TWI711104B - 加熱器區塊及利用所述加熱器區塊的基板熱處理裝置 - Google Patents

加熱器區塊及利用所述加熱器區塊的基板熱處理裝置 Download PDF

Info

Publication number
TWI711104B
TWI711104B TW104117449A TW104117449A TWI711104B TW I711104 B TWI711104 B TW I711104B TW 104117449 A TW104117449 A TW 104117449A TW 104117449 A TW104117449 A TW 104117449A TW I711104 B TWI711104 B TW I711104B
Authority
TW
Taiwan
Prior art keywords
bulbs
substrate
rectangular substrate
parallel
short side
Prior art date
Application number
TW104117449A
Other languages
English (en)
Chinese (zh)
Other versions
TW201545260A (zh
Inventor
李成龍
池尙炫
尹斗永
金泰俊
Original Assignee
南韓商Ａｐ系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商Ａｐ系統股份有限公司 filed Critical 南韓商Ａｐ系統股份有限公司
Publication of TW201545260A publication Critical patent/TW201545260A/zh
Application granted granted Critical
Publication of TWI711104B publication Critical patent/TWI711104B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/0033—Heating devices using lamps
    • H05B3/0038—Heating devices using lamps for industrial applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Control Of Resistance Heating (AREA)
  • Furnace Details (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Resistance Heating (AREA)
TW104117449A 2014-05-29 2015-05-29 加熱器區塊及利用所述加熱器區塊的基板熱處理裝置 TWI711104B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2014-0065147 2014-05-29
KR1020140065147A KR101809141B1 (ko) 2014-05-29 2014-05-29 히터 블록 및 기판 열처리 장치

Publications (2)

Publication Number Publication Date
TW201545260A TW201545260A (zh) 2015-12-01
TWI711104B true TWI711104B (zh) 2020-11-21

Family

ID=54725455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104117449A TWI711104B (zh) 2014-05-29 2015-05-29 加熱器區塊及利用所述加熱器區塊的基板熱處理裝置

Country Status (4)

Country Link
JP (1) JP6545532B2 (ko)
KR (1) KR101809141B1 (ko)
CN (1) CN105140153B (ko)
TW (1) TWI711104B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106353909A (zh) * 2016-11-28 2017-01-25 深圳市华星光电技术有限公司 加热板和烘烤装置
KR102161165B1 (ko) 2018-05-18 2020-09-29 에이피시스템 주식회사 히터 블록, 열 처리 장치 및 방법
WO2020260742A1 (en) * 2019-06-25 2020-12-30 Picosun Oy Substrate backside protection
WO2023206463A1 (zh) * 2022-04-29 2023-11-02 京东方科技集团股份有限公司 阵列基板和显示面板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100496170C (zh) * 1999-11-30 2009-06-03 松下电器产业株式会社 红外线灯、加热装置和生产红外线灯的方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2940047B2 (ja) * 1989-02-14 1999-08-25 株式会社日本自動車部品総合研究所 熱処理装置および熱処理方法
JPH10223549A (ja) * 1997-02-07 1998-08-21 Citizen Watch Co Ltd ランプアニール装置
JP2000068222A (ja) 1998-08-21 2000-03-03 Dainippon Screen Mfg Co Ltd 基板熱処理装置
JP4146558B2 (ja) 1998-12-07 2008-09-10 大日本スクリーン製造株式会社 基板熱処理方法および基板熱処理装置
JP3996717B2 (ja) 1998-12-22 2007-10-24 大日本スクリーン製造株式会社 基板熱処理装置
JP3659863B2 (ja) * 2000-04-06 2005-06-15 大日本スクリーン製造株式会社 熱処理装置
FR2815395B1 (fr) * 2000-10-13 2004-06-18 Joint Industrial Processors For Electronics Dispositif de chauffage rapide et uniforme d'un substrat par rayonnement infrarouge
JP2002289547A (ja) * 2001-03-28 2002-10-04 Dainippon Screen Mfg Co Ltd 熱処理装置
JP4429609B2 (ja) 2002-06-25 2010-03-10 大日本スクリーン製造株式会社 熱処理装置
US6818864B2 (en) * 2002-08-09 2004-11-16 Asm America, Inc. LED heat lamp arrays for CVD heating
JP2005072045A (ja) * 2003-08-26 2005-03-17 Toshiba Corp 半導体装置およびその製造方法
KR20050040591A (ko) * 2003-10-29 2005-05-03 동부아남반도체 주식회사 반도체 급속열처리 장치 및 급속열처리 방법
JP4024764B2 (ja) * 2004-01-20 2007-12-19 松下電器産業株式会社 光照射熱処理方法および光照射熱処理装置
JP4757217B2 (ja) * 2007-03-09 2011-08-24 東京エレクトロン株式会社 基板処理装置
CN103515177A (zh) * 2012-06-20 2014-01-15 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室、基片加工设备及其温度控制方法
CN102913786A (zh) * 2012-09-24 2013-02-06 苏州晶品光电科技有限公司 一种近全方位发光的led片式光源
JP2015088749A (ja) * 2013-10-28 2015-05-07 エーピー システムズ インコーポレイテッド 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100496170C (zh) * 1999-11-30 2009-06-03 松下电器产业株式会社 红外线灯、加热装置和生产红外线灯的方法

Also Published As

Publication number Publication date
KR101809141B1 (ko) 2018-01-19
KR20150138496A (ko) 2015-12-10
JP6545532B2 (ja) 2019-07-17
CN105140153A (zh) 2015-12-09
TW201545260A (zh) 2015-12-01
JP2015226069A (ja) 2015-12-14
CN105140153B (zh) 2019-09-17

Similar Documents

Publication Publication Date Title
US9076828B2 (en) Edge ring for a thermal processing chamber
TWI711104B (zh) 加熱器區塊及利用所述加熱器區塊的基板熱處理裝置
TWI641714B (zh) Heating module, physical vapor deposition chamber, and deposition equipment
US4101759A (en) Semiconductor body heater
JP6258334B2 (ja) 改善されたエッジリングリップ
CN106663630A (zh) 用于校准基座的设备及方法
KR20150074073A (ko) 급속 열 처리를 위한 최소 접촉 에지 링
JP6873696B2 (ja) 強化されたプロセスの均一性および低減された基板の滑りのためのサセプタ
KR101334817B1 (ko) 히터블록 및 기판처리장치
US20180254206A1 (en) Rotor cover
TW515117B (en) Method of manufacturing semiconductor wafer
TW201946182A (zh) 基板處理裝置
JP4467730B2 (ja) 基板加熱装置
US20140265101A1 (en) Minimal contact edge ring for rapid thermal processing
CN103426752B (zh) 加热块和衬底处理设备
JP2005252042A (ja) 基板保持装置
KR101496674B1 (ko) 반도체 제조 장치 및 방법
JP2008304625A (ja) 液晶ディスプレイ部品の製造方法及び製造装置
JP2015065411A (ja) 熱処理炉及び熱処理方法
TW201822312A (zh) 用於燈泡加熱組件的散光器
JP2010217315A (ja) 液晶ディスプレイ部品の製造方法及び製造装置

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees