TWI704205B - 切割片及切割片的製造方法 - Google Patents

切割片及切割片的製造方法 Download PDF

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Publication number
TWI704205B
TWI704205B TW105103998A TW105103998A TWI704205B TW I704205 B TWI704205 B TW I704205B TW 105103998 A TW105103998 A TW 105103998A TW 105103998 A TW105103998 A TW 105103998A TW I704205 B TWI704205 B TW I704205B
Authority
TW
Taiwan
Prior art keywords
resin
resin layer
dicing sheet
temperature
film
Prior art date
Application number
TW105103998A
Other languages
English (en)
Chinese (zh)
Other versions
TW201720890A (zh
Inventor
仁藤有紀
田矢直紀
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201720890A publication Critical patent/TW201720890A/zh
Application granted granted Critical
Publication of TWI704205B publication Critical patent/TWI704205B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW105103998A 2015-12-08 2016-02-05 切割片及切割片的製造方法 TWI704205B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015239723 2015-12-08
JP2015-239723 2015-12-08

Publications (2)

Publication Number Publication Date
TW201720890A TW201720890A (zh) 2017-06-16
TWI704205B true TWI704205B (zh) 2020-09-11

Family

ID=59012983

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105103998A TWI704205B (zh) 2015-12-08 2016-02-05 切割片及切割片的製造方法

Country Status (5)

Country Link
JP (2) JP2017108090A (ko)
KR (1) KR102476430B1 (ko)
CN (1) CN108140566B (ko)
TW (1) TWI704205B (ko)
WO (1) WO2017098736A1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6721398B2 (ja) * 2016-04-22 2020-07-15 日東電工株式会社 ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI232235B (en) * 2001-06-27 2005-05-11 Nitto Denko Corp Adhesive sheet for dicing
JP2013065682A (ja) * 2011-09-16 2013-04-11 Lintec Corp ダイシングシート用基材フィルムおよびダイシングシート

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4786562A (en) * 1986-07-11 1988-11-22 Sumitomo Chemical Company, Limited Polypropylene multi-layer film
JPH05211234A (ja) 1991-12-05 1993-08-20 Lintec Corp ウェハ貼着用粘着シートおよびウェハダイシング方法
US20060051587A1 (en) * 2002-07-29 2006-03-09 Toshiki Mori Thermosetting resin composition and adhesive film
JP4554908B2 (ja) * 2003-10-24 2010-09-29 日東電工株式会社 ダイシング用粘着シート、ダイシング方法および半導体素子の製造方法
JP2006128567A (ja) * 2004-11-01 2006-05-18 Three M Innovative Properties Co 半導体パッケージのプリント配線板への接続方法
JP2008159998A (ja) * 2006-12-26 2008-07-10 Nitta Ind Corp ダイシングテープ
JP5092574B2 (ja) * 2007-06-22 2012-12-05 三菱化学株式会社 共重合ポリエステル樹脂の製造方法
JP2009155623A (ja) * 2007-12-03 2009-07-16 Sumitomo Chemical Co Ltd 液晶ポリエステル樹脂組成物及びその成形体
TWI498215B (zh) * 2010-07-28 2015-09-01 Mitsui Du Pont Polychemical A laminated film, and a thin film for manufacturing a semiconductor thereof
MY184455A (en) * 2011-09-16 2021-04-01 Lintec Corp Base film for dicing sheet and dicing sheet
JP5951216B2 (ja) * 2011-10-13 2016-07-13 リンテック株式会社 粘着シートおよびその使用方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI232235B (en) * 2001-06-27 2005-05-11 Nitto Denko Corp Adhesive sheet for dicing
JP2013065682A (ja) * 2011-09-16 2013-04-11 Lintec Corp ダイシングシート用基材フィルムおよびダイシングシート

Also Published As

Publication number Publication date
JP2017108090A (ja) 2017-06-15
TW201720890A (zh) 2017-06-16
CN108140566B (zh) 2022-05-03
KR20180090782A (ko) 2018-08-13
WO2017098736A1 (ja) 2017-06-15
JP6246989B2 (ja) 2017-12-13
JPWO2017098736A1 (ja) 2018-03-01
CN108140566A (zh) 2018-06-08
KR102476430B1 (ko) 2022-12-09

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