JP6840224B2 - 大粒子監視及びレーザパワー制御を伴う表面欠陥検査 - Google Patents

大粒子監視及びレーザパワー制御を伴う表面欠陥検査 Download PDF

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Publication number
JP6840224B2
JP6840224B2 JP2019506157A JP2019506157A JP6840224B2 JP 6840224 B2 JP6840224 B2 JP 6840224B2 JP 2019506157 A JP2019506157 A JP 2019506157A JP 2019506157 A JP2019506157 A JP 2019506157A JP 6840224 B2 JP6840224 B2 JP 6840224B2
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Prior art keywords
measurement spot
leading
illumination
scattered light
lpm
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JP2019506157A
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Japanese (ja)
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JP2019525180A (ja
JP2019525180A5 (https=
Inventor
スティーヴ イーフェン クイ
スティーヴ イーフェン クイ
ジェイ フアン
ジェイ フアン
チュンハイ ワン
チュンハイ ワン
クリスチャン ウォルターズ
クリスチャン ウォルターズ
ブレット ホワイトサイド
ブレット ホワイトサイド
アナトリー ロマノフスキー
アナトリー ロマノフスキー
チュアンヨン フアン
チュアンヨン フアン
ドナルド ペティボーン
ドナルド ペティボーン
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KLA Corp
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KLA Corp
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Publication of JP2019525180A5 publication Critical patent/JP2019525180A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
JP2019506157A 2016-08-05 2017-08-03 大粒子監視及びレーザパワー制御を伴う表面欠陥検査 Active JP6840224B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/230,330 2016-08-05
US15/230,330 US10324045B2 (en) 2016-08-05 2016-08-05 Surface defect inspection with large particle monitoring and laser power control
PCT/US2017/045261 WO2018027010A1 (en) 2016-08-05 2017-08-03 Surface defect inspection with large particle monitoring and laser power control

Publications (3)

Publication Number Publication Date
JP2019525180A JP2019525180A (ja) 2019-09-05
JP2019525180A5 JP2019525180A5 (https=) 2020-09-10
JP6840224B2 true JP6840224B2 (ja) 2021-03-10

Family

ID=61069145

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JP2019506157A Active JP6840224B2 (ja) 2016-08-05 2017-08-03 大粒子監視及びレーザパワー制御を伴う表面欠陥検査

Country Status (8)

Country Link
US (1) US10324045B2 (https=)
JP (1) JP6840224B2 (https=)
KR (1) KR102228505B1 (https=)
CN (1) CN109564884B (https=)
IL (1) IL264450B (https=)
SG (1) SG11201900803YA (https=)
TW (1) TWI733873B (https=)
WO (1) WO2018027010A1 (https=)

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CN115248531A (zh) * 2021-04-26 2022-10-28 上海微电子装备（集团）股份有限公司 颗粒度检测装置及其检测方法、光刻机
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Also Published As

Publication number Publication date
KR20190027390A (ko) 2019-03-14
JP2019525180A (ja) 2019-09-05
IL264450A (en) 2019-02-28
TWI733873B (zh) 2021-07-21
CN109564884A (zh) 2019-04-02
KR102228505B1 (ko) 2021-03-15
WO2018027010A1 (en) 2018-02-08
IL264450B (en) 2021-09-30
SG11201900803YA (en) 2019-02-27
US10324045B2 (en) 2019-06-18
US20180038803A1 (en) 2018-02-08
TW201807765A (zh) 2018-03-01
CN109564884B (zh) 2020-08-18

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