TWI726240B - 罩幕板及其製備方法 - Google Patents

罩幕板及其製備方法 Download PDF

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Publication number
TWI726240B
TWI726240B TW107131963A TW107131963A TWI726240B TW I726240 B TWI726240 B TW I726240B TW 107131963 A TW107131963 A TW 107131963A TW 107131963 A TW107131963 A TW 107131963A TW I726240 B TWI726240 B TW I726240B
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TW
Taiwan
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area
mask
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auxiliary pixel
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TW107131963A
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English (en)
Chinese (zh)
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TW201843864A (zh
Inventor
李偉麗
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大陸商昆山國顯光電有限公司
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
TW107131963A 2018-03-30 2018-09-12 罩幕板及其製備方法 TWI726240B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810277643.9 2018-03-30
CN201810277643.9A CN108456846A (zh) 2018-03-30 2018-03-30 掩膜板及其制备方法
??201810277643.9 2018-03-30

Publications (2)

Publication Number Publication Date
TW201843864A TW201843864A (zh) 2018-12-16
TWI726240B true TWI726240B (zh) 2021-05-01

Family

ID=63237826

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107131963A TWI726240B (zh) 2018-03-30 2018-09-12 罩幕板及其製備方法

Country Status (7)

Country Link
US (1) US20190345599A1 (enExample)
EP (1) EP3640365A4 (enExample)
JP (1) JP6977140B2 (enExample)
KR (1) KR20200028483A (enExample)
CN (2) CN116024523A (enExample)
TW (1) TWI726240B (enExample)
WO (1) WO2019184205A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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CN109487206B (zh) * 2018-12-11 2020-08-11 武汉华星光电半导体显示技术有限公司 掩膜版及采用该掩膜版的掩膜装置
CN110760790A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN110760791A (zh) * 2019-02-28 2020-02-07 云谷（固安）科技有限公司 掩膜板及掩膜组件
CN109913805B (zh) * 2019-03-27 2021-01-26 京东方科技集团股份有限公司 一种掩膜版
JP7749925B2 (ja) * 2020-03-13 2025-10-07 大日本印刷株式会社 有機デバイスの製造装置の蒸着室の評価方法
KR102836687B1 (ko) * 2020-05-11 2025-07-22 삼성디스플레이 주식회사 마스크 검사 장치 및 이를 이용한 마스크 검사 방법
CN116657099A (zh) * 2023-05-31 2023-08-29 京东方科技集团股份有限公司 遮挡用金属掩膜板、张网组件、掩膜板以及显示面板

Citations (3)

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US20150007768A1 (en) * 2013-07-08 2015-01-08 Samsung Display Co., Ltd. Mask for deposition
CN107435131A (zh) * 2017-09-29 2017-12-05 上海天马微电子有限公司 掩膜装置、蒸镀设备以及掩膜装置制备方法
TW201806146A (zh) * 2016-08-04 2018-02-16 鴻海精密工業股份有限公司 用於沉積oled顯示面板的掩膜

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JP4608874B2 (ja) * 2003-12-02 2011-01-12 ソニー株式会社 蒸着マスクおよびその製造方法
JP4915312B2 (ja) * 2007-08-08 2012-04-11 ソニー株式会社 蒸着用マスクの製造方法
CN202530150U (zh) * 2012-01-16 2012-11-14 昆山允升吉光电科技有限公司 蒸镀掩模板
CN103014618A (zh) * 2012-12-25 2013-04-03 唐军 蒸镀用掩模板及其制造方法
US20160043319A1 (en) * 2013-04-22 2016-02-11 Applied Materials, Inc. Actively-aligned fine metal mask
KR102106331B1 (ko) * 2013-07-08 2020-05-06 삼성디스플레이 주식회사 마스크 조립체 및 이의 제조 방법
CN104593721B (zh) * 2013-10-30 2017-08-08 昆山国显光电有限公司 一种蒸镀用精密金属掩膜板的张网方法及其获得的掩膜板
KR102237428B1 (ko) * 2014-02-14 2021-04-08 삼성디스플레이 주식회사 마스크 프레임 조립체 및 그 제조방법
US10022748B2 (en) * 2014-09-12 2018-07-17 Toshiba Memory Corporation Stencil mask, stencil mask manufacturing method, and imprinting method
CN104630705A (zh) * 2015-03-13 2015-05-20 合肥鑫晟光电科技有限公司 一种掩膜板及其制备方法
KR102541449B1 (ko) * 2015-12-22 2023-06-09 삼성디스플레이 주식회사 박막 증착용 마스크 어셈블리
JP6465075B2 (ja) * 2016-05-26 2019-02-06 大日本印刷株式会社 蒸着マスク、フレーム付き蒸着マスク、有機半導体素子の製造方法、及びに有機ｅｌディスプレイの製造方法
KR102366019B1 (ko) * 2016-06-28 2022-02-23 다이니폰 인사츠 가부시키가이샤 증착 마스크, 유기 반도체 소자의 제조 방법 및 유기 el 디스플레이의 제조 방법
CN205844737U (zh) * 2016-07-29 2016-12-28 昆山国显光电有限公司 掩膜板
CN206512267U (zh) * 2016-10-28 2017-09-22 京东方科技集团股份有限公司 一种掩模片及掩模板
CN106502044B (zh) * 2017-01-10 2020-01-24 昆山国显光电有限公司 掩膜板及其制造方法
JP6304412B2 (ja) * 2017-02-06 2018-04-04 大日本印刷株式会社 金属フレーム付き蒸着マスクの製造方法、有機半導体素子の製造方法、パターンの形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150007768A1 (en) * 2013-07-08 2015-01-08 Samsung Display Co., Ltd. Mask for deposition
TW201806146A (zh) * 2016-08-04 2018-02-16 鴻海精密工業股份有限公司 用於沉積oled顯示面板的掩膜
CN107435131A (zh) * 2017-09-29 2017-12-05 上海天马微电子有限公司 掩膜装置、蒸镀设备以及掩膜装置制备方法

Also Published As

Publication number Publication date
US20190345599A1 (en) 2019-11-14
CN108456846A (zh) 2018-08-28
EP3640365A4 (en) 2020-08-19
KR20200028483A (ko) 2020-03-16
CN116024523A (zh) 2023-04-28
TW201843864A (zh) 2018-12-16
JP6977140B2 (ja) 2021-12-08
WO2019184205A1 (zh) 2019-10-03
JP2020526670A (ja) 2020-08-31
EP3640365A1 (en) 2020-04-22

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