TWI704613B - 平面研磨裝置 - Google Patents

平面研磨裝置 Download PDF

Info

Publication number
TWI704613B
TWI704613B TW106112056A TW106112056A TWI704613B TW I704613 B TWI704613 B TW I704613B TW 106112056 A TW106112056 A TW 106112056A TW 106112056 A TW106112056 A TW 106112056A TW I704613 B TWI704613 B TW I704613B
Authority
TW
Taiwan
Prior art keywords
thickness
workpiece
measuring device
plate
planetary wheel
Prior art date
Application number
TW106112056A
Other languages
English (en)
Chinese (zh)
Other versions
TW201737336A (zh
Inventor
井上裕介
吉原秀明
Original Assignee
日商快遞股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商快遞股份有限公司 filed Critical 日商快遞股份有限公司
Publication of TW201737336A publication Critical patent/TW201737336A/zh
Application granted granted Critical
Publication of TWI704613B publication Critical patent/TWI704613B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW106112056A 2016-04-14 2017-04-11 平面研磨裝置 TWI704613B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-081116 2016-04-14
JP2016081116A JP6760638B2 (ja) 2016-04-14 2016-04-14 平面研磨装置

Publications (2)

Publication Number Publication Date
TW201737336A TW201737336A (zh) 2017-10-16
TWI704613B true TWI704613B (zh) 2020-09-11

Family

ID=60085360

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106112056A TWI704613B (zh) 2016-04-14 2017-04-11 平面研磨裝置

Country Status (4)

Country Link
JP (1) JP6760638B2 (enrdf_load_stackoverflow)
KR (1) KR102315142B1 (enrdf_load_stackoverflow)
CN (1) CN107297678A (enrdf_load_stackoverflow)
TW (1) TWI704613B (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
CN110193775B (zh) * 2019-03-12 2021-09-17 上海新昇半导体科技有限公司 化学机械抛光方法以及化学抛光系统
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
CN113245973B (zh) * 2021-06-08 2022-07-22 唐山国芯晶源电子有限公司 一种石英晶片抛光游轮修磨厚度检测方法
IT202100022463A1 (it) 2021-08-27 2023-02-27 Biesse Spa Metodo per controllare la lavorazione di pannelli di forma sostanzialmente parallelepipeda e macchina per la lavorazione di pannelli di forma sostanzialmente parallelepipeda, in particolare macchina levigatrice per la levigatura/satinatura di pannelli di legno, metallo, o simili
JP7296161B1 (ja) * 2022-06-27 2023-06-22 不二越機械工業株式会社 両面研磨装置
CN117359435B (zh) * 2023-12-05 2024-03-05 福建荣德光电科技有限公司 一种光学镜片加工用的数控平面精密铣磨机
CN117583975B (zh) * 2024-01-18 2024-03-19 山西日盛达太阳能科技股份有限公司 一种光伏玻璃抛光装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP2015047656A (ja) * 2013-08-30 2015-03-16 株式会社Sumco ワークの両面研磨装置及び両面研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
JP4324933B2 (ja) 2000-08-23 2009-09-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 平面研磨装置
JP4202841B2 (ja) * 2003-06-30 2008-12-24 株式会社Ｓｕｍｃｏ 表面研磨装置
JP2010023167A (ja) * 2008-07-18 2010-02-04 Epson Toyocom Corp 砥粒加工装置およびそれを用いた砥粒加工方法
JP4955624B2 (ja) 2008-07-31 2012-06-20 信越半導体株式会社 両面研磨装置
KR20100079199A (ko) * 2008-12-30 2010-07-08 주식회사 동부하이텍 화학적 기계 연마 장치 및 방법
US20120276662A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal features
JP5917994B2 (ja) * 2012-04-23 2016-05-18 スピードファム株式会社 研磨装置の計測用窓構造
JP6622117B2 (ja) * 2016-03-08 2019-12-18 スピードファム株式会社 平面研磨装置及びキャリア

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
JP2015047656A (ja) * 2013-08-30 2015-03-16 株式会社Sumco ワークの両面研磨装置及び両面研磨方法

Also Published As

Publication number Publication date
CN107297678A (zh) 2017-10-27
KR20170117878A (ko) 2017-10-24
KR102315142B1 (ko) 2021-10-20
JP6760638B2 (ja) 2020-09-23
JP2017189849A (ja) 2017-10-19
TW201737336A (zh) 2017-10-16

Similar Documents

Publication Publication Date Title
TWI704613B (zh) 平面研磨裝置
CN101264585B (zh) 双面研磨装置
TWI709457B (zh) 平面研磨裝置及載具
JP4654275B2 (ja) 両面研磨装置
TW201803690A (zh) 研磨裝置
TW201511884A (zh) 晶圓的雙面硏磨方法及雙面硏磨系統
TWI831973B (zh) 異常檢測裝置及異常檢測方法
JP2013004726A (ja) 板状物の加工方法
JP2004017229A (ja) 基板研磨装置
JP4955624B2 (ja) 両面研磨装置
JP2007123687A (ja) 半導体ウェーハ裏面の研削方法及び半導体ウェーハ研削装置
JP7726760B2 (ja) ウェーハの製造方法および研削装置
TW202339900A (zh) 雙面研磨裝置及雙面研磨方法
JP7561605B2 (ja) 研削装置
JP2010186776A (ja) ウエーハの研削方法
CN115900631A (zh) 一种双面抛光机的上下抛光盘测量装置及方法
TW202344342A (zh) 兩面研磨裝置
JP2025077193A (ja) 加工装置
TWI619580B (zh) 平面研磨機及其研磨方法
JPH04261768A (ja) 両面ラップ加工装置
JP2008100319A (ja) 研削加工方法および研削加工装置
KR20240121624A (ko) 웨이퍼 폴리싱 장치
CN120134205A (zh) 主轴坐标校正方法、磨损量检测方法、研削方法及研削机
TW202212052A (zh) 研磨裝置
JP2023135956A (ja) ウェーハの再生方法