TWI699410B - 機能層形成用組合物、機能層形成用組合物之製造方法、有機ｅｌ元件之製造方法、有機ｅｌ裝置、電子機器 - Google Patents

機能層形成用組合物、機能層形成用組合物之製造方法、有機ｅｌ元件之製造方法、有機ｅｌ裝置、電子機器 Download PDF

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TWI699410B
TWI699410B TW105108883A TW105108883A TWI699410B TW I699410 B TWI699410 B TW I699410B TW 105108883 A TW105108883 A TW 105108883A TW 105108883 A TW105108883 A TW 105108883A TW I699410 B TWI699410 B TW I699410B
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Taiwan
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aromatic solvent
forming
functional layer
organic
layer
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TW105108883A
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Chinese (zh)
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TW201641620A (zh
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渡辺昭太朗
森田圭介
園山卓也
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日商精工愛普生股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/15—Deposition of organic active material using liquid deposition, e.g. spin coating characterised by the solvent used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/36—Inkjet printing inks based on non-aqueous solvents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/631—Amine compounds having at least two aryl rest on at least one amine-nitrogen atom, e.g. triphenylamine
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/17—Carrier injection layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/856—Arrangements for extracting light from the devices comprising reflective means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
TW105108883A 2015-03-25 2016-03-22 機能層形成用組合物、機能層形成用組合物之製造方法、有機ｅｌ元件之製造方法、有機ｅｌ裝置、電子機器 TWI699410B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-062200 2015-03-25
JP2015062200A JP6550830B2 (ja) 2015-03-25 2015-03-25 機能層形成用組成物、機能層形成用組成物の製造方法、有機ｅｌ素子の製造方法、有機ｅｌ装置、電子機器

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TW201641620A TW201641620A (zh) 2016-12-01
TWI699410B true TWI699410B (zh) 2020-07-21

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US (1) US10079342B2 (enExample)
EP (1) EP3276696B1 (enExample)
JP (1) JP6550830B2 (enExample)
KR (1) KR101953592B1 (enExample)
CN (1) CN107431137B (enExample)
TW (1) TWI699410B (enExample)
WO (1) WO2016152028A1 (enExample)

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JP7048250B2 (ja) * 2017-10-19 2022-04-05 住友化学株式会社 有機電子デバイスの製造方法
JP7158157B2 (ja) * 2018-02-23 2022-10-21 東ソー株式会社 有機半導体インキ、それを用いた有機薄膜の製造方法
CN108400259B (zh) * 2018-03-20 2020-05-01 京东方科技集团股份有限公司 Oled器件的制备方法及显示面板的制备方法
CN108281474B (zh) * 2018-03-28 2019-05-10 京东方科技集团股份有限公司 有机发光显示面板及其制作方法、显示装置
TWI743489B (zh) * 2018-06-12 2021-10-21 日商住友化學股份有限公司 有機電致發光元件
CN110165055B (zh) * 2018-09-20 2021-12-21 合肥鑫晟光电科技有限公司 有机薄膜图案的制作方法及有机薄膜图案、阵列基板及显示装置
KR102217266B1 (ko) 2018-09-28 2021-02-17 주식회사 엘지화학 유기 발광 소자용 잉크 조성물
JP2022506510A (ja) * 2018-11-06 2022-01-17 メルク パテント ゲーエムベーハー 電子デバイスの有機素子を形成する方法
CN112952025A (zh) * 2021-03-31 2021-06-11 京东方科技集团股份有限公司 显示基板及显示装置
KR102889237B1 (ko) 2022-03-10 2025-11-25 삼성디스플레이 주식회사 표시 패널의 제조 방법

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KR20170110722A (ko) 2017-10-11
EP3276696A1 (en) 2018-01-31
CN107431137B (zh) 2020-02-28
JP6550830B2 (ja) 2019-07-31
US10079342B2 (en) 2018-09-18
US20180062078A1 (en) 2018-03-01
WO2016152028A1 (ja) 2016-09-29
EP3276696B1 (en) 2023-10-11
JP2016181648A (ja) 2016-10-13
EP3276696A4 (en) 2018-11-21
TW201641620A (zh) 2016-12-01
CN107431137A (zh) 2017-12-01
KR101953592B1 (ko) 2019-03-04

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