IL264450B - Surface defect inspection with large particle monitoring and laser power control - Google Patents

Surface defect inspection with large particle monitoring and laser power control

Info

Publication number
IL264450B
IL264450B IL264450A IL26445019A IL264450B IL 264450 B IL264450 B IL 264450B IL 264450 A IL264450 A IL 264450A IL 26445019 A IL26445019 A IL 26445019A IL 264450 B IL264450 B IL 264450B
Authority
IL
Israel
Prior art keywords
inspection
power control
laser power
large particle
surface defects
Prior art date
Application number
IL264450A
Other languages
English (en)
Hebrew (he)
Other versions
IL264450A (en
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL264450A publication Critical patent/IL264450A/en
Publication of IL264450B publication Critical patent/IL264450B/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
IL264450A 2016-08-05 2019-01-24 Surface defect inspection with large particle monitoring and laser power control IL264450B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/230,330 US10324045B2 (en) 2016-08-05 2016-08-05 Surface defect inspection with large particle monitoring and laser power control
PCT/US2017/045261 WO2018027010A1 (en) 2016-08-05 2017-08-03 Surface defect inspection with large particle monitoring and laser power control

Publications (2)

Publication Number Publication Date
IL264450A IL264450A (en) 2019-02-28
IL264450B true IL264450B (en) 2021-09-30

Family

ID=61069145

Family Applications (1)

Application Number Title Priority Date Filing Date
IL264450A IL264450B (en) 2016-08-05 2019-01-24 Surface defect inspection with large particle monitoring and laser power control

Country Status (8)

Country Link
US (1) US10324045B2 (https=)
JP (1) JP6840224B2 (https=)
KR (1) KR102228505B1 (https=)
CN (1) CN109564884B (https=)
IL (1) IL264450B (https=)
SG (1) SG11201900803YA (https=)
TW (1) TWI733873B (https=)
WO (1) WO2018027010A1 (https=)

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US11094501B2 (en) * 2019-11-19 2021-08-17 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Secondary charged particle imaging system
US12146840B2 (en) 2020-06-09 2024-11-19 Hitachi High-Tech Corporation Defect inspection device
EP3923078A1 (en) * 2020-06-10 2021-12-15 ASML Netherlands B.V. Heigth measurement method and height measurement system
US12345658B2 (en) * 2020-09-24 2025-07-01 Kla Corporation Large-particle monitoring with laser power control for defect inspection
CN115248531A (zh) * 2021-04-26 2022-10-28 上海微电子装备（集团）股份有限公司 颗粒度检测装置及其检测方法、光刻机
TWI814412B (zh) * 2022-05-31 2023-09-01 合盈光電科技股份有限公司 多方向物件失效檢查系統及其方法
CN118483249B (zh) * 2024-05-07 2024-12-20 无锡卓海科技股份有限公司 一种晶圆检测装置及检测方法
US20260016405A1 (en) * 2025-09-17 2026-01-15 Jiangsu Sambon Technology Co., Ltd. Method for quality inspection of etching paste material based on spectral response difference

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Also Published As

Publication number Publication date
KR20190027390A (ko) 2019-03-14
JP2019525180A (ja) 2019-09-05
IL264450A (en) 2019-02-28
TWI733873B (zh) 2021-07-21
CN109564884A (zh) 2019-04-02
KR102228505B1 (ko) 2021-03-15
WO2018027010A1 (en) 2018-02-08
JP6840224B2 (ja) 2021-03-10
SG11201900803YA (en) 2019-02-27
US10324045B2 (en) 2019-06-18
US20180038803A1 (en) 2018-02-08
TW201807765A (zh) 2018-03-01
CN109564884B (zh) 2020-08-18

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