TWI705116B - 保護膜形成用複合片及其製造方法 - Google Patents

保護膜形成用複合片及其製造方法 Download PDF

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Publication number
TWI705116B
TWI705116B TW105117577A TW105117577A TWI705116B TW I705116 B TWI705116 B TW I705116B TW 105117577 A TW105117577 A TW 105117577A TW 105117577 A TW105117577 A TW 105117577A TW I705116 B TWI705116 B TW I705116B
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TW
Taiwan
Prior art keywords
protective film
forming
adhesive layer
film
meth
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TW105117577A
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English (en)
Chinese (zh)
Other versions
TW201706387A (zh
Inventor
米山裕之
佐伯尚哉
小橋力也
Original Assignee
日商琳得科股份有限公司
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Publication of TW201706387A publication Critical patent/TW201706387A/zh
Application granted granted Critical
Publication of TWI705116B publication Critical patent/TWI705116B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Dicing (AREA)
TW105117577A 2015-06-05 2016-06-03 保護膜形成用複合片及其製造方法 TWI705116B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015114714 2015-06-05
JP2015-114714 2015-06-05

Publications (2)

Publication Number Publication Date
TW201706387A TW201706387A (zh) 2017-02-16
TWI705116B true TWI705116B (zh) 2020-09-21

Family

ID=57441268

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105117577A TWI705116B (zh) 2015-06-05 2016-06-03 保護膜形成用複合片及其製造方法
TW109127845A TWI745029B (zh) 2015-06-05 2016-06-03 保護膜形成用複合片以及附有保護膜之半導體晶片的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW109127845A TWI745029B (zh) 2015-06-05 2016-06-03 保護膜形成用複合片以及附有保護膜之半導體晶片的製造方法

Country Status (6)

Country Link
JP (2) JP6630956B2 (ja)
KR (1) KR102509165B1 (ja)
CN (1) CN107615454B (ja)
SG (1) SG11201709978PA (ja)
TW (2) TWI705116B (ja)
WO (1) WO2016195071A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641494B (zh) * 2015-11-04 2018-11-21 日商琳得科股份有限公司 第一保護膜形成用片、第一保護膜形成方法以及半導體晶片的製造方法
CN112154536A (zh) * 2018-09-11 2020-12-29 琳得科株式会社 保护膜形成用膜、保护膜形成用复合片、检查方法及识别方法
JP2021037624A (ja) * 2019-08-30 2021-03-11 リンテック株式会社 保護膜形成用複合シート
JP7312679B2 (ja) * 2019-11-19 2023-07-21 日東電工株式会社 粘着剤付き光学フィルムおよびその製造方法
JP2022092286A (ja) 2020-12-10 2022-06-22 リンテック株式会社 保護膜付きワークの製造方法及び保護膜形成フィルム付きワークの製造方法
US20230107095A1 (en) 2021-10-01 2023-04-06 Nitto Denko Corporation Backgrinding tape
US20230108829A1 (en) 2021-10-01 2023-04-06 Nitto Denko Corporation Pressure-sensitive adhesive composition to be used in pressure-sensitive adhesive tape for semiconductor processing and pressure-sensitive adhesive tape using the pressure-sensitive adhesive composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201505832A (zh) * 2013-03-13 2015-02-16 Lintec Corp 保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY138566A (en) * 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
JP4493643B2 (ja) * 2006-12-06 2010-06-30 日東電工株式会社 再剥離型粘着剤組成物、及び粘着テープ又はシート
EP2151858A2 (en) * 2008-08-04 2010-02-10 Nitto Denko Corporation Dicing die-bonding film
JP5210346B2 (ja) * 2010-04-19 2013-06-12 電気化学工業株式会社 粘着シート及び電子部品の製造方法
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
KR101311647B1 (ko) * 2010-07-07 2013-09-25 후루카와 덴키 고교 가부시키가이샤 웨이퍼 가공용 테이프 및 그것을 이용한 반도체 가공 방법
WO2012018083A1 (ja) * 2010-08-06 2012-02-09 日東電工株式会社 電子部品の製造方法
JP5781302B2 (ja) * 2010-12-28 2015-09-16 日東電工株式会社 放射線硬化型粘着剤組成物及び粘着シート
WO2012165368A1 (ja) * 2011-05-27 2012-12-06 電気化学工業株式会社 粘着シート
WO2014030699A1 (ja) * 2012-08-23 2014-02-27 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
JP5965824B2 (ja) * 2012-11-26 2016-08-10 積水化学工業株式会社 後硬化テープ及び接合部材の接合方法
JP6180139B2 (ja) * 2013-03-11 2017-08-16 リンテック株式会社 保護膜形成用複合シートおよび保護膜形成用フィルム付チップの製造方法
CN105074878B (zh) * 2013-03-27 2017-08-04 琳得科株式会社 保护膜形成用复合片
WO2014157520A1 (ja) * 2013-03-28 2014-10-02 リンテック株式会社 保護膜形成用複合シート、保護膜付きチップ、及び保護膜付きチップの製造方法
WO2014199993A1 (ja) * 2013-06-14 2014-12-18 電気化学工業株式会社 半導体検査用の耐熱性粘着シート
JP5950869B2 (ja) * 2013-06-20 2016-07-13 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープ
CN105431289B (zh) * 2013-08-01 2019-03-12 琳得科株式会社 保护膜形成用复合片

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201505832A (zh) * 2013-03-13 2015-02-16 Lintec Corp 保護膜形成用複合膜片、保護膜形成用複合膜片之製造方法以及具有保護膜之晶片的製造方法

Also Published As

Publication number Publication date
JP2020017758A (ja) 2020-01-30
TWI745029B (zh) 2021-11-01
KR102509165B1 (ko) 2023-03-10
SG11201709978PA (en) 2017-12-28
JPWO2016195071A1 (ja) 2018-03-22
CN107615454B (zh) 2020-12-18
TW202043416A (zh) 2020-12-01
TW201706387A (zh) 2017-02-16
CN107615454A (zh) 2018-01-19
JP6630956B2 (ja) 2020-01-15
JP6924243B2 (ja) 2021-08-25
WO2016195071A1 (ja) 2016-12-08
KR20180016411A (ko) 2018-02-14

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