TWI697027B - 用於晶圓容器的氣體供應裝置 - Google Patents

用於晶圓容器的氣體供應裝置 Download PDF

Info

Publication number
TWI697027B
TWI697027B TW107119220A TW107119220A TWI697027B TW I697027 B TWI697027 B TW I697027B TW 107119220 A TW107119220 A TW 107119220A TW 107119220 A TW107119220 A TW 107119220A TW I697027 B TWI697027 B TW I697027B
Authority
TW
Taiwan
Prior art keywords
nozzle
piston
wafer container
cylinder
gas
Prior art date
Application number
TW107119220A
Other languages
English (en)
Chinese (zh)
Other versions
TW201903838A (zh
Inventor
金弘烈
Original Assignee
南韓商責市特馬股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 南韓商責市特馬股份有限公司 filed Critical 南韓商責市特馬股份有限公司
Publication of TW201903838A publication Critical patent/TW201903838A/zh
Application granted granted Critical
Publication of TWI697027B publication Critical patent/TWI697027B/zh

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107119220A 2017-06-09 2018-06-04 用於晶圓容器的氣體供應裝置 TWI697027B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0072609 2017-06-09
KR1020170072609A KR101956797B1 (ko) 2017-06-09 2017-06-09 웨이퍼 용기의 가스공급장치
??10-2017-0072609 2017-06-09

Publications (2)

Publication Number Publication Date
TW201903838A TW201903838A (zh) 2019-01-16
TWI697027B true TWI697027B (zh) 2020-06-21

Family

ID=64612455

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107119220A TWI697027B (zh) 2017-06-09 2018-06-04 用於晶圓容器的氣體供應裝置

Country Status (4)

Country Link
KR (1) KR101956797B1 (ko)
CN (1) CN109037099B (ko)
SG (1) SG10201804853QA (ko)
TW (1) TWI697027B (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102126527B1 (ko) * 2019-11-11 2020-06-26 주식회사 케이씨티 질소 퍼지 기능을 구비한 풉 스테이지 모듈
KR102228698B1 (ko) * 2020-05-26 2021-03-18 주식회사 케이씨 가스 공급 장치
CN114242626B (zh) * 2021-12-21 2022-04-29 智程半导体设备科技(昆山)有限公司 一种干法晶圆片清洗设备
CN117954361A (zh) * 2024-03-26 2024-04-30 沈阳元创半导体有限公司 一种应用于晶圆装载机的吹扫机构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW533174B (en) * 2000-12-04 2003-05-21 Ebara Corp Substrate transportation device, container and substrate transportation method
US8596312B2 (en) * 2010-03-05 2013-12-03 Sinfonia Technology Co., Ltd. Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
TWI500104B (zh) * 2009-05-27 2015-09-11 Rorze Corp Atmosphere replacement device
TWI549209B (zh) * 2011-05-31 2016-09-11 Sinfonia Technology Co Ltd Charging device, automatic loading port
TW201633429A (zh) * 2014-12-01 2016-09-16 安堤格里斯公司 基板容器、用於基板容器之閥總成、沖洗模組及其替換方法
TWI567856B (zh) * 2015-09-08 2017-01-21 古震維 具有吹淨功能的晶圓傳送裝置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4558594B2 (ja) * 2005-06-24 2010-10-06 近藤工業株式会社 シャッター付きブレスフィルター装置および該装置に使用するシャッター押上げロッド並びにシャッター押上げロッド付きノズル
JP6131534B2 (ja) * 2012-06-11 2017-05-24 シンフォニアテクノロジー株式会社 パージノズルユニット、ロードポート、載置台、ストッカー
JP5939080B2 (ja) 2012-08-07 2016-06-22 シンフォニアテクノロジー株式会社 パージノズルユニット、パージ装置、ロードポート
JP5958446B2 (ja) * 2013-10-28 2016-08-02 Tdk株式会社 ロードポート装置
JP6561700B2 (ja) * 2015-09-04 2019-08-21 シンフォニアテクノロジー株式会社 ガス注入装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW533174B (en) * 2000-12-04 2003-05-21 Ebara Corp Substrate transportation device, container and substrate transportation method
TWI500104B (zh) * 2009-05-27 2015-09-11 Rorze Corp Atmosphere replacement device
US8596312B2 (en) * 2010-03-05 2013-12-03 Sinfonia Technology Co., Ltd. Gas charging apparatus, gas discharging apparatus, gas charging method, and gas discharging method
TWI525738B (zh) * 2010-03-05 2016-03-11 翔風技術有限公司 氣體注入裝置、氣體排出裝置、氣體注入方法及氣體排出方法
TWI549209B (zh) * 2011-05-31 2016-09-11 Sinfonia Technology Co Ltd Charging device, automatic loading port
TW201633429A (zh) * 2014-12-01 2016-09-16 安堤格里斯公司 基板容器、用於基板容器之閥總成、沖洗模組及其替換方法
TWI567856B (zh) * 2015-09-08 2017-01-21 古震維 具有吹淨功能的晶圓傳送裝置

Also Published As

Publication number Publication date
KR20180134626A (ko) 2018-12-19
SG10201804853QA (en) 2019-01-30
CN109037099B (zh) 2022-03-08
CN109037099A (zh) 2018-12-18
TW201903838A (zh) 2019-01-16
KR101956797B1 (ko) 2019-03-12

Similar Documents

Publication Publication Date Title
TWI697027B (zh) 用於晶圓容器的氣體供應裝置
KR102288697B1 (ko) 퍼지 노즐 유닛, 적재대, 로드 포트 및 스토커
KR101753920B1 (ko) 퍼지 장치 및 로드 포트
KR100687306B1 (ko) 배출-구동 에스엠아이에프 포드 정화 시스템
KR100706250B1 (ko) 반도체 소자 제조 장치 및 방법
CN105990196B (zh) 夹持装置、基板输入输出装置以及基板处理装置
KR20220052893A (ko) 기판 처리 장치
KR101575652B1 (ko) 퍼지용 노즐과 이를 이용한 foup 흡착장치
KR19990082011A (ko) 진공 일체형 표준 메카니컬 인터페이스 시스템
JP7153616B2 (ja) 基板洗浄装置および基板洗浄方法
KR101748361B1 (ko) 웨이퍼 용기의 가스공급장치
JP2007005599A (ja) シャッター付きブレスフィルター装置および該装置に使用するシャッター押上げロッド並びにシャッター押上げロッド付きノズル
KR102292286B1 (ko) 기판 연마 방법, 톱링 및 기판 연마 장치
JP2017164895A (ja) 基板研磨方法、トップリングおよび基板研磨装置
KR101630039B1 (ko) 반도체 패키지들을 지지하기 위한 팔레트 테이블
TW201639019A (zh) 基板處理裝置及基板處理方法
JP7081119B2 (ja) ロードポート装置
KR101670997B1 (ko) 웨이퍼 용기의 가스공급장치
JP4364396B2 (ja) 物品容器開閉・転送装置
KR101935451B1 (ko) 진공 흡착장치
KR200492425Y1 (ko) 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경
KR102113276B1 (ko) 가스공급용 노즐패드 및 이를 구비한 웨이퍼 용기의 가스공급장치
JP6799280B2 (ja) ロードポート装置
JP2017188523A (ja) 基板処理装置および基板有無確認方法
JP2021013987A (ja) 基板処理システムおよび記録媒体