TWI702093B - 用於排放沉積移除的溫度控制遠端電漿清洗的處理系統 - Google Patents

用於排放沉積移除的溫度控制遠端電漿清洗的處理系統 Download PDF

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Publication number
TWI702093B
TWI702093B TW106113035A TW106113035A TWI702093B TW I702093 B TWI702093 B TW I702093B TW 106113035 A TW106113035 A TW 106113035A TW 106113035 A TW106113035 A TW 106113035A TW I702093 B TWI702093 B TW I702093B
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TW
Taiwan
Prior art keywords
exhaust system
temperature
remote plasma
isolation valve
plasma source
Prior art date
Application number
TW106113035A
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English (en)
Chinese (zh)
Other versions
TW201801813A (zh
Inventor
馬汀Ａ 西爾肯
大衛Ｋ 卡爾森
馬修Ｄ 史寇特尼凱瑟
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美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201801813A publication Critical patent/TW201801813A/zh
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Publication of TWI702093B publication Critical patent/TWI702093B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
    • H01J37/32963—End-point detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2259/00—Type of treatment
    • B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
    • B01D2259/818—Employing electrical discharges or the generation of a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Mechanical Engineering (AREA)
TW106113035A 2016-04-26 2017-04-19 用於排放沉積移除的溫度控制遠端電漿清洗的處理系統 TWI702093B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662327870P 2016-04-26 2016-04-26
US62/327,870 2016-04-26

Publications (2)

Publication Number Publication Date
TW201801813A TW201801813A (zh) 2018-01-16
TWI702093B true TWI702093B (zh) 2020-08-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW106113035A TWI702093B (zh) 2016-04-26 2017-04-19 用於排放沉積移除的溫度控制遠端電漿清洗的處理系統

Country Status (6)

Country Link
US (1) US10500614B2 (enExample)
JP (1) JP6924775B2 (enExample)
KR (1) KR102194085B1 (enExample)
CN (1) CN109069990B (enExample)
TW (1) TWI702093B (enExample)
WO (1) WO2017189194A1 (enExample)

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US11332824B2 (en) 2016-09-13 2022-05-17 Lam Research Corporation Systems and methods for reducing effluent build-up in a pumping exhaust system
WO2019241405A1 (en) * 2018-06-14 2019-12-19 Mks Instruments, Inc. Radical output monitor for a remote plasma source and method of use
JP7374158B2 (ja) * 2021-10-15 2023-11-06 株式会社荏原製作所 生成物除去装置、処理システム及び生成物除去方法
WO2026043853A1 (en) * 2024-08-22 2026-02-26 Lam Research Corporation Methods and apparatus for monitoring a processing tool
CN119819657A (zh) * 2025-01-10 2025-04-15 浙江芯晟半导体科技有限责任公司 氮化硅生产设备中去除氯化铵结晶物的方法及装置

Citations (2)

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TW200725686A (en) * 2005-10-03 2007-07-01 Advanced Tech Materials Systems and methods for determination of endpoint of chamber cleaning processes
TW200802589A (en) * 2006-06-12 2008-01-01 Teratech Co Ltd Apparatus for cleaning exhaust part and vacuum pump of reaction chamber for semiconductor device and LCD manufacturing equipment

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DE19922960C2 (de) * 1999-05-19 2003-07-17 Daimler Chrysler Ag Abgasreinigungsanlage mit interner Ammoniakerzeugung zur Stickoxidreduktion
US6592817B1 (en) * 2000-03-31 2003-07-15 Applied Materials, Inc. Monitoring an effluent from a chamber
US20030207021A1 (en) * 2000-04-28 2003-11-06 Hiroshi Izawa Deposited-film formation apparatus, deposited-film formation process, vacuum system, leak judgment method, and computer-readable recording medium with recorded leak-judgment- executable program
JP2006004962A (ja) * 2004-06-15 2006-01-05 Canon Inc 堆積膜形成装置およびそのクリーニング方法
JP2006086156A (ja) * 2004-09-14 2006-03-30 Canon Inc 生成物の除去方法
TWI279260B (en) * 2004-10-12 2007-04-21 Applied Materials Inc Endpoint detector and particle monitor
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US20060211253A1 (en) * 2005-03-16 2006-09-21 Ing-Shin Chen Method and apparatus for monitoring plasma conditions in an etching plasma processing facility
US20060266288A1 (en) * 2005-05-27 2006-11-30 Applied Materials, Inc. High plasma utilization for remote plasma clean
US7210338B2 (en) * 2005-07-29 2007-05-01 Honda Motor Co., Ltd. Valve testing device having integrated purge circuit and method of valve testing
JP4876242B2 (ja) * 2005-12-16 2012-02-15 国立大学法人静岡大学 結晶成長方法及び結晶成長装置
JP2011111655A (ja) * 2009-11-27 2011-06-09 Sharp Corp プラズマｃｖｄ装置のクリーニング方法、半導体薄膜の成膜方法、光電変換素子の製造方法およびプラズマｃｖｄ装置
CN102758669A (zh) * 2011-04-26 2012-10-31 陈温乐 车辆排放废气中和降温处理装置
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Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
TW200725686A (en) * 2005-10-03 2007-07-01 Advanced Tech Materials Systems and methods for determination of endpoint of chamber cleaning processes
TW200802589A (en) * 2006-06-12 2008-01-01 Teratech Co Ltd Apparatus for cleaning exhaust part and vacuum pump of reaction chamber for semiconductor device and LCD manufacturing equipment

Also Published As

Publication number Publication date
JP2019518327A (ja) 2019-06-27
KR102194085B1 (ko) 2020-12-22
JP6924775B2 (ja) 2021-08-25
TW201801813A (zh) 2018-01-16
KR20180128082A (ko) 2018-11-30
US10500614B2 (en) 2019-12-10
CN109069990B (zh) 2021-11-16
US20170304877A1 (en) 2017-10-26
CN109069990A (zh) 2018-12-21
WO2017189194A1 (en) 2017-11-02

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