配線基板表面黏貼覆蓋膜等著色膜，而無法直接靠視覺識別印刷配線基板之電路圖案(例如參照專利文獻1)。
專利文獻1：日本特開2014-185247號公報。
但印刷配線基板表面中存在電路圖案所造成的台階。因此，即使於印刷配線基板貼合有著色為黑色的膜，電路圖案會因光的反射等而浮出於膜表面，無法獲得充分隱蔽性。因此需要的是隱蔽性進一步提高的膜。
本發明之目的在於能夠實現高電路圖案隱蔽性的貼黏膜。
本發明之印刷配線基板用貼黏膜之第一態樣係具備電路圖案隱蔽層、及與電路圖案隱蔽層積層之接著劑層，電路圖案隱蔽層中，與接著劑層相反側之面的Rku為2.5以上3.0以下。
印刷配線基板用貼黏膜之第一態樣中，電路圖案隱蔽層中，與接著劑層相反側之面在橫斷程度為20%時之負載長度率(Rmr)為5.3%以上8.5%以下。
本發明之印刷配線基板用貼黏膜之第二態樣係具備電路圖案隱蔽層、及與電路圖案隱蔽層積層之接著劑層，電路圖案隱蔽層中，與接著劑層相反側之面的Sku為1.8以上4.0以下。
印刷配線基板用貼黏膜之第二態樣中，電路圖案隱蔽層中，與接著劑層相反側之面中，以分離核心部與突出波峰部之負載面積率為10%且以分離核心部與突出波谷部之負載面積率80%時，核心部之實體體積(Vmc)為2.0mL/m2以上3.0mL/m2以下。
本發明之電磁波屏蔽膜之一態樣係具備本發明之印刷配線基板用貼黏膜，且接著劑層為導電性接著劑層。
電磁波屏蔽膜之一態樣係在電路圖案隱蔽層與接著劑層之間進一步具備屏蔽層。
根據本發明之印刷配線基板貼黏膜可提高電路圖案隱蔽性。
101:貼黏膜
102:印刷配線基板
111:接著劑層
112:隱蔽層
113:屏蔽層
121:底層
122:電路圖案
123:接著劑層
124:絕緣膜
圖1之剖視圖係表示黏貼有一實施形態之印刷配線基板用貼黏膜之印刷配線基板。
圖2之剖視圖係表示印刷配線基板用貼黏膜之變形例。
圖3之俯視圖係表示實施例所使用的試驗用基板。
本實施形態之印刷配線基板貼黏膜101(以下稱為貼黏膜)係具備電路圖案隱蔽層112(以下稱為隱蔽層)、及形成於隱蔽層112一面之接著劑層111。
如圖1所示，本實施形態之貼黏膜101可黏貼於印刷配線基板102。印刷配線基板102例如具有底層121、及設置於底層121表面之電路圖案122。電路圖案122例如被絕緣性接著劑層123及絕緣膜124覆蓋。
底層121係以絕緣性材料構成。絕緣性材料可使用絕緣性樹脂組成物或陶瓷等。絕緣性樹脂組成物可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一種。
電路圖案122係以導電性材料構成。導電性材料可使用將金屬箔或導電性填料與樹脂組成物的混合物進行印刷/硬化之導電性材料，但以費用觀點來看，較佳為使用銅箔。
電路圖案122之厚度並無特別限定，較佳為1μm~100μm，更佳為1~50μm。使電路圖案之厚度為1μm以上，藉此可降低印刷配線基板102的製造成本。使厚度為100μm以下，藉此可使印刷配線基板102薄化。
接著劑層123係以絕緣性材料構成。絕緣性材料較佳為絕緣性樹脂組成物，可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一
種。
接著劑層123之厚度並無特別限定，較佳為1μm~50μm。
絕緣膜124係以絕緣性材料構成。絕緣性材料較佳為絕緣性樹脂組成物，可使用例如由聚醯亞胺系樹脂、聚醯胺醯亞胺系樹脂、聚醯胺系樹脂、聚醚醯亞胺系樹脂、聚酯醯亞胺系樹脂、聚醚腈系樹脂、聚醚碸系樹脂、聚苯硫醚系樹脂、聚對苯二甲酸乙二酯系樹脂、聚丙烯系樹脂、交聯聚乙烯系樹脂、聚酯系樹脂、聚苯并咪唑系樹脂、聚醯亞胺系樹脂、聚醯亞胺醯胺系樹脂、聚醚醯亞胺系樹脂及聚苯硫醚系樹脂所選擇至少一種。
絕緣膜124之厚度並無特別限定，較佳為1μm~100μm，更佳為10μm~25μm。使厚度為1μm以上，藉此可降低印刷配線基板的製造成本。使厚度為100μm以下，藉此可使印刷配線基板薄化。
若著色隱蔽層112並使貼黏膜101為不透明，則無法直接靠視覺識別電路圖案122。例如藉由全光線透過率較佳為20%以下，更佳為10%以下，又更佳為5%以下的膜而覆蓋電路圖案122，則幾乎無法直接靠視覺識別電路圖案122。但會因電路圖案122而在隱蔽層112表面上形成凹凸。一般電路圖案122係藉由銅線而形成，其高度為數μm~十數μm。存在線的部分與不存在線的部分之高度差可藉由埋入接著劑層123等而變小，故在隱蔽層112表面產生之凹凸高度為數μm。但即使是如此些微的凹凸，亦可靠視覺識別在容易反射光的表面中凹凸之存在，無法隱蔽電路圖案122。
為提高隱蔽性而考慮在隱蔽層112表面形成微小凹凸，並降低光於隱蔽層112中之反射。但本申請發明人等發現：電路圖案隱蔽性係與根據為一般表面粗糙度指標之日本工業規格
(JIS)B0601：2001之算術平均粗度(Ra)、及根據國際標準化機構(ISO)25178之三維算術平均高度(Sa)等無關。另一方面，本申請發明人等還發現：使隱蔽層112表面中根據JIS B 0601：2001之峰度(Rku)及根據ISO25178之峰度(Sku)為特定範圍內的值，藉此可提高隱蔽性。
具體而言，隱蔽層112之與接著劑層111相反側之面(表面)的Rku為2.5以上，較佳為2.6以上，更佳為2.7以上，且為3.0以下，較佳為2.9以下。又，隱蔽層112表面的Sku為1.8以上，較佳為1.9以上，更佳為2.1以上，且為4.0以下，較佳為3.0以下，更佳為2.5以下。使Rku及Sku之至少一者為該值，藉此可提高貼黏膜101之電路圖案122隱蔽性。
又，隱蔽層112表面在橫斷程度為20%時之相對負載長度率(Rmr)較佳為5.3%以上，更佳為5.4%以上，又更佳為5.5%以上，較佳為8.5%以下，更佳為8.0%以下，又更佳為7.8%以下，又再更佳為7.0%以下，特佳為6.0%以下。除了Rku以外，還使Rmr為該值，藉此可進一步提高隱蔽性。
又，隱蔽層112表面中，以分離核心部與突出波峰部之負載面積率為10%且以分離核心部與突出波谷部之負載面積率80%為時，核心部之實體體積(Vmc)較佳為1.8mL/m2以上，更佳為2.0mL/m2以上，又更佳為2.2mL/m2以上，較佳為3.0mL/m2以下。除了Sku以外，還使Vmc該值，藉此可進一步提高隱蔽性。
又，如實施例所示，Rku及Rmr可藉由根據JIS B 0601：2001之方法測得。如實施例所示，Sku及Vmc可藉由根據ISO25178之方法測得。
隱蔽層112可由金屬、熱塑性樹脂、熱硬化性樹脂、或活性能量線硬化性樹脂等形成。金屬可使用鎳、銅、銀、錫、金、
鈀、鋁、鉻、鈦、及鋅等任一者、或含有二種以上的合金。熱塑性樹脂並無特別限定，可使用苯乙烯系樹脂、乙酸乙烯系樹脂、聚酯系樹脂、聚乙烯系樹脂、聚丙烯系樹脂、醯亞胺系樹脂、或丙烯酸系樹脂等。熱硬化性樹脂並無特別限定，可使用苯酚系樹脂、環氧系樹脂、末端具有異氰酸酯基之胺甲酸乙酯系樹脂、末端具有異氰酸酯基之尿素系樹脂、末端具有異氰酸酯基之胺甲酸乙酯尿素系樹脂、三聚氰胺系樹脂、或醇酸系樹脂等。又，活性能量線硬化性樹脂並無特別限定，可使用例如分子中具有至少二個(甲基)丙烯醯氧基之聚合性化合物等。該等樹脂可單獨使用或併用二種以上。
可將該等樹脂塗布於剝離性基材之藉由壓印加工等而呈凹凸形狀之表面上並使其乾燥，藉此可形成具有特定表面性質、狀態之隱蔽層112。取代壓印加工，可以於表面設置表面具凹凸之消光層的膜為剝離性基材。於膜表面塗布含有微粒子之樹脂組成物，或對形成於膜表面之樹脂層表面進行壓印加工，藉此可形成消光層。
又，除了使用具有凹凸之剝離性基材以外，可藉由在該等樹脂所形成樹脂層表面吹上乾冰等之方法、或壓接具有凹凸形狀之鑄模之方法等，而形成具有特定表面性質、狀態之隱蔽層112。
為了調整隱蔽層112表面性質、狀態，亦可添加微粒子。於隱蔽層112添加之微粒子並無特別限定，可使用例如樹脂微粒子或無機微粒子。樹脂微粒子可為丙烯酸樹脂微粒子、聚丙烯腈微粒子、聚胺甲酸乙酯微粒子、聚醯胺微粒子、及聚醯亞胺微粒子等。又，無機微粒子可為碳酸鈣微粒子、矽酸鈣微粒子、黏土、高嶺土、滑石、二氧化矽微粒子、玻璃微粒子、矽藻土、
雲母粉、氧化鋁微粒子、氧化鎂微粒子、氧化鋅微粒子、硫酸鋇微粒子、硫酸鋁微粒子、硫酸鈣微粒子、及碳酸鎂微粒子等。該等樹脂微粒子及無機微粒子可單獨使用或組合複數使用。
隱蔽層112之全光線透過率較佳為20%以下，更佳為10%以下，又更佳為5%以下。使全光線透過率為20%以下，藉此，於印刷配線基板102貼黏貼黏膜101時，難以直接靠視覺識別電路圖案122。
以使光不易反射之觀點來看，隱蔽層112較佳為含有黑色系著色劑。黑色系著色劑可為黑色顏料、或複數顏料減色混合而黑色化之混合顏料等。黑色顏料例如可為碳黑，科琴黑、碳奈米管(CNT)、苝黑、鈦黑、鐵黑、及苯胺黑等任一者或該等之組合。混合顏料例如可混合紅色、綠色、藍色、黃色、紫色、青藍及洋紅等顏料而使用。以使光不易反射之觀點來看，相對於樹脂100質量份，黑色系著色劑添加量較佳為0.5質量%以上，更佳為1質量%以上。
隱蔽層112視需要可含有硬化促進劑、黏著性賦予劑、抗氧化劑、顏料、染料、塑化劑、紫外線吸收劑、消泡劑、調平劑、充填劑、阻燃劑、黏度調節劑、及抗結塊劑等至少一種。
隱蔽層112之厚度無特別限定，可視需要適宜設定，但以實現隱蔽性、形成難易度及確保可撓性等觀點來看，較佳為1μm以上，更佳為4μm以上，又，較佳為20μm以下，更佳為10μm以下，又更佳為5μm以下。
本實施形態中，接著劑層111可藉由熱塑性樹脂、熱硬化性樹脂及活性能量線硬化性樹脂等至少一種形成。
接著劑層111含有熱塑性樹脂時，熱塑性樹脂可使用例如苯乙烯系樹脂、乙酸乙烯酯系樹脂、聚酯系樹脂、聚乙烯系樹脂、
聚丙烯系樹脂、醯亞胺系樹脂、及丙烯酸系樹脂等。該等樹脂可單獨使用一種或併用二種以上。
接著劑層111含有熱硬化性樹脂時，熱硬化性樹脂可使用例如苯酚系樹脂、環氧系樹脂、胺甲酸乙酯系樹脂、三聚氰胺系樹脂、聚醯胺系樹脂及醇酸系樹脂等。活性能量線硬化性樹脂並無特別限定，例如可使用分子中具有至少二個(甲基)丙烯醯氧基之聚合性化合物等。該等樹脂可單獨使用一種或併用二種以上。
熱硬化性樹脂例如含有具有反應性第一官能基之第一樹脂成分、及與第一官能基反應之第二樹脂成分。第一官能基例如可為環氧基、醯胺基、或羥基等。第二官能基可因應第一官能基選擇，例如第一官能基為環氧基時，可為羥基、羧基、環氧基及胺基等。具體而言，例如使第一樹脂成分為環氧樹脂時，第二樹脂成分可使用環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺甲酸乙酯聚尿素樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂等。該等中較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂。又，第一樹脂成分為羥基時，第二樹脂成分可使用環氧基改質聚酯樹脂、環氧基改質聚醯胺樹脂、環氧基改質丙烯酸樹脂、環氧基改質聚胺甲酸乙酯聚尿素樹脂、羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質丙烯酸樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯改質聚酯樹脂等。該等中較佳為羧基改質聚酯樹脂、羧基改質聚醯胺樹脂、羧基改質聚胺甲酸乙酯聚尿素樹脂、及胺甲酸乙酯
改質聚酯樹脂。
熱硬化性樹脂可含有促進熱硬化反應之硬化劑。熱硬化性樹脂具有第一官能基與第二官能基時，硬化劑可因應第一官能基及第二官能基之種類而適宜選擇。第一官能基為環氧基且第二官能基為羥基時，可使用咪唑系硬化劑、苯酚系硬化劑、及陽離子系硬化劑等。該等可單獨使用一種或併用二種以上。此外，可含有消泡劑、抗氧化劑、黏度調整劑、稀釋劑、沉降防止劑、調平劑、耦合劑、著色劑、及阻燃劑等作為任意成分。
接著劑層111之厚度並無特別限定，以確保接著性及可撓性等觀點來看較佳為1μm~50μm。
接著劑層111可為在常溫(例如20℃)環境下具有黏性，亦即具有黏著劑性的層。接著劑層111在常溫環境下具有黏性，藉此，可在印刷配線基板102的任意位置容易地貼合印刷配線基板用貼黏膜101。
可於接著劑層111添加導電性填料，使接著劑層111成為具有導電性之導電性接著劑層。使接著劑層111為導電性且使隱蔽層112為絕緣保護層，藉此可將貼黏膜101作為電磁波屏蔽膜使用。將貼黏膜101作為電磁波屏蔽膜使用時，只要將導電性接著劑層111與設置於印刷配線基板102之接地圖案連接起來即可。
導電性填料並無特別限定，例如可使用金屬填料，覆蓋有金屬之樹脂填料，碳填料及該等之混合物。金屬填料可舉出銅粉、銀粉、鎳粉、銀覆銅粉、金覆銅粉、銀覆鎳粉、及金覆鎳粉等。該等金屬粉可藉由電解法、霧化法、或還元法等製成。其中較佳為銀粉、銀覆銅粉及銅粉之任一者。
以填料彼此接觸之觀點來看，導電性填料之平均粒徑較佳為1μm以上，更佳為3μm以上，較佳為50μm以下，更佳為
40μm以下。導電性填料之形狀無特別限定，可為球狀、薄片狀、樹枝狀、或纖維狀等。
導電性填料含量可因應用途而適宜選擇，在全固體成分中較佳為5質量%以上，更佳為10質量%以上，較佳為95質量%以下，更佳為90質量%以下。以埋入性之觀點來看，較佳為70質量%以下，更佳為60質量%以下。又，要實現異向導電性時，較佳為40質量%以下，更佳為35質量%以下。
以貼黏膜101為電磁波屏蔽膜時，如圖2所示，可將屏蔽層113設置在隱蔽層112與接著劑層111之間。可由金屬箔、蒸鍍膜及導電性填料等形成屏蔽層113。
金屬箔並無特別限定，可為鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、及鋅等任一者或含有兩種以上之合金所構成之箔。
金屬箔之厚度並無特別限定，較佳為0.5μm以上，更佳為1.0μm以上。若金屬箔之厚度為0.5μm以上，傳送10MHz~100GHz之高頻訊號至屏蔽印刷配線基板時，可抑制高頻訊號的衰減量。又，金屬箔之厚度較佳為12μm以下，更佳為10μm以下，又更佳為7μm以下。若金屬層之厚度為12μm以下，則可確保良好破裂延伸特性。
蒸鍍膜並無特別限定，可蒸鍍鎳、銅、銀、錫、金、鈀、鋁、鉻、鈦、及鋅等而形成。蒸鍍可使用電解電鍍法、化學電鍍法、濺鍍法、電子束蒸鍍法、真空蒸鍍法、化學氣相沈積(CVD)法、或有機金屬化學氣相沈積(MOCVD)法等。
蒸鍍膜之厚度並無特別限定，較佳為0.05μm以上，更佳為0.1μm以上。若蒸鍍膜之厚度為0.05μm以上，將電磁波屏蔽膜貼合於屏蔽印刷配線基板時，電磁波屏蔽膜屏蔽電磁波之特性優異。又，蒸鍍膜之厚度較佳為未滿0.5μm，更佳為未滿
0.3μm。若蒸鍍膜之厚度為未滿0.5μm，則電磁波屏蔽膜之耐折彎性優異，可抑制因設置於印刷配線基板之台階而使屏蔽層被破壞。
由導電性填料形成屏蔽層113時，可將摻配導電性填料之溶劑塗布於隱蔽層112表面並乾燥，藉此可形成屏蔽層113。導電性填料可使用金屬填料、覆蓋有金屬之樹脂填料、碳填料及該等之混合物。金屬填料可使用銅粉、銀粉、鎳粉、銀覆銅粉、金覆銅粉、銀覆鎳粉、及金覆鎳粉等。該等金屬粉可藉由電解法、霧化法、還元法製成。金屬粉之形狀可舉出球狀、薄片狀、纖維狀、樹枝狀等。
本實施形態中，屏蔽層113之厚度只要因應所求電磁屏蔽效果及重複折彎/滑動耐性而適宜選擇。
貼黏膜101之全光線透過率較佳為20%以下，更佳為10%以下，又更佳為5%以下。使全光線透過率為20%以下，藉此，於印刷配線基板102已貼合有貼黏膜101時，難以直接靠視覺識別電路圖案122。為了使貼黏膜101之全光線透過率為20%以下，只要於隱蔽層112及/或接著劑層111添加著色劑或導電性填料等即可。又，設置金屬箔等所構成之屏蔽層113時，全光線透過率幾乎可為0。又，全光線透過率可根據JIS K 7136測得。
以下使用實施例進一步詳細說明貼黏膜。以下實施例僅為例示，並無限定本發明之意圖。
<剝離性基材之製作>
於厚度25μm之聚對苯二甲酸乙二酯膜(以下稱為PET膜)表面吹上乾冰微粒子而形成凹凸後，設置三聚氰胺系樹脂所構成之剝離層，而得到剝離性基材1。
調整由二氧化矽粒子、三聚氰胺系樹脂、甲苯所構成之消光層組成物，於厚度25μm之聚對苯二甲酸乙二酯膜表面使用線棒塗布並加熱乾燥，而得具有厚度5μm之消光層之離性基材2。改變二氧化矽粒子之粒徑及添加量，藉此以同樣方式而得表面狀態相異之剝離基材3~7。剝離性基材1~5表面(形成隱蔽層的面)之表面性質、狀態示於表1。
<隱蔽層之製作>
以固體成分的量達到20質量%之方式，於甲苯摻配雙酚A型環氧系樹脂(三菱化學製jER1256)100質量份、硬化劑(三菱化學製ST14)0.1質量份、作為黑色系著色劑之碳粒子(Tokai Carbon製TOKABLACK #8300/F)15質量份，而調製出了隱蔽層組成物。於剝離性基材表面使用線棒塗布該組成物並加熱乾燥，在剝離性基材表面製作厚度5μm之隱蔽層。
<接著劑層之製作>
以固體成分的量達到20質量%之方式，於甲苯添加雙酚A型環氧系樹脂(三菱化學製jER1256)100質量份、硬化劑(三菱化學製ST14)0.1質量份，攪拌混合，而調製出了接著劑層組成物。於表面經脫模處理之PET膜(以下稱為支持膜)使用線棒塗布所得接著劑層組成物，加熱乾燥，藉此於支持膜表面形成了厚度5μm之接著劑層。
<貼黏膜之製作>
貼合形成於剝離性基材表面之隱蔽層與形成於支持膜表面之接著劑層，使用加熱至100℃之一對金屬輥，以5MPa壓力加熱加壓，而得貼黏膜。所得貼黏膜之全光線透過率為5%以下。
<評價用基板之製作>
將所得貼黏膜與印刷配線基板使用壓製機以溫度：170℃，時間：3分鐘，壓力：2~3MPa之條件接著後，剝離剝離性基材，而製作出評價用基板。
印刷配線基板係使用在聚醯亞胺膜所構成之底層121上形成有如圖3所示電路圖案122者。電路圖案122係藉由線寬度為0.1mm、高度為12μm之銅箔而形成。在底層121上以覆蓋電路圖案122之方式設置厚度為25μm之接著劑層、及厚度為12.5μm之聚醯亞胺膜所構成之覆蓋膜(絕緣膜)。
<表面狀態之評價>
使用共焦顯微鏡(Lasertec公司製OPTELICS HYBRID，對物透鏡20倍)，根據JIS B 0601：2001設定表面任意五處。其後使用資料解析軟體(LMeye7)進行傾斜修正，測量了Rku、Rmr及Ra。又，根據ISO25178測量了表面任意五處。其後，使用資料解析軟體(LMeye7)進行表面之傾斜修正，測量了Sku、Vmr、Sa、
Sv及Sz。又，S過濾器之截止波長為0.0025mm，L過濾器之截止波長為0.8mm。又，各數值為五處測量值之平均值。
<隱蔽性之評價>
將評價用基板置於平坦桌面上，在對屏蔽配線基板表面之照度為500Lux之環境下，以距離評價用基板30cm之高度且以45度之角度，看看從隱蔽層側靠視覺可否識別出電路圖案。將無法靠視覺識別電路圖案之情形評價為隱蔽性良好(○)，將可靠視覺識別電路圖案之情形評價為隱蔽性不良(×)。
(實施例1)
藉由使用剝離性基材1形成之隱蔽層而製作貼黏膜，而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為2.6，Sku為2.0。橫斷程度為20%時之Rmr為7.7%，以分離核心部與突出波峰部之負載面積率為10%且以分離核心部與突出波谷部之負載面積率80%時，Vmc為2.8mL/m2。又，Ra、Sa、Sv及Sz分別為1.8μm、2.3μm、-10.2μm及18.3μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。
(實施例2)
除了使用剝離性基材2以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為2.9，Sku為2.1。Rmr為5.6%，Vmc為2.9mL/m2。又，Ra、Sa、Sv及Sz分別為1.8μm、2.5μm、-12.9μm及23.6μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。
(實施例3)
除了使用剝離性基材3以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為3.0，Sku為2.3。Rmr為5.8%，Vmc為2.5mL/m2。又，Ra、
Sa、Sv及Sz分別為1.0μm、2.0μm、-9.8μm及18.2μm。目視檢查時，無法靠視覺識別電路圖案，隱蔽性非常良好。
(比較例1)
除了使用剝離性基材4以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為2.3，Sku為1.8。Rmr為8.8%，Vmc為3.5mL/m2。又，Ra、Sa、Sv及Sz分別為2.0μm、2.7μm、-11.5μm及18.8μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。
(比較例2)
除了使用剝離性基材5以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為2.3，Sku為1.8。Rmr為10.1%，Vmc為3.5mL/m2。又，Ra、Sa、Sv及Sz分別為1.7μm、2.7μm、-10.9μm及18.4μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。
(比較例3)
除了使用剝離性基材6以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為2.4，Sku為1.8。Rmr為9.5%，Vmc為3.2mL/m2。又，Ra、Sa、Sv及Sz分別為1.9μm、2.6μm、-10.0μm及16.9μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。
(比較例4)
除了使用剝離性基材7以外，以與實施例1相同方式而得評價用基板。去除剝離性基材後測得的評價用基板之隱蔽層表面的Rku為3.1，Sku為4.2。Rmr為5.1%，Vmc為1.7mL/m2。又，Ra、Sa、Sv及Sz分別為0.7μm、1.5μm、-11.1μm及16.2μm。目視檢查時，可靠視覺識別電路圖案，隱蔽性不良。
表2係顯示各實施例及比較例之結果。
本發明之印刷配線基板用貼黏膜之電路圖案隱蔽性高，可利用作為隱蔽電路圖案之貼黏膜、或電磁波屏蔽膜等。
101:貼黏膜
102:印刷配線基板
111:接著劑層
112:隱蔽層
121:底層
122:電路圖案
123:接著劑層
124:絕緣膜
Claims (4)
- 一種印刷配線基板用貼黏膜，係具備電路圖案隱蔽層、及與前述電路圖案隱蔽層積層之接著劑層，前述電路圖案隱蔽層中，與前述接著劑層相反側之面的Rku為2.5以上3.0以下，且與前述接著劑層相反側之面在橫斷程度為20%時之Rmr為5.3%以上8.5%以下。
- 一種印刷配線基板用貼黏膜，係具備電路圖案隱蔽層、及與前述電路圖案隱蔽層積層之接著劑層，前述電路圖案隱蔽層中，與前述接著劑層相反側之面的Sku為1.8以上4.0以下，且與前述接著劑層相反側之面中，以分離核心部與突出波峰部之負載面積率為10%且以分離核心部與突出波谷部之負載面積率為80%時，Vmc為2.0mL/m2以上3.0mL/m2以下。
- 一種電磁波屏蔽膜，係具備如請求項1或2所記載之印刷配線基板用貼黏膜，前述接著劑層為導電性接著劑層。
- 如請求項3所記載之電磁波屏蔽膜，其中於前述電路圖案隱蔽層與前述接著劑層之間進一步具備屏蔽層。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-129321 | 2018-07-06 | ||
| JP2018129321 | 2018-07-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202019250A TW202019250A (zh) | 2020-05-16 |
| TWI780343B true TWI780343B (zh) | 2022-10-11 |
Family
ID=69059435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108123825A TWI780343B (zh) | 2018-07-06 | 2019-07-05 | 印刷配線基板用貼黏膜及電磁波屏蔽膜 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11937365B2 (zh) |
| JP (1) | JP6722370B2 (zh) |
| KR (1) | KR102479873B1 (zh) |
| CN (1) | CN112586096A (zh) |
| TW (1) | TWI780343B (zh) |
| WO (1) | WO2020009230A1 (zh) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI740515B (zh) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | 液晶高分子膜及包含其之積層板 |
| WO2021131439A1 (ja) * | 2019-12-24 | 2021-07-01 | 住友ベークライト株式会社 | 電磁波シールド性筐体、インバータ部品、エアコン部品及び自動車部品 |
| TWI829973B (zh) * | 2020-02-25 | 2024-01-21 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜 |
| WO2023145952A1 (ja) * | 2022-01-31 | 2023-08-03 | 三菱ケミカル株式会社 | 積層ポリエステルフィルム |
| WO2023145938A1 (ja) * | 2022-01-31 | 2023-08-03 | 三菱ケミカル株式会社 | 積層ポリエステルフィルム |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201422066A (zh) * | 2012-11-28 | 2014-06-01 | Tatsuta Densen Kk | 遮罩膜、遮罩印刷佈線板及遮罩印刷佈線板的製造方法 |
| WO2017110404A1 (ja) * | 2015-12-25 | 2017-06-29 | 三井金属鉱業株式会社 | キャリア付銅箔、樹脂付銅箔、及びプリント配線板の製造方法 |
| JP2018069459A (ja) * | 2016-10-24 | 2018-05-10 | フタムラ化学株式会社 | 二軸延伸つや消し調ポリプロピレン系フィルム及びこれを用いた印刷フィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102791480B (zh) | 2010-03-12 | 2015-06-17 | 积水化学工业株式会社 | 脱模膜和脱模膜的制造方法 |
| JP2014078574A (ja) * | 2012-10-10 | 2014-05-01 | Toyo Ink Sc Holdings Co Ltd | 電磁波シールド性カバーレイフィルム、フレキシブルプリント配線板の製造方法、及びフレキシブルプリント配線板 |
| JP2014185247A (ja) | 2013-03-25 | 2014-10-02 | Mitsubishi Plastics Inc | 難燃性黒色ポリエステルフィルム |
| JP2015052025A (ja) * | 2013-09-05 | 2015-03-19 | 三菱樹脂株式会社 | 樹脂フィルムおよび化粧シート |
| JP7356209B2 (ja) * | 2017-03-31 | 2023-10-04 | Ｊｘ金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6426865B1 (ja) | 2018-02-20 | 2018-11-21 | タツタ電線株式会社 | 電磁波シールドフィルム |
-
2019
- 2019-07-05 KR KR1020217003746A patent/KR102479873B1/ko active IP Right Grant
- 2019-07-05 JP JP2020509529A patent/JP6722370B2/ja active Active
- 2019-07-05 TW TW108123825A patent/TWI780343B/zh active
- 2019-07-05 US US17/256,931 patent/US11937365B2/en active Active
- 2019-07-05 WO PCT/JP2019/026844 patent/WO2020009230A1/ja active Application Filing
- 2019-07-05 CN CN201980057276.4A patent/CN112586096A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201422066A (zh) * | 2012-11-28 | 2014-06-01 | Tatsuta Densen Kk | 遮罩膜、遮罩印刷佈線板及遮罩印刷佈線板的製造方法 |
| WO2017110404A1 (ja) * | 2015-12-25 | 2017-06-29 | 三井金属鉱業株式会社 | キャリア付銅箔、樹脂付銅箔、及びプリント配線板の製造方法 |
| JP2018069459A (ja) * | 2016-10-24 | 2018-05-10 | フタムラ化学株式会社 | 二軸延伸つや消し調ポリプロピレン系フィルム及びこれを用いた印刷フィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2020009230A1 (ja) | 2020-07-16 |
| CN112586096A (zh) | 2021-03-30 |
| JP6722370B2 (ja) | 2020-07-15 |
| US11937365B2 (en) | 2024-03-19 |
| WO2020009230A1 (ja) | 2020-01-09 |
| KR20210028689A (ko) | 2021-03-12 |
| KR102479873B1 (ko) | 2022-12-20 |
| US20210289615A1 (en) | 2021-09-16 |
| TW202019250A (zh) | 2020-05-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI780343B (zh) | 印刷配線基板用貼黏膜及電磁波屏蔽膜 | |
| KR101956091B1 (ko) | 전자파 차폐 필름 | |
| CN110022640B (zh) | 电磁波屏蔽膜 | |
| KR102394462B1 (ko) | 전자파 실드 필름 | |
| TWI768219B (zh) | 印刷配線基板用貼黏膜 | |
| CN110027268B (zh) | 电磁波屏蔽膜 | |
| TWI728302B (zh) | 電磁波屏蔽膜 | |
| WO2020090727A1 (ja) | 電磁波シールドフィルム、シールドプリント配線板の製造方法、及び、シールドプリント配線板 | |
| TW202130500A (zh) | 形狀轉印薄膜 | |
| CN110305603B (zh) | 导电性胶粘剂层 | |
| CN112586103A (zh) | 电磁波屏蔽膜、屏蔽印制线路板的制造方法及屏蔽印制线路板 | |
| JP6856152B1 (ja) | 成形フィルム、成形体およびその製造方法 | |
| CN115024029A (zh) | 电磁波屏蔽膜 | |
| JP2022021641A (ja) | 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板 | |
| JP2021048313A (ja) | 電磁波シールドフィルムの製造方法、電磁波シールドフィルム及び回路基板 | |
| WO2024004991A1 (ja) | 電磁波シールドフィルム | |
| JP2021044342A (ja) | 電磁波シールドフィルムの製造方法、及び電磁波シールドフィルム付きプリント配線板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |