TWI704642B - 治具及使用治具的加工方法 - Google Patents

治具及使用治具的加工方法 Download PDF

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TWI704642B
TWI704642B TW105140453A TW105140453A TWI704642B TW I704642 B TWI704642 B TW I704642B TW 105140453 A TW105140453 A TW 105140453A TW 105140453 A TW105140453 A TW 105140453A TW I704642 B TWI704642 B TW I704642B
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北原信康
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日商迪思科股份有限公司
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Abstract

可以有效率地將複數的長方形的加工物進行加工。
本發明是輔助複數的長方形的加工物(1)排成一列的治具(2)，由具有複數彼此平行的槽(21)的板狀物(20)所構成，複數的槽(21)的一端(23)在一直線上排成一列，槽(21)的深度(21a)比加工物(1)的厚度更形成。因此，將加工物(1)嵌合於複數的槽(21)後，藉由將膠帶貼附在複數的加工物(1)上進行轉印，可以使複數的加工物(1)在膠帶上排成一列。因此，可以防止複數的加工物(1)散亂地貼附在膠帶，可以對於複數的加工物(1)有效率地進行加工。

Description

治具及使用治具的加工方法
本發明是有關於將複數的長方形的加工物排成一列的治具及使用該治具的加工方法。
為了將晶圓等的加工物分割成各個的晶片，例如在下述的專利文獻1所示的劃線裝置，在藉由劃線器形成沿切割道的分割槽之後，例如藉由使用下述的專利文獻2所示的劈裂裝置而將外力賦予於加工物來沿分割槽斷裂成各個的晶片。在加工物的分割時，為了分割的各個的晶片不致飛散，所以藉由將膠帶貼附在中央開口的環狀的環狀框架，使加工物的一方的面朝上而將另一方的面貼附在從該開口部外露的膠帶，經由該膠帶以環狀框架來支撐加工物。
在此，如第7圖所示般，在作為加工對象的加工物是由長方形所構成的加工物10的情況下，藉由將複數的加工物10排列貼附在膠帶11的上方，可以經由膠帶11以環狀框架12來支撐複數的加工物10。
[先前技術文獻] [專利文獻]
[專利文獻1]日本特開2003-45823號公報
[專利文獻2]日本特開2006-156896號公報
不過，在將複數的加工物10排列在上述的膠帶11上時，如果可以將加工物10的一端一致排列在一直線上的話，就可以藉一次的動作而將複數的加工物10進行加工，但因為藉由作業者的手工操作將加工物10載置於膠帶11上，所以在膠帶11上不易將複數的加工物10的一端在一直線上排成一列。因此，有著將各加工物10予以攝像，且藉由圖像處理來測定從其一端到另一端為止的距離，對每個加工物10都進行加工，作業效率不佳的問題。
因而，本發明的目地是提供：可以使複數的長方形的加工物的一端一致而彼此平行地排成一列的治具及使用該治具將複數的長方形的加工物予以加工的加工方法。
依據本發明，提供一種治具，其係輔助複數的長方形的加工物排成一列的治具，由具有複數彼此平行 的槽的板狀物所構成，該複數的槽的一端在一直線上排成一列，且該槽的深度成為比該加工物的厚度更淺，將該加工物嵌合於該複數的槽後將膠帶貼附在該加工物進行轉印且使複數的該加工物排成一列。
依據本發明的其他側面是提供一種加工物的加工方法，該加工方法是使用具有複數彼此平行的槽，該複數的槽的一端在一直線上排成一列，該槽的深度形成比加工物的厚度更淺的治具的複數長方形的加工物的加工方法，具備：將該複數的加工物分別嵌合於該治具的複數的槽中的嵌合步驟；實施該嵌合步驟後，將膠帶貼附在嵌合於該治具的該槽中的側的加工物的第1面的相反側的第2面，將該複數的加工物從該治具轉印於膠帶而使複數的該加工物排成一列的轉印步驟；以及實施該轉印步驟後，將排成一列的該複數的加工物予以加工的加工步驟。
本發明所涉及的治具是由具有複數彼此平行的槽的板狀物所構成，因為複數的槽的一端在一直線上排成一列，槽的深度成為比加工物的厚度更淺，所以分別將加工物嵌合於複數的槽後，藉由將膠帶貼附在複數的加工物且將加工物從該治具轉印於膠帶，可以使複數的加工物在膠帶上排成一列。因此，可以防止複數的加工物的位置及方向散亂地貼附在膠帶，可以對於複數的加工物有效率地進行加工。
本發明所涉及的加工方法，由於具有：將加工物嵌合於治具的槽的嵌合步驟、使膠帶貼附在加工物嵌合於治具的槽側的面的相反側的面且進行轉印而使複數的加工物排成一列的轉印步驟、以及將排成一列的複數的加工物予以加工的加工步驟，因而可以與上述同樣，將複數的加工物排成一列來貼附在膠帶上，可以將複數的加工物有效率地進行加工。
1‧‧‧加工物
1a‧‧‧第1面
1b‧‧‧第2面
1c‧‧‧側面
1d‧‧‧端面
2‧‧‧治具
20‧‧‧板狀物
20a‧‧‧表面
21‧‧‧槽
210‧‧‧內壁
21a‧‧‧深度
21b‧‧‧寬度
21c‧‧‧長度
21d‧‧‧開口部
22‧‧‧間隔
23‧‧‧一端
3‧‧‧工作集
4‧‧‧環狀框架
5‧‧‧膠帶
6‧‧‧工作盤
7‧‧‧雷射加工手段
10‧‧‧加工物
11‧‧‧膠帶
12‧‧‧環狀框架
第1圖是表示長方形的加工物的構造的立體圖。
第2圖是表示治具的構造的部分擴大剖面圖。
第3圖是表示治具的構造的俯視圖。
第4圖是表示嵌合步驟的部分擴大剖面圖。
第5圖是表示轉印步驟的剖面圖。
第6圖是表示加工步驟的立體圖。
第7圖是表示複數的長方形的加工物排列貼附在膠帶的先前例的立體圖。
1 加工物的構造
第1圖所示的加工物1是長方形的加工物的一例，例如由磷化銦(InP)的單結晶所形成。加工物1，具有：上 面側的第1面1a、第1面1a的相反側的第2面1b、朝長邊方向延伸的一對的側面1c、以及朝短邊方向延伸的一對的端面1d。加工物1的尺寸未特別限定，例如形成高度H為80μm，寬度W為200μm，長度L為20mm。
2 治具的構造
第2圖所示的治具2是使用在將複數的加工物1貼附在膠帶時，輔助複數的加工物1排成一列的治具。治具2是由具有用來將複數的加工物1進行嵌合的複數彼此平行的槽21的板狀物20所構成。板狀物20是例如由矽(Si)所構成。複數的槽21是例如藉由雷射刻槽(由雷射照射來形成槽)預先形成在板狀物20的表面20a。此外，板狀物20的厚度或大小未特別限定，可任意設定。
槽21的深度21a是形成比加工物1的厚度更淺。換言之，槽21的深度21a只要是可以將加工物1嵌入於槽21的程度的深度的話即可，例如形成為15μm。槽21的寬度21b是比加工物1的寬度W稍寬而讓加工物1容易進入槽21，例如形成為250~300μm。相鄰的槽21之間的間隔22是例如10μm左右。
如第3圖所示般，槽21是在形成於板狀物20上的一個側面側的開口部21d設有開口。槽21的長度21c是與第1圖所示的加工物1的長度L形成相同程度。複數的槽21是在各個的一端23在一直線上排成一列的狀態下彼此平行排成一列。在將複數的加工物1嵌合於如此 般構成的複數的槽21時，大略地使加工物1對位於各個的槽21來收容後，藉由將加工物1的端面1d碰觸各個的一端23，可以將複數的加工物1的端面1d在一直線上一致。將加工物1收容在槽21時可以從槽21的上方使加工物下降，或將加工物1從開口部21d側插入。因為在槽21形成有開口部21d，所以也可以將長邊方向的長度比槽21長的加工物收容於槽21。此外，槽21的數量未特別限定。
如此般，本發明所涉及的治具2是由具有可以供長方形的加工物1嵌合的複數的槽21的板狀物20所構成，在複數的槽21的一端23在一直線上排成一列的狀態下，因為複數的槽21形成彼此平行排成一列的構造，所以在將複數的加工物1予以加工時，藉由將加工物1嵌合於複數的槽21，例如將膠帶貼附在複數的加工物1而進行轉印，可以使複數的加工物1在膠帶上排成一列。因而，防止複數的加工物1的位置及方向散亂地貼附在膠帶，且可以對於複數的加工物有效率地進行加工。
3 加工方法
接下來，針對使用治具2的複數的加工物1的加工方法進行說明。在本實施方式中，針對在對於複數的加工物1實施雷射加工(雷射劃線)而形成分割起點(槽)之後，沿分割起點進行劈裂，將各加工物1分割成既定的長度的情況進行說明。
(1)嵌合步驟
如第4圖所示般，將複數的加工物1嵌合於治具2的複數的槽21。具體而言，將加工物1的第2面1b側載置於治具2的槽21，使第1面1a朝上外露。此時，因為加工物1的一對的側面1c進入比槽21的內壁210更靠內側，所以可以容易將加工物1定位於槽21。另外，如第2圖所示般，因為槽21的深度21a形成比加工物1的厚度更淺，所以第1面1a是位於比板狀物20的表面20a更靠上方。
接著，藉由將加工物1的端面1d碰觸第3圖所示的槽21的一端23，來定位加工物1的位置。也就是成為加工物1嵌合於槽21的狀態。而且，將各加工物1嵌合於全部的槽21，即完成嵌合步驟。
(2)轉印步驟
如第5圖所示般，將膠帶5貼附在加工物1的嵌合於治具2的槽21側的第2面1b的相反側的第1面1a進行轉印。具體而言，如第5(a)圖所示般，將膠帶5貼附在中央開口的環狀的環狀框架4，從該中央使膠帶5的黏著面朝下方外露。然後，如第5(b)圖所示般，將從該中央外露的膠帶5的黏著面貼附在複數的加工物1的第2面1b。
接著，如第5(c)圖所示般，使治具2從複 數的加工物1離開而將複數的加工物1轉印於膠帶5，使各加工物1的第2面1b朝上。其結果，形成複數的加工物1經由膠帶5支撐在環狀框架4而成為一體的工作集3。如此一來，如第6圖所示般，在膠帶5上，在複數的加工物1的端面1d在一直線上排成一列的狀態下，複數的加工物1成為排成一列的狀態。
(3)加工步驟
如第6圖所示般，進行將分割起點形成於在膠帶5上排成一列的複數的加工物1的雷射加工。在本實施方式所示的加工步驟中使用加工裝置，該加工裝置至少具備：將工作集3予以保持且可朝加工進給方向(X軸方向)移動的工作盤6、以及將分割起點形成於複數的加工物1的雷射加工手段7。
將工作集3載置在工作盤6上進行保持後，使工作盤6往雷射加工手段7的下方移動。接著，使工作盤6一邊朝加工進給方向移動，一邊藉由雷射加工手段7，沿欲分割的分割預定線S照射具有既定的波長的雷射光束LB來將分割起點形成在各加工物1。
因為複數的加工物1是在X軸方向上於一直線上排成一列，所以藉由工作盤6的一次的加工進給，可以將沿分割預定線S的的分割起點形成於複數的加工物1。接著，一邊將工作盤6朝Y軸方向僅進行既定的長度分量的分度進給，一邊反覆進行上述同樣的雷射光束LB 的照射，將分割起點形成在全部的加工物1。而且，將加工物1搬運至未圖示的劈裂裝置，將外力賦予於加工物1且將分割起點作為起點來將加工物1分割成既定的長度。如此般加工物1分割成既定的長度後，在分離的各構件上實施所須加工，例如作為雷射振盪器的零件使用。
加工步驟是雷射劃線後進行劈裂以外，也可以藉由例如沿分割預定線S照射一次或複數次雷射光束，將加工物1完全切斷(全切斷)。
如此般，本發明所涉及的加工方法，因為具有：將加工物1嵌合於治具2的槽21的嵌合步驟、使膠帶5貼附在加工物1嵌合於治具2的槽21側的第2面1b的相反側的第1面1a且進行轉印而使複數的加工物1排成一列的轉印步驟、以及將排成一列的複數的加工物1予以加工的加工步驟，所以可以將複數的加工物1排成一列來貼附在膠帶5上，且可以將複數的加工物1有效率地進行加工。
此外，本發明的作為加工對象的加工物1的材質不限定於磷化銦(InP)。因而，加工物1例如由矽(Si)、碳化矽(SiC)等所形成的情況下，加工步驟不限於以雷射加工來進行的情況，也可以使用切削裝置或劃線裝置來將加工物1予以劃線後，進行劈裂等。
1‧‧‧加工物
1a‧‧‧第1面
1b‧‧‧第2面
1c‧‧‧側面
1d‧‧‧端面
2‧‧‧治具
20‧‧‧板狀物
20a‧‧‧表面
21‧‧‧槽
210‧‧‧內壁

Claims (2)

  1. 一種治具，是輔助複數的長方形的加工物排成一列的治具，由具有複數彼此平行的槽的板狀物所構成，該複數的槽的一端在一直線上排成一列，且該槽的深度成為比該加工物的厚度更淺，將該加工物嵌合於該複數的槽後，在將膠帶貼附在該加工物進行轉印且複數的該加工物排成一列的狀態，形成經由該膠帶支撐在環狀框架的工作集。
  2. 一種加工方法，是使用板狀的治具將複數長方形的加工物進行加工的加工方法，具備：用來準備板狀治具，該板狀治具具有複數彼此平行的槽，該複數的槽的一端在一直線上排成一列，該槽的深度形成比加工物的厚度更淺，該複數的槽的該一端的相反側開口的板狀治具準備步驟；將該複數的加工物的一端抵接於該複數的槽的該一端，且將該複數的加工物分別嵌合於該治具的複數的槽中的嵌合步驟；實施該嵌合步驟後，將膠帶貼附在嵌合於該治具的該槽中的側的加工物的第1面的相反側的第2面，將該複數的加工物從該治具轉印於膠帶而使複數的該加工物排成一列的轉印步驟；以及實施該轉印步驟後，將排成一列的該複數的加工物予以加工的加工步驟。
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