TWI733873B - 用於表面檢測之系統、方法及設備 - Google Patents

用於表面檢測之系統、方法及設備 Download PDF

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Publication number
TWI733873B
TWI733873B TW106126378A TW106126378A TWI733873B TW I733873 B TWI733873 B TW I733873B TW 106126378 A TW106126378 A TW 106126378A TW 106126378 A TW106126378 A TW 106126378A TW I733873 B TWI733873 B TW I733873B
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Taiwan
Prior art keywords
measurement point
leading
light
lpm
illumination
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TW106126378A
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English (en)
Chinese (zh)
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TW201807765A (zh
Inventor
史帝夫 （宜豐） 崔
春聖 黃
春翰 王
克里斯堤安 渥特斯
布萊特 懷特席德
阿那托利 Ｇ 羅曼諾夫斯基
傳勇 黃
唐諾 渥倫 派提波
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美商克萊譚克公司
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Publication of TW201807765A publication Critical patent/TW201807765A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
TW106126378A 2016-08-05 2017-08-04 用於表面檢測之系統、方法及設備 TWI733873B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,330 2016-08-05
US15/230,330 US10324045B2 (en) 2016-08-05 2016-08-05 Surface defect inspection with large particle monitoring and laser power control

Publications (2)

Publication Number Publication Date
TW201807765A TW201807765A (zh) 2018-03-01
TWI733873B true TWI733873B (zh) 2021-07-21

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TW106126378A TWI733873B (zh) 2016-08-05 2017-08-04 用於表面檢測之系統、方法及設備

Country Status (8)

Country Link
US (1) US10324045B2 (https=)
JP (1) JP6840224B2 (https=)
KR (1) KR102228505B1 (https=)
CN (1) CN109564884B (https=)
IL (1) IL264450B (https=)
SG (1) SG11201900803YA (https=)
TW (1) TWI733873B (https=)
WO (1) WO2018027010A1 (https=)

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US11374375B2 (en) 2019-08-14 2022-06-28 Kla Corporation Laser closed power loop with an acousto-optic modulator for power modulation
CN112540082A (zh) * 2019-09-20 2021-03-23 深圳中科飞测科技股份有限公司 检测系统及检测方法
US11094501B2 (en) * 2019-11-19 2021-08-17 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Secondary charged particle imaging system
US12146840B2 (en) 2020-06-09 2024-11-19 Hitachi High-Tech Corporation Defect inspection device
EP3923078A1 (en) * 2020-06-10 2021-12-15 ASML Netherlands B.V. Heigth measurement method and height measurement system
US12345658B2 (en) * 2020-09-24 2025-07-01 Kla Corporation Large-particle monitoring with laser power control for defect inspection
CN115248531A (zh) * 2021-04-26 2022-10-28 上海微电子装备（集团）股份有限公司 颗粒度检测装置及其检测方法、光刻机
CN118483249B (zh) * 2024-05-07 2024-12-20 无锡卓海科技股份有限公司 一种晶圆检测装置及检测方法
US20260016405A1 (en) * 2025-09-17 2026-01-15 Jiangsu Sambon Technology Co., Ltd. Method for quality inspection of etching paste material based on spectral response difference

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Also Published As

Publication number Publication date
KR20190027390A (ko) 2019-03-14
JP2019525180A (ja) 2019-09-05
IL264450A (en) 2019-02-28
CN109564884A (zh) 2019-04-02
KR102228505B1 (ko) 2021-03-15
WO2018027010A1 (en) 2018-02-08
IL264450B (en) 2021-09-30
JP6840224B2 (ja) 2021-03-10
SG11201900803YA (en) 2019-02-27
US10324045B2 (en) 2019-06-18
US20180038803A1 (en) 2018-02-08
TW201807765A (zh) 2018-03-01
CN109564884B (zh) 2020-08-18

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