TWI705524B - 半導體製造裝置、半導體裝置之製造方法及夾頭 - Google Patents
半導體製造裝置、半導體裝置之製造方法及夾頭 Download PDFInfo
- Publication number
- TWI705524B TWI705524B TW107129898A TW107129898A TWI705524B TW I705524 B TWI705524 B TW I705524B TW 107129898 A TW107129898 A TW 107129898A TW 107129898 A TW107129898 A TW 107129898A TW I705524 B TWI705524 B TW I705524B
- Authority
- TW
- Taiwan
- Prior art keywords
- block
- chuck
- die
- push
- dicing tape
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims description 44
- 230000002093 peripheral effect Effects 0.000 claims description 35
- 239000013078 crystal Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 12
- 230000004048 modification Effects 0.000 description 47
- 238000012986 modification Methods 0.000 description 47
- 238000010586 diagram Methods 0.000 description 24
- 238000001179 sorption measurement Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 9
- 238000005452 bending Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241000309551 Arthraxon hispidus Species 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-178987 | 2017-09-19 | ||
JP2017178987A JP6967411B2 (ja) | 2017-09-19 | 2017-09-19 | 半導体製造装置、半導体装置の製造方法およびコレット |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201923963A TW201923963A (zh) | 2019-06-16 |
TWI705524B true TWI705524B (zh) | 2020-09-21 |
Family
ID=65771255
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107129898A TWI705524B (zh) | 2017-09-19 | 2018-08-28 | 半導體製造裝置、半導體裝置之製造方法及夾頭 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6967411B2 (ja) |
KR (1) | KR102101760B1 (ja) |
CN (1) | CN109524313B (ja) |
TW (1) | TWI705524B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7377654B2 (ja) * | 2019-09-17 | 2023-11-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置、剥離ユニット、コレットおよび半導体装置の製造方法 |
JP7343402B2 (ja) * | 2020-01-08 | 2023-09-12 | ファスフォードテクノロジ株式会社 | ダイボンディング装置、半導体装置の製造方法およびエキスパンド装置 |
JP7412219B2 (ja) * | 2020-02-25 | 2024-01-12 | ファスフォードテクノロジ株式会社 | ダイボンディング装置、半導体装置の製造方法および剥離装置 |
WO2022123645A1 (ja) * | 2020-12-08 | 2022-06-16 | 株式会社新川 | 半導体ダイのピックアップ装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20080112127A (ko) * | 2007-06-19 | 2008-12-24 | 가부시끼가이샤 르네사스 테크놀로지 | 반도체 집적 회로 장치의 제조 방법 |
TW200919575A (en) * | 2007-10-09 | 2009-05-01 | Hitachi Chemical Co Ltd | Manufacturing method of semiconductor chip having adhesive film, adhesive film for semiconductor used for the manufacturing method and manufacturing method of semiconductor device |
TW201033100A (en) * | 2009-03-05 | 2010-09-16 | Shinkawa Kk | Apparatus and method for picking up semiconductor die |
JP2013065628A (ja) * | 2011-09-15 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ並びにダイピックアップ装置及びダイピックアップ方法 |
TW201724287A (zh) * | 2015-09-30 | 2017-07-01 | 捷進科技有限公司 | 黏晶機及半導體裝置的製造方法 |
Family Cites Families (20)
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JPH11274202A (ja) * | 1998-03-24 | 1999-10-08 | Fuji Xerox Co Ltd | バンプ形成装置およびバンプ形成に使用されるチップトレイ |
JP3848606B2 (ja) * | 2002-08-26 | 2006-11-22 | 日東電工株式会社 | コレットおよびそれを用いてチップ部品をピックアップする方法 |
JP4405211B2 (ja) * | 2003-09-08 | 2010-01-27 | パナソニック株式会社 | 半導体チップの剥離装置、剥離方法、及び半導体チップの供給装置 |
JP4574251B2 (ja) * | 2003-09-17 | 2010-11-04 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
CN1802735A (zh) * | 2003-09-18 | 2006-07-12 | Nec机械股份有限公司 | 筒夹、芯片附着装置及芯片的拾取方法 |
JP2005322815A (ja) * | 2004-05-11 | 2005-11-17 | Matsushita Electric Ind Co Ltd | 半導体製造装置および半導体装置の製造方法 |
JP4945339B2 (ja) * | 2007-06-22 | 2012-06-06 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP4864816B2 (ja) * | 2007-06-19 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP2010129588A (ja) * | 2008-11-25 | 2010-06-10 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP5123357B2 (ja) * | 2010-06-17 | 2013-01-23 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ及びピックアップ装置 |
JP5777202B2 (ja) * | 2011-02-14 | 2015-09-09 | 富士機械製造株式会社 | ダイピックアップ装置 |
JP5805411B2 (ja) * | 2011-03-23 | 2015-11-04 | ファスフォードテクノロジ株式会社 | ダイボンダのピックアップ方法およびダイボンダ |
JP2012248778A (ja) * | 2011-05-31 | 2012-12-13 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ及びボンディング方法 |
JP2013165230A (ja) * | 2012-02-13 | 2013-08-22 | Elpida Memory Inc | 吸着コレット及び半導体装置の製造方法 |
JP2013214683A (ja) * | 2012-04-04 | 2013-10-17 | Mitsubishi Electric Corp | 半導体チップのピックアップ装置 |
JP2014179561A (ja) * | 2013-03-15 | 2014-09-25 | Hitachi High-Tech Instruments Co Ltd | ボンディングヘッドとそれを備えたダイボンダ |
JP5647308B2 (ja) * | 2013-08-02 | 2014-12-24 | ルネサスエレクトロニクス株式会社 | 半導体集積回路装置の製造方法 |
JP2015076410A (ja) | 2013-10-04 | 2015-04-20 | 株式会社日立ハイテクインスツルメンツ | ボンディング方法及びダイボンダ |
JP6400938B2 (ja) * | 2014-04-30 | 2018-10-03 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
JP5888455B1 (ja) * | 2015-04-01 | 2016-03-22 | 富士ゼロックス株式会社 | 半導体製造装置および半導体片の製造方法 |
-
2017
- 2017-09-19 JP JP2017178987A patent/JP6967411B2/ja active Active
-
2018
- 2018-08-27 KR KR1020180100186A patent/KR102101760B1/ko active IP Right Grant
- 2018-08-28 TW TW107129898A patent/TWI705524B/zh active
- 2018-09-17 CN CN201811085188.9A patent/CN109524313B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20080112127A (ko) * | 2007-06-19 | 2008-12-24 | 가부시끼가이샤 르네사스 테크놀로지 | 반도체 집적 회로 장치의 제조 방법 |
TW200919575A (en) * | 2007-10-09 | 2009-05-01 | Hitachi Chemical Co Ltd | Manufacturing method of semiconductor chip having adhesive film, adhesive film for semiconductor used for the manufacturing method and manufacturing method of semiconductor device |
TW201033100A (en) * | 2009-03-05 | 2010-09-16 | Shinkawa Kk | Apparatus and method for picking up semiconductor die |
JP2013065628A (ja) * | 2011-09-15 | 2013-04-11 | Hitachi High-Tech Instruments Co Ltd | ダイボンダ並びにダイピックアップ装置及びダイピックアップ方法 |
TW201724287A (zh) * | 2015-09-30 | 2017-07-01 | 捷進科技有限公司 | 黏晶機及半導體裝置的製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP6967411B2 (ja) | 2021-11-17 |
CN109524313A (zh) | 2019-03-26 |
TW201923963A (zh) | 2019-06-16 |
KR102101760B1 (ko) | 2020-04-20 |
CN109524313B (zh) | 2022-12-30 |
KR20190032180A (ko) | 2019-03-27 |
JP2019054209A (ja) | 2019-04-04 |
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